JP2006134910A - Printed circuit board manufacturing method - Google Patents
Printed circuit board manufacturing method Download PDFInfo
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- JP2006134910A JP2006134910A JP2004318831A JP2004318831A JP2006134910A JP 2006134910 A JP2006134910 A JP 2006134910A JP 2004318831 A JP2004318831 A JP 2004318831A JP 2004318831 A JP2004318831 A JP 2004318831A JP 2006134910 A JP2006134910 A JP 2006134910A
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- Prior art keywords
- circuit board
- printed circuit
- solder
- identification
- lead
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 24
- 238000000034 method Methods 0.000 claims abstract description 33
- 239000000758 substrate Substances 0.000 claims abstract description 5
- 229910000679 solder Inorganic materials 0.000 description 34
- 238000004140 cleaning Methods 0.000 description 10
- 238000002844 melting Methods 0.000 description 10
- 230000008018 melting Effects 0.000 description 10
- 238000012790 confirmation Methods 0.000 description 6
- 229910020816 Sn Pb Inorganic materials 0.000 description 4
- 229910020922 Sn-Pb Inorganic materials 0.000 description 4
- 229910008783 Sn—Pb Inorganic materials 0.000 description 4
- QCEUXSAXTBNJGO-UHFFFAOYSA-N [Ag].[Sn] Chemical compound [Ag].[Sn] QCEUXSAXTBNJGO-UHFFFAOYSA-N 0.000 description 3
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- GZCWPZJOEIAXRU-UHFFFAOYSA-N tin zinc Chemical compound [Zn].[Sn] GZCWPZJOEIAXRU-UHFFFAOYSA-N 0.000 description 3
- 238000003672 processing method Methods 0.000 description 2
- 229910017944 Ag—Cu Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
Images
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- Structure Of Printed Boards (AREA)
Abstract
【課題】 作業効率の向上や作業の迅速性の向上が図れるプリント基板の製造方法を提供する。
【解決手段】 本体部と廃棄部にて構成し、少なくとも前記廃棄部に製造工程の識別を表示した基板を備え、該表示に従って少なくとも２つに分岐して製造するステップを含むことを特徴とする。
【選択図】図２PROBLEM TO BE SOLVED: To provide a printed circuit board manufacturing method capable of improving working efficiency and working speed.
The method includes a step of forming a main body part and a disposal part, including at least a substrate on which an identification of a manufacturing process is displayed in the disposal part, and branching into at least two parts according to the display. .
[Selection] Figure 2
Description
本発明は、プリント基板の製造方法に関する。 The present invention relates to a method for manufacturing a printed circuit board.
従来技術では、プリント基板と部品とを接続する必要のある電子機器において、使用するはんだは一般的にＳｎ-Ｐｂはんだを使用しており、この融点は約１８０℃である。このためＳｎ-Ｐｂはんだ合金を使用する場合にはリフロー炉の温度プロファイルが共通であるため、製造工程を区別する必要がなかった。 In the prior art, in an electronic device that needs to connect a printed circuit board and a component, the solder to be used generally uses Sn—Pb solder, and its melting point is about 180 ° C. For this reason, when the Sn—Pb solder alloy is used, the temperature profile of the reflow furnace is common, so there is no need to distinguish the manufacturing process.
しかしながら、最近では、環境を配慮した鉛フリーはんだが多数提案され、はんだの種類により融点が異なる。例えばスズ−銅系の鉛フリーはんだの場合の融点は約２２０℃、スズ-銀系の鉛フリーはんだの場合の融点は約２１０℃、スズ-亜鉛系の鉛フリーはんだの場合の融点は約１９０℃である。 Recently, however, many environmentally friendly lead-free solders have been proposed, and the melting point differs depending on the type of solder. For example, the melting point in the case of tin-copper lead-free solder is about 220 ° C., the melting point in the case of tin-silver lead-free solder is about 210 ° C., and the melting point in the case of tin-zinc lead-free solder is about 190 ° C. ° C.
