JPH02125373U - - Google Patents
Info
- Publication number
- JPH02125373U JPH02125373U JP3326189U JP3326189U JPH02125373U JP H02125373 U JPH02125373 U JP H02125373U JP 3326189 U JP3326189 U JP 3326189U JP 3326189 U JP3326189 U JP 3326189U JP H02125373 U JPH02125373 U JP H02125373U
- Authority
- JP
- Japan
- Prior art keywords
- molded
- groove
- circuit board
- electronic components
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
図−１は本考案の一実施例に係るモールド回路
基板の斜視図、図−２は同モールド回路基板を構
成する樹脂成形体とプリント回路フイルムを分離
して示す斜視図、図−３は同モールド回路基板に
電子部品を実装した状態を示す斜視図、図−４は
従来のプリント回路基板を示す断面図、図−５は
従来のモールド回路基板用のプリント回路フイル
ムを示す斜視図である。
２１……モールド回路基板、２２……樹脂成形
体、２３……プリント回路フイルム、２４……溝
、２５……パツド部、２６……回路パターン、２
７……電子部品。
Figure 1 is a perspective view of a molded circuit board according to an embodiment of the present invention, Figure 2 is a perspective view showing the molded circuit board separated from the resin molded body and printed circuit film, and Figure 3 is the same. FIG. 4 is a sectional view showing a conventional printed circuit board, and FIG. 5 is a perspective view showing a conventional printed circuit film for a molded circuit board. 21... Molded circuit board, 22... Resin molded body, 23... Printed circuit film, 24... Groove, 25... Pad portion, 26... Circuit pattern, 2
7...Electronic parts.
Claims (1)
ト回路フイルムまたは転写回路パターンを一体に
設けてなるモールド回路基板において、上記樹脂
成形体は、複数個の電子部品が嵌め込まれる直線
状の溝を有し、上記プリント回路フイルムまたは
転写回路パターンは、その中間部が上記溝の内面
に沿つて折り曲げられていて、その溝の縁に電子
部品接続用のパツド部が位置するように形成され
ていることを特徴とするモールド回路基板。 In a molded circuit board in which a printed circuit film or a transferred circuit pattern is integrally provided on the surface of a molded resin body, the resin molded body has a linear groove into which a plurality of electronic components are fitted, The printed circuit film or the transferred circuit pattern is characterized in that its intermediate portion is bent along the inner surface of the groove, and a pad portion for connecting electronic components is located at the edge of the groove. molded circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3326189U JPH02125373U (en) | 1989-03-27 | 1989-03-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3326189U JPH02125373U (en) | 1989-03-27 | 1989-03-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02125373U true JPH02125373U (en) | 1990-10-16 |
Family
ID=31536786
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3326189U Pending JPH02125373U (en) | 1989-03-27 | 1989-03-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02125373U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06275940A (en) * | 1993-03-23 | 1994-09-30 | Meiki Co Ltd | METHOD FOR MANUFACTURING MOLDED CIRCUIT BOARD HAVING PROJECTS OR CONCRETES AND CIRCUIT FILM FOR MOLDING |
-
1989
- 1989-03-27 JP JP3326189U patent/JPH02125373U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06275940A (en) * | 1993-03-23 | 1994-09-30 | Meiki Co Ltd | METHOD FOR MANUFACTURING MOLDED CIRCUIT BOARD HAVING PROJECTS OR CONCRETES AND CIRCUIT FILM FOR MOLDING |