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JPH02134811A - Pattern exposure device - Google Patents

Pattern exposure device

Info

Publication number
JPH02134811A
JPH02134811A JP63289475A JP28947588A JPH02134811A JP H02134811 A JPH02134811 A JP H02134811A JP 63289475 A JP63289475 A JP 63289475A JP 28947588 A JP28947588 A JP 28947588A JP H02134811 A JPH02134811 A JP H02134811A
Authority
JP
Japan
Prior art keywords
temperature
sample
vacuum chamber
stage
infrared ray
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP63289475A
Other languages
Japanese (ja)
Inventor
Toyomi Kanamaru
金丸 豊美
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP63289475A priority Critical patent/JPH02134811A/en
Publication of JPH02134811A publication Critical patent/JPH02134811A/en
Pending legal-status Critical Current

Links

Landscapes

  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Electron Beam Exposure (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

PURPOSE:To enable accurate temperature setting of a stage and its periphery in a short time by providing an infrared ray sensor to measure a temperature of a sample within a vacuum chamber. CONSTITUTION:In a pattern exposure device to generate a pattern by irradiating a charged beam 2 consisting of ion or electron to a sample 3 which is held inside a vacuum chamber 4, an infrared ray sensor 6 to measure a temperature of the sample 3 is provided inside the vacuum chamber 4. For example, the infrared ray sensor 6 for temperature measurement is provided to an upper part inside the vacuum chamber 4, a photo mask substrate 3 moves from a movable stage 5 to a lower part thereof, and measurement results are displayed on a display 7 to allow the confirmation of temperature distribution. As for the infrared ray sensor 6, an area array sensor, etc., consisting of HgDdTe is used.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は半導体装置の製造工程でICパターンの描画に
用られるパターン露光装置に関する。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a pattern exposure apparatus used for drawing IC patterns in the manufacturing process of semiconductor devices.

〔従来の技術〕[Conventional technology]

従来、この種のパターン露光装置におけるマスク基板等
の試料や試料ホルダーの温度測定には、銅・コンスタン
タン、白金・白金ロジュウム等の熱電対が検出器として
使われていた。
Conventionally, thermocouples made of copper/constantan, platinum/platinum rhodium, or the like have been used as detectors to measure the temperature of samples such as mask substrates and sample holders in this type of pattern exposure apparatus.

すなわち第2図に示すように、露光装置内に挿入された
試料21および試料ホルダー22はガイド23によりス
テージ24に載置される。そして、ステージ内に埋め込
まれな熱電対25により試料21や試料ホルダー22の
温度が測定されていた。
That is, as shown in FIG. 2, a sample 21 and a sample holder 22 inserted into the exposure apparatus are placed on a stage 24 by a guide 23. As shown in FIG. The temperature of the sample 21 and the sample holder 22 was measured by a thermocouple 25 embedded in the stage.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

上述した従来のパターン露光装置においては、試料温度
測定は、試料のステージへの載置位置精度の向上のため
、熱電対は試料および試料ホルダーと直接触れないよう
に構成されていた。
In the above-mentioned conventional pattern exposure apparatus, the thermocouple is configured so as not to come into direct contact with the sample and the sample holder in order to improve the precision of the placement position of the sample on the stage when measuring the sample temperature.

荷電ビームに依るパターン描画は高真空中で行なう必要
があるため、試料の出し入れ時には、真空引きに伴なう
断熱膨張があり温度制御を行なっていても試料および試
料ホルダーの温度が0.6〜1.0℃程度変化する。こ
の温度変化が試料或いは試料ホルダーの伸び縮みを起こ
し、パターン描画精度低下の要因となっている。
Pattern drawing using a charged beam must be performed in a high vacuum, so when loading and unloading the sample, there is adiabatic expansion due to evacuation, and even if temperature control is performed, the temperature of the sample and sample holder may exceed 0.6 It changes by about 1.0℃. This temperature change causes expansion and contraction of the sample or sample holder, causing a decrease in pattern drawing accuracy.

