JPH0221643A - Water cooling jacket for LSI module - Google Patents
Water cooling jacket for LSI moduleInfo
- Publication number
- JPH0221643A JPH0221643A JP17090388A JP17090388A JPH0221643A JP H0221643 A JPH0221643 A JP H0221643A JP 17090388 A JP17090388 A JP 17090388A JP 17090388 A JP17090388 A JP 17090388A JP H0221643 A JPH0221643 A JP H0221643A
- Authority
- JP
- Japan
- Prior art keywords
- water
- cooling
- jacket
- water cooling
- cooling jacket
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はＬＳＩモジュール用水冷ジャケットに係り、特
に流水経路の構造に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a water cooling jacket for an LSI module, and particularly to the structure of a water flow path.
従来の装置は、特開昭６２−１３９３４６号公報に記載
のように水冷ジャケットの流水部分はフィンを並べたも
のになっていた。In a conventional device, as described in Japanese Patent Application Laid-Open No. 139346/1982, the water flowing portion of the water cooling jacket is arranged with fins.
上記従来技術は、ジャケット内を流れる水流状態につい
ては配慮がされておらず、熱交換の効率、不純物の付着
の問題があった。The above-mentioned conventional technology does not take into account the state of the water flow inside the jacket, and there are problems with heat exchange efficiency and impurity adhesion.
本発明の目的は上記問題を解決し、更にジャケット強度
を増大することにある。The purpose of the present invention is to solve the above problems and further increase the jacket strength.
上記目的は、ジャケットの断面構造を円とし、入水部分
に螺旋構造をもたすことにより、達成される。The above object is achieved by making the cross-sectional structure of the jacket circular and providing a spiral structure in the water entry portion.
入水部分の薄板を通過した冷却水は、進行方向に対し直
角方向に回転運動を与えられる。この回転運動を続けた
ままジャケット本体を通過する。The cooling water that has passed through the thin plate in the water entry section is given rotational motion in a direction perpendicular to the direction of travel. It passes through the jacket body while continuing this rotational movement.
この際の回転運動による渦流が、熱交換効率の向上と不
純物の付着の防止に寄与する。The vortex generated by the rotational movement at this time contributes to improving the heat exchange efficiency and preventing the adhesion of impurities.
以下、本発明の一実施例を図により説明する。 Hereinafter, one embodiment of the present invention will be described with reference to the drawings.
第１図に示す様に水冷ジャケット１は、入口２より冷却
水が入り、冷却水経路入口部分７を通過後、導水経路８
を通る際、基板４上の集積回路５の熱をフィン６を介し
て受は取り出口３より冷却水を出す。水冷ジャケット１
の構造は第２図に示す様に、螺旋を切った六８をもつ薄
板７と断面が円の導水経路をもつ本体１より成る。第３
図に穴の螺旋構造を示す。As shown in FIG. 1, cooling water enters the water cooling jacket 1 from an inlet 2, passes through a cooling water path inlet portion 7, and then enters a water guide path 8.
When passing through the cooling water, the heat from the integrated circuit 5 on the substrate 4 is received via the fins 6 and the cooling water is discharged from the outlet 3. water cooling jacket 1
As shown in FIG. 2, the structure consists of a thin plate 7 having a helical helix 78 and a main body 1 having a water guide path with a circular cross section. Third
The figure shows the spiral structure of the hole.
冷却水が第２図の螺旋を切った六８を通過する際に回転
運動を得て、ジャケット本体１へ流れ込み回転運動を続
けたままジャケットを通過する。When the cooling water passes through the spiral 68 shown in FIG. 2, it acquires a rotational motion, flows into the jacket body 1, and passes through the jacket while continuing its rotational motion.
本実施例によれば、この回転運動による渦流により効率
よく熱交換ができるとともに冷却水中の不純物の付着を
防止する効果がある。また、ジャケットの断面構造を円
にすることにより機械的強度が増大する。According to this embodiment, the vortex flow caused by this rotational movement allows for efficient heat exchange and has the effect of preventing the adhesion of impurities in the cooling water. Furthermore, mechanical strength is increased by making the cross-sectional structure of the jacket circular.
本発明によれば、水冷ジャケットと冷却水との熱交換の
効率が上がるので、ＬＳＩモジュールの冷却能力が向上
する。According to the present invention, the efficiency of heat exchange between the water cooling jacket and the cooling water is increased, so that the cooling capacity of the LSI module is improved.
第１図は本発明の一実施例の全体図、第２図は第１図の
構造説明図、第３図は第２図の螺旋を切った穴の拡大図
である。
１・・水冷ジャケット本体、７・・・薄板、８・・・螺
旋を切った穴。
第１に
コ
ルー２￥ンシ）゛ヤブ、ト
２− 玲１１７７臥口
３〜・−冷却２に上口
４′−−−モ、う４．−Ｊし基イ１シ。
ｊ−・−年槓囚発
６− 放熱フィン
７・−水冷う￥ブ、ＶＸ口奪板
３−導入慢
づ
第５０FIG. 1 is an overall view of an embodiment of the present invention, FIG. 2 is an explanatory view of the structure of FIG. 1, and FIG. 3 is an enlarged view of the spiral hole shown in FIG. 1. Water cooling jacket body, 7. Thin plate, 8. Spiral cut hole. First, the first thing to do is 2 yen) Yabu, To 2 - Rei 1177 Lie 3 - - Cooling 2 and Upper mouth 4' - - Mo, U 4. - Jshi base 1shi. J-・-2019 release 6- Heat dissipation fin 7--Water cooling, VX mouth removal board 3-Introduction 50th
Claims (1)
ケージから発生する熱を、冷却水が流れるようになった
複数の水冷ジャケットにより冷却するような集積回路の
冷却構造において、水冷ジャケットの冷却水経路入口部
分に螺旋を切った穴をもち、その穴を通過した冷却水の
導水経路の断面が円であることを特徴とするＬＳＩモジ
ュール用水冷ジャケット。1. In an integrated circuit cooling structure where heat generated from multiple integrated circuit packages mounted and mounted on a circuit board is cooled by multiple water cooling jackets through which cooling water flows, the cooling water path of the water cooling jacket is A water cooling jacket for an LSI module, which has a spiral hole in the inlet portion, and has a circular cross-section of a cooling water guide path passing through the hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17090388A JPH0221643A (en) | 1988-07-11 | 1988-07-11 | Water cooling jacket for LSI module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17090388A JPH0221643A (en) | 1988-07-11 | 1988-07-11 | Water cooling jacket for LSI module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0221643A true JPH0221643A (en) | 1990-01-24 |
Family
ID=15913472
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17090388A Pending JPH0221643A (en) | 1988-07-11 | 1988-07-11 | Water cooling jacket for LSI module |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0221643A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0787274B2 (en) * | 1990-03-30 | 1995-09-20 | ラインメタル ゲゼルシャフト ミット ベシュレンクテル ハフツング | Circuit board for power electronics |
-
1988
- 1988-07-11 JP JP17090388A patent/JPH0221643A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0787274B2 (en) * | 1990-03-30 | 1995-09-20 | ラインメタル ゲゼルシャフト ミット ベシュレンクテル ハフツング | Circuit board for power electronics |
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