JPH01270250A - Integrated circuit device and its manufacture - Google Patents

Abstract

PURPOSE:To improve thickness accuracy and reduce cost by covering, with insulating protective material, conductor lines each of which is partly exposed and is used to connect plural input/output pads of an integrated circuit with conductor pads on an insulating board which has plural conductor pads, and equipping plural electrodes such that they correspond to the exposed conductor lines. CONSTITUTION:It is constituted of an IC 24 which is placed on one face 23 of an insulating substrate 22 having plural conductor pads 21, plural conductor lines 25 which connect input/output pads of IC 24 and conductor pads 21, sealing resin 26 which contains the conductor pads 21, the IC 24 and the conductor lines 25 and is so arranged as to partly expose the conductor line 25, and plural electrodes 27 which are so installed as to correspond to the conductor lines 25 each of which is exposed from the sealing resin 26. Accordingly, for substrate processing, the substrate can be formed using an injection molding method, and further it becomes simple constitution not requiring through holes. Hereby, improvement of thickness accuracy and cost reduction can be realized.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to an integrated circuit device (hereinafter referred to as an IC module) used, for example, in an IC card or the like.

Conventional technology Conventionally, identification methods using magnetic or optical reading have been used to identify individuals, but these cards lack permanence and are easy to change, resulting in low identification security. was there. For this reason, recently, ICs equipped with integrated circuits (hereinafter referred to as ICs) or built-in
Studies are underway to put a system that uses cards as identification cards into practical use.

These IC cards have a larger storage capacity than conventional magnetic stripe cards, and have a built-in IC microcomputer that makes identification more secure. Application systems are being considered for storing transaction history, such as shopping history in the credit-related field, and personal health data in the medical field.

Although there are many types of IC cards, D' is also a thin type, and the standardization of an IC card with a thickness of 760 μm is being considered by the International Organization for Standardization (I5O).

Below, the conventional IC card and the IC used in this card will be explained.
The C module will be explained with reference to the attached drawings.

FIG. 5 is a perspective view of the IC card, FIG. 5 is a cross-section of MuA' in FIG. 5, showing the vicinity of the IC module, FIG. 7 is a cross-sectional view of the circuit board, and FIG. FIG. 2 is a cross-sectional view of an IC module using the circuit board shown in the figure.

Conventionally, this type of IC card has been manufactured by using an end mill or Thomson mold to form an IC module 300 in size on a 760 μm thick plastic card 1 in the form of a stack or sheet, as shown in FIGS. The IC module 30'fr, which has a hole 2 and is slightly thinner than the plastic card 1, is inserted and glued so that the electrode 3 for external connection is exposed. A circuit board 20i as shown in FIG. First, a substrate 4 made of glass epoxy or polyimide with a thickness of about 300 μm is prepared.
Copper foil with a thickness of 16 to 36 μm is laminated on both sides, etched to obtain the desired pattern, through holes 6 are made to connect the patterns on the front and back sides, and then nickel and gold are plated to form the exterior. electrodes 3 and circuit patterns 6 are formed. Furthermore, in order to extremely thinly mount the IC module, the substrate 4 is counterbored using an end mill to form a recess 7, and then an insulating protective material (hereinafter referred to as sealing resin) is used to protect the ICs. A sealing frame 8 for preventing leakage of the circuit pattern 11 from the through hole 6 is attached onto the circuit pattern 6 using an adhesive or the like. The circuit board 20 obtained by the above method (using i-, then I
FIG. 8 will be used to explain where Ce is implemented. After die-bonding a 9ft IC into the recess 7 and connecting the circuit pattern 6 and the input/output pad (not shown) of the IC 9 with a wire bonding 10 made of a material such as gold, aluminum, or steel with the wire loop height as low as possible, the above steps are performed. ze9t
It was covered with a sealing resin 11 such as epoxy resin.

Problems to be Solved by the Invention IC cards are similar to conventional magnetic stripe cards.
Since a thickness of 0 μm is required, the thickness of the IC module 30 to be buried is greatly restricted. For example, an IC module 30 is attached to a plastic card 1 as shown in FIG.
In the case of an IC card configured to be embedded, use an end mill or Thomson mold to drill holes 2 into plastic card 1.
, and the thickness of the remaining part of plastic card 1 is 9
When it is 0 μm, the thickness of the IC module 30Fi buried in the hole 2 needs to be limited to 670 μm.

As the basic dimensions for determining the thickness of this IC module 30, the 8 dimensions of the circuit board 2o in FIG. 7 are extremely necessary. However, in manufacturing the circuit board 20, it is very difficult to manufacture the circuit board 20 within a predetermined dimensional range, for example, 870mm thick and 30μ thick, resulting in a poor manufacturing yield and an expensive circuit board. In addition, since the electrode 3 and the circuit pattern 6 are connected through the through hole 6, it becomes very complicated. Although it is necessary to make the loop height of the wire 10 that connects the circuit pattern 6 very low, stable low loop bonding is extremely difficult.

