JPH01204499A - Ground connecting structure for plastic cover - Google Patents
Ground connecting structure for plastic coverInfo
- Publication number
- JPH01204499A JPH01204499A JP2740288A JP2740288A JPH01204499A JP H01204499 A JPH01204499 A JP H01204499A JP 2740288 A JP2740288 A JP 2740288A JP 2740288 A JP2740288 A JP 2740288A JP H01204499 A JPH01204499 A JP H01204499A
- Authority
- JP
- Japan
- Prior art keywords
- terminal fitting
- plastic cover
- terminal
- conductive coating
- coating film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011248 coating agent Substances 0.000 claims abstract description 30
- 238000000576 coating method Methods 0.000 claims abstract description 30
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims abstract description 13
- 239000003973 paint Substances 0.000 abstract description 6
- 238000010586 diagram Methods 0.000 description 9
- 230000000694 effects Effects 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
Description
【発明の詳細な説明】
〔概 要〕
電子機器における導電性塗膜が施されたプラスチックカ
バーのアース接続構造に関し、塗装面にリードワイ°ヤ
の取付を可能として該塗装面を本体機器と電気的に一体
化することを目的とし、
導電性塗膜が施され且つ該塗膜がアースされるプラスチ
ックカバーを有する電子機器において、取付孔を有する
端子金具がプラスチックカバーの塗装予定面に予め設け
られた端子取付用突起に嵌合固定され、該端子金具を含
んで塗装予定面に導電性塗膜が形成され、さらに該端子
金具がリード線により本体機器のアース電位部材に接続
されるように構成する。[Detailed Description of the Invention] [Summary] Regarding the ground connection structure of a plastic cover coated with a conductive coating in electronic equipment, it is possible to attach a lead wire to the painted surface and connect the painted surface to the main device electrically. In electronic equipment that has a plastic cover that is coated with a conductive coating and that is grounded, terminal fittings with mounting holes are pre-installed on the surface of the plastic cover that is to be painted. The terminal fitting is fitted and fixed to the terminal mounting protrusion, a conductive coating film is formed on the surface to be painted including the terminal fitting, and the terminal fitting is further connected to an earth potential member of the main device by a lead wire. .
[産業上の利用分野]
本発明は電子機器における導電性塗膜が施されたプラス
チックカバーのアース接続構造に関する。[Industrial Field of Application] The present invention relates to a ground connection structure for a plastic cover coated with a conductive coating in electronic equipment.
近年、電子機器においては電波雑音対策が求められてい
る。このため電子機器本体を覆うカバーがプラスチック
製である場合には、第6図に示すようにプラスチックカ
バー1の内面に金属のような特性をもたせた導電性塗膜
2を形成し、該導電性塗膜を本体機器3の金属部分に接
触させ、取付ねじ4で締結し、導電性塗膜2をアース電
位にある本体機器3に導通させ、電気的一体化を計って
いる。In recent years, countermeasures against radio noise have been required for electronic devices. For this reason, when the cover that covers the main body of the electronic device is made of plastic, a conductive coating film 2 having metal-like properties is formed on the inner surface of the plastic cover 1 as shown in FIG. The coating film is brought into contact with a metal part of the main device 3 and fastened with a mounting screw 4, and the conductive coating film 2 is electrically connected to the main device 3 which is at ground potential, thereby achieving electrical integration.
〔発明が解決しようとする課題]
上記従来の方式では、ねじの締付力の過不足、カバーの
反り等により理想的な接触が得られない。[Problems to be Solved by the Invention] In the conventional method described above, ideal contact cannot be obtained due to excessive or insufficient tightening force of the screw, warpage of the cover, etc.
このためねじの締付力、カバーの反り等に関係なく塗装
面からリードワイヤを用いて本体機器に接続することも
考えられるが、導電性塗膜は樹脂塗料のため、直接リー
ドワイヤ等を半田付けすることができないという問題が
ある。For this reason, it is conceivable to connect the main unit to the main unit using lead wires from the painted surface, regardless of the tightening force of the screws or the warpage of the cover, etc. However, since the conductive coating is a resin paint, the lead wires, etc. can be directly soldered. The problem is that it cannot be attached.
本発明は上記問題点に鑑み、塗装面にリードワイヤの取
付を可能とし、本体機器と電気的一体化ができるプラス
チックカバーのアース接続構造を提供することを目的と
するものである。SUMMARY OF THE INVENTION In view of the above-mentioned problems, it is an object of the present invention to provide a ground connection structure for a plastic cover that allows lead wires to be attached to a painted surface and electrically integrated with the main device.
