JPH01307233A - Soldering material supplying equipment - Google Patents
Soldering material supplying equipmentInfo
- Publication number
- JPH01307233A JPH01307233A JP13800788A JP13800788A JPH01307233A JP H01307233 A JPH01307233 A JP H01307233A JP 13800788 A JP13800788 A JP 13800788A JP 13800788 A JP13800788 A JP 13800788A JP H01307233 A JPH01307233 A JP H01307233A
- Authority
- JP
- Japan
- Prior art keywords
- soldering material
- detection sensor
- brazing material
- filler metal
- ribbon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 title claims abstract description 52
- 238000005476 soldering Methods 0.000 title abstract description 13
- 238000001514 detection method Methods 0.000 claims abstract description 23
- 238000005219 brazing Methods 0.000 claims description 69
- 239000002184 metal Substances 0.000 claims description 33
- 239000000945 filler Substances 0.000 claims description 31
- 238000005520 cutting process Methods 0.000 abstract description 10
- 230000003287 optical effect Effects 0.000 abstract description 5
- 239000004065 semiconductor Substances 0.000 description 6
- 230000007547 defect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、半導体チップ等をフレーム等に固着させるた
めのろう材を、フレームに供給する際に使用されるろう
材供給装置に関するものである。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a brazing material supply device used for supplying a brazing material to a frame for fixing a semiconductor chip or the like to the frame. .
従来のこの種ろう材供給装置はリボン形状のろう材を使
用し、とのろう材を機械的に一定量ずつ送る移送装置と
、この移送装置によって送られたリボン状ろう材を切断
するカッターと、このカッターで切断されたろう材片を
フレーム上の定位置へ移載させる移載装置とから構成さ
れている。これを図によって説明する。Conventional brazing material supply devices of this kind use ribbon-shaped brazing material, and include a transfer device that mechanically feeds the brazing material in a fixed amount at a time, and a cutter that cuts the ribbon-shaped brazing material fed by this transfer device. , and a transfer device that transfers the brazing filler metal pieces cut by the cutter to a fixed position on the frame. This will be explained using a diagram.
第３図は従来のろう材供給装置を示す斜視図で、同図に
おいて１はろう材で、ろう材用リール２に巻き付けられ
ている。３は前記ろう材１を移送するためのリボン送り
ローラで、駆動装置（図示せず）に連結され、ろう材１
を一定量ずつ移送するよう構成されている。４はろう材
１を切断するためのカッターで、このカッター４はろう
材１が挿入される凹部４ａを有するリボン受は部４ｂと
、このリボン受は部４ｂＫ当接される切断用上切刃４Ｃ
と、とれらリボン受は部４ｂおよび切断用上切刃４Ｃに
沿って平行移動しろう材１を切断する切断用下切刃４ｄ
とを備えている。５は前記カッター４で切断されたろう
材片１ａをフレーム６の所定位置に移載するための移載
装置としての吸着ニードルで、一端部にはろう材片１ａ
を吸着する真空吸着ノズル５ａが設けられており、駆動
装置（図示せず）に連結され、カッター４とフレーム６
との間を往復動自在に設けられている。また、この吸着
ニードル５は、ろう材片１ａを吸着した状態で真空吸着
ノズル５ａとろう材片１ａとの間から流入される空気量
を検出するセンサ（図示せず）を備え、圧力差を検出す
ることによってろう材片１ａが吸着されているか否かが
確認されていた０
このように構成されたろう材供給装置によってフレーム
６にろう材片１ａを供給するには、先ずリボン送りロー
ラ３を回転させることによりろう材１をカッター４に送
る。次いで、このカッター４でろう材１を切断させ、こ
のカッター４により切断されたろう材片１ａに吸着ニー
ドル５を近接させる。そして、吸着ニードル５の真空吸
着ノズル５ａにろう材片１ａを吸着させ、吸着ニードル
５を移動させろう材片１ａをフレーム６に移載させる。FIG. 3 is a perspective view showing a conventional brazing material supply device, in which reference numeral 1 denotes a brazing material, which is wound around a brazing material reel 2. As shown in FIG. Reference numeral 3 denotes a ribbon feed roller for transporting the brazing material 1, which is connected to a driving device (not shown) and is used to transport the brazing material 1.
