JPH02101794A - Multilayer printed interconnection board - Google Patents
Multilayer printed interconnection boardInfo
- Publication number
- JPH02101794A JPH02101794A JP63255155A JP25515588A JPH02101794A JP H02101794 A JPH02101794 A JP H02101794A JP 63255155 A JP63255155 A JP 63255155A JP 25515588 A JP25515588 A JP 25515588A JP H02101794 A JPH02101794 A JP H02101794A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- layer conductor
- inner layer
- wiring board
- heat dissipating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims abstract description 28
- 230000017525 heat dissipation Effects 0.000 abstract description 16
- 230000000694 effects Effects 0.000 abstract description 5
- 238000001816 cooling Methods 0.000 abstract description 4
- 238000007747 plating Methods 0.000 description 10
- 239000000463 material Substances 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 239000011889 copper foil Substances 0.000 description 5
- 239000011162 core material Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- 229920006332 epoxy adhesive Polymers 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 210000003298 dental enamel Anatomy 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、部品作動時にＩＣ，ＬＳＩ等の発熱部品より
発生する熱を効果的に放散させることのできる熱放散性
に優れた多層プリント配線板に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a multilayer printed wiring board with excellent heat dissipation properties that can effectively dissipate heat generated from heat generating components such as ICs and LSIs when the components are in operation. It is something.
従来の技術 近年、プリント配線板において、高密度配線化。Conventional technology In recent years, printed wiring boards have become more densely wired.
高密度部品実装化が進み、限られたヌペーヌに数多くの
ＩＣ，ＬＳＩ等の発熱部品が配置されるようにな−てき
ておシ、この発熱部品から発生する熱の蓄積によるトラ
ブルが問題となってきている。As high-density component packaging progresses, a large number of heat-generating parts such as ICs and LSIs are placed in a limited space, and troubles due to the accumulation of heat generated from these heat-generating parts become a problem. It's coming.
第７図に示すように内層材１に内層導体２を形成し、そ
の両面に外層材またはエポキシ系の接着剤３を介して外
層導体４を設け、一部にフルホール６を設け、外表面に
フルダーレジヌト６を設けた構成の従来の多層プリント
配線板では、配線板自体の熱放散性が劣るため、一般に
、熱処理方法として、発熱部品に設けた冷却用のフィン
を空冷で強制冷却する方式が用いられてきた。しかしな
がら上記のような方法では、十分に熱放散ができないと
いう欠点を有していた。As shown in FIG. 7, an inner layer conductor 2 is formed on an inner layer material 1, an outer layer conductor 4 is provided on both sides of the inner layer material 1 via an outer layer material or an epoxy adhesive 3, a full hole 6 is provided in a part, and the outer layer conductor 2 is formed on the inner layer material 1. In a conventional multilayer printed wiring board with a structure in which a fuller resin nut 6 is provided, the heat dissipation of the wiring board itself is poor, so the general heat treatment method is to forcefully cool the cooling fins provided on the heat generating components with air cooling. has been used. However, the method described above has the disadvantage that heat cannot be dissipated sufficiently.
一方では第８図に示すような熱放散性に優れたメタルコ
アのプリント配線板が開発されている。On the other hand, a metal core printed wiring board with excellent heat dissipation properties as shown in FIG. 8 has been developed.
これは薄いアルミニウム等熱伝導のよい板からなるメタ
ルコア１８の表面を、エポキシ系やポリイミド系の樹脂
、まだはホーロー等の絶縁材１９で被覆し、この表面に
所望の回路４やスルーホール６をめっきで形成したもの
である。In this method, the surface of a metal core 18 made of a plate with good heat conductivity such as thin aluminum is coated with an insulating material 19 such as epoxy or polyimide resin or enamel, and the desired circuit 4 and through holes 6 are formed on this surface. It is formed by plating.
