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JPH01240274A - Hybrid polishing tape - Google Patents

Hybrid polishing tape

Info

Publication number
JPH01240274A
JPH01240274A JP6716888A JP6716888A JPH01240274A JP H01240274 A JPH01240274 A JP H01240274A JP 6716888 A JP6716888 A JP 6716888A JP 6716888 A JP6716888 A JP 6716888A JP H01240274 A JPH01240274 A JP H01240274A
Authority
JP
Japan
Prior art keywords
polishing
polishing tape
tape
films
abrasive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6716888A
Other languages
Japanese (ja)
Inventor
Yasuki Suzuura
泰樹 鈴浦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dai Nippon Printing Co Ltd
Original Assignee
Dai Nippon Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dai Nippon Printing Co Ltd filed Critical Dai Nippon Printing Co Ltd
Priority to JP6716888A priority Critical patent/JPH01240274A/en
Publication of JPH01240274A publication Critical patent/JPH01240274A/en
Pending legal-status Critical Current

Links

Landscapes

  • Polishing Bodies And Polishing Tools (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)

Abstract

PURPOSE:To perform a good finish-polishing so that a substrate develops the cushioning ability and other various performances intended for use during the time of using a polishing tape by forming the substrate by two or more types of films having different physical properties. CONSTITUTION:A substrate for a polishing tape used for polishing magnetic heads, magnetic discs, optical fiber end faces is formed by two or more types of films having different physical properties. As a result, the substrate develops the cushioning ability and other various performances (mechanical strength, dimensional stability, heat-resisting property and the like) intended for use during the time of using the polishing tape. When a work is finish-polished with the polishing tape held closely in contact with the work, an excessive pressure applied to the polishing tape can thus be absorbed by the cushioning ability of the substrate, and the work can be favorably polished and finished.

Description

【発明の詳細な説明】 〔産業上の利用分野] 本発明は磁気ヘッドや磁気ディスクの仕上げ研磨、光フ
アイバ一端面の精密仕上げ研磨、金型の精密仕上げ研磨
等に使用される研磨テープに関するものである。
[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to an abrasive tape used for finish polishing of magnetic heads and magnetic disks, precision finish polishing of one end face of optical fibers, precision finish polishing of molds, etc. It is.

〔従来の技術〕[Conventional technology]

精密機械部品や精密電子部品に使用される磁気ヘッドや
磁気ディスク等の表面は、例えばミクロン又はザブミク
ロンオーダー以下の精密な表面に仕上げられることが、
しばしば必要とされており、古くから用いられていた砥
石にかえて、近年、ポリエステルフィルムからなる研磨
テープ用のフィルム状基村上に、硬度の高い無機質微粉
末を樹脂溶液中に分散させた無機質微粉末の分散樹脂溶
液を塗布、乾燥し、研磨層を形成することによって得ら
れる研磨テープ(例えば特公昭53−44714号公報
)が使用されている。
The surfaces of magnetic heads, magnetic disks, etc. used in precision mechanical parts and precision electronic parts can be finished to a precision surface of, for example, micron or submicron order.
In place of the whetstones that are often needed and have been used for a long time, in recent years, inorganic fine powders made of highly hard inorganic fine powders dispersed in a resin solution have been used for polishing tapes made of polyester film. An abrasive tape (for example, Japanese Patent Publication No. 44714/1983) obtained by applying a powder dispersed resin solution and drying it to form an abrasive layer is used.

〔発明が解決しようとする課題] しかしながら、前記従来の研磨テープでは弾力性に劣る
ため被研磨物の厚みが極く薄いものの場合には、研磨テ
ープを使用する研磨作業工程で、前記被研磨物を支持し
ている支持体の表面状態の影響を受は易く、また前記研
磨テープを支持している支持体の表面状態や、前記研磨
テープの研磨テープ用基材の非研磨層面の表面状態や、
研磨テープにおける研磨層表面の歪み(研磨層を形成す
る際のコーティングむら、稀に発生している突起)更に
は異物の混入等の影響を受けることがあり、均一な研磨
仕上げを実施し難いという欠点を有している。
[Problem to be Solved by the Invention] However, since the conventional polishing tape has poor elasticity, when the thickness of the object to be polished is extremely thin, the polishing process using the polishing tape may It is easy to be influenced by the surface condition of the support supporting the abrasive tape, and the surface condition of the non-abrasive layer surface of the abrasive tape base material of the abrasive tape. ,
The surface of the polishing layer on the polishing tape may be affected by distortions (unevenness in the coating when forming the polishing layer, rare protrusions that occur), and may also be affected by the inclusion of foreign matter, making it difficult to achieve a uniform polishing finish. It has its drawbacks.

