JPH0228966A - Semiconductor device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor device, and more particularly, to an improvement in a method for attaching a semiconductor chip to a lead frame.

[Prior Art] As is well known, in a semiconductor device, a semiconductor chip on which an integrated circuit or the like is formed is attached to a die pad of a lead frame using an adhesive or the like, and each bonding pad of the semiconductor chip is connected to a corresponding inner lead of the lead frame. Then, the semiconductor chip and the inner leads around it are integrally molded with plastic or ceramic and sealed. Then, each inner lead is separated from the lead frame on the outside of the molded package, and each inner lead is appropriately bent as necessary to manufacture a semiconductor device.

FIG. 4 is a plan view schematically showing a conventional example of mounting a semiconductor chip on a lead frame, and FIG. 5 is a sectional view thereof. In both figures, 1 is a lead frame, and a die pad 2 supported by support arms 3 is provided in the center. 4
are a large number of inner leads protruding from the lead frame 1 toward the center, and their tips are disposed around the die pad 2 to face the die pad 2 at a predetermined distance.

5 is a semiconductor chip attached to the die pad 2 with an adhesive or the like, and the bonding pad 5a provided on the semiconductor chip 5 and each inner lead 4 corresponding thereto are
As shown in the figure, they are connected by wires 6, respectively.

The semiconductor chip 5 connected to a large number of inner leads 4 as described above is attached to the die pad 2 along with the die pad 2, leaving a part of the inner leads 4, for example, in the area indicated by the dashed line P in FIG. The package 7 is made of a plastic material such as the like, and sealed as shown in FIG. Next, each inner lead 4 is cut at the position indicated by the dashed-dotted line C, and the inner lead 4 protruding from the package 7 is bent to form a terminal, completing the assembly of the semiconductor device.

[Problems to be Solved by the Invention] In the conventional semiconductor device as described above, the lead frame 1 is designed in a shape that matches the size of the semiconductor chip 5, the arrangement of the bonding pads 5a, etc. each time. and is being produced. In particular, recently, the field of manufacturing semiconductor devices according to customer specifications has expanded, and the size of semiconductor chips 5, the arrangement of bonding pads 5a, etc. are becoming increasingly diverse.

For this reason, as the types of semiconductor chips 5 increase, the types of lead frames 1 also continue to increase, and as these have to be designed and manufactured each time, not only does it increase costs, but also shortens delivery times. The problem was that it was inevitable that the situation would be prolonged.

The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to obtain a semiconductor device that can be used with many types of semiconductor chips using one type of lead frame.

[Means for Solving the Problems] A semiconductor device according to the present invention omits a conventional die pad, and a semiconductor chip is directly attached to an inner lead of a lead frame.

[Function] The semiconductor chip is directly bonded to the inner lead of the lead frame using a non-conductive adhesive, and the bonding pad of the semiconductor chip and the corresponding inner lead are connected with a wire.

[Embodiments of the invention] FIG. 1 is a plan view schematically showing an embodiment of the present invention.

In the figure, reference numeral 1 denotes a lead frame, in which a large number of inner leads 4 are provided protruding toward the center, and their tips end in a space 8 that is even smaller than the planar area of a small semiconductor chip 5.
are placed facing each other across. Reference numeral 5 denotes a semiconductor chip, in which the die pad is omitted in the present invention, and the semiconductor chip 5 is directly bonded to each inner lead 4 with a non-conductive adhesive 9, as shown in FIG.

In this case, in order to prevent the inner lead 4 and the semiconductor chip 5 from directly contacting each other and causing a short circuit accident, it is necessary to provide a slight gap g between them. As shown in Figure 2, a solid (
For example, granular silica (10) may be mixed into the adhesive to maintain the gap g.

In this way, the semiconductor chips 5 directly attached to each inner lead 4 are connected to
Each bonding pad 5a of FIG. A semiconductor device is obtained by sealing with a plastic package or the like within the range of P and bending the inner leads 4 protruding from the package to form terminals.

[Effects of the Invention] As is clear from the above description, the present invention omits the die pad on which the semiconductor chip was conventionally attached and directly attaches the semiconductor chip to the inner lead of the lead frame, which reduces the size of the semiconductor chip. Various types of semiconductor chips can be attached to one type of lead frame regardless of the semiconductor chip, and it is possible to connect to the inner leads regardless of the arrangement position of the bonding pads of the semiconductor chip.

As a result, one type of lead frame can be used for many types of semiconductor chips, which greatly reduces design and manufacturing man-hours, which not only reduces costs but also shortens delivery times. be.

[Brief explanation of the drawing]

Fig. 1 is a plan view schematically showing an embodiment of the present invention, Fig. 2 is an enlarged view of the main parts thereof, Fig. 3 is a side view showing the connection state between the inner lead and the semiconductor chip, and Fig. 4 is FIG. 5 is a plan view schematically showing a connection state between a conventional inner lead and a semiconductor chip, FIG. 5 is a side view thereof, and FIG. 6 is a perspective view of the conventional semiconductor device partially shown in cross section. 1: Lead frame, 4: Inner lead, 5: Semiconductor chip, 5a: Bonding pad, 6: Wire, 9: Adhesive.

Claims (1)

[Scope of Claims] A semiconductor device in which a bonding pad of a semiconductor chip and an inner lead of a lead frame are connected with a wire and these are sealed with plastic or the like, wherein the semiconductor chip is bonded to the bonding pad of the lead frame with a non-conductive adhesive. A semiconductor device, characterized in that it is directly attached to an inner lead, and the bonding pad of the semiconductor chip and the inner lead are connected with a wire.