JPH01273683A - Laser beam machining device - Google Patents
Laser beam machining deviceInfo
- Publication number
- JPH01273683A JPH01273683A JP63102709A JP10270988A JPH01273683A JP H01273683 A JPH01273683 A JP H01273683A JP 63102709 A JP63102709 A JP 63102709A JP 10270988 A JP10270988 A JP 10270988A JP H01273683 A JPH01273683 A JP H01273683A
- Authority
- JP
- Japan
- Prior art keywords
- laser beam
- optical system
- pattern
- level
- laser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003754 machining Methods 0.000 title abstract description 8
- 230000003287 optical effect Effects 0.000 claims abstract description 40
- 238000001514 detection method Methods 0.000 claims abstract description 10
- 238000005286 illumination Methods 0.000 claims abstract description 9
- 230000004075 alteration Effects 0.000 abstract description 2
- 230000003247 decreasing effect Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
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- Laser Beam Processing (AREA)
Abstract
Description
【発明の詳細な説明】
[発明の目的]
(産業上の利用分野)
本発明はレーザ加工装置に係り、特に倣い制御方式の装
置に関する。DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a laser processing device, and particularly to a tracing control type device.
(従来の技術)
倣い制御方式のレーザ加工装置としては、従来特開昭5
4−31899号公報に開示された装置が知られている
。この装置は第3図に示す構成になっている。すなわち
、レーザ発振器(1)を有し、この発振器から放出され
たレーザ光(2)の光路にはレーザ光(2)を加工に用
いる出力密度の高いレーザ光(2a)と、検出に用いる
出力密度の低いレーザ光(2b)とに分けるビームスプ
リッタ(3)が設けられている。レーザ光(2a)の光
路にはモジュレータ(4)および反射鏡(5)が設けら
れ、この反射鏡(5)で直角に反射されたレーザ光(2
a)は第1の集光レンズ(6a)に入射するようになっ
ている。(Conventional technology) As a laser processing device using a scanning control method,
A device disclosed in Japanese Patent No. 4-31899 is known. This device has the configuration shown in FIG. That is, it has a laser oscillator (1), and the optical path of the laser beam (2) emitted from this oscillator includes a laser beam (2a) with high output density used for processing, and a laser beam (2a) with high output power used for detection. A beam splitter (3) is provided that separates the light into a low-density laser beam (2b). A modulator (4) and a reflecting mirror (5) are provided in the optical path of the laser beam (2a), and the laser beam (2a) is reflected at right angles by the reflecting mirror (5).
a) is made incident on the first condensing lens (6a).
一方、レーザ光(2b)は反射鏡(7)で反射されて、
レーザ光(2a)と平行の光路にされた後、さらに反射
鏡(8)でレーザ光(2a)と同軸になるように直角に
反射され、集光レンズ(6b)に入射するようになって
いる。上記第1.第2の集光レンズは支持体(9)に一
体に支持されている。支持体(9)はモータ(10)の
回転運動を直線運動に変換する送り機構(11)に結合
されている。集光レンズ(6a) 、 (8b)のそれ
ぞれの下方に位置し、またそれらの外周面が上記レンズ
の光軸を横切って回転される一対の円板(10a) 、
(10b)が段状に設けられている。これら円板は回
転軸(11)に共通に軸着され、減速機(12)を介し
てモータ(13)によって駆動される。下方側の円板(
10a)の外週面には所望のパターン(14)を形成し
た透明材からなるマスク(15)が固定されている。マ
スク(15)が固定されている円板(10a)の外周部
の一部はマスク(15)を照明するための通過孔(1B
)に形成されている。上記支持体(9)には光検出器(
18)が取付けられ、通過孔(16)に対面している。On the other hand, the laser beam (2b) is reflected by the reflecting mirror (7),
After being made into an optical path parallel to the laser beam (2a), it is further reflected by a reflecting mirror (8) at right angles so as to be coaxial with the laser beam (2a), and then enters a condenser lens (6b). There is. Above 1. The second condensing lens is integrally supported by the support (9). The support (9) is connected to a feed mechanism (11) which converts the rotational movement of the motor (10) into linear movement. a pair of discs (10a) located below each of the condenser lenses (6a) and (8b), and whose outer peripheral surfaces are rotated across the optical axis of the lenses;
(10b) are provided in a stepped manner. These disks are commonly attached to a rotating shaft (11) and driven by a motor (13) via a speed reducer (12). Lower disk (
A mask (15) made of a transparent material and having a desired pattern (14) formed thereon is fixed to the outer surface of 10a). A part of the outer periphery of the disk (10a) to which the mask (15) is fixed has a passage hole (1B) for illuminating the mask (15).