また更に、前記従来の研磨テープは、該研磨テープを磁
気ディスク等の被研磨物の表面に押し当てる際の圧力調
整が困難なため、圧力不足の状態で研磨が実施される場
合には研磨不十分となり、また、逆に圧力過剰の状態で
研磨が実施される場合には、深い研磨層ができる等の欠
点をも有している。
Furthermore, with the conventional polishing tape, it is difficult to adjust the pressure when pressing the polishing tape against the surface of the object to be polished, such as a magnetic disk, so if polishing is performed under insufficient pressure, polishing will not be possible. On the other hand, when polishing is carried out under excessive pressure, there are also drawbacks such as the formation of a deep polishing layer.

そのうえ、従来の研磨テープは、強度が充分でなかった
り、わずかの傷により破断したり裂けたりするし、また
、力をかけて伸ばした場合伸び切ってしまって元の状態
に復元しなかったり等、数多くの欠点を未だ保有してい
る。
Furthermore, conventional abrasive tapes do not have sufficient strength, break or tear due to slight scratches, and when stretched with force, they stretch completely and do not return to their original state. , still possesses many shortcomings.

これに対して本発明は、これらの欠点がなく、特に、被
研磨物の厚みが極く薄いものの場合でも、被研磨物を支
持している支持体の表面状態に影響されるようなことが
なく、また、研磨テープの支持体の表面状態や研磨テー
プの研磨テープ用基材の被研磨層面の表面状態や研磨層
形成時のコーティングむら等に起因する研磨層の歪み等
の影響を受けるようなことがなく、更には、研磨作業時
に異物の混入の影響を受けるようなこともなく、また、
被研磨物の表面に研磨テープを押し当てる際の圧力調整
がやり易く、たとえ、過剰圧力が研摩テープにかけられ
るようなことがあっても、これが研磨テープ中に吸収さ
れる等の作用が奏されるもので、良好な研磨を行ない得
る研磨テープを提供するものである。
In contrast, the present invention does not have these drawbacks, and in particular, even when the thickness of the object to be polished is extremely thin, it is not affected by the surface condition of the support supporting the object to be polished. In addition, the polishing layer may be affected by distortion of the polishing layer due to the surface condition of the support of the polishing tape, the surface condition of the polished layer surface of the polishing tape base material, and coating unevenness during polishing layer formation. Furthermore, there is no possibility of being affected by foreign matter during polishing work, and
It is easy to adjust the pressure when pressing the polishing tape against the surface of the object to be polished, and even if excessive pressure is applied to the polishing tape, it will be absorbed into the polishing tape. The present invention provides a polishing tape that can perform good polishing.

[課題を解決するための手段] 本発明は、上記した従来既知の研磨テープの欠点を解決
するためになされたものである。そのために、研磨テー
プについて、研磨材料、その粒度、接着剤、硬化剤等各
方面から検討を深く行ったが、目的とするような研磨テ
ープを得るのには全く成功しなかった。
[Means for Solving the Problems] The present invention has been made in order to solve the above-described drawbacks of conventionally known abrasive tapes. To this end, we conducted extensive research on polishing tape from various aspects, including the polishing material, its particle size, adhesives, and hardening agents, but we were not successful at all in obtaining the desired polishing tape.

そこで、本発明者等は、フィルム状をなす研磨テープ用
基材に着目するに到り、材料の選択、厚みの検討を鋭意
行ったけれども成功するには到らなかった。そこで発想
を完全に転換して、従来のポリエステルフィルムのみか
らなる単層のテープ用基材にかえて、これにポリウレタ
ンフィルムをラミネートした2層のテープ用基材を使用
したところ、フィルムの厚みは薄くしたにもかかわらず
、強度がすぐれ且つ弾力性にも優れた従来既知の単一フ
ィルムでは得ることのできない従来にない卓越したテー
プ用基材が得られるという新知見を全く予期せざること
に得た。
Therefore, the inventors of the present invention focused on a film-like base material for polishing tape, and although they made extensive studies on material selection and thickness, they were not successful. Therefore, we completely changed our thinking and used a two-layer tape base material laminated with polyurethane film instead of the conventional single-layer tape base material made only of polyester film. We unexpectedly discovered that despite being thinner, we can obtain an unprecedented and excellent base material for tapes that has excellent strength and elasticity and cannot be obtained with conventionally known single films. Obtained.

そしてこの新知見を基礎として更に検討を行い、本発明
の完成に到ったのである。本発明は、物性の異なるフィ
ルム状の基材を2種以上併用することを重要な特徴とす
るものである。
Based on this new knowledge, further studies were conducted and the present invention was completed. An important feature of the present invention is that two or more kinds of film-like base materials having different physical properties are used in combination.

本発明においてフィルムとしては、合成樹脂のほか、紙
、セロファン、金属(アルミ箔、ステンレス箔等)、各
種ラミネートフィルム、加工フィルム(FRPフィルム
等、ファイバー、ガラス繊維、ワイヤー等で強化したフ
ィルムその他)等、フィルム状の基材であればすべての
材料が適宜単用又は併用される。
In the present invention, films include, in addition to synthetic resins, paper, cellophane, metals (aluminum foil, stainless steel foil, etc.), various laminate films, processed films (FRP films, etc., films reinforced with fibers, glass fibers, wires, etc.) If the substrate is in the form of a film, all the materials can be used alone or in combination as appropriate.

本発明においては、これらフィルムの内、物性の異なる
ものを2種以上はり合わせて使用するものであるが、物
性とは、例えば次のものが例示される。機械的強度、寸
法安定性、耐熱性、弾力性、伸長性、耐伸長性、耐薬品
性、耐光性、耐油性、耐湿性、耐衝撃性、その他研磨フ
ィルムに関連する物性をすべて指すものである。
In the present invention, two or more of these films having different physical properties are used in combination, and the physical properties include, for example, the following. It refers to mechanical strength, dimensional stability, heat resistance, elasticity, elongation, elongation resistance, chemical resistance, light resistance, oil resistance, moisture resistance, impact resistance, and other physical properties related to polishing films. be.

本発明においては、このような物性を有するフィルムを
目的に応じて適宜選択し、それらを張り合わせて使用す
るものであり、例えば機械的強度の高いフィルムと弾力
性に冨むフィルムを張り合わせる等、全く別個のフィル
ムを張り合わせて使用する。
In the present invention, films having such physical properties are appropriately selected depending on the purpose and used by laminating them together. For example, by laminating a film with high mechanical strength and a film with high elasticity, Completely separate films are pasted together and used.

しかしながら、同一材料であってもそのフィルムの厚み
が変われば物性も変化してくる。例えば弾力性に富むフ
ィルム上にそれよりも厚い同一フィルムを積層すること
によって機械的強度を付加してやるというように、同一
材料においても物性が相違するものがあり、このような
場合も本発明に包含される。また、延伸フィルムのよう
に、ポリアミドやポリプロピレン等のフィルムを再加工
して片軸延伸したものと2軸延伸したものとは性質が相
違してくるので、このような場合も本発明に包含される
However, even if the material is the same, the physical properties will change if the thickness of the film changes. For example, the same material may have different physical properties, such as adding mechanical strength by laminating a thicker film on top of a highly elastic film, and such cases are also included in the present invention. be done. Furthermore, as with stretched films, the properties of polyamide, polypropylene, etc. films that have been reprocessed and uniaxially stretched differ from those that have been biaxially stretched, so such cases are not included in the present invention. Ru.

このようにして材料を変えて、また同一材料でもその厚
さ、再加工処理、製法等を変えて、物性の相違するフィ
ルムを各種用意しておき、目的に応してこれらフィルム
を2種以上併用することにより、各種ニーズにきめ細か
く応じることができる。ずくれた物性を数種類併有する
単一フィルJ、を2種以上併用すれば更にすくれた研磨
テープを得ることができる。
In this way, by changing the material, or by changing the thickness, reprocessing, manufacturing method, etc. of the same material, various films with different physical properties are prepared, and two or more of these films are used depending on the purpose. By using them together, it is possible to precisely meet various needs. If two or more types of single fill J having several kinds of irregular physical properties are used in combination, an even more irregular abrasive tape can be obtained.

