JPH06132472A - Ic package - Google Patents

Abstract

PURPOSE:To realize high density mounting by allowing mounting of other circuit components on the rear side of an IC package body. CONSTITUTION:In a resin molded body (sealing resin) 4 constituting an IC package 101, a chip capacitor 210 is resin sealed together with a semiconductor element such that the metallized electrode 212 thereof is exposed to the mounting board side of package thus mounting the chip capacitor 210 integrally with the IC package 101.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC package, and more particularly to a package structure for three-dimensionally mounting a chip capacitor and an IC package which are required as a countermeasure against noise.

[0002]

2. Description of the Related Art FIG. 5 (a) is a sectional view for explaining the structure of a conventional surface mount type IC package mounted on a mounting substrate, and 200 is an IC element (semiconductor element) 1 mounted thereon. In a SOP (Small Outline Package) package (hereinafter referred to as an IC package), the IC element 1 is fixed on the die pad 3 by a brazing material 6 such as silver paste, and the IC element 1 and the IC lead 2 are connected by a gold wire 5. The structure is such that they are connected and the whole is sealed with the sealing resin 4. Here, the encapsulating resin 4 protects the semiconductor element 1 from the external environment, and the IC lead 2 is a gull wing type lead, and the dimension in the height direction is short, and the height of the IC package in the mounted state is high. It is designed to be as low as possible.

Further, FIG. 5 (b) shows a chip capacitor mounted on a mounting substrate. In the figure, 210 is a noise countermeasure chip capacitor having a counter electrode (not shown) in a ceramic housing 211 thereof. Then, the ceramic housing 211
A metallized electrode 212 connected to the counter electrode is formed on the surfaces of both ends of the.

FIG. 6 shows an example of a semiconductor module modularized using the IC package and the chip capacitor. In the figure, 201 is a semiconductor module, and the IC package 200 and the chip capacitor 210 are mounted on the mounting substrate 10. Has been implemented. Where 12,
Reference numeral 13 denotes a mounting board side electrode formed at a predetermined position of the mounting board 10. The electrode 12 is fixed to the IC lead 2 of the IC package 200, and the electrode 13 is fixed to the metallized electrode 212 of the chip capacitor 210 by soldering. And are electrically connected. Reference numeral 11 denotes an electrode for connection with a plurality of sockets 20 formed on the mounting board 10 along one side thereof.

The semiconductor module 201 having such a structure
Then, when this is mounted in the socket 20 and a predetermined signal is applied to the electrode 11 of the mounting substrate 10 via the socket 20, the semiconductor element 1 in the IC package 200 performs predetermined signal processing and, at the same time, the chip. Capacitor 21
When 0, noise processing of the signal is performed.

[0006]

However, it is usually necessary to provide one chip capacitor for noise suppression for one IC package. Therefore, in a semiconductor module in which a plurality of IC packages are mounted on a mounting board, The area occupied by the chip capacitor on the mounting board also becomes large. Further, in the above IC package, in order to suppress the thickness of the semiconductor module, that is, the height of the IC package on the mounting substrate, the dimension of the IC lead 2 in the height direction is shortened. Therefore, the package body (sealing resin) There is almost no space between the lower surface of No. 4 and the mounting board, and it is difficult to realize high-density mounting by disposing the chip capacitor on the lower side of the IC package.

The present invention has been made in order to solve the above problems, and it is possible to arrange and mount other circuit components on the lower side of the IC package body, and to realize high-density mounting. Intended to get the package.

[0008]

In an IC package according to the present invention, a resin mold body constituting the IC package is resin-sealed together with a semiconductor element so that electrodes of the chip capacitor are exposed to the mounting substrate side of the package body. The resin mold body can be mounted on the mounting board at the same time as the chip capacitor integrated with the resin mold body.

In the IC package according to the present invention, the resin mold body constituting the IC package has a component escape hole formed on the mounting board side so that the upper portion of the chip capacitor arranged on the mounting board can be inserted thereinto, The resin mold body is configured to be mountable on the mounting board by inserting the chip capacitor mounted on the mounting board into the component escape hole.

[0010]

According to the present invention, the resin molded body constituting the IC package is structured such that the chip capacitor is resin-sealed together with the semiconductor element so that the electrodes of the chip capacitor are exposed to the mounting substrate side of the package body. Since it can be mounted on the mounting substrate at the same time as the chip capacitor integrated with the chip capacitor, the chip capacitor is located below the IC package when the IC package is mounted on the mounting substrate. High-density mounting can be realized by mounting such three-dimensional elements.