) is formed. The support (9) has a photodetector (
18) is attached and faces the passage hole (16).
光検出器(18)の検出信号はモジュレータ(4)を制
御する制御回路(20)に送られるようになっている。A detection signal from the photodetector (18) is sent to a control circuit (20) that controls the modulator (4).
また、支持体(9)用のモータ(lO)は送り速度制御
回路(21)と接続している。Further, the motor (lO) for the support (9) is connected to the feed speed control circuit (21).
以上のような構成で、加工は次のように行われる。上方
になる円板(10a)の外周面に複数の被加工物(22
)が所定ピッチで放射状に配列される。マスタ(15)
も被加工物(22)と同数それぞれ対面して配列される
。一対の円板(10a) 、(10b)が定速度で回転
される一方、支持体(9)がモータ(10)、送り機構
(11)によって定速度で半径方向に往復動される。光
検出器(18)は上記の回転と往復動中にマスタ(15
)を透過してきたレーザ光(2b)を検出し、その光量
が制御回路(20)へ送られる。制御回路(2o)では
マスタ(15)におけるパターン(14)に照射された
ときの光量と、パターン(14)以外の部分に照射され
たときの光量との違いでモジュレータ(4)をオン、オ
フ制御する。すなわち、パターン(14)に照射された
ときの光量の検出時にレーザ光(2a)が被加工物(2
2)が照射され、パターン(14)と同形に加工される
。With the above configuration, processing is performed as follows. A plurality of workpieces (22
) are arranged radially at a predetermined pitch. Master (15)
The same number of workpieces (22) are arranged facing each other. The pair of discs (10a) and (10b) are rotated at a constant speed, while the support (9) is reciprocated in the radial direction at a constant speed by a motor (10) and a feed mechanism (11). The photodetector (18) detects the master (15) during the above rotation and reciprocation.
) is detected, and the amount of light is sent to the control circuit (20). The control circuit (2o) turns on and off the modulator (4) based on the difference in the amount of light when the pattern (14) in the master (15) is irradiated and the amount of light when the part other than the pattern (14) is irradiated. Control. In other words, when detecting the amount of light irradiated onto the pattern (14), the laser light (2a) is applied to the workpiece (2).
2) is irradiated and processed into the same shape as the pattern (14).
なお、上記従来例の他に、実開昭60−11187号に
あるようにパターンをプログラム化し、このプログラム
に基づいて、レーザ光を走査する反射鏡や、XYテ〜プ
ルを制御してレーザ加工を行うことが知られている。In addition to the above-mentioned conventional example, a pattern is programmed as described in Utility Model Application Publication No. 60-11187, and based on this program, a reflecting mirror that scans the laser beam and an XY table are controlled to perform laser processing. is known to do.
(発明が解決しようとする課8)
上記前者の場合では、マスクを配列するテーブルと被加
工物を配列するテーブルの二つが必要であり、また、検
出用と加工用の二種の光学系が必要であり、さらに、こ
れら光学系のための二つの駆動系が必要となり、装置が
大形化してしまう欠点があった。また、後者の場合、微
細なパターンの加工が困難となるばかりでなく、プログ
ラムが極めて繁雑となる欠点があった。本発明はこのよ
うな事情に鑑みてなされたもので、装置が大形化せずに
微細なパターンを高精度に加工するレーザ装置を提供す
ることを目的とする。(Issue 8 to be solved by the invention) In the former case, two tables are required, one for arranging the masks and the other for arranging the workpieces, and two types of optical systems, one for detection and one for processing, are required. Furthermore, two drive systems for these optical systems are required, which has the disadvantage of increasing the size of the apparatus. Moreover, in the latter case, not only is it difficult to process fine patterns, but also the program is extremely complicated. The present invention has been made in view of the above circumstances, and it is an object of the present invention to provide a laser device that can process fine patterns with high precision without increasing the size of the device.