発明が解決しようとする課題
しかしながらこのような配線板では、芯材が薄い金属板
であることより、外形加工を行うと、加工端面において
、パリ、ダレ、カエリが生じ配線板や、スルーホールの
穴の周囲が盛ｐ上が９、表面平滑性が悪く、反りも発生
しやすい。またホーローを構成する金属酸化物は、熱や
電界の作用によりイオン化しマイグレーションが生じ、
回路の誤動作の原因となる。さらにメタルコア１８を用
いたプリント配線板では、配線板の大きさがそりの関係
で小さなものに限定され、また工法上多層化が困難など
の欠点を有していた。このため、熱放散性の優れた多層
プリント配線板の開発が望まれていた。Problems to be Solved by the Invention However, in such a wiring board, since the core material is a thin metal plate, when the outer shape is processed, burrs, sagging, and burrs may occur on the processed end surface, causing damage to the wiring board and through holes. The circumference of the hole is embankment 9, the surface smoothness is poor, and warping is likely to occur. In addition, the metal oxides that make up the enamel are ionized and migrated by the action of heat and electric fields.
This may cause circuit malfunction. Furthermore, the printed wiring board using the metal core 18 has drawbacks such as the size of the wiring board is limited to a small one due to warping, and it is difficult to multilayer the wiring board due to the construction method. Therefore, it has been desired to develop a multilayer printed wiring board with excellent heat dissipation properties.
本発明はこのような従来の課題を解決するものであり、
部品作動時に、発熱部品より発生する熱を効果的に放散
させることのできる熱放散性に優れた多層プリント配線
板を提供するものである。The present invention solves these conventional problems,
The present invention provides a multilayer printed wiring board with excellent heat dissipation properties that can effectively dissipate heat generated from heat-generating components when the components operate.
課題を解決するための手段
このような課題を解決するために、本発明の多層プリン
ト配線板は、回路を形成した外層導体と、スルーホール
を介し又接続した内層導体のうち、内層導体のうちの一
部を、配線板の少なくとも一部で露出させ、この露出部
を放熱部として利用する構成をとっている。Means for Solving the Problems In order to solve these problems, the multilayer printed wiring board of the present invention has an outer layer conductor forming a circuit and an inner layer conductor connected via a through hole. A part of the wiring board is exposed at least in part of the wiring board, and this exposed part is used as a heat dissipation part.
作用
この構成によりて、内層導体を配線板の少なくとも一部
で露出させることで、部品作動時に発熱部品より発生す
る熱を効果的に放散させることが可能になる。Effect: With this configuration, by exposing the inner layer conductor in at least a portion of the wiring board, it becomes possible to effectively dissipate the heat generated by the heat generating component when the component is operated.
実施例 以下、本発明の実施例を図面を用いて説明する。Example Embodiments of the present invention will be described below with reference to the drawings.
第１図は、本発明における多層プリント配線板の構造例
である。７が発熱部品のリード端子、８がはんだ付けさ
れたスルーホール、９が放散される熱を示している。FIG. 1 shows an example of the structure of a multilayer printed wiring board according to the present invention. 7 indicates a lead terminal of a heat generating component, 8 indicates a soldered through hole, and 9 indicates dissipated heat.
実施例として、内周材１にはガラ７工ポキシ樹脂積層板
、内層導体２には銅はく、外周材３にはエポキシ系接着
剤（シート状のもの）、外層導体４にははんだめっきを
捲した銅はくという構成をとった。As an example, the inner circumferential material 1 is a glass 7-layer poxy resin laminate, the inner layer conductor 2 is copper foil, the outer circumferential material 3 is an epoxy adhesive (sheet type), and the outer layer conductor 4 is plated with solder. It was constructed of copper foil covered with .
以下、本発明の製造方法の一例を第２図〜第６図の図面
を参照して説明する。第２図に示すように、電源回路ま
だはアース回路として利用する内層回路、および放熱部
１６として利用する銅はくよりなる内層導体２を形成し
た内周材１の両面に前もって放熱部１６を形成するため
に外形加工した、エポキシ系接着剤３（シート状のもの
、ローフローブリプレグでも可）と銅はく１０を重ね合
わせ熟成型することにより４層の多層プリント配線板を
形成する。このようにして、配線板の少なくとも一部で
、内層導体２を露出させた４Ｎの多層プリント配線板を
容易に形成することができる。Hereinafter, an example of the manufacturing method of the present invention will be explained with reference to the drawings of FIGS. 2 to 6. As shown in FIG. 2, a heat dissipation section 16 is formed in advance on both sides of the inner circumferential material 1, which has an inner layer circuit used as a ground circuit for the power supply circuit and an inner layer conductor 2 made of copper foil used as the heat dissipation section 16. A four-layer multilayer printed wiring board is formed by stacking and aging the epoxy adhesive 3 (sheet-like or low-flow repreg) and the copper foil 10, which have been shaped to form a shape. In this way, a 4N multilayer printed wiring board in which the inner layer conductor 2 is exposed in at least a portion of the wiring board can be easily formed.