パターン露光装置の試料温度測定は、上述の温度変化を
最小に制御するために必要であるが、従来の温度測定用
熱電対はステージ側壁内に埋め込まれているため、瞬時
にして試料等の正確な温度を測定する事は不可能であっ
た。このなめ、新しいパターン露光装置のステージおよ
びその周辺の温度設定条件を決めるのに、極めて長時間
を要するという欠点がある。
Sample temperature measurement in pattern exposure equipment is necessary to minimize the temperature changes mentioned above, but since conventional temperature measurement thermocouples are embedded in the side wall of the stage, they can instantly and accurately measure the sample temperature. It was impossible to measure the exact temperature. This has the disadvantage that it takes an extremely long time to determine the temperature setting conditions for the stage and its surroundings of a new pattern exposure apparatus.

〔課題を解決するための手段〕[Means to solve the problem]

本発明のパターン露光装置は、試料の温度を測定するた
めに赤外線センサを真空室内に設けたものである。
The pattern exposure apparatus of the present invention includes an infrared sensor provided in a vacuum chamber to measure the temperature of a sample.

〔実施例〕〔Example〕

次に、本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.

第1図は本発明の一実施例の電子ビームによるパターン
露光装置の断面図である。
FIG. 1 is a sectional view of a pattern exposure apparatus using an electron beam according to an embodiment of the present invention.

第1図において、電子銃]より発せられた電子ビーム2
は偏向制御を受けて、試料であるフォトマスク基板3上
にICパターンを描画する。フォトマスク基板3は、真
空室4内の稼働ステージ5上に載置され、所望の位置に
移動可能となっている。フォトマスク基板3は、試料交
換室(図示せず)内での真空引きのため断熱膨張を受け
た後に、真空室4に挿入され可動ステージ5上に保持さ
れる。温度測定用の赤外線センサ6は真空室4内の上部
に設けられており、この下部に可動ステージ5によりフ
ォトマスク基板3が移動する。そして赤外線センサ6に
よりフォトマスク基板3とその周辺部の温度測定が行な
われる。測定結果はデイスプレィ7に表示され温度分布
の確認が可能となっている。尚8はフォトマスク基板3
の温度調節を行うための温度調節器である。
In Figure 1, an electron beam 2 emitted from an electron gun
Under deflection control, an IC pattern is drawn on the photomask substrate 3, which is a sample. The photomask substrate 3 is placed on a movable stage 5 within a vacuum chamber 4 and is movable to a desired position. After the photomask substrate 3 undergoes adiabatic expansion due to evacuation in a sample exchange chamber (not shown), it is inserted into the vacuum chamber 4 and held on the movable stage 5 . An infrared sensor 6 for temperature measurement is provided in the upper part of the vacuum chamber 4, and the photomask substrate 3 is moved to the lower part thereof by a movable stage 5. Then, the infrared sensor 6 measures the temperature of the photomask substrate 3 and its surrounding area. The measurement results are displayed on the display 7, making it possible to check the temperature distribution. 8 is the photomask substrate 3
This is a temperature controller for controlling the temperature of

本実施例における赤外線センサとして、HgCd T 
eからなるエリアアレイセンサを用いると、室温範囲の
温度測定で0,05〜0.1°Cの分解能を持つため、
大きな表面積を有する試料の温度を非接触で精度よく測
定できる。このためICパターン描画に必要とされる精
度を得るためのステージ及びその周辺の温度条件、すな
わち温度調節器8の設定条件を短時間に且つ精度良くき
める事ができる。すなわち、従来1週間程度を要してい
たステージおよびその周辺の温度設定を、1日程度の短
時間でかつ精度良く行うことができる。上記実施例にお
いては赤外線センサとしてエリアアレイセンサを用いた
が、安価なりニアアレイセンサを用いることも可能であ
る。この場合でもHg Cd T eの時定数は数百n
sであるので、リニアアレイセンサに直角の方向にステ
ージを移動することにより、2〜3秒で所望の温度分布
を測定する事ができる。
As the infrared sensor in this example, HgCdT
When using an area array sensor consisting of e, it has a resolution of 0.05 to 0.1°C for temperature measurement in the room temperature range, so
The temperature of a sample with a large surface area can be measured accurately without contact. Therefore, the temperature conditions of the stage and its surroundings, that is, the setting conditions of the temperature controller 8, can be determined in a short time and with high precision in order to obtain the precision required for IC pattern drawing. That is, the temperature setting of the stage and its surroundings, which conventionally required about one week, can be done in a short time of about one day and with high precision. In the above embodiment, an area array sensor is used as the infrared sensor, but a near array sensor can also be used since it is cheaper. Even in this case, the time constant of Hg Cd T e is several hundred nanometers.
s, the desired temperature distribution can be measured in 2 to 3 seconds by moving the stage in a direction perpendicular to the linear array sensor.

