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JPH012274A - Packaged microwave integrated circuit connector assembly - Google Patents

Packaged microwave integrated circuit connector assembly

Info

Publication number
JPH012274A
JPH012274A JP63-88898A JP8889888A JPH012274A JP H012274 A JPH012274 A JP H012274A JP 8889888 A JP8889888 A JP 8889888A JP H012274 A JPH012274 A JP H012274A
Authority
JP
Japan
Prior art keywords
connector
gasket
integrated circuit
housing
rim
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP63-88898A
Other languages
Japanese (ja)
Other versions
JPS642274A (en
Inventor
モニコ ティー パーラー
ディヴィッド アール ジョンソン
ポール イー ビュークホルズ
ジョン ジー ガリー
Original Assignee
ワトキンズ−ジョンソン コムパニー
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US07/038,539 external-priority patent/US4737123A/en
Application filed by ワトキンズ−ジョンソン コムパニー filed Critical ワトキンズ−ジョンソン コムパニー
Publication of JPH012274A publication Critical patent/JPH012274A/en
Publication of JPS642274A publication Critical patent/JPS642274A/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 本発明は、一般に導電性ハウジング内にパッケージした
形式のマイクロ波集積回路を相互接続するラジオ周波数
コネクタ組立体に関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention generally relates to radio frequency connector assemblies for interconnecting microwave integrated circuits packaged in conductive housings.

過去において、パッケージしたマイクロ波集積回路は、
一般に、メスカップラを持つ各ハウジングに固着される
オスコネクタを有するラジオ周波数同1Fillコネク
タによって相互接続され、すなわち結合される6周波数
が増加し、パッケージが小さくなればなるほど、従来の
コネクタを用いることが困難になる。その結果、パッケ
ージは、パッケージハウジングの部分を形成する絶縁ビ
ードを貫通するリード線を含むように簡略化されてきた
In the past, packaged microwave integrated circuits
In general, radio frequencies are interconnected, i.e., coupled, by a single fill connector with a male connector fixed to each housing with a female coupler.As the frequencies increase and the package becomes smaller, it is difficult to use conventional connectors. become. As a result, packages have been simplified to include leads that pass through insulating beads that form part of the package housing.

コネクタはリード線を受は入れる中心導体および外側導
体から成る。導電性接続ガスケットが外側導体とハウジ
ングとの間に接触を与える。このようなコネクタに伴う
問題は、温度が変化すると、金属−金属接触がしばしば
失われ、同軸接地帰線回路接続(したがって、境界イン
ピーダンス)が間欠的になる事実である。
The connector consists of a center conductor and an outer conductor for receiving the leads. A conductive connection gasket provides contact between the outer conductor and the housing. A problem with such connectors is the fact that as the temperature changes, metal-to-metal contact is often lost and the coaxial ground return circuit connection (and thus boundary impedance) becomes intermittent.

本発明のコネクタ組立体に固有な低い輪郭により、サブ
システムの設計者はフラットパック式のマイクロ波集積
回路を取付けるための比較的簡単な平らな取付は表面を
使用できる。コネクタ組立体の基本的な設計は、周囲温
度変化にも拘らず最高レベルの機械的一体性を保証し、
一方完全に遮断した、定インピーダンスのラジオ周波数
伝搬ライン接続を維持する。
The inherent low profile of the connector assembly of the present invention allows the subsystem designer to use a relatively simple flat mounting surface for mounting flat pack microwave integrated circuits. The basic design of the connector assembly ensures the highest level of mechanical integrity despite ambient temperature changes,
while maintaining a completely disconnected, constant impedance radio frequency propagation line connection.

コネクタ組立体は、3つの部品、すなわち1つの相互接
続本体くまたはバレル)および2つの同一の導電性圧縮
ガスケットから成る。圧縮ガスケットは、サブシステム
が温度変化を受けても、パッケージおよび相互接続本体
間に同軸接地帰線接続を維持する機能を有する。このこ
とは、安定な高い周波数性能が要求されるときには、コ
ネクタの重要な機能である。コネクタ組立体は、望まし
い任意の平らなパターンに配列される多数のマイクロ波
集積回路から成るサブシステムの実現に利用されること
ができる。
The connector assembly consists of three parts: one interconnection body (or barrel) and two identical electrically conductive compression gaskets. The compression gasket has the function of maintaining a coaxial ground return connection between the package and the interconnect body even when the subsystem is subjected to temperature changes. This is an important feature of the connector when stable high frequency performance is required. The connector assembly can be utilized to implement subsystems consisting of multiple microwave integrated circuits arranged in any desired planar pattern.

