JPH0220156B2 - - Google Patents
Info
- Publication number
- JPH0220156B2 JPH0220156B2 JP12820484A JP12820484A JPH0220156B2 JP H0220156 B2 JPH0220156 B2 JP H0220156B2 JP 12820484 A JP12820484 A JP 12820484A JP 12820484 A JP12820484 A JP 12820484A JP H0220156 B2 JPH0220156 B2 JP H0220156B2
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- conductor circuit
- insulating layer
- metal plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910052751 metal Inorganic materials 0.000 claims description 27
- 239000002184 metal Substances 0.000 claims description 27
- 239000004020 conductor Substances 0.000 claims description 18
- 239000002131 composite material Substances 0.000 claims description 16
- 239000010410 layer Substances 0.000 claims description 15
- 238000001816 cooling Methods 0.000 claims description 9
- 239000012790 adhesive layer Substances 0.000 claims description 5
- 238000005304 joining Methods 0.000 claims description 5
- 239000000758 substrate Substances 0.000 description 15
- 239000000853 adhesive Substances 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 8
- 230000000694 effects Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 229920001721 polyimide Polymers 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 238000009413 insulation Methods 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 239000009719 polyimide resin Substances 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000003801 milling Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000012809 cooling fluid Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229920003192 poly(bis maleimide) Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、金属板上に絶縁層を介して導体回路
の形成されたプリント配線板（以下金属基板と称
する）とフレキシブルプリント配線板とを接続し
たプリント配線板（以下複合プリント配線板と称
する）に関する。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a printed wiring board (hereinafter referred to as a metal board) in which a conductive circuit is formed on a metal plate via an insulating layer, and a flexible printed wiring board. The present invention relates to a connected printed wiring board (hereinafter referred to as a composite printed wiring board).
特開昭58−9399号公報には、第４図の如く、金
属板イの表面にフレキシブルプリント配線板ロを
貼着するプリント配線板の製造方法が開示されて
いる。
JP-A-58-9399 discloses a method for manufacturing a printed wiring board, in which a flexible printed wiring board (2) is attached to the surface of a metal plate (1), as shown in FIG.
従来の技術に記載のプリント配線板は、スルホ
ールを介して両面に導体回路が形成された従来の
プリント配線板と配線密度が同等であり、しかも
このプリント配線板上にのみ電子部品の搭載可能
な導体回路が存在するという理由から、熱放散を
求められる電子部品をもこの熱伝導性の劣悪なプ
リント配線板上に搭載せざるをえなかつた。
The printed wiring board described in the prior art has the same wiring density as a conventional printed wiring board in which conductor circuits are formed on both sides via through holes, and electronic components can only be mounted on this printed wiring board. Because of the presence of conductive circuits, electronic components that require heat dissipation had to be mounted on printed wiring boards with poor thermal conductivity.
本発明は、このように従来技術では未だ得るこ
とができなかつた放熱性の良い、しかもプリント
配線板当たりの配線密度の限界を越えたプリント
配線板を提供することを目的とする。 It is therefore an object of the present invention to provide a printed wiring board which has good heat dissipation, which has not yet been possible with the prior art, and which exceeds the limit of the wiring density per printed wiring board.
以下本発明の複合プリント配線板を図面に基づ
いて具体的に説明する。本発明の複合プリント配
線板は第１図の縦断面図に示す如く、金属板１の
表面に絶縁層２が形成されており、その表面に導
体回路３が形成されており、スルホール４を有す
るフレキシブル基板５が接着層６および導通接続
部７を介して、該金属基板に搭載されていること
を特徴としている。前記金属板にはアルミニウ
ム、鉄、銅などがあり、加工性を考慮して板厚
は、1.0〜5.0mm程度が好ましい。前記絶縁層には
ポリイミド樹脂、エポキシ樹脂などの絶縁性樹脂
を使用し、妨熱性を考慮してその厚みは10〜
100μｍ程度が好ましい。さらに、アルミナやシ
リカなどの無機絶縁性フイラーを混入すると放熱
性が向上する。前記接着層には接着シート、接着
剤などがある。また、前記フレキシブル基板は、
ポリイミド樹脂基板ビスマレイミド、トリアジン
樹脂基板、耐熱エポキシ樹脂基板などがある。基
板厚みは、市販品の中から比較的自由に選択でき
るが、使用目的およびコストなどを考慮すると25
〜100μｍ程度が好ましい。そして、前記導通接
続部は、導電ペースト印刷、めつき、ソルダーコ
ートの中から少くとも１種以上の組合せにより形
成する。
The composite printed wiring board of the present invention will be specifically explained below based on the drawings. As shown in the longitudinal cross-sectional view of FIG. 1, the composite printed wiring board of the present invention includes an insulating layer 2 formed on the surface of a metal plate 1, a conductive circuit 3 formed on the surface, and a through hole 4. It is characterized in that a flexible substrate 5 is mounted on the metal substrate via an adhesive layer 6 and a conductive connection portion 7. The metal plate is made of aluminum, iron, copper, etc., and the plate thickness is preferably about 1.0 to 5.0 mm in consideration of workability. Insulating resin such as polyimide resin or epoxy resin is used for the insulating layer, and its thickness is 10 to 10 cm in consideration of heat blocking properties.