Since the chip capacitors are mounted at the same time as the IC package, the time required for mounting the circuit parts can be shortened.

According to the present invention, the resin molded body constituting the IC package has a structure having a component escape hole formed on the side of the mounting substrate so that the upper portion of the chip capacitor arranged on the mounting substrate can enter the resin molded body. Since the mold body can be mounted on the mounting board by inserting the chip capacitor mounted on the mounting board into the component escape hole, the three-dimensional mounting of the IC package and the chip capacitor can be performed in the same manner as above. High-density mounting can be realized.

[0013]

EXAMPLES Example 1. 1 is a diagram for explaining a structure of an IC package according to a first embodiment of the present invention, and FIG. 2 is a diagram for explaining a mounting method of the IC package.
In the figure, 101 is the IC package of this embodiment, which is capable of mounting the chip capacitor 210 as an integral part of the IC package. That is, the above I
In the C package 101, the resin mold body (sealing resin) 4 constituting the C package 101 is resin-sealed together with the semiconductor element 1 so that the electrode 212 of the chip capacitor 210 is exposed to the mounting substrate side of the package body. The chip capacitor 210 is positioned so that the contact surface of the metallized electrode 212 with the mounting substrate is flush with the contact surface of the IC lead 2 with the mounting substrate.

At a predetermined position on the mounting board 10, an IC is placed.
Electrode 12 for connection with lead 2 and chip capacitor 21
No. 0 metallization electrode 212 and connection electrode 13 are formed, and solder paste is applied to the surfaces of these electrodes. Other configurations are the same as those of the conventional IC package 200.

Next, a mounting method will be described. First, Figure 2
As shown in (a), I
The C package 101 is attached to each electrode 1 on the mounting substrate 10.
2 and 13 are positioned in a plane (Fig. 2 (a)) and the I
The C package 101 is placed on the surface of the mounting substrate 10.
In this state, the IC lead 2 and the metallized electrode 212 of the chip capacitor are in contact with the electrodes 12 and 13, respectively. After that, heat treatment is performed to melt the solder paste and fix the metallized electrodes 212 of the IC lead 2 and the chip capacitor to the electrodes 12 and 13, respectively. As a result, the IC package 101 is fixed on the mounting substrate 10 together with the chip capacitor 210.

In the IC package 101 having such a structure, the chip capacitor 210 is resin-sealed together with the semiconductor element 1 so that the electrode 212 of the chip capacitor 210 is exposed to the mounting substrate side of the package body, and the chip capacitor 210 is replaced with the I capacitor.
Since it can be mounted integrally with the C package 101, when the IC package 101 is mounted on the mounting substrate 10, the chip capacitor 210 is located below the IC package 101. High-density mounting can be realized by mounting three-dimensional elements.

The chip capacitor 210 is mounted by I
Since it is performed at the same time as the C package 101, the time required for the component mounting work can be shortened.

Example 2. FIG. 3 is a diagram for explaining an IC package according to the second embodiment of the present invention, and FIG. 4 is the IC package.
It is a figure for demonstrating the mounting method of a package. In the figure, 102 is the IC package of this embodiment,
The C package 120 can be mounted so as to be overlaid on the chip capacitor 210 so as to cover it. That is, in the IC package 102, the resin mold body (sealing resin) 4 constituting the IC package 102 is formed in the component escape hole 4a formed on the side of the mounting substrate 10 so that the upper portion of the chip capacitor 210 arranged on the mounting substrate 10 enters. The structure has The other structure is the same as that of the conventional IC package 200, and the structure of the mounting substrate 10 is the same as that of the first embodiment.

Next, a mounting method will be described. Figure 4
As shown in (a), the chip capacitor 210 is positioned on the mounting substrate 10 so that its metallized electrode 212 faces the electrode 13 (FIG. 4 (a)), and the chip capacitor 210 is placed on the surface of the mounting substrate 10. Put on. Then I
The C package 102 is positioned with respect to the chip capacitor 210 such that the upper part thereof enters the component escape hole 4a of the IC package 102 and the IC lead 2 faces the electrode 12 (FIG. 4 (b)). Place on top of 10 (Fig. 4 (c)). In this state, the metallized electrode 212 of the chip capacitor 210 is in contact with the electrode 13 on the mounting board, and the upper part of the chip capacitor 210 is inserted into the component escape hole 4a of the IC package 102 so that the IC lead 2 of the package 102 is Mounting board 1
0 is in contact with the upper electrode 12.