It is configured to transfer a fixed amount of Reference numeral 4 denotes a cutter for cutting the brazing material 1, and the cutter 4 has a recess 4a into which the brazing material 1 is inserted, a ribbon holder having a section 4b, and an upper cutting edge for cutting that comes into contact with the ribbon holder section 4bK. 4C
The ribbon receiver moves in parallel along the portion 4b and the upper cutting blade 4C, and the lower cutting blade 4d cuts the brazing filler metal 1.
It is equipped with Reference numeral 5 designates a suction needle as a transfer device for transferring the brazing material piece 1a cut by the cutter 4 to a predetermined position on the frame 6, and the brazing material piece 1a is attached to one end thereof.
A vacuum suction nozzle 5a for suctioning the cutter 4 and the frame 6 is connected to a drive device (not shown).
It is provided so that it can freely move back and forth between the two. The suction needle 5 is also equipped with a sensor (not shown) that detects the amount of air flowing in from between the vacuum suction nozzle 5a and the soldering material piece 1a while the soldering material piece 1a is being adsorbed. By detecting this, it was confirmed whether or not the brazing material piece 1a was attracted. In order to supply the brazing material piece 1a to the frame 6 using the brazing material supplying device configured as described above, first, the ribbon feed roller 3 is moved. By rotating, the brazing filler metal 1 is sent to the cutter 4. Next, the cutter 4 is used to cut the brazing filler metal 1, and the suction needle 5 is brought close to the cutter filler metal piece 1a. Then, the vacuum suction nozzle 5a of the suction needle 5 adsorbs the brazing filler metal piece 1a, and the suction needle 5 is moved to transfer the brazing filler metal piece 1a onto the frame 6.
このようにしてフレーム６にろう材片１ａが供給される
ことになる。In this way, the brazing material piece 1a is supplied to the frame 6.
しかるに、従来のろう材供給装置においては、フレーム
６に供給されるろう材片１ａの大きさはリボン送りロー
２３により送られるろう材１の送り量によって決定され
、カッター４にろう材１が詰ったり、リボン送りローラ
３に空転等の不具合が生じた場合には、カッター４に所
定量のろう材１が送られず、ろう材片１ａをその大きさ
が均一になるよう形成することができない０また、ろう
材片１ａはその大きさが真空吸着ノズル５ａの内径より
大きければ、大きさに関係なくフレーム６に供給される
ことになり、ろう材片１ａが小さく形成された場合には
、後工程で固着される半導体チップの特性劣化、動作寿
命の短縮という問題が生じ、ろう材片１ａが大きく形成
された場合には、余剰ろう材が流れ出すことによって半
導体チップが短絡を起こすという問題があった。However, in the conventional brazing material supply device, the size of the brazing material piece 1a supplied to the frame 6 is determined by the feed amount of the brazing material 1 sent by the ribbon feed row 23, and the cutter 4 is clogged with the brazing material 1. Or, if a malfunction occurs in the ribbon feed roller 3 such as idling, the predetermined amount of the brazing material 1 is not fed to the cutter 4, and the brazing material pieces 1a cannot be formed to have uniform sizes. 0 Furthermore, if the size of the brazing filler metal piece 1a is larger than the inner diameter of the vacuum suction nozzle 5a, it will be supplied to the frame 6 regardless of the size, and if the brazing filler metal piece 1a is formed small, Problems arise such as deterioration of the characteristics of the semiconductor chip that is fixed in the subsequent process and shortening of its operating life, and if the solder metal piece 1a is formed to be large, the problem that the semiconductor chip is short-circuited due to excess solder metal flowing out is caused. there were.
本発明に係るろう材供給装置は、リボン状ろう材の先端
を検出する送り過ぎ検出センナおよび送り不足検出セン
サを、リボン状ろう材の送り方向に沿って所定間隔おい
て並設したものである。The brazing filler metal supply device according to the present invention includes an overfeed detection sensor and an underfeed detection sensor for detecting the tip of a ribbon-shaped brazing filler metal, which are arranged in parallel at a predetermined interval along the feeding direction of the ribbon-shaped brazing filler metal. .