本発明においては、これらの基材をはり合わせて用いる
ものである。すなわち本発明において、本発明に係る研
磨テープは、該研磨テープにおけるフィルム状をなす研
磨テープ用基利が2種類以上の、異なる物性を有するフ
ィルムが張り合わされているものである。ここでいう張
り合わされるとは、これらのフィルムを2層以上積層、
ラミネートすることをいい、これらを接着、熱溶着、圧
着等適宜の手段で張り合わすことを指すほか、必要ある
場合には、適当な個所をスポット状に又は縁部のみを又
はこれらを組合わせる等一部分を接着してもよいし、あ
るいは、接着することなく両者の端部を挟持してフィル
ムを単に重ね合わせるようにしてもよい。
In the present invention, these base materials are used together. That is, in the present invention, the abrasive tape according to the present invention is one in which two or more types of films having different physical properties are laminated together in the film-like abrasive tape base material of the abrasive tape. Laminated here refers to laminating two or more layers of these films,
It refers to laminating, and it refers to attaching these by appropriate means such as gluing, heat welding, pressure bonding, etc. In addition, if necessary, it can be done in spots at appropriate places, only at the edges, or by combining these, etc. A portion of the film may be adhered, or the two ends may be sandwiched without adhesion and the films may be simply overlapped.

このようにして各種の用途に特に適した研磨テープを自
由に製造することができるが、例えば被研磨物に密着し
て研磨効果を高めるための緩衝性を有する研磨テープに
おける研磨テープ用基材としては、例えばポリエチレン
テレツクレート、ポリアクリレート、ポリカーボネー1
−、ポリイミド等からなる厚さ10〜150μm程度の
機械的強度、寸法安定性、耐熱性等に優れた性質を有す
るフィルムとポリプロピレン、ポリエチレン、ポリウレ
タン等からなる厚さ1〜150μm程度の弾力性に優れ
た性質を有するフィルムとを、2種類以上張り合わせた
、機械的強度、寸法安定性、耐熱性等、基材として要求
される性質と弾力性等緩衝性に寄与する性質とを合わせ
有するフィルムが好適に利用される。研磨層は前記研磨
テープ用基材の表裏いずれの面に形成されても良く、前
記研磨層と前記研磨テープ用基材との間の密着性の向上
のため、前記研磨層と前記研磨テープ用基材との間に下
塗層を設けても良い。また前記研磨層は研磨テープ用基
材を張り合わせる前後いずれの工程で形成さされても良
い。
In this way, polishing tapes that are particularly suitable for various uses can be freely manufactured. For example, polyethylene terecrate, polyacrylate, polycarbonate 1
- A film made of polyimide, etc. with a thickness of about 10 to 150 μm and having excellent properties such as mechanical strength, dimensional stability, and heat resistance, and a film made of polypropylene, polyethylene, polyurethane, etc. with a thickness of about 1 to 150 μm and elasticity. A film that combines two or more types of films with excellent properties and has properties required as a base material such as mechanical strength, dimensional stability, and heat resistance, and properties that contribute to cushioning properties such as elasticity. Suitable for use. The polishing layer may be formed on either the front or back surface of the polishing tape base material, and in order to improve the adhesion between the polishing layer and the polishing tape base material, the polishing layer and the polishing tape base material may be formed on either the front or back surface. An undercoat layer may be provided between the base material and the base material. Further, the polishing layer may be formed either before or after bonding the polishing tape substrate.