上記目的は、導電性塗膜が施され且つ該塗膜がアースさ
れるプラスチックカバーを有する電子機器において、取
付孔13aを有する端子金具13がプラスチックカバー
11の塗装予定面に予め設けられた端子取付用突起12
に嵌合固定され、該端子金具13を含んで塗装予定面に
導電性塗膜14が形成され、さらに該端子金具13がリ
ード線15により本体機器10のアース電位部材16に
接続されて成ることを特徴とするプラスチックカバーの
アース接続構造によって達成される。The above-mentioned purpose is to provide a terminal mounting device in which a terminal fitting 13 having a mounting hole 13a is provided in advance on a surface to be painted of a plastic cover 11 in an electronic device having a plastic cover on which a conductive coating film is applied and the coating film is grounded. protrusion 12
A conductive coating film 14 is formed on the surface to be painted including the terminal fitting 13, and the terminal fitting 13 is further connected to the earth potential member 16 of the main device 10 by a lead wire 15. This is achieved by a plastic cover earth connection structure featuring:
[作 用]
プラスチックカバー11に予め端子取付用突起12を設
けておき、該突起により端子金具13を固定し、該端子
金具を含んで塗装予定面に導電性塗膜14を施すことに
より、導電性塗膜14と端子金具13との電気的接続が
とれ、該端子金具13をリード線15を介して本体機器
10のアース電位部材16に接続することにより確実な
アースが可能となる。[Function] A terminal mounting protrusion 12 is provided in advance on the plastic cover 11, a terminal fitting 13 is fixed by the protrusion, and a conductive coating film 14 is applied to the surface to be painted, including the terminal fitting, thereby making it conductive. By establishing an electrical connection between the adhesive coating film 14 and the terminal fitting 13, and connecting the terminal fitting 13 to the earth potential member 16 of the main device 10 via the lead wire 15, reliable grounding becomes possible.
第1図は本発明の第1の実施例を示す図である。 FIG. 1 is a diagram showing a first embodiment of the present invention.
本実施例は同図に示すように、本体機器10を覆うプラ
スチックカバー11に端子取付用の突起12を設け、こ
の突起12に、取付孔13aを有する端子金具13を嵌
合し、熱カシメで固定した後、該端子金具13の固定部
を含んでプラスチックカバー11の塗装予定面(カバー
内面)に導電性塗料を塗布して導電性塗膜14を形成し
、さらに端子金具13をリード線15により本体機器1
0のアース電位部材16に接続するように構成している
。As shown in the figure, in this embodiment, a protrusion 12 for attaching a terminal is provided on a plastic cover 11 that covers the main device 10, and a terminal fitting 13 having an attachment hole 13a is fitted into the protrusion 12, and is thermally caulked. After fixing, a conductive paint is applied to the surface to be painted (inner surface of the cover) of the plastic cover 11 including the fixing portion of the terminal fitting 13 to form a conductive coating film 14, and the terminal fitting 13 is connected to the lead wire 15. Main device 1
It is configured to be connected to the ground potential member 16 of 0.
このように構成された本実施例は、端子金具13がカバ
ー11に取付固定され、その上から導電性塗料が塗布さ
れているので、導電性塗膜14と端子金具13との電気
的接続がカバーの歪等の影響を受けないため良好となり
、該端子金具13をリード線15を介して本体機器10
のアース電位部材16に接続することにより電波ノイズ
に対する良好なシールド効果を得ることができる。In this embodiment configured as described above, the terminal fitting 13 is fixedly attached to the cover 11, and the conductive paint is applied thereon, so that the electrical connection between the conductive coating film 14 and the terminal fitting 13 is established. This is good because it is not affected by distortion of the cover, etc., and the terminal fitting 13 is connected to the main device 10 via the lead wire 15.
By connecting it to the ground potential member 16, a good shielding effect against radio noise can be obtained.
第2図は本発明の第2の実施例の要部を示す図である。FIG. 2 is a diagram showing essential parts of a second embodiment of the present invention.
同図において第1図と同一部分は同一符号を付して示し
た。In this figure, the same parts as in FIG. 1 are designated by the same reference numerals.
