JPH0215239Y2 - - Google Patents
Info
- Publication number
- JPH0215239Y2 JPH0215239Y2 JP1985136231U JP13623185U JPH0215239Y2 JP H0215239 Y2 JPH0215239 Y2 JP H0215239Y2 JP 1985136231 U JP1985136231 U JP 1985136231U JP 13623185 U JP13623185 U JP 13623185U JP H0215239 Y2 JPH0215239 Y2 JP H0215239Y2
- Authority
- JP
- Japan
- Prior art keywords
- flux
- melting point
- temperature fuse
- low melting
- point metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000004907 flux Effects 0.000 claims description 30
- 238000002844 melting Methods 0.000 claims description 26
- 230000008018 melting Effects 0.000 claims description 24
- 239000002184 metal Substances 0.000 claims description 24
- 229910052751 metal Inorganic materials 0.000 claims description 24
- 238000003756 stirring Methods 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 15
- 238000004140 cleaning Methods 0.000 description 5
- 239000012212 insulator Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 230000015556 catabolic process Effects 0.000 description 3
- 238000013467 fragmentation Methods 0.000 description 3
- 238000006062 fragmentation reaction Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- QXJJQWWVWRCVQT-UHFFFAOYSA-K calcium;sodium;phosphate Chemical compound [Na+].[Ca+2].[O-]P([O-])([O-])=O QXJJQWWVWRCVQT-UHFFFAOYSA-K 0.000 description 2
- 239000011247 coating layer Substances 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 230000001737 promoting effect Effects 0.000 description 2
- 239000011800 void material Substances 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 229910020816 Sn Pb Inorganic materials 0.000 description 1
- 229910020922 Sn-Pb Inorganic materials 0.000 description 1
- 229910008783 Sn—Pb Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Fuses (AREA)
Description
【考案の詳細な説明】
〈産業上の利用分野〉
本考案は温度ヒユーズの改良に関するものであ
る。[Detailed Description of the Invention] <Industrial Application Field> The present invention relates to an improvement in a temperature fuse.
〈従来の技術〉
温度ヒユーズとして、第３図に示すように、絶
縁基板１′上に電極２′，２′を設け、これらの電
極２′，２′間に低融点金属体３′を橋設し、該低
融点金属体３′上にフラツクス層４′を設け、これ
らの外部を樹脂のモールド層５′で絶縁したもの
が公知である。この温度ヒユーズにおいて、フラ
ツクス４′は低融点金属体３′よりも低融点であ
り、低融点金属体３′の溶融時に低融点金属体表
面の酸化物をクリーニングし、かつ、溶融金属体
３′の球状化に基づく分断作用を促進することに
ある。<Prior art> As a temperature fuse, as shown in FIG. 3, electrodes 2', 2' are provided on an insulating substrate 1', and a low melting point metal body 3' is bridged between these electrodes 2', 2'. It is known that a flux layer 4' is provided on the low melting point metal body 3', and the outside thereof is insulated with a resin mold layer 5'. In this temperature fuse, the flux 4' has a lower melting point than the low melting point metal body 3', and cleans the oxide on the surface of the low melting point metal body when the low melting point metal body 3' is melted, and also cleans the oxide on the surface of the low melting point metal body 3'. The aim is to promote the dividing action based on spheroidization.
ところで、この温度ヒユーズにおいては、低融
点金属体の分断時に発生するスパークによつてフ
ラツクスが急激に熱膨張して樹脂モールド層が破
壊するおそれがある。 By the way, in this temperature fuse, there is a risk that the resin mold layer will be destroyed due to rapid thermal expansion of the flux due to sparks generated when the low melting point metal body is divided.
〈解決しようとする課題〉
従来、高温用の温度ヒユーズとして、可溶金属
線を、該可溶金属線の溶融温度よりやや低い融点
を有する微小中空ガラス球の集合体で包い、その
外部を耐熱性の絶縁体で包囲したものが公知であ
り、（実用新案出願公開昭59−98548号）、この構
成によれば、中空ガラス球の溶融により空間が形
成され、この空間による内圧の吸収作用が期待さ
れるが、ガラスでは、上記したフラツクスのクリ
ーニング作用、溶融金属の球状化分断を促進する
作用を期待し難い。<Problem to be solved> Conventionally, as a temperature fuse for high temperatures, a fusible metal wire is wrapped in an aggregate of micro hollow glass spheres whose melting point is slightly lower than the melting temperature of the fusible metal wire, and the outside of the A structure surrounded by a heat-resistant insulator is known (Utility Model Application Publication No. 59-98548). According to this structure, a space is formed by melting the hollow glass bulb, and this space absorbs the internal pressure. However, with glass, it is difficult to expect the above-mentioned flux cleaning action and action to promote spheroidization and fragmentation of molten metal.
