JPH0143867Y2 - - Google Patents

Description

[Detailed Description of the Invention] This invention relates to a lead frame loader that transports lead frames.

Generally, in the manufacturing process of electronic components such as ICs, a chip is attached to each island part formed by connecting one or more lead frames made of thin metal plates with an almost rectangular overall shape. Some are formed by die bonding, a wire bonding process, and then resin molding. During this process, a plurality of lead frames after wire bonding are arranged on a loading frame and set in a mold for resin molding.

Therefore, it is necessary to accurately install the lead frame at a predetermined position on the loading frame.

Conventionally, the lead frame is transported onto a loading frame by a lead frame loader and stopped at a predetermined position. As shown in FIG. 1, this lead frame loader consists of a support base a on which a loading frame (not shown) is placed, and a transport conveyor b, a frame guide c, and a stopper d. b etc. can appear and disappear from the loading frame.

The lead frame e is guided by the frame guides c on both sides from the conveyor b, and is stopped by coming into contact with the stopper d.

However, in this lead frame loader, the lead frame e is guided by two frame guides c on both sides, and the contact surface of the stopper d is flat so that the entire front side of the lead frame e comes into contact with the stopper d. Therefore, since the distance between the two frame guides c is slightly larger than the width of the lead frame e and there is some clearance with the lead frame e, there is a problem that the accuracy of the stop position of the lead frame e is poor. In other words, the lead frame e shifts in the left-right direction by the amount of clearance, and in addition, the stopper d is simply contacted by the lead frame e to position it in the front-rear direction, and the positioning in the left-right direction is performed only by the frame guide c. Because of this, there was a problem that the stopping position was inaccurate and the next process of resin molding could not be performed accurately.

Therefore, it is conceivable to reduce the clearance by reducing the distance between the frame guides c, but this has the disadvantage that it is difficult to convey the lead frame e. It is also conceivable to improve the stopping position accuracy by adding another mechanism, but this poses a problem of complicating the structure.

In view of the above, the present invention provides a lead frame loader in which when the lead frame comes into contact with a stopper, the lead frame is pressed against the frame guide by the stopper, so that the lead frame can be accurately positioned. The purpose is to

That is, this invention includes a loading frame on which the lead frame is transported and placed on a predetermined position, a conveyor that conveys the lead frame onto the loading frame, and a conveyor that is parallel to and adjacent to the conveyor. a frame guide that is provided only on one side and guides the lead frame; and a frame guide that is provided in front of a predetermined position where the lead frame stops and that is an open side corner opposite to the frame guide side of the front corner of the lead frame. It is composed of a stopper having an inclined surface with which a corner abuts.

Hereinafter, one embodiment of this invention will be described in detail based on the drawings.

As shown in FIGS. 2 to 5, numeral 1 denotes a lead frame loader that transports and places a lead frame 2 on a loading frame 3 at a predetermined position.

This lead frame loader 1 is composed of a lead frame 2 setting section 4, an intermediate conveying section 5, and a stopping section 6. Lead frame 2 is an IC
It is in the process of manufacturing electronic parts such as
It is formed of a thin metal plate into a substantially rectangular shape, and although not shown, a plurality of element bodies to which chips are die-bonded are arranged in series, and this is the state after die bonding. The lead frame loader 1 transports the lead frame 2 after wire bonding in order to proceed to a resin molding process.

The stop section 6 moves from the set section 4 to the intermediate conveyance section 5.
The lead frame 2 conveyed through the loading frame 3 is stopped and held on the loading frame 3, and the support table 7 is provided with a conveyor 8, a frame guide 9, and a stopper 10.

The conveyor 8 is made up of two round belts 8a suspended around rollers 8b, and the lead frame 2 is placed on the round belts 8a and conveyed. Further, a plurality of these conveyors 8 are arranged in parallel.

The frame guide 9 is composed of one square piece of wood,
This conveyor 8 is only on one side of the conveyor 8.
It is provided in parallel with the lead frame 2 to guide the lead frame 2.