本実施例は同図に示すように、プラスチックカバー11
の端子金具取付用突起12を先端から根本に行くに従っ
て細くなるようなテーパーを設け、且つ先端に面取を施
し、端子金具13の取付孔13aは突起12の根本の太
さとほぼ同じ径としておき、該端子金具13を突起12
に圧入するのみで固定し、その後導電性塗膜14を施し
、さらに該端子金具13をリード線により本体機器のア
ース電位部材に接続したものである。In this embodiment, as shown in the figure, a plastic cover 11
The terminal fitting mounting protrusion 12 is tapered so as to become thinner from the tip to the base, and the tip is chamfered, and the mounting hole 13a of the terminal fitting 13 has a diameter that is approximately the same as the thickness of the base of the protrusion 12. , the terminal fitting 13 is attached to the protrusion 12
After that, a conductive coating film 14 is applied, and the terminal fitting 13 is connected to the earth potential member of the main device by a lead wire.
このように構成された本実施例は前実施例と同様に電波
ノイズに対する良好なシールド効果を有するほか、端子
金具13の取付固定に熱カシメ作業を必要とせず、組立
工数の節減ができるという効果がある。The present embodiment configured in this manner not only has a good shielding effect against radio wave noise as in the previous embodiment, but also has the advantage that no thermal crimping work is required to attach and fix the terminal fitting 13, reducing assembly man-hours. There is.
第3図は本発明の第3の実施例の要部を示す図である。FIG. 3 is a diagram showing essential parts of a third embodiment of the present invention.
同図において第1図と同一部分は同一符号を付して示し
た。In this figure, the same parts as in FIG. 1 are designated by the same reference numerals.
本実施例は図に示すように、プラスチックカバー11の
端子金具取付用突起12の周囲に端子金具13の取付部
の外径及び厚さと等しい内径及び深さを有する凹部17
を形成しておき、該突起12に端子取付金具13を固定
した後、カバ−11内面に導電性塗膜14を施し、さら
に該端子金具13をリード線により本体機器のアース電
位部材に接続したものである。As shown in the figure, in this embodiment, a recess 17 having an inner diameter and depth equal to the outer diameter and thickness of the mounting portion of the terminal fitting 13 is formed around the terminal fitting mounting protrusion 12 of the plastic cover 11.
After forming a terminal fitting 13 on the protrusion 12, a conductive coating 14 was applied to the inner surface of the cover 11, and the terminal fitting 13 was connected to a ground potential member of the main device by a lead wire. It is something.
このように構成された本実施例は、第1の実施例と同様
な電波ノイズに対する良好なシールド効果を有するほか
、端子金具13の上面とプラスチックカバーの表面とが
同一平面となり段差を生じないため導電性塗膜が段差部
で薄くなることや、塗膜切れなどを生ずることを防止す
ることができる。This embodiment configured in this manner not only has a good shielding effect against radio wave noise similar to the first embodiment, but also has the advantage that the top surface of the terminal fitting 13 and the surface of the plastic cover are on the same plane, so that there is no difference in level. It is possible to prevent the conductive coating from becoming thinner at stepped portions and from causing coating breakage.
第4図は本発明の第4の実施例の要部を示す図である。FIG. 4 is a diagram showing essential parts of a fourth embodiment of the present invention.
同図において第1図と同一部分は同一符号を付して示し
た。In this figure, the same parts as in FIG. 1 are designated by the same reference numerals.
本実施例は、端子金具13の取付部の外周にテーパー1
3bを付けておき、該端子金具13をプラスチックカバ
ーの端子金具取付用突起12で取付固定した後、カバ−
11内面に導電性塗膜14を施し、さらに該端子金具1
3をリード線により本体機器のアース電位部材に接続し
たものである。In this embodiment, the outer periphery of the mounting portion of the terminal fitting 13 has a taper.
3b, and after attaching and fixing the terminal fitting 13 with the terminal fitting mounting protrusion 12 of the plastic cover, remove the cover.
A conductive coating film 14 is applied to the inner surface of 11, and the terminal fitting 1
3 is connected to the earth potential member of the main device by a lead wire.
このように構成された本実施例は、端子金具13とプラ
スチックカバー11との間に段差を生じないため、前実
施例と同様に塗膜切れ等の欠陥を生ぜず良好なシールド
効果が得られる。In this embodiment configured in this way, since there is no step difference between the terminal fitting 13 and the plastic cover 11, a good shielding effect can be obtained without causing defects such as paint film breakage, as in the previous embodiment. .
第5図は本発明の第5の実施例を示す図である。FIG. 5 is a diagram showing a fifth embodiment of the present invention.