C発明の構成]
(課順を解決するための手段と作用)
エネルギレベルが照明レベルと加工レベルに変更可能な
二つのレーザ光を予め定められた範囲に2次元走査する
可変光学系と、基準パターンを有し上記可変光学系を経
た上記照明レベルのレーザ光で照射されるパターン原板
と、上記照明レベルのレーザ光の上記二次元走査の照射
を受けた上記基準パターンを含む領域からの反射光量を
検出する検出手段と、上記可変光学系に駆動信号を送出
するとともに上記検出した反射光量から上記基準パター
ンを記憶しこの記憶した信号から被加工物に対し上記加
工レベルのレーザ光を上記基準パターンに応じた照射に
制御する制御部とを備えた構成としたもので、基準パタ
ーンの走査時と加工時の光学系が同一のため、極めて良
好に再現加工する。Structure of invention C] (Means and effects for solving the order of assignments) A variable optical system that two-dimensionally scans a predetermined range with two laser beams whose energy level can be changed to an illumination level and a processing level, and a reference. A pattern original plate having a pattern and irradiated with a laser beam at the illumination level that has passed through the variable optical system, and an amount of reflected light from an area including the reference pattern that has been irradiated with the two-dimensional scanning of the laser beam at the illumination level. a detection means for detecting the processing level, and a detection means for transmitting a drive signal to the variable optical system, storing the reference pattern from the detected amount of reflected light, and applying the laser beam of the processing level to the workpiece based on the stored signal in the reference pattern. Since the optical system used during scanning and processing of the reference pattern is the same, extremely good reproducibility is achieved.
(実施例) 以下、実施例を示す図面に基づいて本発明を説明する。(Example) EMBODIMENT OF THE INVENTION Hereinafter, this invention will be explained based on drawing which shows an Example.
第1図は本発明の一実施例で、エネルギレベルが照明用
、加工用の高低に切換え可能な連続発振のYAGレーザ
等からなるし〜ザ発振器(3o)(以下、単に発振器と
略す)が所定位置に設けられている。この発振器(30
)から放出されたレーザ光(31)はX方向に走査する
第1の走査光学系(32)とこの光学系と対になって設
けられY方向に走査する第2の走査光学系(33)とを
経て記録兼加工用の第1の集光レンズ(34)によって
集光されるようになっている。発振器(30)とこの発
振器側に位置した第1の走査光学系(32)におけるレ
ーザ光(31)の光路には部分反射鏡(35)が設けら
れている。部分反射鏡(35)は第1の走査光学系(3
2)から発振器(30)に向かう反射光を上記光路に同
一平面内で直角に反射させるように反射面が傾けられて
いる。Figure 1 shows an embodiment of the present invention, which consists of a continuous wave YAG laser whose energy level can be switched between high and low levels for illumination and processing. provided in a predetermined position. This oscillator (30
) is emitted from a first scanning optical system (32) that scans in the X direction, and a second scanning optical system (33) that is paired with this optical system and scans in the Y direction. The light is then condensed by a first condensing lens (34) for recording and processing. A partial reflecting mirror (35) is provided in the optical path of the laser beam (31) in the oscillator (30) and the first scanning optical system (32) located on the oscillator side. The partially reflecting mirror (35) is connected to the first scanning optical system (3
The reflecting surface is tilted so as to reflect the reflected light from 2) toward the oscillator (30) at right angles to the optical path within the same plane.