Approximately 100 μm is preferable. Furthermore, heat dissipation is improved by mixing an inorganic insulating filler such as alumina or silica. The adhesive layer includes an adhesive sheet, an adhesive, and the like. Further, the flexible substrate is
Examples include polyimide resin substrates, bismaleimide resin substrates, triazine resin substrates, and heat-resistant epoxy resin substrates. The board thickness can be selected relatively freely from commercially available products, but considering the purpose of use and cost, it is
The thickness is preferably about 100 μm. The conductive connection portion is formed by a combination of at least one of conductive paste printing, plating, and solder coating.
第２図は金属板の両面に導体回路を形成し、フ
レキシブル基板により両面接続を行つた本発明の
複合プリント配線板の一例である。 FIG. 2 is an example of a composite printed wiring board of the present invention in which conductor circuits are formed on both sides of a metal plate and connections are made on both sides using a flexible substrate.
前記フレキシブル基板の表面には、カバーレイ
１１が施されている。前記カバーレイは、導体回
路の保護および、金属板１の角部との接触による
電気絶縁性の低下を防ぐという目的を兼ねてい
る。 A coverlay 11 is provided on the surface of the flexible substrate. The coverlay serves both the purpose of protecting the conductor circuit and preventing deterioration of electrical insulation due to contact with the corners of the metal plate 1.
前記カバーレイは、ポリイミドフイルム、ポリ
エステルフイルムなどを使用する。本発明はこの
ようにその発明の構成を発展させることもでき、
金属基板の両面接続のために従来から実施されて
いた第６図の構成が持つ欠点、すなわちスルホー
ルヘのコーナー部トの絶縁層が薄くなり、かつ比
較的大きなＲがつくために絶縁性が悪く、かつ高
密度配線の妨げとなる欠点をも解決できる。 The coverlay may be made of polyimide film, polyester film, or the like. The present invention can also be developed in this way,
The drawbacks of the conventional structure shown in FIG. 6 for double-sided connection of metal substrates are that the insulating layer at the corner to the through-hole is thinner and has a relatively large radius, resulting in poor insulation. Moreover, it is possible to solve the drawbacks that hinder high-density wiring.
第３図は金属板の内部に冷却用空洞２１を設け
た本発明の複合プリント配線板の一例である。前
記冷却用空洞は、２枚の金属板の片面に、フライ
ス法、エツチング法、レーザー法などにより凹部
を形成したのち、これらの凹部形成面同志を接着
剤または金属接合用はんだ２２を介して接合し形
成されている。前記接着剤は、市販の金属接合用
接着剤の中から選択するが、冷却用空洞に水又は
フロンなどの冷却用流体を通すために耐水性、耐
薬品性、耐候性に優れた接着剤を使用すべきであ
る。本発明はさらにこのようにその発明の構成を
発展させることもでき、特開昭58−9393号公報に
記載された発明（第５図）の如きヒートパイプハ
を有する金属芯表面に絶縁被膜ニを形成し、前記
絶縁被膜の表面に導体回路ホを形成する構成が持
つ欠点、すなわちヒートパイプの加工が面倒であ
り、かつ導体回路は一層のみであるから配線密度
が低いという欠点をも解決できる。 FIG. 3 shows an example of a composite printed wiring board of the present invention in which a cooling cavity 21 is provided inside a metal plate. The cooling cavity is formed by forming a recess on one side of two metal plates by a milling method, an etching method, a laser method, etc., and then joining these recess-formed surfaces together with an adhesive or metal bonding solder 22. and is formed. The adhesive is selected from commercially available adhesives for joining metals, but an adhesive with excellent water resistance, chemical resistance, and weather resistance is selected in order to pass a cooling fluid such as water or Freon into the cooling cavity. Should be used. The structure of the present invention can be further developed in this way, and an insulating film 2 is formed on the surface of a metal core having a heat pipe 2, as in the invention described in JP-A No. 58-9393 (FIG. 5). However, it is also possible to solve the disadvantages of the structure in which the conductor circuit is formed on the surface of the insulating film, namely, that processing of the heat pipe is troublesome, and since the conductor circuit is in only one layer, the wiring density is low.