本考案の目的は、上記クリーニング作用等を営
むフラツクスに、実質上、上記微小中空ガラス球
と同様な空間形成作用を営ましめてクリーニング
作用を保持しつつ、上記フラツクスの熱膨張に起
因するモールド絶縁層の内圧破壊を防止し得る温
度ヒユーズを提供することにある。 The object of the present invention is to provide the flux that performs the cleaning action, etc., with a space-forming action substantially similar to that of the micro hollow glass spheres, thereby maintaining the cleaning action, while forming a mold insulating layer caused by the thermal expansion of the flux. An object of the present invention is to provide a temperature fuse that can prevent internal pressure breakdown.
〈課題を解決するための手段〉
本考案に係る温度ヒユーズは、低融点金属体上
に、該低融点金属溶融時に表面酸化物をクリーニ
ングし、かつ溶融金属の球状化分断を促進するフ
ラツクスを塗布し、このフラツクス層上に絶縁層
を設けた温度ヒユーズにおいて、上記フラツクス
に、撹拌により泡立てたフラツクスを用いたこと
を特徴とする構成である。<Means for Solving the Problems> The temperature fuse according to the present invention is provided by coating a low melting point metal body with a flux that cleans surface oxides when the low melting point metal melts and promotes spheroidization and fragmentation of the molten metal. However, in the temperature fuse in which an insulating layer is provided on the flux layer, the structure is characterized in that a flux foamed by stirring is used as the flux.
〈実施例の説明〉
以下、図面により本考案の実施例について説明
する。<Description of Examples> Examples of the present invention will be described below with reference to the drawings.
第１図Ａは本考案に係る温度ヒユーズを示す上
面説明図、第１図Ｂは第１図Ａにおけるｂ−ｂ断
面図である。第１図Ａ並びに第１図Ｂにおいて、
１は耐熱性に秀れた絶縁基板、例えばセラミツク
ス板である。２，２は絶縁基板１上に設けた箔状
電極であり、例えば銅箔を用いることができる。
３は電極２，２間に橋設した低融点金属体例えば
Sn−Pb合金箔である。４は低融点金属体３上に
塗布したフラツクスであり、塗料状のフラツクス
をミキサーにより撹拌して泡立てたものを塗布・
乾燥してある。このフラツクスは、低融点金属体
の溶融時、該金属体表面の酸化物をクリーニング
すると共に、溶融金属の球状化分断を促進する作
用を営み、ロジンを主成分とせるものが用いられ
る。５は絶縁、例えば常温硬化型エポキシ樹脂の
モールド層、フイルム状、シート状絶縁体であ
る。 FIG. 1A is an explanatory top view showing a temperature fuse according to the present invention, and FIG. 1B is a sectional view taken along line bb in FIG. 1A. In Figure 1A and Figure 1B,
1 is an insulating substrate with excellent heat resistance, such as a ceramic plate. 2, 2 are foil electrodes provided on the insulating substrate 1, and for example, copper foil can be used.
3 is a low melting point metal body bridged between the electrodes 2, 2, for example.
It is a Sn-Pb alloy foil. 4 is a flux applied on the low melting point metal body 3, which is a paint-like flux that has been stirred and foamed with a mixer.
It's dry. This flux has the function of cleaning oxides on the surface of the metal body when the low-melting metal body is melted, as well as promoting the spheroidization and fragmentation of the molten metal, and is mainly composed of rosin. Reference numeral 5 denotes an insulator, such as a mold layer of a cold-curing epoxy resin, a film-like insulator, or a sheet-like insulator.
上記において、温度ヒユーズは低融点金属体３
の溶融により作動するが、フラツクス４の融点は
低融点金属体３の融点よりも低温であり、温度ヒ
ユーズの作動以前にフラツクス層４が溶融し、フ
ラツクスの泡が消滅して実質上フラツクス層４の
体積が減少する結果、第２図に示すように溶融フ
ラツクス層４０と樹脂モールド層５との間に空隙
６が発生する。従つて、温度ヒユーズが作動温度
に達し、その作動に伴いスパークが発生し、フラ
ツクス層が熱膨張しても、その熱膨張を空隙６に
逃がしてよく吸収できるから、樹脂モールド層５
の破壊を防止できる。 In the above, the temperature fuse is the low melting point metal body 3
However, the melting point of the flux 4 is lower than the melting point of the low melting point metal body 3, and the flux layer 4 melts before the temperature fuse is activated, and the bubbles of the flux disappear and the flux layer 4 becomes substantially As a result, a void 6 is generated between the molten flux layer 40 and the resin mold layer 5 as shown in FIG. Therefore, even if the temperature fuse reaches the operating temperature and a spark is generated due to its operation, and the flux layer thermally expands, the thermal expansion can be absorbed well by escaping into the void 6, so that the resin mold layer 5
Destruction can be prevented.
本考案温度ヒユーズは、温度ヒユーズを予め低
融点金属体３の融点よりも低温で、フラツクス層
４の融点よりも高温で加熱し、第２図の状態にし
てから被保護機器に装着することもできる。 The temperature fuse of the present invention can be heated in advance to a temperature lower than the melting point of the low-melting point metal body 3 and higher than the melting point of the flux layer 4 to bring it into the state shown in Fig. 2 before being attached to the protected equipment. can.