第３図は、この多層配線板に穴加工を行いスルーホール
６を形成し、無電解銅めっき１１を行った断面図を示す
ものである。第４図は、めっきレジメト膜１２を形成し
た後の断面図であり、第６図は、電気銅めっき１３．電
気はんだめっき１４を行った後の断面図である。第６図
は、めっきレジメト膜１２を除去し、エツチングによシ
回路を形成し、フュージングを行い、その後ソルダレジ
ヌトθを形成した多層プリント配線板の断面図である。FIG. 3 shows a cross-sectional view of this multilayer wiring board, in which through-holes 6 were formed and electroless copper plating 11 was performed. FIG. 4 is a sectional view after forming the plating regimen film 12, and FIG. 6 is a cross-sectional view after forming the plating regimen film 12. FIG. 3 is a cross-sectional view after performing electric solder plating 14. FIG. 6 is a cross-sectional view of a multilayer printed wiring board in which the plating regimen film 12 has been removed, a circuit has been formed by etching, fusing has been performed, and then a solder resin θ has been formed.
また配線板端部での放熱部においては、シ目−トを防ぐ
とともに、多層プリント配線板の形状を作るために、外
形加工１６を行っ１いる。ここで露出部１７を形成して
いるのは、放熱性をさらに向上させるためである。これ
らにより熱放散性に浸れた多層プリント配線板が形成さ
れる。Further, in the heat dissipating portion at the end of the wiring board, external processing 16 is performed to prevent seams and to form the shape of the multilayer printed wiring board. The exposed portion 17 is formed here to further improve heat dissipation. These form a multilayer printed wiring board with excellent heat dissipation properties.
なお、第２図から第６図までは、４層の多層プリント配
線板の一例を示したが、６層以上の多層プリント配線板
についても同様にして、目的の多層プリント配線板を形
成することができる。Although FIGS. 2 to 6 show an example of a four-layer multilayer printed wiring board, the desired multilayer printed wiring board can be formed in the same manner for a multilayer printed wiring board with six or more layers. Can be done.
上記のようにして得られた本発明の多層プリント配線板
において、第１図を参照して、部品作動時に発熱部品よ
り発生する熱は、発熱部品のリード端子部７より、はん
だ付けされたスルーホール８、スルーホール８と電源回
路またはアース回路として使用した内層導体２の接続部
、そして内層導体２かも放熱部１６へと伝わる。露出し
た内層導体２の放熱部１６を強制的に冷却することによ
ってさらに放熱効果が高まるのである。なお、この放熱
部１６を数箇所に設けたフ、放熱部のトータル面積を上
げることにより、放熱効果はさらに浸れる。In the multilayer printed wiring board of the present invention obtained as described above, with reference to FIG. The connection portion between the hole 8 , the through hole 8 and the inner layer conductor 2 used as a power supply circuit or a ground circuit, and the inner layer conductor 2 are also transmitted to the heat dissipation section 16 . By forcibly cooling the exposed heat radiation portion 16 of the inner layer conductor 2, the heat radiation effect is further enhanced. Note that by providing the heat radiating portions 16 at several locations, the heat radiating effect can be further improved by increasing the total area of the heat radiating portions.
発明の効果
以上のように本発明は、回路を形成した外層導体と、ス
ルーホールを介して接続した内層導体のうち、内層導体
のうちの一部を、配線板の少なくとも一部で露出させ、
この露出した内層導体で放熱部を設けることにより、部
品作動時に、発熱部品より発生する熱を効果的に放散さ
せることができ、その実用的効果は大なるものである。Effects of the Invention As described above, the present invention provides a method for exposing a part of the inner layer conductor between an outer layer conductor forming a circuit and an inner layer conductor connected via a through hole at least in a part of the wiring board,
By providing a heat dissipation section using the exposed inner layer conductor, the heat generated from the heat generating component can be effectively dissipated when the component is operated, and this has a great practical effect.