部分反射鏡(35)よりの上記反射光の光路には第2の
集光レンズ(36)および光検出器(37)が順次設け
られている。光検出器(37)はパターン原板(50)
の位置および集光レンズ(34)、(3B)の位置によ
り設置位置が決まる。その位置はパターン原板(50)
の位置に対して共役な位置となる必要がある。第1゜第
2の走査光学系の制御のために、光検出器(37)の検
出信号を入力する制御部(40)が設けられている。制
御部(40)は第2図に示すように、上記検出信号を入
力しこの入力信号に基準光量と比較した“1″、“0”
のオンまたはオフ信号を付加して出力する比較回路(4
1)と、比較回路(41)から出力した信号を入出力回
路(42)を通して記憶する記憶回路(43)と、入出
力回路(42)と記憶回路(43)とのバス(45)に
共通に接続される中央処理装置(44)と、第1の走査
光学系(32)の振り角を指令する第1のD/A変換器
(46)およびその指令に基づく駆動をさせるX軸ドラ
イバ(47)と、第2の走査光学系(33)の振り角を
指令する第2のD/A変換器(48)およびその指令に
基づく駆動をさせるY軸ドライバ(49)とを主要素と
して構成されている。中央処理装置(44)は第1の集
光レンズ(34)の焦点位置に置かれるパターン原板(
50)に対する走査範囲と、記憶回路(43)に記憶さ
れた走査信号を入出力回路(42)を通して発振器(3
0)側へ送る指令の制御を行うようになっている。入出
力回路(42)からはパターン原板(50)に形成され
た基準パターン(51)の照射時のときに、発振器(3
0)内に組込まれた音響素子等からなるQスイッチ(図
示せず)を開く制御信号を送る回路構成になっている。A second condenser lens (36) and a photodetector (37) are sequentially provided on the optical path of the reflected light from the partial reflecting mirror (35). The photodetector (37) is the pattern original plate (50)
The installation position is determined by the position of and the positions of the condenser lenses (34) and (3B). Its position is the pattern original plate (50)
The position must be conjugate to the position of . In order to control the first and second scanning optical systems, a control section (40) is provided which inputs a detection signal from the photodetector (37). As shown in FIG. 2, the control unit (40) inputs the detection signal and outputs "1" and "0" to this input signal as compared with the reference light amount.
A comparator circuit (4) that adds and outputs an on or off signal
1), a memory circuit (43) that stores the signal output from the comparison circuit (41) through the input/output circuit (42), and a bus (45) common to the input/output circuit (42) and the memory circuit (43). a central processing unit (44) connected to the first scanning optical system (32), a first D/A converter (46) that commands the swing angle of the first scanning optical system (32), and an X-axis driver (46) that drives based on the command. 47), a second D/A converter (48) that commands the swing angle of the second scanning optical system (33), and a Y-axis driver (49) that drives based on the command. has been done. The central processing unit (44) processes a pattern original plate (
The scanning range for 50) and the scanning signal stored in the storage circuit (43) are transmitted to the oscillator (3
It is designed to control commands sent to the 0) side. The input/output circuit (42) outputs an oscillator (3) when irradiating the reference pattern (51) formed on the pattern original plate (50).
The circuit has a circuit configuration that sends a control signal to open a Q switch (not shown) consisting of an acoustic element etc. incorporated in the 0).
次に上記構成の作用について説明する。発振器(30)
は低エネルギレベルに切換えられて、弱いレーザ光が放
出されるように準備される。ここで先ず、第1の集光レ
ンズ(34)の焦点位置にパターン原板(50)が公知
の位置決め手段によって定置される。次に、上記弱いレ
ーザ光が放出されるとともに、中央処理装置(44)を
してパターン原板(5o)に対してレーザ光(31)が
第1.第2の走査光学系で定められた範囲を走査され、
光検出器(37)の検出光量から基準パターン(51)
の部分が“1#、それ以外の部分が“θ″として記憶回
路(43)に記憶される。上記走査後に発振器(3o)
は高エネルギレベルに切換えられ、加工が準備される。Next, the operation of the above configuration will be explained. Oscillator (30)
is switched to a low energy level and a weak laser light is prepared to be emitted. First, the pattern original plate (50) is placed at the focal position of the first condensing lens (34) by a known positioning means. Next, the weak laser beam is emitted, and the central processing unit (44) emits the first laser beam (31) onto the pattern original plate (5o). A predetermined range is scanned by a second scanning optical system,
The reference pattern (51) is determined from the amount of light detected by the photodetector (37).
The part is stored as "1#" and the other parts are stored as "θ" in the memory circuit (43). After the above scanning, the oscillator (3o)
is switched to a high energy level and prepared for machining.
すなわち、パターン原板(50)が除去され、同一位置
に被加工物(52)が定置される。中央処理装置(44
)をして第1、第2の走査光学系が第1.第2のD/A
変換器(4G) 、 (48)で振り角を制御され、そ
れぞれX。That is, the pattern original plate (50) is removed and the workpiece (52) is placed in the same position. Central processing unit (44
) so that the first and second scanning optical systems are connected to the first. 2nd D/A
The swing angle is controlled by converters (4G) and (48), respectively.
