JPH04214658A - semiconductor equipment - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device in which a lead frame including a frame portion for mounting a chip and a lead portion for outputting signals from the chip is packaged.

0002

[Prior Art] Figures 5(a) and 5(b) show a semiconductor device (
(hereinafter referred to as LSI) is a diagram showing the basic configuration of (a
) is a schematic perspective view showing the structure of the lead frame, (b
) is a perspective view showing an example of the shape of a conventional LSI. As shown in FIG. 5(a), the lead frame 1 includes a frame portion 2 on which a chip 10 is mounted, a lead portion 3 that outputs a signal from the chip 10, and an electrical connection between the chip 10 and the lead portion 3. It is constituted by a wire 4.

[0003] The LSI 40 is made into an LSI by solidifying a portion of the lead portion 3 of the lead frame 1 and a portion other than the terminal portion 3a provided at the tip thereof with a package 5 made of epoxy resin or the like. Figure 5(b)
shows an example of the shape of a conventional LSI 40 manufactured in this manner.

0004

[Problems to be Solved by the Invention] The conventional LSI 40 is
Most of the lead frame 1 is covered with a package 5 made of epoxy resin or the like, but since this epoxy resin has poor thermal conductivity, there is a drawback that heat generated by the chip 10 tends to be trapped inside the package 5. If the heat dissipation from the package 5 is insufficient and it gets trapped inside,
As time passes, the temperature inside the package 5 increases more and more, causing the LSI 40 to malfunction and, in the worst case, to breakage.

The present invention aims to realize a semiconductor device with significantly improved heat dissipation efficiency compared to conventional devices by providing means for dissipating heat generated by the chip 10 in a bypass manner.

[0006]

[Means for Solving the Problems] The LSI according to the present invention has the following features:
■As shown in FIG. 1, an elastic member 11 for heat dissipation is arranged such that one end contacts the frame portion 2 of the lead frame 1 and the other end is exposed to the outside of the package 5. (hereinafter referred to as LSI20) and ■Figure 3
As shown in FIG. 2, a coolant distribution pipe 16 is provided, in which only the opening surfaces at both ends are exposed to the outside of the package 5, and the other portions are arranged in close contact with the frame portion 2 of the lead frame 1 ( (hereinafter referred to as LSI 20A); and (hereinafter referred to as LSI 20B) equipped with a coolant distribution groove 18 as an alternative to the distribution pipe 16 as shown in FIG. However, all of these devices are equipped with means for dissipating the heat generated by the chip 10 to the outside in a bypass manner, as described above.

[0007]

[Operation] Each of these LSIs 20, 20A, and 20B is equipped with a means for dissipating the heat generated by the chip 10 to the outside in a bypass manner. The LSI 20A is equipped with an elastic member 11 arranged in such a way that the other end is exposed to the outside of the package 5, and only the opening surface that serves as the entrance and exit for the coolant is exposed to the outside of the package 5. , other parts are equipped with a coolant distribution pipe 16 arranged in close contact with the frame part 2, and ■ LSI 20
B is equipped with a coolant flow groove 18 as a substitute for the flow pipe 16], so heat dissipation is significantly activated.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in detail below with reference to embodiment figures. Figure 1 (a), (b), (c) and (d)
1 is a diagram showing a first embodiment of an LSI according to the present invention, in which (a) is a perspective view showing the structure of a lead frame part;
(b) is a perspective view showing an example of the shape of the leaf spring attached to this lead frame part, (c) is a perspective view showing the state immediately after packaging, (d) is a perspective view showing the completed state, and FIG. This is a schematic side cross-sectional view showing the mounting state of this LSI, in which the same parts as in FIG. 5 are given the same reference numerals.

FIGS. 1(a), (b), (c) and (
d) As shown in FIG. (referred to as a leaf spring 11). The leaf spring 11, which is attached to the frame portion 2 of the lead frame 1 in the form shown in FIG. Manufactured. This leaf spring 11 is attached to the frame portion 2 using, for example, an electric welding means known as a spot welding method, but this attachment means is not specified.

The lead frame 1 after the plate spring 11 is attached is as follows:
As shown in FIG. 1(c), the package 5 together with the leaf spring 11 hardens the surrounding area. Note that at this time, the leaf spring 11 remains in an upright state, but after that it is moved as shown by arrow C.
bend it in the direction shown in Figure 1(d). This plastic working potentially imparts a repulsive force in the direction of arrow C' to the leaf spring 11.

FIG. 2 is a diagram showing the state in which this LSI 20 is mounted, in which 50 indicates boards arranged in upper and lower stages with spacers 51 interposed therebetween, and 60 indicates a box that accommodates the entire board. The LSI 20 mounted on the board 50 is a leaf spring 1 whose exposed end is brought into contact with the box 60 by its own repulsive force.
The internal heat is released to the box 60 side through 1. In addition, box 6
0 is manufactured using a material with good thermal conductivity, such as an iron plate or a copper alloy plate, so that the LSI 20 mounted on the substrate 50 is efficiently cooled.