前記研磨層は、常法によって形成せしめるが、通常、1
次粒子の平均粒径が0.1〜60μm程度の例えば酸化
アルミニウム、炭化ケイ素、酸化クロム、酸化鉄、ダイ
ヤモンド、酸化ジルコニウム、窒化ケイ素、窒化ホウ素
、エメリー、酸化セリウム等の研磨材粒子と例えば、ポ
リエステル樹脂、塩・酢ビ樹脂、ポリウレタン樹脂、ブ
チラール樹脂、ポリアミド樹脂、エポキシ樹脂、アクリ
ル樹脂、硝化綿、塩化ゴム等の樹脂の1種または2種以
上からなるバインダー用樹脂とで構成される厚さ3〜1
00μm程度のものであるが、研磨層における耐摩耗性
、耐溶剤性、耐熱性及び基材との密着性等の性質を向上
させるために、イソシアナート系硬化剤を添加し、硬化
樹脂層とすることかできる。
The polishing layer is formed by a conventional method.
For example, with abrasive particles such as aluminum oxide, silicon carbide, chromium oxide, iron oxide, diamond, zirconium oxide, silicon nitride, boron nitride, emery, cerium oxide, etc., the average particle size of the secondary particles is about 0.1 to 60 μm, Thickness composed of a binder resin made of one or more resins such as polyester resin, salt/vinyl acetate resin, polyurethane resin, butyral resin, polyamide resin, epoxy resin, acrylic resin, nitrified cotton, chloride rubber, etc. Sa3~1
00 μm, but in order to improve properties such as abrasion resistance, solvent resistance, heat resistance, and adhesion to the substrate in the polishing layer, an isocyanate-based curing agent is added, and the cured resin layer and I can do something.

一般的にはバインダー成分100重量部に対して研磨材
粒子100〜1400重量部程度を含有する研磨層とさ
れるものである。
Generally, the polishing layer contains about 100 to 1400 parts by weight of abrasive particles per 100 parts by weight of the binder component.

前記研磨フィルム用基材に研磨層形成用塗布液を塗布す
る方法には、2本ロール、3本ロール。
The method of applying the polishing layer forming coating liquid to the polishing film substrate includes two rolls and three rolls.

4本ロール等によるロールコート、グラビアコート、キ
スコート、ナイフコート、パ゛−コート、ロットコート
、コンマコート、スプレーコート、ハークコート等があ
り、ロールコート法とグラビアコート法とにおいては、
ダイレクト法とリバース法との両方法が利用し得るし、
特に、2本、3本。
There are roll coats using four rolls, gravure coats, kiss coats, knife coats, pie coats, lot coats, comma coats, spray coats, hard coats, etc.; in the roll coat method and gravure coat method,
Both the direct method and reverse method can be used,
Especially two or three.

4本リバースロールコート法を利用する場合には、表面
平滑性に優れた塗布層が得られる。
When using the four-roll reverse roll coating method, a coating layer with excellent surface smoothness can be obtained.

〔実施例] 以下、本発明の研磨テープの具体的な構成を製造実施例
に基づいて説明する。
[Example] Hereinafter, the specific structure of the polishing tape of the present invention will be described based on manufacturing examples.

実施例1 下記組成の研磨材分散樹脂液[A]に対して、キシリレ
ンジイソシアナート[諸星インキ■製。
Example 1 Xylylene diisocyanate [manufactured by Moroboshi Ink ■] was added to the abrasive dispersion resin liquid [A] having the following composition.

χE L硬化剤O)]を、前記研磨材分散樹脂[A]中
のポリエステル樹脂における一〇H基と添加されるキシ
リレンジイソシアナ−1・のイソシアナート基(−NG
O)との関係が、(−NGO/−〇〇) −5(当量比
)に相当する量で添加し、引き続いて、トルエンとメチ
ルエチルケトンとの当量混合溶剤で希釈して得られた粘
度250cpの塗布液を、厚さ25μmのポリエチレン
テレフタレートフィルム〔奇人製。
χEL curing agent O)] is combined with the 10H group in the polyester resin in the abrasive dispersion resin [A] and the isocyanate group (-NG
O) was added in an amount corresponding to (-NGO/-〇〇) -5 (equivalent ratio), and then diluted with an equivalent mixed solvent of toluene and methyl ethyl ketone with a viscosity of 250 cp. Apply the coating solution to a 25 μm thick polyethylene terephthalate film [manufactured by Kijin.

テトロンフィルム〕と厚さ20μmのポリウレタンフィ
ルム〔大日本プラスチンク製、ダイプラウレタンフィル
ム〕をラミネートした厚さ50μ「の研磨テープ用基材
のポリウレタンフィルム側基材表面に3本リバース法に
て塗布、乾燥後、45°Cにて10日間のエージング処
理に付し、厚さ20μmの研磨層を形成することにより
本発明の1実施例品たる緩衝性を有する研磨テープ〔1
〕を得た。
Tetoron film] and a 20 μm thick polyurethane film [Dipura Urethane Film, manufactured by Dainippon Plastics Co., Ltd.] were laminated together to form a 50 μm thick abrasive tape base material. After drying, it was subjected to an aging treatment at 45°C for 10 days to form an abrasive layer with a thickness of 20 μm, thereby producing an abrasive tape having a buffering property [1], which is an embodiment of the present invention.
] was obtained.