Y軸ドライバ(47) 、 (49)でXYに走査され
る。この走査時において、記憶回路(43)に記憶され
た信号の内、基準パターン(51)の位置で“1”の信
号、すなわち、上記図示せぬQスイッチが開かれ、発振
中のレーザ光を発振器(30)外に放出して第1の走査
光学系(32)に入射させる。これにより被加工物(5
2)の加工面に基準パターン(51)と同形のパターン
が加工される。It is scanned in XY by Y-axis drivers (47) and (49). During this scanning, among the signals stored in the memory circuit (43), a signal of "1" at the position of the reference pattern (51), that is, the above-mentioned Q switch (not shown) is opened, and the laser beam being oscillated is The light is emitted from the oscillator (30) and incident on the first scanning optical system (32). As a result, the workpiece (5
A pattern having the same shape as the reference pattern (51) is processed on the processed surface of 2).
なお、パターン原板(5o)および被加工物(52)を
定置するために、インデックステーブル、水平方向に往
復動する切換えテーブル等を用いれば、効率的に同じパ
ターンが複数個加工することができる。また、基準パタ
ーン(51)を記憶後は第1の集光レンズ(34)を透
過したレーザ光を反射鏡や光ファイバで全く別の箇所に
導き、再度集光するように構成すれば被加工物(52)
をパターン原板(5o)と同じ箇所に配置する必要はな
い。さらに、上記実施例では発振器を制御してし゛−ザ
光のエネルギレベルを切替えたが、これに限ることなく
例えば加工用と照明用の2台の発振器を設け、これら発
振器から放出された二つのレーザ光をグイクロイックミ
ラ等で同一光軸に重畳するよにに構成してもよい。Note that if an index table, a switching table that reciprocates in the horizontal direction, or the like is used to position the pattern original plate (5o) and the workpiece (52), it is possible to efficiently process a plurality of the same patterns. In addition, after memorizing the reference pattern (51), the laser beam transmitted through the first condensing lens (34) can be guided to a completely different location using a reflecting mirror or an optical fiber, and the beam can be condensed again. Things (52)
There is no need to place it at the same location as the pattern original plate (5o). Furthermore, in the above embodiment, the oscillator was controlled to switch the energy level of the laser light, but the invention is not limited to this; for example, two oscillators, one for processing and one for illumination, may be provided, and the two oscillators emitted from these oscillators may be The laser beams may be configured to be superimposed on the same optical axis using a guichroic mirror or the like.
[発明の効果]
パターン原板のパターンの倣いと加工とを同一の光学系
にしたので、装置の構成が大幅に簡略化され、小形化を
達成することができた。また、光学系が同一であること
から、レンズの収差によるパターンの歪みなども相殺さ
れ、基準パターンを極めて高精度にしかも再現性よく加
工することができるようになった。したがって、一般の
倣い加工は無論のこと、マーキング加工においても極め
て良好に行なえるようになった。[Effects of the Invention] Since the same optical system is used for copying and processing the pattern on the pattern original plate, the configuration of the device can be greatly simplified and miniaturization can be achieved. Furthermore, since the optical systems are the same, distortion of the pattern due to lens aberrations is canceled out, making it possible to process the reference pattern with extremely high precision and good reproducibility. Therefore, not only general copying processing but also marking processing can now be performed extremely well.
第1図は本発明の一実施例を示す構成図、第2図は上記
第1図における制御部を示すブロック図、第3図は従来
例を示す構成図であ゛る。
(30〉・・・レーザ発振器
(32)・・・第1の走査光学系(可変光学系)(33
)・・・第2の走査光学系(可変光学系)(37)・・
・光検出器(検出手段)
(40)・・・制御部
(50)・・・パターン原板FIG. 1 is a block diagram showing an embodiment of the present invention, FIG. 2 is a block diagram showing the control section in FIG. 1, and FIG. 3 is a block diagram showing a conventional example. (30>... Laser oscillator (32)... First scanning optical system (variable optical system) (33
)...Second scanning optical system (variable optical system) (37)...
