JPH02215180A - Hybrid integrated circuit and manufacture thereof - Google Patents

Abstract

PURPOSE:To prevent an assembly operation from deteriorating in efficiency even if a different type of a board is transferred onto an assembly line by a method wherein a conductive path of a metal foil formed in required shape is formed on a hybrid integrated circuit board, and a symbol mark containing a specified data is provided to a specified position on the board when two or more circuit elements are fixed to the conductive path. CONSTITUTION:A conductive path 2 of a required shape is formed on the surface of an rectangular insulating board 1 corresponding to a region 3 which grows to be an individual board, and a specified circuit element is fitted to the conductive path 2. It is important that an individual symbol mark 4 corresponding to the conductive path 2 is printed in bar code on a blank region located at the edge of the individual board region 3 at the same time when the conducive path 2 is formed through a screen printing technique. The symbol mark 4 is not necessary to be printed in bar code, but it may be represented by a hole located in the region 3 which enables the formation of a pattern to be easily recognized. By this setup, a circuit element is mounted basing on the symbol mark 4, whereby an assembly operation is stably executed and can be fully automated.

Description

DETAILED DESCRIPTION OF THE INVENTION (a) Field of Industrial Application The present invention relates to a hybrid integrated circuit, and more particularly to a hybrid integrated circuit and a manufacturing method thereof that are effective in serially producing hybrid integrated circuits having different functions.

(B) Conventional technology In conventional hybrid integrated circuits, a conductive path of a desired shape is formed on a substrate made of ceramics or insulating metal, and multiple circuit elements such as printed resistors, transistors, and ICs are placed at predetermined positions on the conductive path. Hybrid integrated circuits have been provided with attached and predetermined functions.

When manufacturing such a hybrid integrated circuit, there are three steps: preparing a predetermined substrate, forming a conductive pattern on the substrate, forming a printed resistor between the conductive patterns, and forming a chip-shaped circuit on the conductive pattern. A predetermined hybrid integrated circuit is formed on an assembly line having a plurality of assembly steps including the step of attaching elements.

(c) Problems to be Solved by the Invention In the conventional hybrid integrated circuit described above, the type or product of the hybrid integrated circuit is determined using the pattern shape of the conductive pattern. When manufacturing a hybrid integrated circuit as described above, substrates of the same type, that is, having the same conductive pattern, are usually transported to an assembly line and subjected to predetermined assembly.

However, substrates of the same type are not necessarily transported on the same assembly line; in actual manufacturing, substrates having different types of conductive patterns are transported and assembled on the assembly line. In this case, if there are different processes within the same process section, for example, if the positions of the resistors are different when forming the printed resistor, or if the number of resistors is different, humans will have to manually distribute the work. There was a problem in that the work efficiency and work efficiency were significantly reduced.

(d) Means for Solving the Problems The present invention has been made in view of the above-mentioned problems, and includes a hybrid integrated circuit board formed into a desired shape, and a metal foil formed on the hybrid integrated circuit board. In a hybrid integrated circuit comprising a conductive path having a desired shape and a plurality of circuit elements fixed on the conductive path, a marker symbol having a desired shape is provided at a predetermined position on the hybrid integrated circuit board, and the marker symbol is to assemble and solve hybrid integrated circuits.

(*) Effect In this way, by providing a marker symbol at a predetermined position on a hybrid integrated circuit board and assembling a hybrid integrated circuit using the symbol symbol, boards having different assembly processes are transported on the assembly line. Even if the assembly process is performed based on the data predetermined by the marking symbol, the assembly process can be carried out efficiently.

(F) Embodiments The hybrid integrated circuit of the present invention and its manufacturing method will be explained in detail below based on the embodiments shown in the drawings.

As shown in FIG. 1, the hybrid integrated circuit of the present invention includes a hybrid integrated circuit board (5) made of ceramics or insulated metal, and an insulating resin layer (not shown) such as epoxy resin on the board (5). A conductive path of desired shape formed through (
2) and a plurality of circuit elements (
7) and a marker symbol (4) provided at a predetermined position on the substrate (5).

The manufacturing method will be described below based on FIGS. 2A to 4130.

First, as shown in FIG. 2A, a strip-shaped insulating substrate (1) is prepared, and areas (within dotted lines) that will become individual substrates on the main surface of the substrate (1) (3)...(3) ) with the desired shape of the conductive path (
2)...(2) is formed. The insulating substrate (1) is made of a metal such as aluminum with a thickness of 0.5 to 1.0 mm, and an aluminum oxide film (not shown) is formed on the surface of the aluminum substrate (1) by well-known anodic oxidation. Furthermore, conductive paths (
2)...(2) is formed. A conductive metal foil, for example a copper foil, is adhered onto the substrate (1). The surface of the metal foil is screen printed to expose the desired conductive paths (2)...(2) and masked with a resist, and then coated with noble metals (gold, silver, platinum).
A plating layer is plated on the surface of the metal foil. Thereafter, the resist is removed and the metal foil is etched using the noble metal plating layer as a mask to form desired conductive paths (2) and -(2). The thinness of the conductive paths (2) and -(2) by screen printing is limited to 0.51 mm, so when ultra-fine wiring is required, the ultra-fine conductive paths (2 )...(2) can be formed.