本実施例は同図に示すように端子金具13をプラスチッ
クカバーへの取付前に、予めリード線15を半田付は等
により接続したものであり、導電性塗料を塗装するとき
に核部をマスクする必要がなく工数節減を可能としたも
のである。In this embodiment, as shown in the figure, the lead wire 15 is connected in advance by soldering or the like before the terminal fitting 13 is attached to the plastic cover, and the core part is masked when applying conductive paint. This makes it possible to save man-hours as there is no need to do this.
以上説明した様に本発明によれば、端子金具をプラスチ
ックカバーの導電性塗膜塗装予定面に取り付け、その上
から導電性塗料を塗装することにより両者間の良好な電
気的接続が得られ、それにより電波ノイズに対するシー
ルド効果も良好となる。As explained above, according to the present invention, a good electrical connection between the two can be obtained by attaching the terminal fitting to the surface to be coated with the conductive coating of the plastic cover and painting the conductive coating over it. This also improves the shielding effect against radio noise.
第1図は本発明の第1の実施例を示す図、第2図は本発
明の第2の実施例を示す図、第3図は本発明の第3の実
施例を示す図、第4図は本発明の第4の実施例を示す図
、第5図は本発明の第5の実施例を示す図1、第6図は
従来のプラスチックカバーのアース接続構造を示す図で
ある。
図において、
10は機器本体、
11はプラスチックカバー、
12は端子金具取付用突起、
13は端子金具、
14は導電性塗膜、
15はリード線、
16はアース電位部材
を示す。FIG. 1 is a diagram showing a first embodiment of the invention, FIG. 2 is a diagram showing a second embodiment of the invention, FIG. 3 is a diagram showing a third embodiment of the invention, and FIG. 4 is a diagram showing a third embodiment of the invention. FIG. 5 shows a fourth embodiment of the invention, FIG. 5 shows a fifth embodiment of the invention, and FIG. 6 shows a conventional ground connection structure for a plastic cover. In the figure, 10 is the main body of the device, 11 is a plastic cover, 12 is a projection for attaching a terminal fitting, 13 is a terminal fitting, 14 is a conductive coating, 15 is a lead wire, and 16 is an earth potential member.
Claims (3)
スチックカバーを有する電子機器において、 取付孔(13a)を有する端子金具(13)がプラスチ
ックカバー(11)の塗装予定面に予め設けられた端子
取付用突起(12)に嵌合固定され、該端子金具(13
)を含んで塗装予定面に導電性塗膜(14)が形成され
、さらに該端子金具(13)がリード線(15)により
本体機器(10)のアース電位部材(16)に接続され
て成ることを 特徴とするプラスチックカバーのアース接続構造。1. In an electronic device having a plastic cover on which a conductive coating is applied and the coating is grounded, a terminal fitting (13) having a mounting hole (13a) is provided in advance on the surface to be painted of the plastic cover (11). Fitted and fixed to the terminal mounting protrusion (12), the terminal fitting (13)
), a conductive coating film (14) is formed on the surface to be painted, and the terminal fitting (13) is further connected to the earth potential member (16) of the main device (10) by a lead wire (15). A plastic cover earth connection structure characterized by:
(12)の周囲に端子金具(13)の外径及び厚さに等
しい内径及び深さを有する凹部(17)が設けられた特
許請求の範囲第1項記載のプラス チックカバーのアース接続構造。2. Claim 1: A recess (17) having an inner diameter and depth equal to the outer diameter and thickness of the terminal fitting (13) is provided around the terminal mounting protrusion (12) of the plastic cover (11). Earth connection structure of the plastic cover described in section.
けられた特許請求の範囲第1項記載の プラスチックカバーのアース接続構造。3. The earth connection structure for a plastic cover according to claim 1, wherein a slope (13b) is provided on the outer periphery of the terminal fitting (13).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2740288A JPH01204499A (en) | 1988-02-10 | 1988-02-10 | Ground connecting structure for plastic cover |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2740288A JPH01204499A (en) | 1988-02-10 | 1988-02-10 | Ground connecting structure for plastic cover |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01204499A true JPH01204499A (en) | 1989-08-17 |
Family
ID=12220071
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2740288A Pending JPH01204499A (en) | 1988-02-10 | 1988-02-10 | Ground connecting structure for plastic cover |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01204499A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6908338B2 (en) | 2003-03-27 | 2005-06-21 | Nec Corporation | Housing of electronic apparatus |
US9226434B2 (en) | 2012-10-24 | 2015-12-29 | Pegatron Corporation | Electronic device and electrically-conducting assembly thereof |
-
1988
- 1988-02-10 JP JP2740288A patent/JPH01204499A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6908338B2 (en) | 2003-03-27 | 2005-06-21 | