JPH0163194U - - Google Patents
Info
- Publication number
- JPH0163194U JPH0163194U JP1987158342U JP15834287U JPH0163194U JP H0163194 U JPH0163194 U JP H0163194U JP 1987158342 U JP1987158342 U JP 1987158342U JP 15834287 U JP15834287 U JP 15834287U JP H0163194 U JPH0163194 U JP H0163194U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- protrusions
- diagram showing
- heat dissipation
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004080 punching Methods 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims 2
- 230000017525 heat dissipation Effects 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 1
Landscapes
- Insertion Pins And Rivets (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は本考案の放熱板と取り付け方法を示す
図。第２図ａ，ｂは、放熱板固定用端子の詳細図
。第３図ａ，ｂは、ハーフパンチ加工により突起
部を形成したアルミ板を示す図。第４図は、アル
ミ板の突起部に放熱板固定用端子をはめ込む状態
の図。第５図は、アルミ板の突起部に放熱板固定
用端子をはめ込んだ図。第６図は、従来例の放熱
板と取り付け構造を示す図。
１…アルミ板、２…放熱板固定用端子、３…プ
リント配線基板、４…放熱板取り付け穴、６１…
従来の放熱板、６２…ネジ穴、６３…ネジ、６４
…プリント配線基板。
FIG. 1 is a diagram showing the heat sink of the present invention and its attachment method. FIGS. 2a and 2b are detailed views of the terminal for fixing the heat sink. FIGS. 3a and 3b are views showing an aluminum plate with protrusions formed by half punching. FIG. 4 is a diagram showing the state in which the terminal for fixing the heat sink is fitted into the protrusion of the aluminum plate. FIG. 5 is a diagram showing the heat sink fixing terminals fitted into the protrusions of the aluminum plate. FIG. 6 is a diagram showing a conventional heat sink and mounting structure. 1... Aluminum plate, 2... Terminal for fixing the heat sink, 3... Printed wiring board, 4... Heat sink mounting hole, 61...
Conventional heat sink, 62...screw hole, 63...screw, 64
...Printed wiring board.
Claims (1)
板と前記突起部にはめ込む金属端子とから構成さ
れることを特徴とする電子部品の放熱装置。 1. A heat dissipation device for an electronic component, comprising a metal plate having protrusions formed by half punching and a metal terminal fitted into the protrusions.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987158342U JPH0163194U (en) | 1987-10-16 | 1987-10-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987158342U JPH0163194U (en) | 1987-10-16 | 1987-10-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0163194U true JPH0163194U (en) | 1989-04-24 |
Family
ID=31438581
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987158342U Pending JPH0163194U (en) | 1987-10-16 | 1987-10-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0163194U (en) |
-
1987
- 1987-10-16 JP JP1987158342U patent/JPH0163194U/ja active Pending
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