The important point in this process is that each conductive path (2) is
...Print the individual indicator symbol (4) corresponding to (2). That is, a bar code is printed in the margin area of the etched portion in the individual substrate areas (3)...(3), and an indicator symbol (4) is formed when patterning the copper foil. Since the marker symbol (4) is formed of copper foil, a Ni plating film is formed on its surface by a predetermined plating process to prevent corrosion.

FIG. 4 is an enlarged view showing the marker symbol (4), in which a bar code symbol, which is the minimum data necessary for the assembly process, is shown using copper foil. In the case of the marker symbol (4), since microfabrication is required, it is formed by photolithography.

Furthermore, the sign symbol (4) is not only based on the barcode symbol shown in Fig. 4, but also the barcode, that is, the sign symbol (
4) can be dealt with by recognizing the external shape pattern.

For the marking symbols (4) formed on the plurality of individual board areas (3)...(3), if the assembly process on the assembly line is different, marking symbols (4) with different barcodes or data are formed. If the process is the same, an indicator symbol (4) having the same data is formed. The data of the indicator symbol (4) is recognized by a predetermined recognition device before each assembly process to be described later, and each process is performed.

Further, as described above, the marker symbol (4) is not limited to a bar code having day and night, but each assembly process can also be selected based on the external pattern shape of the marker symbol (4).

In the above, the marking symbol (4) using copper foil has been explained, but as shown in Fig. 3, a hole (4゛) of a desired shape is formed in the individual board area (3). It is also possible to select each process by recognizing the external pattern shape of '). As mentioned above, the marker symbol (4) can be placed anywhere as long as it is a blank area, but in order to effectively use the pattern area, it is formed at the peripheral edge of the individual substrate areas (3) and -(3). It is preferable that the case material is fixed to the peripheral end portion later, so that there is no problem in reducing the pattern area during pattern formation.

Next, as shown in FIG. 2B, the individual substrate area (3)...
Press punching is performed on the peripheral edge of 3) using a male mold to separate it into a plurality of individual integrated circuit boards (5)...(5)0
A plurality of separated individual integrated circuit boards (5)...(5)
are boards having at least different assembly processes, and are transported to an assembly line having a predetermined assembly process to assemble a hybrid integrated circuit having a desired function.

The assembly process includes a resistor formation process to form a printed resistor body 6) having a predetermined resistance value, a bonding process to place the semiconductor element (7) and chip components on the conductive path (2), and a bonding process to place the semiconductor element (7) and chip components on the conductive path (2). A wire bonding process that connects the electrode (7) and the corresponding conductive path (2) with a gold or aluminum bonding wire, and a circuit function test and characteristic test.
The inspection process includes functional trimming and the like. In the resistor forming step, a resistor paste is screen printed between predetermined conductive paths (2) using a silk mask and then baked. In the wire bonding process, a semiconductor element (7) such as a semiconductor integrated circuit is fixed to a desired position of a conductive path (2) using a conductive paste, and a chip component (not shown) is soldered in a zero-order wire bonding process. Then, an automatic digital bonder device automatically connects the electrodes of the semiconductor element (7) and the conductive paths (2) with bonding wires by ultrasonic bonding or nail-to-nail rad bonding while recognizing patterns.

Next, as shown in FIG. 2C, the resistor forming step of the above-mentioned assembly process is performed at predetermined positions on the plurality of integrated circuit boards (5)...(5) transported on the transport rail. On the transport rail are boards (5) with different assembly processes...
5) is being transported, and a predetermined process is selected using the indicator symbol (4).

In this embodiment, the printed resistor forming process includes three screen printing processes, and screen A has 100 screen printing processes.
Ω, IKΩ on screen B, IOK on screen C
For example, on each substrate (5), print a resistor having a resistance value of 100Ω, IKΩ and IOKΩ, 100Ω.
When forming Ω, IKΩ, and 10Ω, conventionally A,
For products that do not require the three steps of B and C, M9 classification was performed manually, but in the present invention, before the printing process, the marking symbol (4) is divided into optical or Xs using a recognition device (8). The predetermined data of the numerical code of the marker symbol (4) (bar food) is recognized by the operator, and the resistor is selected and printed based on the data. That is, the recognition device (8)
and the printed resistor forming apparatus are connected by a predetermined connecting means, and the data of the recognized sign symbol (4) is supplied to the control device of the resistor forming apparatus, and the screen processes A, B, and C are performed based on the data. Alternatively, a combination of these screening processes can be selected.