FIGS. 3(a), 3(b), and 3(c) are diagrams showing a second embodiment of the LSI according to the present invention, in which (a)
2 is a perspective view showing the structure of the lead frame section, FIG. 1B is a perspective view showing the packaged state of the lead frame section, and FIG. As shown in FIG. 3(a), this LSI 20A is arranged such that only the opening surfaces at both ends thereof are exposed from the side end surfaces of the package 5, and the outer peripheral surface is in close contact with the frame portion 2 of the lead frame 1. It is equipped with a coolant distribution pipe 16. This coolant distribution pipe 16
is made of a copper pipe or the like with good thermal conductivity, so the heat generated in the chip 10 is transferred to the coolant 15 through the heat transfer course of the chip 10 → frame part 2 → coolant distribution pipe 16 → coolant 15. The coolant 15 flows upward and is discharged to the outside.

In the figure, reference numeral 17 indicates air bubbles generated by the heat generation of the chip 10. If these air bubbles 17 adhere, the cooling efficiency will be significantly inhibited, but in the case of this LSI 20A, the cooling liquid 15 is Since convection is activated, air bubbles 17 will not remain in the coolant distribution pipe 16. This LSI 20A is particularly effective when applied to a liquid-cooled LSI that cools by flowing the cooling liquid 15.

FIGS. 4(a) and 4(b) show L according to the present invention.
FIG. 3 is a diagram showing a third embodiment of the SI, in which (a) is a perspective view showing an example of the shape of a completed product, and (b) is a side sectional view of a main part showing a detailed internal structure. As shown in FIGS. 4(a) and 4(b), this LSI 20B has a coolant flow groove 18 along the frame portion 2 of the lead frame 1 instead of the coolant flow pipe 16 in the second embodiment. Equipped. Note that this coolant flow groove 18 provided in a part of the package 5 is formed when the lead frame 1 is packaged.

Since the coolant flow groove 18 is provided adjacent to the frame portion 2, one wall surface is the frame portion 2 itself on which the chip 10 is mounted. Therefore, the heat generated in the chip 10 is almost directly transferred to the coolant 15, so that the heat dissipation efficiency is particularly good. This LSI20B is also effective when applied to liquid-cooled LSI.

[0016]

Effects of the Invention Since the LSI according to the present invention is provided with means for radiating heat generated by the chip in a bypass manner, the internal temperature thereof will not rise abnormally. Therefore, the operation of this LSI is extremely stable.

[Brief explanation of the drawing]

FIG. 1 is a diagram showing a first embodiment of an LSI according to the present invention, in which (a) is a perspective view showing the structure of a lead frame section, and (b) is a perspective view of a leaf spring attached to this lead frame section. (c) is a perspective view showing a state after packaging; (d) is a perspective view showing a completed state.

FIG. 2 is a schematic side sectional view showing a mounting state of an LSI according to the present invention.

FIG. 3 is a diagram showing a second embodiment of the LSI according to the present invention, in which (a) is a perspective view showing the structure of the lead frame part, and (b) shows the state when this lead frame part is packaged. A perspective view, and (c) a side sectional view of the main part showing the detailed structure of the lead frame part.

FIG. 4 is a diagram showing a third embodiment of the LSI according to the present invention, in which (a) is a perspective view showing an example of the shape of the finished product;
(b) is a side sectional view of the main part showing the detailed internal structure.

[Fig. 5] Diagrams showing the basic configuration of a semiconductor device (hereinafter referred to as LSI), in which (a) is a schematic perspective view showing the structure of a lead frame, and (b) shows an example of the shape of a conventional LSI. FIG.

[Explanation of symbols]

1 Lead frame 2 Frame portion 3 Lead portion 3a Terminal portion 4 Wire 5 Package 10 Chip 11 Leaf spring (elastic member) 15 Coolant 16 Coolant distribution pipe 17 Air bubble 18 Coolant distribution groove 20, 20A, 20B, 40 LSI ( semiconductor devices)
50 board 51 spacer 60 box

Claims (3)

[Claims] 1. A lead frame (2) comprising a frame part (2) on which a chip (10) is mounted, and a lead part (3) for outputting a signal from the chip (10).
In a semiconductor device formed by solidifying 1) with a package (5), one end of the semiconductor device contacts the frame part (2) covered with the package (5), and the other end contacts the outside of the package (5). A semiconductor device characterized in that it is equipped with an elastic member (11) arranged in such a manner as to be exposed to the elastic member (11). 2. A lead frame (1) comprising a frame part (2) on which a chip (10) is mounted and a lead part (3) that outputs a signal from the chip (10).
) in a package (5), only the openings at both ends of the package (5)
is exposed from the side end surface of the lead frame (1
2. The semiconductor device according to claim 1, further comprising a coolant distribution pipe (16) disposed in close contact with the frame portion (2) of the semiconductor device. 3. The semiconductor device according to claim 1, further comprising a coolant flow groove (18) as a substitute for the coolant flow pipe (16).