The stopper 10 is provided in front of the conveyor 8 and stops the lead frame 2 at a predetermined position. This stopper 10 has an inclined surface 10a formed on the surface facing the lead frame 2. This inclined surface 10a is formed on the side where the frame guide 9 is not provided, and is formed on the side where the frame guide 9 is not provided.
Among the front corner parts of the frame guide 9, the corner part on the open side opposite to the frame guide 9 side comes into contact with the frame guide 9 side.

The loading frame 3 is removably installed on the support base 7 via a column 11, and has an opening (not shown) through which the conveyor 8 and the like can be retracted upward.

In the setting section 4, a magazine 12 in which lead frames 2 are stacked is removably set, and each lead frame 2 is discharged from the magazine 12 one by one. From this setting section 4, the intermediate conveying section 5 is transferred via the guide roller 13.
The lead frame 2 is transported.

In this intermediate conveyance section 5, the round belt 5a is
The lead frame 2 is conveyed to the stop part 6 by a conveyor suspended by the conveyor belt 6.

Next, the action of the stop portion 6 will be explained.

First, the loading frame 3 is installed on the support base 7 via the struts 11, and the conveyor 8, frame guide 9, and stopper 10 are made to protrude slightly from the loading frame 3 and are substantially flush with the intermediate conveyance section 5. .

Subsequently, the lead frame 2 is released from the magazine 12 and sent to the transport conveyor 8 from the intermediate transport section 5. Then, it is placed on the round belt 8a and moved, and is guided along the frame guide 9.

Next, when the lead frame 2 reaches a predetermined position on the loading frame 3, the open corner comes into contact with the inclined surface 10a of the stopper 10, and as shown in FIG. Upon hitting the guide 9, the lead frame 2 is slightly inclined.

Subsequently, since the round belt 8a is moving, the entire side of the lead frame 2 hits the frame guide 9, and is stopped and held at a predetermined position.

After that, when the conveyor 8 and the like are lowered while the loading frame 3 is supported by the support 11,
Lead frame 2 is placed on loading frame 3 at a predetermined position. Then, the entire loading frame 3 is transferred to a resin molding process.

Incidentally, a plurality of lead frames 2 are placed on the loading frame 3 by the above-described operation.
Alternatively, the stopper 10 may be provided in the middle of the conveyor 8 so as to be freely retractable so that the two lead frames 2 are stopped from being conveyed.

Furthermore, in this invention, it is not necessary to provide the setting section 4 and the intermediate conveying section 5.

Further, the lead frame is not limited to one after wire bonding.

As described above, according to this invention, the stopper is provided with an inclined surface, and the corner of the lead frame is brought into contact with this inclined surface and pressed against the frame guide.
The lead frame will always stop at a predetermined position. Therefore, since positioning can be performed with high precision, the next process of the lead frame can be performed accurately and quickly.

In addition, the structure is extremely simple because the frame guide only needs to be provided on one side of the conveyor belt by simply changing the shape of the stopper.

[Brief explanation of the drawing]

Figure 1 is a schematic plan view of the main parts of a conventional lead frame loader, Figures 2 to 5 show an embodiment of this invention, and Figure 2 is a schematic diagram of the main parts of the lead frame loader. 3 is a schematic diagram of the lead frame loader, FIG. 4 is a schematic diagram of the stop section with the loading frame raised, and FIG. 5 is a perspective view of the stop section. 1: Lead frame loader, 2: Lead frame, 3: Loading frame, 7: Support stand,
8: Conveyor, 9: Frame guide, 10:
Stopper, 10a: Slope.

Claims (1)

[Claims for Utility Model Registration] A lead frame loader that transports a lead frame of an electronic component includes a loading frame on which the lead frame is transported and placed at a predetermined position, and a lead frame is transported onto the loading frame. a frame guide provided parallel to the transport conveyor and only on one side of the transport conveyor to guide the lead frame; and a frame guide provided in front of a predetermined position where the lead frame stops and in front of the lead frame. 1. A lead frame loader comprising: a stopper having an inclined surface against which a corner portion on the open side opposite to the frame guide side of the corner portion abuts.