第１図は本発明の多層プリント配線板の一実施例を説明
するだめの断面図、第２図〜第ｅ図は同製造工程を説明
するための断面図、第７図は従来の４層の多層プリント
配線板の断面図、第８図は従来のメタルコアのプリント
配線板の断面図である。
１・・・・・・内層材、２・・・・・・内層導体、３・
・・・・・外層材、またはエポキシ系接着剤（またはロ
ーフロープリブレグ）、４・・・・・・外層導体、６・
・・・・・スルーホール、６・・・・・・ソルダレジヌ
ト、７・・・・・・発熱部品のリード端子、８・・・・
・・はんだ付けされたヌル−ボール、９・・・・・・放
散される熱、１０・・・・・・銅はく、１１・・・・・
・無電解銅めっき、１２・・印・めっきレジヌト膜、１
３・・・・・電気鋼めっき、１４・・・・・・電気はん
だめっき、１６・・・・・・外形加工面、１６・・・・
・・放熱部、１７・・・・・・放熱性を向上させるだめ
の内層導体露出部。
代理人の氏名 方埋士 粟 野 重 孝 ほか１名図
図
？
図
第
図Figure 1 is a cross-sectional view for explaining one embodiment of the multilayer printed wiring board of the present invention, Figures 2 to e are cross-sectional views for explaining the manufacturing process, and Figure 7 is a conventional four-layer printed wiring board. FIG. 8 is a sectional view of a conventional metal core printed wiring board. 1... Inner layer material, 2... Inner layer conductor, 3.
...Outer layer material or epoxy adhesive (or low flow prepreg), 4...Outer layer conductor, 6.
...Through hole, 6...Solder resin, 7...Lead terminal of heat generating component, 8...
...Soldered null ball, 9...Dissipated heat, 10...Copper foil, 11...
・Electroless copper plating, 12... mark ・Plating resin film, 1
3... Electric steel plating, 14... Electric solder plating, 16... External processing surface, 16...
... Heat dissipation part, 17... Inner layer conductor exposed part for improving heat dissipation. Name of agent: Shigetaka Awano and 1 other person Figure diagram
Claims (1)
続した内層導体のうちの内部導体の一部を、配線板の少
なくとも一部で露出させた多層プリント配線板。A multilayer printed wiring board in which a part of an inner conductor of an outer layer conductor forming a circuit and an inner layer conductor connected via a through hole is exposed in at least a part of the wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63255155A JPH02101794A (en) | 1988-10-11 | 1988-10-11 | Multilayer printed interconnection board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63255155A JPH02101794A (en) | 1988-10-11 | 1988-10-11 | Multilayer printed interconnection board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02101794A true JPH02101794A (en) | 1990-04-13 |
Family
ID=17274834
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63255155A Pending JPH02101794A (en) | 1988-10-11 | 1988-10-11 | Multilayer printed interconnection board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02101794A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04253396A (en) * | 1991-01-29 | 1992-09-09 | Fuji Photo Film Co Ltd | Multilayer printed board |
| JP2010123708A (en) * | 2008-11-19 | 2010-06-03 | Sony Corp | Mounting board and semiconductor module |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61124196A (en) * | 1984-11-20 | 1986-06-11 | 松下電器産業株式会社 | Multilayer wiring board |
-
1988
- 1988-10-11 JP JP63255155A patent/JPH02101794A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61124196A (en) * | 1984-11-20 | 1986-06-11 | 松下電器産業株式会社 | Multilayer wiring board |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04253396A (en) * | 1991-01-29 | 1992-09-09 | Fuji Photo Film Co Ltd | Multilayer printed board |
| JP2010123708A (en) * | 2008-11-19 | 2010-06-03 | Sony Corp | Mounting board and semiconductor module |
| JP4730426B2 (en) * | 2008-11-19 | 2011-07-20 | ソニー株式会社 | Mounting substrate and semiconductor module |
| US8263871B2 (en) | 2008-11-19 | 2012-09-11 | Sony Corporation | Mount board and semiconductor module |
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