以下、本発明の複合プリント配線板の最も代表
的な実施例を第３図の縦断面図を用いて具体的に
説明する。金属板１として板厚2.0mmのアルミニ
ウム板を使用し、前記アルミニウム板の片面に、
フライス加工により凹部を形成し、前記凹部形成
面同志を三井石油化学工業(株)製エポキシ系接着剤
（品名；AH−130X）にて接合し、前記アルミニ
ウム板表面を陽極酸化したのち、三井石油化学工
業(株)製耐熱エポキシ絶縁ワニス（品名；TA−
1850）を浸漬コーテイング厚み40μｍの絶縁層２
を形成した。前記絶縁層表面に、めつき法により
導体回路３を形成し、その表面にニツカン工業(株)
製接着シート（品名；SAFV−40）を介して板厚
50μｍのポリイミド樹脂フレキシブル基板５を搭
載した。前記フレキシブル基板表面には、ポリイ
ミドフイルムによるカバーレイ１１が施されてい
る。さらに、無電解銅めつきおよびソルダーコー
トにより導通接続部７が形成されている。
Hereinafter, the most typical embodiment of the composite printed wiring board of the present invention will be described in detail using the vertical cross-sectional view of FIG. An aluminum plate with a thickness of 2.0 mm is used as the metal plate 1, and on one side of the aluminum plate,
A recess is formed by milling, the surfaces on which the recess is formed are joined together using an epoxy adhesive (product name: AH-130X) manufactured by Mitsui Petrochemical Industries, Ltd., and the surface of the aluminum plate is anodized. Heat-resistant epoxy insulation varnish manufactured by Kagaku Kogyo Co., Ltd. (Product name: TA-
1850) dipping coating 40μm thick insulation layer 2
was formed. A conductor circuit 3 is formed on the surface of the insulating layer by a plating method, and a conductive circuit 3 made by Nitzkan Kogyo Co., Ltd. is formed on the surface.
The thickness of the plate is adjusted through the adhesive sheet (product name: SAFV-40).
A 50 μm polyimide resin flexible substrate 5 is mounted. A coverlay 11 made of polyimide film is provided on the surface of the flexible substrate. Further, a conductive connection portion 7 is formed by electroless copper plating and solder coating.
以上のように、本発明によれば次に示すような
優れた効果がもたらされる。
As described above, according to the present invention, the following excellent effects are brought about.
１ 発明が解決しようとする問題点に記載の配線
密度が低いという点について、本発明の複合プ
リント配線板は、片面で少なくとも３層の導体
回路を有しており、高密度配線が可能となつ
た。Regarding the low wiring density described in 1. Problems to be Solved by the Invention, the composite printed wiring board of the present invention has at least three layers of conductor circuits on one side, making high-density wiring possible. Ta.
２ しかも、発熱の多い電子部品を金属基板上の
導体回路に直接搭載でき、放熱性が向上した。2 Moreover, electronic components that generate a lot of heat can be mounted directly on the conductor circuit on the metal substrate, improving heat dissipation.
また、本発明はその構成を前述した如く発展
させ得るものであり、その発展態様においては
次に示すような優れた効果が、前記効果を何ら
減ずることなく結合させうるものである。 Further, the structure of the present invention can be developed as described above, and in the developed mode, the following excellent effects can be combined without any reduction in the above effects.
３ 金属基板の両面接続を、スルホールを介さず
フレキシブル基板によつて行うことができ、電
気絶縁性が向上し、大電力用のプリント配線板
としての使用が可能となる。3. Both sides of the metal substrate can be connected using a flexible substrate without using through holes, improving electrical insulation and allowing use as a printed wiring board for high power.