本発明の目的は、パッケージしたマイクロ波集積回路を
相互接続する改良した低い輪郭のラジオ周波数コネクタ
組立体を提供することにある。
It is an object of the present invention to provide an improved low profile radio frequency connector assembly for interconnecting packaged microwave integrated circuits.

本発明の他の目的は、温度変化を伴うマイクロ波集積回
路パッケージ間に金属接触(したがって定インピーダン
ス)を維持する改良したラジオ周波数コネクタ組立体を
提供することにある。
Another object of the present invention is to provide an improved radio frequency connector assembly that maintains metal contact (and thus constant impedance) between microwave integrated circuit packages with temperature changes.

本発明の他の目的は、マイクロ波集積回路の相互接続中
ガスケットの圧縮を制限することにより一貫した接続を
与えるコネクタ組立体を提供することにある。
Another object of the present invention is to provide a connector assembly that provides a consistent connection by limiting gasket compression during interconnection of microwave integrated circuits.

前述のおよび他の目的は、誘電体スリーブによって前記
本体に支持された中心接点を持つ相互接続本体と、中心
接点と同軸で所定距離だけ本体の両側から外方に延びた
円筒状リムと、円筒状リムの直径に対応する直径の第1
の軸線方向外方に延びるフランジおよび第2の軸線方向
反対向きに延びるフランジを含むディスク状圧縮ガスケ
ットと、を有し、導電性ハウジングにパッケージしたマ
イクロ波集積回路を接続するコネクタによって達成され
る。ガスケットの厚さおよび円筒状リムの長さが選択さ
れて、ガスケットは集積回路パッケージのハウジングお
よび温度変化を伴うコネクタ本体の間に有効な電気接触
を維持する。
The foregoing and other objects include: an interconnection body having a center contact supported on said body by a dielectric sleeve; a cylindrical rim coaxial with the center contact and extending outwardly from each side of the body a predetermined distance; The first diameter corresponds to the diameter of the shaped rim.
a disc-shaped compression gasket including an axially outwardly extending flange and a second axially oppositely extending flange, the connector connecting a microwave integrated circuit packaged in a conductive housing. The thickness of the gasket and the length of the cylindrical rim are selected so that the gasket maintains effective electrical contact between the housing of the integrated circuit package and the connector body subject to temperature changes.

次に、図面を参照して、本発明を説明する。Next, the present invention will be explained with reference to the drawings.

第1図は本発明のコネクタ13によって相互接続したマ
イクロ波集積回路パッケージ11および12を示す、集
積回路パッケージは外方に延びるパッケージした集積回
路に接続するリード線14を含む、リード線14は、ハ
ウジング壁に適当に固定されかつハウジングに密封した
絶縁ビード16によって支持されている。
FIG. 1 shows microwave integrated circuit packages 11 and 12 interconnected by a connector 13 of the present invention. The integrated circuit package includes leads 14 extending outwardly and connecting to the packaged integrated circuit. Leads 14 include It is supported by an insulating bead 16 suitably secured to the housing wall and sealed to the housing.

本発明によると、1つのハウジングのリード線14およ
び隣接するハウジングの対応するリード線14の間に接
続を与え、またハウジングの壁17の間に有効な電気接
触を与えるコネクタが提供される。
In accordance with the present invention, a connector is provided that provides a connection between the leads 14 of one housing and the corresponding leads 14 of an adjacent housing, and also provides effective electrical contact between the walls 17 of the housings.

コネクタ13は、穿孔されてホールすなわち開口22を
与える導体21を有する0円周方向の溝23がホール2
2の両端の中間に形成されている。
The connector 13 has a circumferential groove 23 with a conductor 21 drilled to provide a hole or opening 22.
It is formed between both ends of 2.

導体は、例えばTFEフルオロカーボンでもよい誘電体
シリンダ24を支持しており、シリンダは中心接点26
を支持している。さらに詳細には、シリンダ24にはリ
ム27が設けられている。シリンダ24は、ホールに挿
入されるとき、リム27が溝23にばちんと入るまで、
変形され、それによって絶縁部材をハウジング内にロッ
クする。
The conductor supports a dielectric cylinder 24, which may be, for example, TFE fluorocarbon, and the cylinder has a center contact 26.
is supported. More specifically, the cylinder 24 is provided with a rim 27. When the cylinder 24 is inserted into the hole, the rim 27 snaps into the groove 23 until the cylinder 24 is inserted into the hole.
is deformed, thereby locking the insulating member within the housing.

