JPH02133945A - Semiconductor device - Google Patents

Abstract

PURPOSE:To obtain a structure of a semiconductor device having a degree of extreme freedom for an arrangement by a method wherein a plurality of IC chips are mounted on a flexible printed-circuit board having a wiring pattern and the individual IC chips are resin-molded independently. CONSTITUTION:In a memory device 1, an IC chip 3 is mounted on the surface of a flexible printed-circuit board 2 (hereafter abbreviated as FPC) and is molded by a sealing resin 4. A well-known pattern is formed on a surface 2a of the FPC 2; its one part is connected to external terminals 5 which have been formed at one end of the FPC 2 and is wire-bonded to a pad electrode of each IC chip 3. A part other than a wiring position of the external connection terminals 5 is protected by a coating of a resist film 6; after that, each IC chip 3 is molded individually by the sealing resin 4. Accordingly, since only a part of the sealing resin 4 in the memory device 1 is solid and other parts are structured to be flexible, it is possible to mount this device even on a substrate of a non-planer shape.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a mounting structure for a semiconductor device, such as a semiconductor memory device, in which a large number of IC chips are mounted.

[Conventional technology]

In recent years, with the increase in the capacity of semiconductor memories such as R, OM, and ILAM, memory devices have been manufactured in which a large number of IC chips for these semiconductor memories are mounted on a single substrate.
It is used in a wide range of applications such as games and process pipes.

However, the semiconductor memory device described above is manufactured by mounting a large number of chips on a ceramic substrate or a hard resin substrate (PCB), and then sealing the device with a ceramic lid or a resin lid, or by molding the entire device with resin. Card shape, PG
Finished in A shape, DLPW shape, etc.

[Problem to be solved by the invention]

As mentioned above (conventional semiconductor memory devices are attached and detached using connectors such as memory cards and PGAs, or have external terminals soldered to patterns on the motherboard, so their structures are robust.

However, in recent years, electronic devices such as portable computers equipped with the semiconductor memory devices have become smaller and lighter, and the amount of memory has increased.

Therefore, there are various restrictions on the space for installing semiconductor devices in the electronic device, and there is a demand for a semiconductor memory device with a structure that has a degree of freedom in placement that can cope with such restrictions. There is.

An object of the present invention is to meet the above-mentioned needs, and to provide a structure of a semiconductor device having an extremely high degree of freedom in arrangement.

[Means to solve the problem]

The gist of the present invention for achieving the above object is as follows.

A semiconductor device characterized in that a plurality of IC chips are mounted on a flexible circuit board having a wiring pattern, and each IC chip is independently molded with resin, and the circuit board The semiconductor device is characterized in that a metal plate is fixed to the back surface of the circuit board, and the semiconductor device is further fixed to a base having a non-planar shape on the back surface of the circuit board.

[Function] FIG. 1 is a plan view of a memory device, which is a semiconductor device according to the present invention. A chip 6 is mounted and molded with sealing resin 4. A well-known wiring pattern (not shown) is provided on the surface 2a of the FPC 2, a part of which is connected to the external connection terminal 5 provided at one end of the FPC 2, and is also connected to the pad electrode of each IC chip B and the wire bond. It is dengue.

After the surface 2a other than the external connection terminal 5 is protectively coated with a resist film 6 as shown by the dashed line, each IC chip 6 is individually molded with the sealing resin 4. . Therefore, in the memory device 1 having the above configuration, only the sealing resin 40 portion is strong and the other portions are flexible due to the FPc 2, so that it can be mounted even on a base having a non-planar shape.

〔Example〕

The present invention will be explained in detail below with reference to the drawings.

FIG. 2 is a cross-sectional view showing the mounting structure of the memory device 1.
The back surface 2b of the FPC 2 is bonded to a thin metal plate 8.

According to the above configuration, the metal plate 8 allows the memory device it
1 has an elastic structure, and the metal plate 8 also functions as a heat sink, so that temperature characteristics can be improved.

FIG. 3 is a sectional view showing a mounting structure of a memory device 1 according to another embodiment.

The memory device 1 is bonded to a bent metal plate 9, and an FPC 2 between two sealing resins 40 is attached to the bent portion 9a.
It is arranged as if it were located.

As mentioned above (the memory device 1 in the present invention can also be fixed to a bent non-planar base like the metal plate 9).

FIG. 4 shows still another embodiment, and is a sectional view of a portable computer in which the memory device 1 is mounted.

10 is a portable computer, 11 is an upper case, and 12 is a lower case, both of which are locked together by a locking means (not shown). And the upper case 11 has a transparent window 11
a and an opening 11b are provided. 13 is a circuit board; on the surface side of the circuit board 130 there is an IC chip 14.1.
5. Electronic components 16, 17 and connector 18 are mounted,
Further, a display device 19 and a keyboard 2o are mounted on the back side. 21 is a spacer, and 22 is a battery.

The memory device 1 is provided on the inner surface of the lower case 12.
The arrangement is such that the portion where the sealing resin 4 is present is adhered to the bottom surface of the lower case 12 and the portion where the external connection terminal 5 is present is raised.
It is glued to the side of 2.

Next, a procedure for assembling the portable computer 1o will be explained. First, the memory device 1 is adhered to the lower case 12, and then each element is dropped in the order of the spacer 21, the circuit board 16, and the battery 22. Next, the upper case 11 is attached and fixed to the lower case 12, thereby completing the assembly. In this state, the keyboard 20 is disposed in an operable manner relative to the opening 11b of the soil case 11, and the display section of the display device 19 is disposed so as to be visible relative to the transparent window 11b. In addition, the connector 18 is pushed leftward by the slope portion 21a provided on the spacer 21 and is pressed against the external connection terminal 5 of the memory device 1, so that the I of the memory device 1 is pressed.
The C chip 3 and the IC chips 14 and 15 on the circuit board 13 are electrically connected.

According to the above configuration, there is almost no need to consider the storage space of the memory device 1, so that the portable computer can be made smaller and thinner.

Furthermore, if the lower case 12 is made of metal, its temperature characteristics can also be improved.

The injection molding of the restraining resin 4 for the plurality of IC chips B in the memory device 1 is described in Japanese Patent Application No. 63-50738 and Japanese Patent Application No. 63-59409 filed by the present applicant.
Simultaneous molding can be performed using the resin sealing method proposed in the issue.

〔Effect of the invention〕

As mentioned above (according to the present invention, it is possible to provide a flexible semiconductor device by individually sealing a plurality of FPCK-mounted IC chips with resin, and the non-planar shape portion of this semiconductor device By implementing this, we were able to obtain a great effect in making mobile devices smaller and thinner.

[Brief explanation of the drawing]

FIG. 1 is a plan view of a memory device which is an embodiment of the present invention;
FIG. 2 is a cross-sectional view of FIG. 1, FIG. 3 is a cross-sectional view of another embodiment in which the memory device is attached to a metal plate, and FIG. 4 is a still further embodiment in which the memory device is portable. FIG. 3 is a cross-sectional view showing the state in which it is attached to a model computer. 1... Memory device, 2... I"PC. 4... Sealing resin. Fig. 2 Fig. 4

Claims (3)

[Claims] (1) A semiconductor device characterized in that a plurality of IC chips are mounted on a flexible circuit board having a wiring pattern, and each IC chip is independently resin molded. (2) The semiconductor device according to claim 1, further comprising a metal plate fixed to the back surface of the circuit board. (3) The semiconductor device according to claim 1, wherein the back surface of the circuit board is fixed to a base having a non-planar shape.