・Photodetector (detection means) (40)...Control unit (50)...Pattern original plate
Claims (1)
二つのレーザ光を予め定められた範囲に2次元走査する
可変光学系と、基準パターンを有し上記可変光学系を経
た上記証明レベルのレーザ光で照射されるパターン原板
と、上記照明レベルのレーザ光の上記二次元走査の照射
を受けた上記基準パターンを含む領域からの反射光量を
検出する検出手段と、上記可変光学系に駆動信号を送出
するとともに上記検出した反射光量から上記基準パター
ンを記憶しこの記憶した信号から被加工物に対し上記加
工レベルのレーザ光を上記基準パターンに応じた照射に
制御する制御部とを備えたことを特徴とするレーザ加工
装置。A variable optical system that two-dimensionally scans a predetermined range with two laser beams whose energy level can be changed to illumination level and processing level, and a laser beam of the above certification level that has a reference pattern and passes through the variable optical system. a detection means for detecting an amount of reflected light from a pattern original plate to be irradiated, a region including the reference pattern irradiated by the two-dimensional scanning of the laser beam at the illumination level, and a drive signal to the variable optical system. and a control unit that stores the reference pattern from the detected amount of reflected light and controls the irradiation of the laser beam at the processing level to the workpiece based on the stored signal in accordance with the reference pattern. Laser processing equipment.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63102709A JPH01273683A (en) | 1988-04-27 | 1988-04-27 | Laser beam machining device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63102709A JPH01273683A (en) | 1988-04-27 | 1988-04-27 | Laser beam machining device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01273683A true JPH01273683A (en) | 1989-11-01 |
Family
ID=14334797
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP63102709A Pending JPH01273683A (en) | 1988-04-27 | 1988-04-27 | Laser beam machining device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01273683A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0449680A (en) * | 1990-06-18 | 1992-02-19 | Advantest Corp | Laser machining method for semiconductor wafer |
JP2009039783A (en) * | 2007-08-07 | 2009-02-26 | Visiontech | Laser apparatus for patterning at light guide plate of back light unit and method for forming pattern at light guide plate of back light unit using thereof |
JP2009172647A (en) * | 2008-01-25 | 2009-08-06 | Pulstec Industrial Co Ltd | Laser machining apparatus and laser machining method |
US7728255B2 (en) * | 2006-04-28 | 2010-06-01 | Coretronic Corporation | Spinning-type pattern-fabrication system and a method thereof |
ITTO20110425A1 (en) * | 2011-05-12 | 2012-11-13 | Adige Spa | PROCEDURE FOR THE SCANNING OF A TUBE INTENDED TO BE WORKED ON A LASER CUTTING MACHINE |
-
1988
- 1988-04-27 JP JP63102709A patent/JPH01273683A/en active Pending
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0449680A (en) * | 1990-06-18 | 1992-02-19 | Advantest Corp | Laser machining method for semiconductor wafer |
US7728255B2 (en) * | 2006-04-28 | 2010-06-01 | Coretronic Corporation | Spinning-type pattern-fabrication system and a method thereof |
JP2009039783A (en) * | 2007-08-07 | 2009-02-26 | Visiontech | Laser apparatus for patterning at light guide plate of back light unit and method for forming pattern at light guide plate of back light unit using thereof |
JP2009172647A (en) * | 2008-01-25 | 2009-08-06 | Pulstec Industrial Co Ltd | Laser machining apparatus and laser machining method |
ITTO20110425A1 (en) * | 2011-05-12 | 2012-11-13 | Adige Spa | PROCEDURE FOR THE SCANNING OF A TUBE INTENDED TO BE WORKED ON A LASER CUTTING MACHINE |
WO2012153315A1 (en) * | 2011-05-12 | 2012-11-15 | Adige S.P.A. | Method for scanning a tube intended to be worked on a laser cutting machine using a sensor for measuring the radiation reflected or emitted by the tube |
CN103547404A (en) * | 2011-05-12 | 2014-01-29 | 艾迪奇股份公司 | Method for scanning a tube intended to be worked on a laser cutting machine using a sensor for measuring the radiation reflected or emitted by the tube |
RU2608868C2 (en) * | 2011-05-12 | 2017-01-25 | АДИДЖЕ С.п.А. | Method of pipe scanning intended for processing at laser cutting machine, using sensor for measuring radiation reflected or emitted by pipe |
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