なお、プリント基板にバーコードを貼付し、その１桁目に、鉛等重金属含有の絶対量をバーコード化して表示する技術が、特許文献１で提案されている。
このようにはんだの種類により融点が異なるため、はんだを溶かすためのリフロー炉の温度プロファイルを区別する必要がある。また、後工程においてプリント基板にボンディング配線処理が必要な場合には、洗浄工程が必要となる場合がある。このように従来のＳｎ-Ｐｂはんだを含めはんだの種類ごとに製造工程を区別する必要があり、且つ後工程における洗浄、無洗浄の区別をする必要がある。 As described above, since the melting point differs depending on the type of solder, it is necessary to distinguish the temperature profile of the reflow furnace for melting the solder. Further, when a bonding wiring process is necessary for the printed circuit board in a subsequent process, a cleaning process may be necessary. As described above, it is necessary to distinguish the manufacturing process for each type of solder including the conventional Sn—Pb solder, and it is necessary to distinguish between cleaning and non-cleaning in the subsequent process.
またプリント基板を解体して廃棄する場合において、鉛フリーはんだか鉛入りはんだか、使用しているはんだを特定できれば、解体処理方法が明確となり分別廃棄が可能となる。 Further, when disassembling and disposing of the printed circuit board, if the lead-free solder, the solder containing lead, or the solder being used can be specified, the disassembly processing method becomes clear, and sorting and disposing becomes possible.
なお上記特許文献１においては、製造工程を識別することについてなんらふれていない。
In
本発明の目的は、作業効率の向上や作業の迅速性の向上が図れるプリント基板の製造方法を提供することにある。 An object of the present invention is to provide a printed circuit board manufacturing method capable of improving working efficiency and working speed.
本発明は、上記目的を達成するために、本体部と廃棄部にて構成し、少なくとも前記廃棄部に製造工程の識別を表示した基板を備え、該表示に従って少なくとも２つに分岐して製造するステップを含むことを特徴とする。 In order to achieve the above object, the present invention comprises a main body part and a disposal part, and includes at least a substrate on which the identification of the manufacturing process is displayed in the disposal part, and is manufactured by branching into at least two according to the display. Including steps.
本発明によれば、作業効率の向上や作業の迅速性の向上が図れるプリント基板の製造方法を得ることができる。 ADVANTAGE OF THE INVENTION According to this invention, the manufacturing method of the printed circuit board which can aim at the improvement of work efficiency and the quickness of work can be obtained.
本発明に係る実施の形態について、図１〜図２を用いて説明する。 Embodiments according to the present invention will be described with reference to FIGS.
図１は本発明の実施の形態によるプリント基板を示す図である。 FIG. 1 is a diagram showing a printed circuit board according to an embodiment of the present invention.
本発明の実施の形態は、プリント基板の任意の箇所、廃棄部のプリント基板１あるいは、本体（製品）部のプリント基板２上に、製造工程の識別を表示をする。
In the embodiment of the present invention, the identification of the manufacturing process is displayed on an arbitrary portion of the printed circuit board, the
例えばスズ−銅系の鉛フリーはんだの場合は融点約２２０℃、スズ-銀系の鉛フリーはんだの場合は融点約２１０℃、スズ-亜鉛系の鉛フリーはんだの場合は融点約１９０℃である。この３種類の鉛フリーはんだのリフロー炉の温度プロファイルは３種類となり、製造工程も３つに分けられる。 For example, in the case of tin-copper-based lead-free solder, the melting point is about 220 ° C, in the case of tin-silver-based lead-free solder, the melting point is about 210 ° C, and in the case of tin-zinc-based lead-free solder, the melting point is about 190 ° C. . The three types of lead-free solder reflow furnaces have three temperature profiles, and the manufacturing process is divided into three.
スズ−銅系の鉛フリーはんだの場合のリフロー炉の温度プロファイルを用いる工程をＡとする場合、その旨をプリント基板上に「Ａ」４と表記する。スズ-銀系の鉛フリーはんだの場合は「Ｂ」６と表記する。スズ-亜鉛系の鉛フリーはんだの場合は「Ｃ」７と表示する。 When the process using the temperature profile of the reflow furnace in the case of tin-copper-based lead-free solder is A, this is expressed as “A” 4 on the printed circuit board. In the case of tin-silver based lead-free solder, “B” 6 is indicated. In the case of tin-zinc based lead-free solder, “C” 7 is indicated.