リボン状ろう材の送り量が許容範囲内から外れると、送
り量不良として検出されることになり、一定寸法を有す
るろう材片を供給することができる０
〔実施例〕
以下、その構成等を図に示す実施例により詳細に説明す
る。第１図は本発明に係るろう材供給装置の概略構成を
示す側断面図、第２図は要部を拡大して示す側断面図で
、これらの図において第３図で説明したものと同一もし
くは同等部材にづいては同一符号を付し、ここにおいて
詳細な説明は省略する０これらの図において、１１線送
り過ぎ検出センナとしての最長限界検出センサ、１２は
送り不足検出センナとしての最短限界検出センサで、こ
れら両センサ１１．１２はそれぞれ光源１１ａｌ１２ａ
と、この光源からの光を検出するだめの受光素子１１ｂ
、１２ｂとから構成されている。また、前記光源１１ａ
、１２ａは、カッター４の切断用下切刃４ｄにろう材１
の送り方向に泊って複数穿設された透孔１３．１４内に
それぞれ取付けられている。光源１１ａは、ろう材１が
所定量より多く送られた際にろう材１の先端によって光
路が遮断されるよう位置付けられ、また光源１２ａは、
ろう材１が所定量送られている際には光路がろう材１に
よって遮断され、送り不足の際には遮光が解かれ受光素
子１２ｂへ入射されるよう位置付けられている。すなわ
ち、最長限界検出センサ１１はろう材１の送り過ぎをろ
う材１が光路を遮断することによって検出し、また最短
限界検出センサ１２はろう材１の送り不足をろう＊４１
により光路が遮断されなくなり、受光素子１２ｂに光が
入射されることによって検出するよう構成され、これら
両センナをろう材供給装置本体制御部に接続すれば、最
短限界検出センサ１２が遮光、最長限界検出センサ１１
が投光状態の時のみ切断用下切刃４ｄにより切断させ、
吸着ニードル５によってフレーム６に移載させてろう材
片１ａを供給することができる。また、前記の他の場合
、例えば最短限界検出センサ１２が投光となった場合や
、最長限界検出センサ１１が遮光とカつた場合には、各
センナからの信号により装置全体が停止される。If the feed rate of the ribbon-shaped brazing filler metal deviates from the allowable range, it will be detected as a feed rate defect, and a piece of brazing filler metal with a certain size can be supplied. This will be explained in detail with reference to the embodiments shown in the figures. Fig. 1 is a side cross-sectional view showing a schematic configuration of a brazing material supply device according to the present invention, and Fig. 2 is a side cross-sectional view showing an enlarged main part. Or equivalent parts are given the same reference numerals, and detailed explanations are omitted here. In these figures, 11 is the longest limit detection sensor as an overfeed detection sensor, and 12 is the shortest limit as an insufficient feed detection sensor. These two sensors 11.12 each have a light source 11al12a.
and a light receiving element 11b that detects the light from this light source.
, 12b. Further, the light source 11a
, 12a is a brazing material 1 on the lower cutting edge 4d of the cutter 4.
They are each installed in a plurality of through holes 13 and 14 drilled in the feeding direction. The light source 11a is positioned so that the optical path is blocked by the tip of the brazing filler metal 1 when more than a predetermined amount of the brazing filler metal 1 is fed, and the light source 12a is
The beam path is positioned so that when the brazing filler metal 1 is being fed by a predetermined amount, the optical path is blocked by the brazing filler metal 1, and when the brazing filler metal 1 is being fed insufficiently, the light is unblocked and enters the light receiving element 12b. That is, the longest limit detection sensor 11 detects overfeeding of the brazing filler metal 1 by the brazing filler metal 1 blocking the optical path, and the shortest limit detection sensor 12 detects insufficient feed of the brazing filler metal 1 by detecting insufficient feed of the brazing filler metal 1.
When the light path is no longer blocked and the light is incident on the light receiving element 12b, detection is performed.If both sensors are connected to the control unit of the main body of the brazing material supplying device, the shortest limit detection sensor 12 blocks the light and detects the longest limit. Detection sensor 11
Cut by the lower cutting blade 4d only when is in the light emitting state,
The brazing material piece 1a can be transferred to the frame 6 using the suction needle 5 and supplied. Further, in other cases as described above, for example, when the shortest limit detection sensor 12 emits light or when the longest limit detection sensor 11 interrupts light, the entire apparatus is stopped by signals from each sensor.
したがって、ろう材１の送り量が許容範囲内から外れる
と、送り量不良として検出されることにカリ、一定寸法
を有するろう材片１ａを供給することができる。Therefore, if the feed rate of the brazing filler metal 1 deviates from the allowable range, it is detected as an insufficient feed rate, and a piece of brazing filler metal 1a having a fixed size can be supplied.
