JPH02118966U - - Google Patents
Info
- Publication number
- JPH02118966U JPH02118966U JP2687089U JP2687089U JPH02118966U JP H02118966 U JPH02118966 U JP H02118966U JP 2687089 U JP2687089 U JP 2687089U JP 2687089 U JP2687089 U JP 2687089U JP H02118966 U JPH02118966 U JP H02118966U
- Authority
- JP
- Japan
- Prior art keywords
- land
- thick film
- pellet mounting
- bonding
- bonding land
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
第１図は本考案の一実施例を示す部分平面図で
、第２図は第１図のＸ−Ｙ線断面図である。
１……セラミツク基板、２……厚膜導体、３…
…ペレツト搭載ランド、４……ボンデイングラン
ド。
FIG. 1 is a partial plan view showing an embodiment of the present invention, and FIG. 2 is a sectional view taken along the line X-Y in FIG. 1... Ceramic substrate, 2... Thick film conductor, 3...
...Pellet loading land, 4...Bonde land.
Claims (1)
ンデイングランド以外の部分を厚膜で形成し、前
記ペレツト搭載ランド及びボンデイングランドを
薄膜で形成し、前記厚膜パターンと接続を行うこ
とを特徴とする混成集積回路基板。 A hybrid integrated circuit board, characterized in that parts other than the pellet mounting land and the bonding land are formed with a thick film on a ceramic substrate, the pellet mounting land and the bonding land are formed with a thin film, and are connected to the thick film pattern. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2687089U JPH02118966U (en) | 1989-03-08 | 1989-03-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2687089U JPH02118966U (en) | 1989-03-08 | 1989-03-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02118966U true JPH02118966U (en) | 1990-09-25 |
Family
ID=31248884
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2687089U Pending JPH02118966U (en) | 1989-03-08 | 1989-03-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02118966U (en) |
-
1989
- 1989-03-08 JP JP2687089U patent/JPH02118966U/ja active Pending