シリンダ24は鋸歯状溝29を持つホール28を含んで
いる。中心導体には鋸歯状リム30が形成されている。
Cylinder 24 includes a hole 28 with serrated grooves 29. A serrated rim 30 is formed on the center conductor.

中心導体がシリンダ24に強制的に入れられるとき、シ
リンダは変形して中心導体が挿入され、鋸歯状リムが溝
29に係合することを可能にする。中心導体は固着され
る。中心導体の両端は、スロット(32)付きの凹部3
1を含み、それによって中心導体が導体14に摺動して
嵌合できる。コネクタ本体組立体は、外側導体、本体、
および誘電体部材によって同軸的に支持した中心導体を
含む同軸組立体を形成する。
When the center conductor is forced into the cylinder 24, the cylinder deforms allowing the center conductor to be inserted and the serrated rim to engage the groove 29. The center conductor is fixed. Both ends of the center conductor are provided with a recess 3 with a slot (32).
1 so that the center conductor can slide into conductor 14 . The connector body assembly consists of an outer conductor, a main body,
and forming a coaxial assembly including a center conductor coaxially supported by a dielectric member.

本発明によると、本体21に形成した円筒状リム34に
よって形成した凹部に載る導電性圧縮ガスケットが設け
られている。ガスケットは本体21とハウジング壁17
との間に接触を与える。
According to the invention, an electrically conductive compression gasket is provided which rests in the recess formed by the cylindrical rim 34 formed in the body 21. The gasket connects the main body 21 and the housing wall 17.
give contact between

ガスケットは、リム34の内径と同一直径を有する第1
の外方にかつ軸線方向に延びるフランジ35と、ハウジ
ング表面17に当接するように構成した第2の外方にか
つ軸線方向逆向きに延びるフランジ36とを含んでいる
。ガスケットは圧縮され、それによって2つの軸線方向
かつ半径方向に延びるフランジ部材の外側表面、関連す
る本体およびハウジングの間に有効な電気接触を与える
The gasket has a first diameter that is the same as the inner diameter of the rim 34.
and a second outwardly and axially oppositely extending flange 36 configured to abut the housing surface 17 . The gasket is compressed, thereby providing effective electrical contact between the outer surfaces of the two axially and radially extending flange members and the associated body and housing.

本発明によると、リム34の大きさおよびガスケットの
厚みは、パッケージの組立中、ガスケット圧縮がリム3
4によって制限され正確で反復使用可能な圧縮を保証す
るように、選ばれる。このことにより、温度変化があっ
ても有効な電気接触を保証してコネクタ本体とパッケー
ジハウジングとの間の良好な接地帰線接続を維持する。
In accordance with the present invention, the size of the rim 34 and the thickness of the gasket are such that during assembly of the package, gasket compression will occur on the rim 34.
4 to ensure accurate and repeatable compression. This ensures effective electrical contact and maintains a good ground return connection between the connector body and the package housing despite temperature changes.