また、後工程にボンディング工程があり基板洗浄が必要な場合は、その旨前述の表示の後に「Ｘ」３を表示しておく。基板洗浄が不要の場合は、その旨の「Ｙ」５を表記しておく。 If there is a bonding process in the subsequent process and substrate cleaning is required, “X” 3 is displayed after the above-mentioned display. When the substrate cleaning is not necessary, “Y” 5 to that effect is written.
このように本発明の実施の形態では、製造工程の識別を廃棄部のプリント基板１と本体部のプリント基板２上に表示する。
As described above, in the embodiment of the present invention, the identification of the manufacturing process is displayed on the printed
図２はプリント基板上に表示した製造工程の識別を使った，本発明の実施の形態によるプリント基板の製造方法の各工程を示す図である。 FIG. 2 is a diagram showing each step of the printed circuit board manufacturing method according to the embodiment of the present invention using the identification of the manufacturing process displayed on the printed circuit board.
まず２０１にて、部品配膳を行う。次に２０２にて、工程管理識別即ちプリント基板の表示によりはんだ印刷工程の確認識別を行う。次に２０３にて、はんだ印刷即ちはんだの種類に応じた分岐工程で各々はんだ印刷を行う。本実施の形態では、Ｓｎ−Ｐｂ印刷、Ｓｎ−Ａｇ−Ｃｕ印刷、Ｓｎ−Ａｇ−Ｃｕ−Ｉｎ印刷を行う。 First, at 201, parts are arranged. Next, at 202, confirmation and identification of the solder printing process is performed by process management identification, that is, display of the printed circuit board. Next, at 203, solder printing is performed in a branching process corresponding to the type of solder, that is, the type of solder. In this embodiment, Sn-Pb printing, Sn-Ag-Cu printing, and Sn-Ag-Cu-In printing are performed.
次に２０４にて、工程管理識別即ちプリント基板の表示によりリフロー工程の確認識別を行う。次に２０５にて、リフロー条件に応じた分岐工程でリフローを行う。 Next, at 204, confirmation of the reflow process is performed by process management identification, that is, display of a printed circuit board. Next, at 205, reflow is performed in a branching process according to the reflow conditions.
次に２０６にて、工程管理識別即ちプリント基板の表示により洗浄の有無の確認識別を行う。次に２０７にて、洗浄の有無に応じた分岐工程で、洗浄の有の箇所の洗浄作業を行う。 Next, at 206, process management identification, that is, confirmation identification of the presence or absence of cleaning is performed by displaying the printed circuit board. Next, in 207, a cleaning operation is performed on a portion where the cleaning is performed in a branching process according to the presence or absence of the cleaning.
次に２０８にて、工程管理識別即ちプリント基板の表示によりワイヤーボンディングの有無の確認識別を行う。次に２０９にて、ワイヤーボンディングの有無に応じた分岐工程で、ワイヤーボンディングの有の箇所のワイヤーボンディングを行う。 Next, at 208, process management identification, that is, confirmation identification of presence / absence of wire bonding is performed by displaying the printed circuit board. Next, at 209, wire bonding is performed at a location where there is wire bonding in a branching process according to the presence or absence of wire bonding.
このように、廃棄部のプリント基板１と本体部のプリント基板２上に表示した製造工程の識別を使うことで、製造工程の明確化、製造工程ミスの削除、作業者が表示を理解し製造工程をその場で認識することによる作業効率の向上、作業の迅速性の向上が図れる。
In this way, by using the identification of the manufacturing process displayed on the printed
図３はプリント基板上に表示した製造工程の識別のうちの鉛フリーはんだか鉛入りはんだかの識別を用いた，本発明の実施の形態による解体方法の各工程を示す図である。 FIG. 3 is a diagram showing each step of the disassembling method according to the embodiment of the present invention using identification of lead-free solder or lead-containing solder among the identification of manufacturing processes displayed on the printed circuit board.