Then, heat treatment is performed in this state to melt the solder paste applied to the surfaces of the electrodes 12 and 13 and fix the metallized electrodes 212 of the IC lead 2 and the chip capacitor 210 to the electrodes 12 and 13, respectively. To do. As a result, the IC package 102 and the chip capacitor 210 are fixed on the mounting substrate 10.

In the IC package 102 having such a structure, the resin mold body 4 constituting the IC package 102 is mounted on the mounting substrate 10.
Since the component escape hole 4a is formed on the side of the mounting substrate so that the upper portion of the chip capacitor 210 arranged above can be inserted, the IC package 102 can be mounted over the chip capacitor 10 so as to cover it. , The IC package 102 as in the first embodiment.
High-density mounting can be realized by three-dimensional mounting of the chip capacitor 201 and the chip capacitor 201.

In each of the embodiments described above, the lead of the package is the gull wing type lead adopted in the SOP package (small outline package), but the lead shape is not limited to this.

[0023]

As described above, according to the IC package of the present invention, the resin molded body forming the IC package is molded together with the semiconductor element so that the electrodes of the chip capacitor are exposed to the mounting substrate side of the package body. Since the structure is such that it is sealed, and the resin mold body can be mounted on the mounting board at the same time as the chip capacitor integrated with the resin mold body, when the IC package is mounted on the mounting board, the resin molding body is mounted. Since the chip capacitor is located on the lower side, there is an effect that high-density mounting can be realized by mounting such a three-dimensional element.

Since the chip capacitors are mounted at the same time as the IC package, there is an effect that the time required for mounting the parts can be shortened.

Further, according to the IC package of the present invention, the resin relief forming the IC package is formed on the side of the mounting board so that the upper portion of the chip capacitor arranged on the mounting board is inserted into the resin molding body. Since the resin mold body is configured to be mountable by inserting the chip capacitor mounted on the mounting board into the component escape hole, the three-dimensional structure of the IC package and the chip capacitor can be achieved in the same manner as above. There is an effect that high density mounting can be realized by mounting.

[Brief description of drawings]

FIG. 1 is a sectional view for explaining a structure of an IC package according to a first embodiment of the present invention.

FIG. 2 is a diagram for explaining a mounting method of the IC package.

FIG. 3 is a sectional view for explaining the structure of an IC package according to a second embodiment of the present invention.

FIG. 4 is a diagram for explaining a method of mounting the IC package of the second embodiment.

FIG. 5 is a cross-sectional view for explaining the structure of a conventional IC package.

FIG. 6 is a plan view for explaining a semiconductor module in which a conventional IC package and a chip capacitor are mounted on a mounting board.

[Explanation of symbols]

 1 Semiconductor Element 2 IC Lead 3 Die Pad 4 Sealing Resin (Resin Molded Body) 4a Component Escape Hole 5 Gold Wire 6 Brazing Material 10 Mounting Board 11 Socket Connecting Electrode 12 IC Lead Connecting Electrode 13 Chip Capacitor Connection electrodes 101, 102 IC package 210 Chip capacitor 211 Ceramic housing 212 Metallized electrode

Claims (2)

[Claims] 1. An IC package, which comprises a resin mold body having a semiconductor element enclosed therein and is mounted on a mounting substrate, wherein the resin mold body, together with the semiconductor element, has a chip capacitor and electrodes of the package body. The resin mold body is integrally sealed so as to be exposed to the mounting board side, and the resin mold body can be mounted on the mounting board at the same time as the chip capacitor integrated with the resin molding body. IC package to do. 2. An IC package, comprising a resin mold body having a semiconductor element encapsulated therein, which is mounted on a mounting board, wherein the resin mold body is such that an upper portion of a chip capacitor arranged on the mounting board is inserted thereinto. It has a component escape hole formed on the mounting board side, and the resin mold body can be mounted on the mounting board by inserting the chip capacitor mounted on the mounting board into the component escape hole. IC package characterized by.