第5図を特に参照するに、フランジ35の最大許容偏向
は偏向を計算することによって決定され、この偏向は誘
電体部材24の縁にある接触点、具体的には矢印37で
示す接触点である。同様に、ハウジングに対する重要な
接触点は矢印38で示されている。これら2つの点に対
する偏向が解るとき、リム34の長さが選択され、リム
はハウジングに接触し、ガスケットがさらに圧縮するこ
とを許容せず、周囲温度の変化に起因するハウジングお
よびコネクタの膨張および収縮があっても正確で反復使
用可能な有効な接触を保証する。
With particular reference to FIG. 5, the maximum allowable deflection of flange 35 is determined by calculating the deflection, which deflection is determined at the contact point at the edge of dielectric member 24, specifically at the contact point indicated by arrow 37. be. Similarly, critical points of contact with the housing are indicated by arrows 38. When the deflection to these two points is known, the length of the rim 34 is selected so that the rim contacts the housing and does not allow the gasket to compress further and prevent expansion of the housing and connector due to changes in ambient temperature. Guarantees accurate, repeatable and effective contact even in the presence of shrinkage.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は、本発明のコネクタによって相互接続したハウ
ジング内にパッケージした2つの集積マイクロ波回路を
示す概略図である。 第2図は、第1[4の線2−2に沿った端面図である。 第3図は、第1図の線3−3に沿った、ハウジングを相
互接続するコネクタの拡大図である。 第4図は、第3図の線4−4に沿ったコネクタの端面図
である。 第5図は、温度変化があっても有効な電気接続を与える
導電性圧縮ガスケットの拡大図である。 11.12・・・集積回路パッケージ、13・・・コネ
クタ、 14・・・リード線、 17・・・ハウジング壁、 21・・・導体、 22・・・開口、 24・・・シリンダ、 33・・・ガスケット、 35.36・・・フランジ。
FIG. 1 is a schematic diagram showing two integrated microwave circuits packaged in a housing interconnected by the connector of the present invention. FIG. 2 is an end view taken along line 2-2 of the first [4]. FIG. 3 is an enlarged view of the connector interconnecting the housings taken along line 3--3 of FIG. 4 is an end view of the connector taken along line 4--4 of FIG. 3. FIG. FIG. 5 is an enlarged view of a conductive compression gasket that provides a valid electrical connection despite temperature changes. 11.12... Integrated circuit package, 13... Connector, 14... Lead wire, 17... Housing wall, 21... Conductor, 22... Opening, 24... Cylinder, 33... ...Gasket, 35.36...Flange.

Claims (2)

【特許請求の範囲】[Claims] (1)絶縁ビードおよび中心導体から成る貫通体を持つ
ハウジングを含む形式のマイクロ波集積回路パッケージ
を相互接続するコネクタにおいて、導電性コネクタ本体
と、 中心接点と、 中心接点を本体内で同軸的に支持する誘電体スリーブと
、 所定の距離だけ前記本体から外方に延び、中心接点に関
して同軸上にある円筒状リムと、 円筒状リムの直径に対応する直径の第1の外方軸線方向
に延びるフランジと第2の反対向きに外方軸線方向に延
びるフランジとを有するディスク形状ガスケットと、を
有し、フランジ間の前記ガスケットの厚さおよび円筒状
リムの長さは、ガスケットが集積回路パッケージハウジ
ングおよび温度変化を持つコネクタ本体の間に有効な電
気接触を維持するように選ばれている、ことを特徴とす
るコネクタ。
(1) A connector for interconnecting microwave integrated circuit packages of the type including a housing having a penetrating body consisting of an insulating bead and a center conductor, in which a conductive connector body, a center contact, and a center contact are coaxially disposed within the body. a supporting dielectric sleeve; a cylindrical rim extending outwardly from the body a predetermined distance and coaxial with respect to the central contact; and a first outer axially extending rim having a diameter corresponding to the diameter of the cylindrical rim. a disk-shaped gasket having a flange and a second opposing axially extending flange, the thickness of the gasket between the flanges and the length of the cylindrical rim being such that the gasket is connected to the integrated circuit package housing. and a connector body selected to maintain effective electrical contact between the connector body and the connector body with temperature changes.
(2)請求項1記載のコネクタにおいて、前記第2の外
方に延びるフランジは第1の外方に延びるフランジより
小さい直径を有することを特徴とするコネクタ。
2. The connector of claim 1, wherein the second outwardly extending flange has a smaller diameter than the first outwardly extending flange.
JP63088898A 1987-04-15 1988-04-11 Connector assembly for packaged microwave integrated circuit Pending JPS642274A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US07/038,539 US4737123A (en) 1987-04-15 1987-04-15 Connector assembly for packaged microwave integrated circuits
US038539 1987-04-15
SG159094A SG159094G (en) 1987-04-15 1994-10-27 Connector assembly for packaged microwave integrated circuits

Publications (2)

Publication Number Publication Date
JPH012274A true JPH012274A (en) 1989-01-06
JPS642274A JPS642274A (en) 1989-01-06

Family

ID=26664466

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63088898A Pending JPS642274A (en) 1987-04-15 1988-04-11 Connector assembly for packaged microwave integrated circuit

Country Status (6)

Country Link
US (1) US4737123A (en)
EP (1) EP0287291B1 (en)
JP (1) JPS642274A (en)
DE (1) DE3886978T2 (en)
HK (1) HK146394A (en)
SG (1) SG159094G (en)

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