JPH02181960A - Resin-sealed semiconductor device - Google Patents

Abstract

PURPOSE:To form a resin-sealed type semiconductor device whose leads are not deformed when it is handled, packaged, transported and the like by a method wherein a resin body with which peripheral faces of the leads are covered is formed so as to hold a plurality of leads mutually. CONSTITUTION:A resin-sealed type semiconductor device is formed of a resin body 4 with which inside faces of bent parts of leads 2 are covered. The resin body 4 may be manufactured by using not a high-cost resin such as a resin enclosure body but, e.g. vinyl chloride or an ABS resin. Needless to say, the same material as a resin enclosure body 1, e.g. an epoxy resin, may be used in order to shorten a manufacturing process and may be resin-sealed and molded simultaneously with the resin enclosure body 1.

Description

[Detailed description of the invention] [Industrial application field] The present invention relates to a resin-sealed semiconductor device.

[Conventional technology]

Conventionally, this type of semiconductor device consists of: - A semiconductor chip having a large number of electronic elements and electronic circuits formed on its main surface, and input/output terminals of this semiconductor chip and leads connected through thin metal wires; It has a resin outer body which is exposed at a predetermined length and sealed with resin. In addition, the exposed leads are folded back along the side of the resin outer shell.
One surface of the bent lead tip is soldered and mounted on a printed wiring board or the like.

FIG. 4 is a perspective view of a conventional resin-sealed semiconductor device. This resin-sealed semiconductor device includes a hexahedral resin shell 1 in which a semiconductor chip or the like is sealed with resin, and a lead 2 that protrudes from the side surface of the resin shell 1 and is bent and returned along the protruding surface. have.

This lead 2 is bent along the side surface from which the lead 2 protrudes by a predetermined length from the side surface of the resin outer shell 1, and the lead tips 3a and 3b are further folded back so that the resin outer shell 1 can be used as a printed wiring board, etc. The surface is shaped so that it is parallel to the surface on which it will be mounted.

[Problem to be solved by the invention]

In the conventional resin-encapsulated semiconductor device described above, when the semiconductor device is mounted on the printed wiring board 3, the leads are deformed due to handling, packaging, transportation, etc. after manufacturing the semiconductor device, and as shown in FIG. This results in a lead tip 3b that is deformed within the tip. For this reason, for example, when mounting on the printed wiring board 3, a gap occurs between the surface of the lead tip portion 3b and the surface of the electrode pad of the printed wiring board, causing a problem that soldering cannot be performed.

An object of the present invention is to provide a resin-sealed semiconductor device whose leads do not deform due to handling, packaging, transportation, etc.

[Means to solve the problem]

The resin-sealed semiconductor device of the present invention has a hexahedral resin outer shell in which a semiconductor chip and leads connected to input/output terminals of the semiconductor chip through thin metal wires are exposed at a predetermined length and sealed with resin. The leads exposed from the resin outer shell are bent and folded back along the resin outer shell, and the exposed area of the lead other than the mounting surface of the printed wiring board, etc. at the tip of the folded lead is and a covering resin body.

〔Example'〕

Next, the present invention will be explained with reference to the drawings.

1(a), (b), and (c) are a plan view, an AA sectional view, and a partial perspective view of a resin-sealed semiconductor device showing a first embodiment of the present invention. The semiconductor device is formed with a resin body 4 that covers the inner surface of the bent portion of the lead 2. Other than that, the semiconductor device is the same as the conventional example.

This resin body 4 is not made of expensive resin like the resin outer body,
For example, it may be made of vinyl chloride or ABSt31 resin. Of course, in order to shorten the manufacturing process, the resin outer shell 1
It is also possible to use a similar material, for example, epoxy resin, and seal and mold the resin shell 1 with the resin at the same time.

2(a) and (b) are a plan view and a BB sectional view of a resin-sealed semiconductor device showing a second embodiment of the present invention. This resin-sealed semiconductor device has a frame-shaped resin body. 4a is molded with resin in advance, and when the lead 2 is not bent back, the glue portion 2 is inserted into the frame-shaped resin body 4a and fixed with adhesive 5. There is an advantage in that the surface of this resin body 4a can be used as a mold when folding back.

FIGS. 3(a) and 3(b) are a plan view and a CC sectional view of a resin-sealed semiconductor device showing a third embodiment of the present invention. In this resin-sealed semiconductor device, when the leads 2 are not bent back, a frame-shaped resin body 4b is attached to the inside of the leads 2 with an adhesive 5, and then the lead tips 3a are hidden in the resin outer body 1. It is to bend it. This embodiment is advantageous in that the leading end portions of the leads do not protrude outside the resin shell, so they are less susceptible to external forces, deformation of the leads is small, and the mounting area is small.

〔Effect of the invention〕

As explained above, the present invention provides resin sealing that prevents the leads from being deformed during collection, packaging, transportation, etc. by providing a resin body that covers the peripheral surface of the leads so as to hold the leads together. This has the effect that a type semiconductor device can be obtained.

[Brief explanation of the drawing]

1(a>, (b), and (C) are a plan view, an AA@ side view, and a partial perspective view of a resin-sealed semiconductor device showing a first embodiment of the present invention, and FIG. 2(a>) 3(b) is a plan view and a BBl!7r side view of a resin-sealed semiconductor device showing a second embodiment of the present invention, and FIGS. 3(a) and 3(b) are a third embodiment of the present invention. 4 is a plan view and a CC sectional view of a resin-sealed semiconductor device showing a conventional example, and FIG. 4 is a perspective view of a resin-sealed semiconductor device showing a conventional example. 1...Resin outer shell, 2...Lead , 3.3a, 3b
...Lead tip, 4.4a, 4b...Resin body, 5
···glue.

Claims (1)

[Claims] A hexahedral resin outer shell formed by exposing a semiconductor chip and leads connected to the input/output terminals of the semiconductor chip via thin metal wires at a predetermined length and sealing them with resin; A resin-sealed semiconductor having a lead that is folded back along the surface of the resin outer shell and a resin body that covers an exposed area of the lead other than the mounting surface of a printed wiring board or the like at the tip of the folded lead. Device.