Furthermore, the surface of the electrode 3 is often made of a soft gold plating layer (IC: During the mounting of the module 30, the electrode 3 on the back side is easily scratched, resulting in poor appearance and lowering manufacturing yield. It was also becoming.

The technical means of the present invention for determining the problem and solving all of the above problems is to connect an IC mounted on an insulating substrate, an input/output pad of the IC, and a conductor pad on the insulating substrate. Connect the conductor wire and the conductor pad so that a part of the conductor wire is exposed, and connect the conductor wire and the conductor pad to the IC' ((the stacked sealing resin and the part exposed from the sealing surface). It is composed of electrodes installed in correspondence with the conductor wires described above.

Function: With this configuration, the substrate can be processed using injection molding, and since it has a simple structure that does not require through holes, it has high thickness accuracy and can be manufactured at low cost. In addition, when mounting ICs, wire bonding conditions with a small loop height are sufficient, making stable and reliable mounting possible.Furthermore, since the electrodes are formed in the final process, IC modules with fewer electrode scratches can be achieved. Embodiment Hereinafter, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a cross-sectional structural diagram of an IC module according to a first embodiment of the present invention. input/output pad (not shown) and the conductor pad 21f! : A plurality of conductor wires 26 to be connected,
The sealing resin 26 includes the conductor pad 21, the IC 24, and the conductor wire 26, and is provided so that a part of the conductor wire 26 is exposed, and the conductor wire 26 is partially exposed from the sealing resin 26. It is composed of a plurality of electrodes 2T installed in correspondence with the electrodes 2T.

A method of manufacturing the IC module configured as described above will be explained below with reference to FIG. 2. For example, the insulating substrate 22 is molded by injection molding, and then the insulating substrate 2
The IO 24 is placed at a predetermined location on the negative side 23 of the ICE 24, and then the input/output pad (not shown) of the ICE 24 and the conductor pad 21 are connected to a conductor wire made of gold, copper, etc. by wire bonding, for example. 26 to maintain a predetermined loop height and connect (FIG. 2a). At this time, the height of the loop 4 of the conductor wire 26 is set to the height at which the conductor wire 26 contacts the upper mold for transfer molding in the next step, taking into account the total thickness of the IC module. The conductor wire 26 is molded with, for example, an epoxy sealing resin 26 by a transfer molding method using a method such that the highest portion 29 of the conductor wire 26 is exposed (FIG. 2b). In other words, since the highest part 29 of the conductor wire 25 is molded in a state in which it is in contact with the upper mold for transfer molding (FIG. 2a), the highest part 29 of the four bodies ffM25 is exposed from the sealing resin 26. I will do it. Naturally, even if there is variation in the loop height of the conductor wire 25, since it is held down by the upper die of the seven transfer molding, it is possible to make the height of the highest part 29 almost uniform, and the height of the highest part 29 can be made almost uniform. The upper surface of the sealing resin 26 becomes substantially flat. However, in order to achieve complete contact between the conductor wire 26 and the electrode 27, the surface of the sealing resin 260 is polished to a thickness of, for example, several microns after soil molding.
may be widely exposed.

Further, in correspondence to the exposed highest portion 29 of the conductor wire 26, a layer made of copper, nickel, or gold is placed on the sealing resin 26 by, for example, a plating method so as to be in contact with the conductor wire 26. The electrode 27 is patterned (second
Figure C). It goes without saying that the number and shape of the electrodes 27 at this time comply with the ISO standard. In this structure, only the side 23 on which the IC 24 is placed is molded with the sealing resin 26, but the It is also possible to cover the main surface 28 side of the insulating substrate 22 with the sealing material 2e, and with this structure, the above IC 24 can be coated with the same sealing material.
Since both the front and back sides are sealed, the strain stress applied to the IC 24 is reduced, making it possible to improve the reliability of the IC 24.

Next, a second embodiment of the present invention will be described using FIG. 3. The main structure is the same as that of the first embodiment, but the structure of the insulating substrate 22 is changed, and at least the input/output pads (not shown) of the IC 24 and the conductor pads of the insulating substrate 22 are changed. In this structure, a wall 30 is provided on the insulating substrate 22 along a path where the conductor wires 21 are connected to each other by the conductor wire 26.

The height of the upper 8C wall 30 is approximately the height obtained by subtracting the wire diameter of the conductor wire 26 from the surface of the upper mold for transfer molding,
During transfer molding, the conductor wire 26 is sandwiched between the upper mold and the wall 30 so that the height of the uppermost portion 29 of the conductor wire 26 is kept constant.