以上説明したように本発明によればリボン状ろう材の先
端を検出する送り過ぎ検出センサおよび送り不足検出セ
ンナを、リボン状ろう材の送り方向に沿って所定間隔お
いて並設したため、リボン状ろう材の送り量が許容範囲
内から外れると、送り量不良として検出されることにな
り、一定寸法を有するろう材片を供給することができる
。したがって、ろう材の量が少なくなることによって半
導体チップの特性が劣化したり、動作寿命が短縮される
ことを防ぐことができ、またろう材の量が余剰となり半
導体素子が短絡を起こすようなこと、もないから、高品
質な半導体装置を製造することができる。As explained above, according to the present invention, the overfeed detection sensor and the underfeed detection sensor for detecting the tip of the ribbon-shaped brazing material are arranged side by side at a predetermined interval along the feeding direction of the ribbon-shaped brazing material. If the amount of feed of the brazing filler metal deviates from the allowable range, it will be detected as a feed rate defect, and a piece of brazing filler metal having a fixed size can be supplied. Therefore, it is possible to prevent the characteristics of the semiconductor chip from deteriorating or the operating life to be shortened due to a decrease in the amount of brazing filler metal, and it is also possible to prevent short-circuiting of semiconductor elements due to an excess amount of brazing filler metal. , it is possible to manufacture high quality semiconductor devices.
第１図は本発明に係るろう材供給装置の概略構成を示す
側断面図、第２図は製部を拡大して示す側断面図、第３
図は従来のろう材供給装置を示す斜視図である。
１・・・ｅろう材、１ａ＠・・０ろう材片、３・拳・・
リボン送りローラ、４・・ｍ−カッター、４ｄ・・拳・
切断用下切刃、５・・・・吸着ニードル、６１１・・・
フレーム、１１・・ｅ＠最長限界検出叱ンサ、１２・・
・・最短限界検出センナ。FIG. 1 is a side sectional view showing a schematic configuration of a brazing material supply device according to the present invention, FIG. 2 is a side sectional view showing an enlarged manufacturing section, and FIG.
The figure is a perspective view showing a conventional brazing material supply device. 1...e brazing material, 1a@...0 piece of brazing material, 3. fist...
Ribbon feed roller, 4...m-cutter, 4d...fist...
Lower cutting blade for cutting, 5... Suction needle, 611...
Frame, 11... e @ longest limit detection sensor, 12...
... Shortest limit detection sensor.
Claims (1)
、このカッターによって切断されたろう材片を移載装置
によって被供給部材に供給するろう材供給装置において
、前記リボン状ろう材の先端を検出する送り過ぎ検出セ
ンサおよび送り不足検出センサを、リボン状ろう材の送
り方向に沿って所定間隔おいて並設したことを特徴とす
るろう材供給装置。In a brazing material supplying device that includes a transfer device that transfers a ribbon-shaped brazing material to a cutter and supplies a piece of brazing material cut by the cutter to a supplied member by a transfer device, the tip of the ribbon-shaped brazing material is detected. A brazing filler metal supply device characterized in that an overfeed detection sensor and an underfeed detection sensor are arranged side by side at a predetermined interval along the feeding direction of ribbon-shaped brazing filler metal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13800788A JPH01307233A (en) | 1988-06-03 | 1988-06-03 | Soldering material supplying equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13800788A JPH01307233A (en) | 1988-06-03 | 1988-06-03 | Soldering material supplying equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01307233A true JPH01307233A (en) | 1989-12-12 |
Family
ID=15211882
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13800788A Pending JPH01307233A (en) | 1988-06-03 | 1988-06-03 | Soldering material supplying equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01307233A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5277354A (en) * | 1990-03-16 | 1994-01-11 | F&K Delvotec Bondtechnik Gmbh | Device for monitoring wire supply and consumption |
| JPH071115A (en) * | 1992-11-06 | 1995-01-06 | Tsukuba Seiki Kk | Automatic continuous soldering device and method for controlling feeding speed of thread solder |
| JP2008288334A (en) * | 2007-05-16 | 2008-11-27 | Yamaha Motor Co Ltd | Solder supplying apparatus, and surface mounting machine |
-
1988
- 1988-06-03 JP JP13800788A patent/JPH01307233A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5277354A (en) * | 1990-03-16 | 1994-01-11 | F&K Delvotec Bondtechnik Gmbh | Device for monitoring wire supply and consumption |
| JPH071115A (en) * | 1992-11-06 | 1995-01-06 | Tsukuba Seiki Kk | Automatic continuous soldering device and method for controlling feeding speed of thread solder |
| JP2008288334A (en) * | 2007-05-16 | 2008-11-27 | Yamaha Motor Co Ltd | Solder supplying apparatus, and surface mounting machine |
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