４ ヒートパイプとして使用する冷却用空洞の加
工を、各２枚の金属板の片面に凹部を形成し、
前記凹部形成面同志を接合するという単純な工
程を採用できるため、工数およびコストが大幅
に低減できる。4. Machining the cooling cavity used as a heat pipe by forming a recess on one side of each of the two metal plates,
Since the simple process of joining the concave-forming surfaces together can be adopted, the number of man-hours and costs can be significantly reduced.
第１図は特許請求の範囲第１項に示す本発明の
複合プリント配線板の一例の縦断面図である。第
２図は特許請求の範囲第４項に示す本発明の複合
プリント配線板の一例の縦断面図である。第３図
は特許請求の範囲第６項に示す本発明の複合プリ
ント配線板の一例の縦断面図である。第４図は従
来の技術に示すプリント配線板の一例の縦断面図
である。第５図は発明の詳細な説明に示す従来の
プリント配線板の一例の縦断面図である。第６図
は発明の詳細な説明に示す従来のプリント配線板
のその他の一例を示す縦断面図である。
１……金属基板、２……絶縁層、３……導体回
路、４……スルホール、５……フレキシブルプリ
ント配線板、６……接着層、７……導通接続部、
１１……カバーレイ、２１……冷却用空洞、２２
……接着剤または金属接合用はんだ、イ……金属
芯、ロ……フレキシブル基板、ハ……ヒートパイ
プ、ニ……絶縁被膜、ホ……導体回路、ヘ……ス
ルホール、ト……スルホールのコーナー部。
FIG. 1 is a longitudinal sectional view of an example of a composite printed wiring board of the present invention as set forth in claim 1. FIG. 2 is a longitudinal sectional view of an example of the composite printed wiring board of the present invention as set forth in claim 4. FIG. 3 is a longitudinal sectional view of an example of the composite printed wiring board of the present invention as set forth in claim 6. FIG. 4 is a longitudinal sectional view of an example of a printed wiring board according to the prior art. FIG. 5 is a longitudinal sectional view of an example of a conventional printed wiring board shown in the detailed description of the invention. FIG. 6 is a longitudinal sectional view showing another example of the conventional printed wiring board shown in the detailed description of the invention. DESCRIPTION OF SYMBOLS 1...Metal board, 2...Insulating layer, 3...Conductor circuit, 4...Through hole, 5...Flexible printed wiring board, 6...Adhesive layer, 7...Continuity connection part,
11...Coverlay, 21...Cooling cavity, 22
...Adhesive or solder for metal bonding, A...Metal core, B...Flexible board, C...Heat pipe, D...Insulating coating, E...Conductor circuit, F...Through hole, G...Through hole Corner section.
Claims (1)
層の表面に電子部品を搭載する導体回路３を有
し、前記導体回路の表面には、スルホール４を介
して両面に導体回路が形成された両面フレキシブ
ルプリント配線板５が接着層を介して搭載され、
前記絶縁層表面の導体回路と前記スルホールとが
直接電気的に接続されていることを特徴とする複
合プリント配線板。 ２ 金属板の内部に冷却用空洞を持つことを特徴
とする特許請求の範囲第１項記載の複合プリント
配線板。 ３ 前記冷却用空洞は、各２枚の金属板の片面に
凹部を形成し、これらの凹部形成面同志を接合し
て成ることを特徴とする特許請求の範囲第２項記
載の複合プリント配線板。 ４ 金属板１の両面に絶縁層２を有し、前記絶縁
層の表面に電子部品を搭載する導体回路３を有
し、前記導体回路の表面には、スルホール４を介
して両面に導体回路が形成された両面フレキシブ
ルプリント配線板５が接着層を介して搭載され、
前記絶縁層表面の導体回路と前記スルホールとが
直接電気的に接続され、かつ前記フレキシブルプ
リント配線板の少なくとも一端が、他面に搭載さ
れたフレキシブルプリント配線板と接続されてい
ることを特徴とする複合プリント配線板。 ５ 金属板の内部に冷却用空洞２１を持つことを
特徴とする特許請求の範囲第４項記載の複合プリ
ント配線板。 ６ 前記冷却用空洞は、各２枚の金属板の片面に
凹部を形成し、これらの凹部形成面同志を接合し
て成ることを特徴とする特許請求の範囲第５項記
載の複合プリント配線板。[Claims] 1. A metal plate 1 has an insulating layer 2 on its surface, a conductor circuit 3 on which electronic components are mounted on the surface of the insulating layer, and a through hole 4 is provided on the surface of the conductor circuit. A double-sided flexible printed wiring board 5 with conductor circuits formed on both sides is mounted via an adhesive layer,
A composite printed wiring board, wherein the conductor circuit on the surface of the insulating layer and the through hole are directly electrically connected. 2. The composite printed wiring board according to claim 1, which has a cooling cavity inside the metal plate. 3. The composite printed wiring board according to claim 2, wherein the cooling cavity is formed by forming a recess on one side of each of two metal plates, and joining these recessed surfaces to each other. . 4 A metal plate 1 has an insulating layer 2 on both sides, a conductor circuit 3 on which electronic components are mounted on the surface of the insulating layer, and a conductor circuit is formed on both sides through through holes 4 on the surface of the conductor circuit. The formed double-sided flexible printed wiring board 5 is mounted via an adhesive layer,