〈考案の効果〉
本考案に係る温度ヒユーズは上述した通りの構
成であり、フラツクスに泡立てたフラツクスを用
いており、従来の温度ヒユーズに較べて、フラツ
クスの塗布時、フラツクスを泡立ててから塗布す
るだけで、フラツクスの熱膨張を吸収し得て絶縁
被覆層の内圧破壊を防止することができる。而し
て、フラツクスのクリーニング作用、溶融ヒユー
ズエレメントの球状化分断促進作用をそのまま保
有させて絶縁被覆層の内圧破壊を防止できる。<Effects of the invention> The temperature fuse according to the invention has the configuration as described above, and uses foamed flux.Compared to conventional temperature fuses, when applying the flux, the flux is foamed before application. This alone can absorb the thermal expansion of the flux and prevent internal pressure breakdown of the insulating coating layer. Thus, the cleaning action of the flux and the action of promoting spheroidization and separation of the molten fuse element can be maintained as they are, and internal pressure breakdown of the insulating coating layer can be prevented.
第１図Ａは本考案に係る温度ヒユーズを示す上
面説明図、第１図Ｂは第１図Ａにおけるｂ−ｂ断
面図、第２図は本考案温度ヒユーズの使用状態を
示す説明図、第３図は従来の温度ヒユーズを示す
説明図である。
３……低融点合金体、４……フラツクス層。
FIG. 1A is an explanatory top view showing the temperature fuse according to the present invention, FIG. 1B is a sectional view taken along line bb in FIG. 1A, and FIG. FIG. 3 is an explanatory diagram showing a conventional temperature fuse. 3...Low melting point alloy body, 4...Flux layer.
Claims (1)
化物をクリーニングし、かつ溶融金属の球状化分
断を促進するフラツクスを塗布し、このフラツク
ス層上に絶縁層を設けた温度ヒユーズにおいて、
上記フラツクスに、撹拌により泡立てたフラツク
スを用いたことを特徴とする温度ヒユーズ。 A temperature fuse in which a flux is applied to a low melting point metal body to clean surface oxides when the low melting point metal is melted and to promote spheroidization and division of the molten metal, and an insulating layer is provided on the flux layer,
A temperature fuse characterized in that the above-mentioned flux uses a flux foamed by stirring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985136231U JPH0215239Y2 (en) | 1985-09-04 | 1985-09-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985136231U JPH0215239Y2 (en) | 1985-09-04 | 1985-09-04 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6243440U JPS6243440U (en) | 1987-03-16 |
| JPH0215239Y2 true JPH0215239Y2 (en) | 1990-04-24 |
Family
ID=31039154
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985136231U Expired JPH0215239Y2 (en) | 1985-09-04 | 1985-09-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0215239Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002099827A1 (en) * | 2001-06-05 | 2002-12-12 | Matsushita Electric Industrial Co., Ltd. | Temperature fuse, and battery using the same |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5192524B2 (en) | 2009-09-04 | 2013-05-08 | 乾坤科技股▲ふん▼有限公司 | Protective device |
| US8472158B2 (en) * | 2009-09-04 | 2013-06-25 | Cyntec Co., Ltd. | Protective device |
| JP2014130696A (en) * | 2012-12-28 | 2014-07-10 | Murata Mfg Co Ltd | Fuse and manufacturing method of the same |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5998548U (en) * | 1982-12-22 | 1984-07-04 | 松下電器産業株式会社 | high temperature fuse |
-
1985
- 1985-09-04 JP JP1985136231U patent/JPH0215239Y2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002099827A1 (en) * | 2001-06-05 | 2002-12-12 | Matsushita Electric Industrial Co., Ltd. | Temperature fuse, and battery using the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6243440U (en) | 1987-03-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH06314538A (en) | Element for protecting circuit | |
| JPH0215239Y2 (en) | ||
| JPH0723863Y2 (en) | Thermal fuse | |
| JPH11126553A (en) | Alloy type thermal fuse | |
| JP2507073Y2 (en) | Substrate type temperature fuse / resistor | |
| JPH0514438Y2 (en) | ||
| JPS6239568Y2 (en) | ||
| JPS6030020A (en) | Temperature fuse | |
| JPS636832Y2 (en) | ||
| JPH03254033A (en) | Alloy type thermal fuse | |
| JPH0312192Y2 (en) | ||
| JP2905171B2 (en) | Electronic element overheating cutoff structure | |
| JPH0514433Y2 (en) | ||
| JPH0436022Y2 (en) | ||
| JPH0436035Y2 (en) | ||
| JPH0436034Y2 (en) | ||
| JPH086353Y2 (en) | Thermal fuse | |
| JPH073558Y2 (en) | Resistance temperature fuse composite | |
| JPH0436531Y2 (en) | ||
| JPH0514439Y2 (en) | ||
| JPH0917302A (en) | Flat type temperature fuse | |
| JPH0436024Y2 (en) | ||
| JPH0310593Y2 (en) | ||
| JPH0312190Y2 (en) | ||
| JPH0422516Y2 (en) |