研磨材分散樹脂液[A] (1)ポリエステル樹脂−=−−−一一=40重量部[
東洋紡績■:ハイロン#1o3] (2)酸化アルミニュウム−−−−−−−−−−−20
0重量部[不二見研磨剤■ニーへ1110000 ](
3)トルエン −−−−−−−−−−−−−−−−−−
−−−−−−−−−60重量部(4)メチルエチルケト
ン−−−−−−−−60重量部実施例2 前記実施例1における研磨テープ〔1〕の製造工程での
研磨テープ用基材として厚さ16μmのポリエチレンテ
レフタレートフィルム〔東し製、ルミラー]と厚さ16
μmのポリエチレンテレフタレートフィルム〔東し製、
ルミラー〕の各片面に下塗層としてポリエチレンイミン
を塗布した後、ポリエチレンをサンドラミネーションし
た厚さ50μmの基材を使用する以外は、全て前記実施
例1と同様に処方し、本発明の実施例布たる緩衝性を有
するテープ(ii)を得た。
Abrasive material dispersion resin liquid [A] (1) Polyester resin -=---1=40 parts by weight [
Toyobo ■: Hiron #1o3] (2) Aluminum oxide ----------------------20
0 parts by weight [Fujimi Abrasive ■knee 1110000] (
3) Toluene −−−−−−−−−−−−−−−−−
----------60 parts by weight (4) Methyl ethyl ketone---60 parts by weight Example 2 Base material for polishing tape in the manufacturing process of polishing tape [1] in Example 1 As a polyethylene terephthalate film with a thickness of 16 μm [Lumirror, manufactured by Toshi] and a thickness of 16 μm
μm polyethylene terephthalate film [manufactured by Toshi,
Example 1 of the present invention was prepared in the same manner as in Example 1, except that a base material with a thickness of 50 μm was used, in which polyethyleneimine was applied as an undercoat layer on each side of the Lumirror and then polyethylene was sand-laminated. A tape (ii) having cloth-like cushioning properties was obtained.

比較例1 前記実施例1にける研磨テープ〔1〕の製造工程での研
磨テープ基材として厚さ50μmのポリエチレンテレフ
タレートフィルム〔奇人製、テトロン]を使用する以外
は全て前記実施例1と同様に処方し比較のための研磨テ
ープ(iii )を得た。
Comparative Example 1 Everything was the same as in Example 1 except that a 50 μm thick polyethylene terephthalate film (manufactured by Kijin Co., Ltd., Tetron) was used as the polishing tape base material in the manufacturing process of polishing tape [1] in Example 1. An abrasive tape (iii) was prepared and used for comparison.

記比較のための研磨テープとを使用して、それぞれの研
磨テープを、5mm/secの速度で送りながら中心線
平均粗さ0.045μmの3.5インチフロッピーディ
スク〔日本メモレックス■製〕を400Orpmで回転
させることからなる前記フロッピーディスクの表面研磨
仕上げを実施し、得られたフロッピーディスクの研磨仕
上げ面の中心線平均粗さ(μm)と、フロッピーディス
クの研磨仕上げ面に筋状の傷が発生して不良品となった
製品の数とを表にて示す。
A 3.5-inch floppy disk (manufactured by Nippon Memorex ■) with a center line average roughness of 0.045 μm was heated at 400 rpm while feeding each polishing tape at a speed of 5 mm/sec. Polishing the surface of the floppy disk by rotating the floppy disk, and measuring the center line average roughness (μm) of the polished surface of the obtained floppy disk and the occurrence of streak-like scratches on the polished surface of the floppy disk. The table shows the number of defective products.

上記結果からも明らかなように、本発明によれば、不良
製品がほとんど発生せず、本発明の効果が卓越している
ことがわかる。
As is clear from the above results, according to the present invention, almost no defective products were produced, and it can be seen that the effects of the present invention are outstanding.