〔発明の効果〕〔Effect of the invention〕

以上説明したように本発明は、パターン露光装置におけ
る試料の温度測定を真空室内に設けた赤外線センサによ
り行うことにより、ステージおよびその周辺の温度設定
を短時間で且つ精度良く行なうことができるという効果
がある。
As explained above, the present invention has the advantage that the temperature of the stage and its surroundings can be set in a short time and with high precision by measuring the temperature of the sample in the pattern exposure apparatus using an infrared sensor installed in the vacuum chamber. There is.

−ン露光装置の温度測定機構を説明するためのステージ
近傍の斜視図である。
FIG. 2 is a perspective view of the vicinity of a stage for explaining a temperature measurement mechanism of the exposure apparatus.

1・・・電子銃、2・・・電子ビーム、3・・・フォト
マスク基板、4・・・真空室、5・・・可動ステージ、
6・・・赤外線センサ、7・・・デイスプレィ、8・・
・温度調節器、21・・・試料、22・・・試料ホルダ
、23・・・カイト、24・・・ステージ、25・・・
熱電対、26・・・ステージ側壁。
DESCRIPTION OF SYMBOLS 1... Electron gun, 2... Electron beam, 3... Photomask substrate, 4... Vacuum chamber, 5... Movable stage,
6...Infrared sensor, 7...Display, 8...
-Temperature controller, 21...sample, 22...sample holder, 23...kite, 24...stage, 25...
Thermocouple, 26...Stage side wall.

Claims (1)

【特許請求の範囲】[Claims]  真空室内に保持された試料上にイオンまたは電子から
なる荷電ビームを照射してパターンを描画するパターン
露光装置において、前記試料の温度を測定するための赤
外線センサを前記真空室内に設けたことを特徴とするパ
ターン露光装置。
A pattern exposure apparatus that draws a pattern by irradiating a charged beam of ions or electrons onto a sample held in a vacuum chamber, characterized in that an infrared sensor for measuring the temperature of the sample is provided in the vacuum chamber. Pattern exposure equipment.
JP63289475A 1988-11-15 1988-11-15 Pattern exposure device Pending JPH02134811A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63289475A JPH02134811A (en) 1988-11-15 1988-11-15 Pattern exposure device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63289475A JPH02134811A (en) 1988-11-15 1988-11-15 Pattern exposure device

Publications (1)

Publication Number Publication Date
JPH02134811A true JPH02134811A (en) 1990-05-23

Family

ID=17743756

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63289475A Pending JPH02134811A (en) 1988-11-15 1988-11-15 Pattern exposure device

Country Status (1)

Country Link
JP (1) JPH02134811A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0496314A (en) * 1990-08-14 1992-03-27 Toshiba Corp Method of forming or testing pattern for semiconductor device
JP2006128206A (en) * 2004-10-26 2006-05-18 Nikon Corp Exposure method and exposure apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0496314A (en) * 1990-08-14 1992-03-27 Toshiba Corp Method of forming or testing pattern for semiconductor device
JP2006128206A (en) * 2004-10-26 2006-05-18 Nikon Corp Exposure method and exposure apparatus

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