In addition, with this structure, when wire bonding the conductor wire 26, poor contact between the conductor wire 26 and the electrode 27 due to variations in bonding performance of the wire bonding equipment (particularly a problem when the loop height becomes low) can be avoided. It becomes possible to eliminate it.

In the structure of the solid IC module described above, the other surface 28 of the insulating substrate 22 is made of insulating street resin such as Empera material, for example, and when it is made into an IC card, the insulating resin is used as the card material. It will be directly bonded with a specified adhesive. Next, in order to further strengthen the adhesive force between the card material and the IC module, a third embodiment will be described as shown in FIG. 4. A metal plate 31 made of copper, nickel, stainless steel, etc. is placed on the other surface 28 of the insulating substrate 22.
It is formed on almost the entire surface of. If this structure is
When making an IC card, the metal plate 31 is bonded to the card material Enbi using an adhesive, which has stronger adhesive strength than if an insulating resin is bonded, making it possible to create a highly reliable IC card. It becomes possible. The metal plate 31 may be formed at the same time as the conductor pad 21 or the electrode 27 when the insulating substrate 22 is made.

The insulating substrate 22 used in the present invention described above was manufactured by injection molding, but since IC modules for IC cards require high thickness accuracy, a highly accurate injection molding method was adopted. .

Further, a conductive pad 21 is provided on one surface 23 of the insulating substrate 21.
The conductor wire 26 closely reflects the conductor pad 21 and the input/output pad (not shown) on the IC 24, but the conductor pad 21 is not provided and the input/output pad (not shown) on the IC 24 is provided instead. Make the output band louder or use the above IC2
A dummy pad may be provided on the IC 24, and the conductor wire 26 may be wire-bonded on the IC 24 to form a loop of a predetermined height.

Effects of the Invention As described above, according to the present invention, the substrate can be formed using the injection molding method and has a simple structure that does not require through holes, so it can be manufactured at low cost with high thickness accuracy. In addition, since wire bonding conditions with a high loop height are sufficient for mounting, stable and reliable IC mounting is possible.Furthermore, since the electrodes are formed in the final process, IC modules with extremely few scratches can be produced. It becomes possible to manufacture.

[Brief explanation of the drawing]

FIG. 1 is a sectional view of an IC module according to the first embodiment of the present invention, FIG. 4 is a sectional view of the third embodiment of the invention, FIG. 5 is a perspective view of the IC card, and FIG. 5 is a sectional view taken along the Moum' line in FIG. , FIG. 7 is a sectional view of a conventional circuit board, and FIG. 8 is a sectional view of a conventional IC module. 21... Conductor pad, 22... Insulating substrate, 23... - surface, 24... IC,
25... Conductor wire, 26... Sealing resin,
27...electrode, 28...other surface, 29.
...Top, 30...Wall, 31...
...Metal plate. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
Figure 7 Figure 2 Figure 3 Figure 5 /j) - 'F' 30IOMoji restaurant Figure 5

Claims (7)

[Claims] (1) An integrated circuit mounted on one surface of an insulating substrate having a plurality of conductor pads, a plurality of conductor wires connecting the plurality of input/output pads of the integrated circuit and the conductor pads, and a plurality of conductor wires connecting the conductor pads to the plurality of input/output pads of the integrated circuit; An insulating protective material that partially exposes the conductor wire, the conductor pad, and the integrated circuit, and a plurality of electrodes that are installed in correspondence with the conductor wire that is partially exposed from the insulative protective material. An integrated circuit device comprising: (2) The integrated circuit device according to claim 1, wherein the insulating substrate is formed by injection molding. (3) The integrated circuit device according to claim 1, wherein a wall having higher insulating properties than the conductor pads is provided between the portion of the insulating substrate on which the integrated circuit is mounted and the conductor pads. (4) The integrated circuit device according to claim 1, wherein a metal plate is provided on the other surface of the insulating substrate. (5) a step of placing an integrated circuit on one surface of an insulating substrate having a plurality of conductor pads; a step of connecting the plurality of input/output pads of the integrated circuit and the conductor pads with a plurality of conductor wires; A step of exposing a part of the conductor wire and covering the conductor wire, the conductor pad, and the integrated circuit with an insulating protective material; A method for manufacturing an integrated circuit device, comprising the step of forming electrodes. (6) The method for manufacturing an integrated circuit device according to claim 5, wherein the method for connecting the conductor wires is a wire bonding method. (7) The method of manufacturing an integrated circuit device according to claim 5, wherein the method of exposing a portion of the conductor wire is a method of polishing the insulating protective material.