〔発明の作用効果〕[Function and effect of the invention]

本発明の研磨テープは、研磨層が形成されているフィル
ム状をなす研磨テープ用基材が2種類以上の、異なる物
性を有するフィルムから構成されているものであって、
該研磨テープの使用時において、前記研磨テープにおけ
る研磨テープ用基材が緩衝性その他目的とする各種性能
を発現するものである。
In the polishing tape of the present invention, the film-like polishing tape base material on which the polishing layer is formed is composed of two or more types of films having different physical properties,
When the abrasive tape is used, the abrasive tape base material of the abrasive tape exhibits various desired properties such as cushioning properties.

したがって、本発明に係るテープは、研磨しようとする
被研磨物の形状、構造、材質その他の性質にきめ細かく
対応できるのみでなく、テープ自体にも耐久性、耐摩耗
性、機械的強度、耐引張性等希望する性質を付与するこ
とができ、きわめですくれている。
Therefore, the tape according to the present invention not only can finely adapt to the shape, structure, material, and other properties of the object to be polished, but also has durability, abrasion resistance, mechanical strength, and tensile resistance. It is possible to give desired properties such as gender, and it is extremely slender.

例えば、特に緩衝性を付与した本発明に係る研磨テープ
は、被研磨物の厚みが極く薄いものの場合であっても、
被研磨物を支持している支持体の表面状態に影響される
ようなことがなく、また、研磨テープの支持体の表面状
態や研磨テープの研磨テープ用基材の非研磨層面の表面
状態や研磨層形成時のコーティングむら等に起因する研
磨層の歪み等の影響を受けるようなことがなく、更には
、研磨作業時に異物の混入の影響を受けるようなことも
なく、また、被研磨物の表面に研磨テープを押し当てる
際の圧力調整がやり易く、たとえ、過電圧力が研磨テー
プにかけられるようなことがあっても、これが研磨テー
プ中に吸収される等の作用が奏され極めて良好な研磨仕
上げを実施し得るものである。
For example, the abrasive tape according to the present invention, which is particularly provided with cushioning properties, can be used even when the object to be polished is extremely thin.
It is not affected by the surface condition of the support that supports the object to be polished, and is not affected by the surface condition of the abrasive tape support or the surface condition of the non-abrasive layer of the abrasive tape base material. The polishing layer is not affected by distortions caused by coating unevenness during polishing layer formation, and furthermore, it is not affected by foreign matter mixed in during polishing work, and the object to be polished is It is easy to adjust the pressure when pressing the abrasive tape against the surface of the abrasive tape, and even if an overvoltage force is applied to the abrasive tape, it will be absorbed into the abrasive tape, resulting in extremely good results. Polishing can be performed.

Claims (1)

【特許請求の範囲】[Claims] フィルム状をなす研磨テープ用基材上に研磨層を具備す
る研磨テープにおいて、前記フィルム状をなす研磨テー
プ用基材が2種類以上の、異なる物性を有するフィルム
からなることを特徴とする研磨テープ。
An abrasive tape comprising an abrasive layer on a film-like abrasive tape base material, wherein the film-like abrasive tape base material is composed of two or more types of films having different physical properties. .
JP6716888A 1988-03-23 1988-03-23 Hybrid polishing tape Pending JPH01240274A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6716888A JPH01240274A (en) 1988-03-23 1988-03-23 Hybrid polishing tape

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6716888A JPH01240274A (en) 1988-03-23 1988-03-23 Hybrid polishing tape

Publications (1)

Publication Number Publication Date
JPH01240274A true JPH01240274A (en) 1989-09-25

Family

ID=13337095

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6716888A Pending JPH01240274A (en) 1988-03-23 1988-03-23 Hybrid polishing tape

Country Status (1)

Country Link
JP (1) JPH01240274A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005014190A (en) * 2003-06-27 2005-01-20 Ricoh Co Ltd Polishing film and polishing method

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62203769A (en) * 1986-02-12 1987-09-08 キンバリ− クラ−ク コ−ポレ−シヨン Supporter for abrasive grid bonding

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62203769A (en) * 1986-02-12 1987-09-08 キンバリ− クラ−ク コ−ポレ−シヨン Supporter for abrasive grid bonding

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005014190A (en) * 2003-06-27 2005-01-20 Ricoh Co Ltd Polishing film and polishing method

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