The conductor circuit on the surface of the insulating layer and the through hole are directly electrically connected, and at least one end of the flexible printed wiring board is connected to a flexible printed wiring board mounted on the other surface. Composite printed wiring board. 5. The composite printed wiring board according to claim 4, which has a cooling cavity 21 inside the metal plate. 6. The composite printed wiring board according to claim 5, wherein the cooling cavity is formed by forming a recess on one side of each of two metal plates, and joining these recessed surfaces to each other. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12820484A JPS617694A (en) | 1984-06-21 | 1984-06-21 | Composite printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12820484A JPS617694A (en) | 1984-06-21 | 1984-06-21 | Composite printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS617694A JPS617694A (en) | 1986-01-14 |
| JPH0220156B2 true JPH0220156B2 (en) | 1990-05-08 |
Family
ID=14979045
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12820484A Granted JPS617694A (en) | 1984-06-21 | 1984-06-21 | Composite printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS617694A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7099707B2 (en) | 1997-10-10 | 2006-08-29 | Cingular Wirless Ii, Llc | Method and system for providing power to a communications device |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06309923A (en) * | 1993-04-26 | 1994-11-04 | Tafuto:Kk | Radiating body working also as insulator, manufacture of the body, low voltage heater using the body, and manufacture of the heater |
| JP4275004B2 (en) | 2004-05-24 | 2009-06-10 | Ｈｏｙａ株式会社 | High frequency cutting tool for endoscope |
| JP4745673B2 (en) | 2005-02-02 | 2011-08-10 | Ｈｏｙａ株式会社 | Endoscopic high-frequency incision tool |
| JP4682017B2 (en) | 2005-10-31 | 2011-05-11 | Ｈｏｙａ株式会社 | Endoscopic high-frequency incision tool |
-
1984
- 1984-06-21 JP JP12820484A patent/JPS617694A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7099707B2 (en) | 1997-10-10 | 2006-08-29 | Cingular Wirless Ii, Llc | Method and system for providing power to a communications device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS617694A (en) | 1986-01-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4858073A (en) | Metal substrated printed circuit | |
| JP4669392B2 (en) | Metal core multilayer printed wiring board | |
| JPH0220156B2 (en) | ||
| JP2877171B2 (en) | Composite hybrid integrated circuit | |
| JP3156798B2 (en) | Circuit board for semiconductor mounting | |
| WO1988002978A1 (en) | Multi-layer printed circuit board and a method of fabricating the same | |
| JPH0750816B2 (en) | Printed wiring board and manufacturing method thereof | |
| JPS60257191A (en) | printed wiring board | |
| JP2000299564A5 (en) | ||
| JP2000299564A (en) | Heat-radiation structure for multi-layer substrate | |
| JPH0446479B2 (en) | ||
| JP4761200B2 (en) | controller | |
| JPH06120628A (en) | Metallic base board | |
| JPH07249876A (en) | Multilayer printed board with metal core | |
| JPH03219689A (en) | metal core printed wiring board | |
| JPS6265395A (en) | Printed circuit board | |
| JPS6260286A (en) | Printed circuit board | |
| JP2867631B2 (en) | Semiconductor chip carrier | |
| JPS61241999A (en) | Multilayer metal cored printed wiring board | |
| JPH0660163U (en) | Heat dissipation type double sided circuit board | |
| JPH05259592A (en) | Printed wiring board | |
| JPH03245589A (en) | Hybrid integrated circuit | |
| JPH0249741Y2 (en) | ||
| JPH01228193A (en) | Printed wiring board with heat insulating structure | |
| JPH01228191A (en) | Metal core printed wiring board and manufacture thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term |