JPH0351861U - - Google Patents
Info
- Publication number
- JPH0351861U JPH0351861U JP11214889U JP11214889U JPH0351861U JP H0351861 U JPH0351861 U JP H0351861U JP 11214889 U JP11214889 U JP 11214889U JP 11214889 U JP11214889 U JP 11214889U JP H0351861 U JPH0351861 U JP H0351861U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- substrate
- board substrate
- notch
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Description
第１図及び第２図は本考案の一実施例を示し、
第１図は印刷配線板の基板の平面図、第２図は同
基板の断面図であり、第３図及び第４図は従来例
を示し、第３図は印刷配線板の基板の平面図、第
４図は同基板の断面図である。
１……印刷配線板、７……樹脂、８……ベアチ
ツプＩＣ、１０……基板、１４……切欠部。
1 and 2 show an embodiment of the present invention,
Fig. 1 is a plan view of the substrate of the printed wiring board, Fig. 2 is a sectional view of the same board, Figs. 3 and 4 show conventional examples, and Fig. 3 is a plan view of the substrate of the printed wiring board. , FIG. 4 is a sectional view of the same substrate. DESCRIPTION OF SYMBOLS 1...Printed wiring board, 7...Resin, 8...Bare chip IC, 10...Substrate, 14...Notch.
Claims (1)
路素子へ樹脂をポツテイングすべき部位の縁部に
切欠部を設けたことを特徴とする印刷配線板の基
板。 1. A printed wiring board substrate, characterized in that a notch is provided at the edge of a portion of the printed wiring board substrate where a resin is to be potted onto a circuit element mounted on the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11214889U JPH0351861U (en) | 1989-09-26 | 1989-09-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11214889U JPH0351861U (en) | 1989-09-26 | 1989-09-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0351861U true JPH0351861U (en) | 1991-05-20 |
Family
ID=31660599
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11214889U Pending JPH0351861U (en) | 1989-09-26 | 1989-09-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0351861U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008107061A (en) * | 2006-10-27 | 2008-05-08 | Toshiba Corp | Air-conditioning duct straightening plate slit, constructing method of air-conditioning duct straightening plate slit and radioactive substance storage building |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS647689A (en) * | 1987-06-30 | 1989-01-11 | Shinwa Print Kogyo Kk | Processing of printed wiring board |
-
1989
- 1989-09-26 JP JP11214889U patent/JPH0351861U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS647689A (en) * | 1987-06-30 | 1989-01-11 | Shinwa Print Kogyo Kk | Processing of printed wiring board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008107061A (en) * | 2006-10-27 | 2008-05-08 | Toshiba Corp | Air-conditioning duct straightening plate slit, constructing method of air-conditioning duct straightening plate slit and radioactive substance storage building |
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