For example, in the marking symbol (4) formed on the substrate (5'), A
, B, and C are performed on the substrate (5''), and the screen process A is performed on the substrate (5'').

Next, as shown in the second diagram, after forming the resistor, multiple substrates (
5)...(5) is transported to a bonding process and the circuit element (7) of the chip component is fixed. In this step as well, the marker symbol (4) is recognized by the recognition device (8) in the same way as the step in FIG.
can be selected and fixed.

By recognizing the mark symbol (4) before the assembly process, a process based on the data of the symbol (4) can be selected and performed, and the manufacturing process can be carried out smoothly.

Although this embodiment has been explained using the printed resistor forming process and the bonding process, it can also be used in each process on the same assembly line, and can also be used, for example, in the resistor trimming process. It can be used while

(G) Effects of the Invention As detailed above, according to the present invention, even if boards having different assembly processes are transported on the assembly line, the marking symbols provided on the boards in advance can be recognized. ,
The process determined by that data can be performed and a stable assembly process can be performed.

Furthermore, in the present invention, each process is selected by recognizing the sign symbol, so that the manufacturing line can be completely automated and work efficiency is significantly improved.

[Brief explanation of the drawing]

FIG. 1 is an assembled perspective view showing the hybrid integrated circuit of the present invention, FIGS. 2A to 2 and 3 are process diagrams for manufacturing the hybrid integrated circuit shown in FIG. FIG. 3 is an enlarged view showing the indicator symbols used in the example; (5)...Hybrid integrated circuit board, (4)...Label symbol, (2)...Conducting path.

Claims (11)

[Claims] (1) A hybrid integrated circuit board formed in a desired shape, a conductive path in a desired shape formed of metal foil on the hybrid integrated circuit board, and a plurality of circuit elements fixed on the conductive path. A hybrid integrated circuit, characterized in that an indicator symbol having predetermined data is provided at a predetermined position on the hybrid integrated circuit board. (2) The hybrid integrated circuit according to claim 1, wherein the sign symbol is formed from the metal foil. (3) The hybrid integrated circuit according to claim 1, wherein the indicator symbol is a hole provided in the hybrid integrated circuit board. (4) The hybrid integrated circuit according to claim 2 or 3, wherein the indicator symbol is formed in a fixed area of a case material fixed to the hybrid integrated circuit board or in a fixed area to which an external lead terminal is fixed. circuit. (5) preparing a hybrid integrated circuit board with a desired shape; forming conductive paths and marking symbols with a desired shape from metal foil on the hybrid integrated circuit board; and reading the marking symbols with a predetermined reading device. A method for manufacturing a hybrid integrated circuit, comprising the steps of: performing a predetermined assembly process on an assembly line based on the data of the sign read by the device. (6) The method of manufacturing a hybrid integrated circuit according to claim 5, wherein hybrid integrated circuit boards having different types of assembly processes are transported to the assembly line. (7) a step of preparing a plurality of hybrid integrated circuit boards having a desired shape; a step of forming conductive paths and marking symbols of a desired shape with metal foil on the hybrid integrated circuit board; and a step of using a predetermined reading device to read the marking symbols. and forming a printed resistor between predetermined conductive paths of each of the plurality of hybrid integrated circuit boards based on the data of the symbol read by the device. A method for manufacturing a hybrid integrated circuit. (8) The method for manufacturing a hybrid integrated circuit according to claim 7, wherein the printed resistors are formed at at least one location with different values. (9) a step of preparing a plurality of hybrid integrated circuit boards having a desired shape; a step of forming conductive paths and sign symbols of a desired shape with metal foil on the hybrid integrated circuit board; forming a printed resistor between each predetermined conductive path; reading the marker symbol with a predetermined reading device; and trimming the printed resistor based on the data of the marker symbol read by the device. 1. A method for manufacturing a hybrid integrated circuit, comprising the step of making an adjustment. (10) A step of preparing a plurality of hybrid integrated circuit boards having a desired shape, a step of forming conductive paths and marking symbols of a desired shape using metal foil on the hybrid integrated circuit board, and a step of using a predetermined reading device to read the marking symbols. and placing a plurality of chip components on a predetermined conductive path of each of the plurality of hybrid integrated circuit boards based on the data of the sign read by the device. manufacturing method. (11) The hybrid integrated circuit and its manufacturing method according to claim 1, 5, 7, 9, or 10, wherein the indicator symbol uses a bar code.