まず３０１にて、工程管理識別即ちプリント基板の表示により解体工程の確認識別を行う。次に３０２にて、解体即ち解体処理条件（鉛フリーか鉛含有）に応じた分岐工程で各々分解を行う。 First, at 301, confirmation of the dismantling process is performed by process management identification, that is, display of a printed board. Next, at 302, each is disassembled in a branching step according to dismantling, that is, dismantling processing conditions (lead-free or lead-containing).
次に３０３にて、分解即ち基板と部品の分解の有無を確認する。次に３０４にて、基板と部品に分解する。そのことで、基板と部品毎に、廃棄かリサイクルかを決める。 Next, at 303, it is confirmed whether or not there is any disassembly, that is, disassembly of the board and components. Next, at 304, the board and components are disassembled. Therefore, it is decided whether to discard or recycle for each board and component.
このように、プリント基板を解体する場合、プリント基板上の表示により、鉛フリーはんだか鉛入りはんだか使用しているはんだの種類が特定できるため、解体処理方法が明確となり分別廃棄が可能となる。 In this way, when disassembling a printed circuit board, the type of solder used, whether it is lead-free solder or lead-containing solder, can be specified from the display on the printed circuit board, so that the disassembly processing method becomes clear and segregated disposal becomes possible. .
１：廃棄部のプリント基板、２：本体部のプリント基板、３，４，５，６，７：表示部、２０１：部品配膳、２０２：工程管理識別、２０３：はんだ印刷、２０４：工程管理識別、２０５：リフロー、２０６：工程管理識別、２０７：洗浄、２０８：工程管理識別、２０９：ワイヤーボンディング、３０１：工程管理識別、３０２：解体、３０３：分解確認、３０４：分解。 1: Printed circuit board of disposal section, 2: Printed circuit board of main body section, 3, 4, 5, 6, 7: Display section, 201: Component layout, 202: Process management identification, 203: Solder printing, 204: Process management identification 205: reflow, 206: process management identification, 207: cleaning, 208: process management identification, 209: wire bonding, 301: process management identification, 302: disassembly, 303: disassembly confirmation, 304: disassembly.
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|---|---|---|---|
| JP2004318831A JP2006134910A (en) | 2004-11-02 | 2004-11-02 | Printed circuit board manufacturing method |
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| JP2004318831A JP2006134910A (en) | 2004-11-02 | 2004-11-02 | Printed circuit board manufacturing method |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02215180A (en) * | 1989-02-16 | 1990-08-28 | Sanyo Electric Co Ltd | Hybrid integrated circuit and manufacture thereof |
| JPH04286180A (en) * | 1991-03-14 | 1992-10-12 | Nec Corp | Printed wiring board and printed wiring board discriminator |
| JPH1084176A (en) * | 1996-09-09 | 1998-03-31 | Hitachi Telecom Technol Ltd | Etching equipment for printed wiring boards |
| JP2000223830A (en) * | 1999-01-28 | 2000-08-11 | Sony Corp | Printed wiring board |
| JP2001284752A (en) * | 2000-03-30 | 2001-10-12 | Konica Corp | Substrate having identification display and camera mounting the same |
| JP2002094198A (en) * | 2000-09-11 | 2002-03-29 | Sharp Corp | Use member of solder |
-
2004
- 2004-11-02 JP JP2004318831A patent/JP2006134910A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02215180A (en) * | 1989-02-16 | 1990-08-28 | Sanyo Electric Co Ltd | Hybrid integrated circuit and manufacture thereof |
| JPH04286180A (en) * | 1991-03-14 | 1992-10-12 | Nec Corp | Printed wiring board and printed wiring board discriminator |
| JPH1084176A (en) * | 1996-09-09 | 1998-03-31 | Hitachi Telecom Technol Ltd | Etching equipment for printed wiring boards |
| JP2000223830A (en) * | 1999-01-28 | 2000-08-11 | Sony Corp | Printed wiring board |
| JP2001284752A (en) * | 2000-03-30 | 2001-10-12 | Konica Corp | Substrate having identification display and camera mounting the same |
| JP2002094198A (en) * | 2000-09-11 | 2002-03-29 | Sharp Corp | Use member of solder |
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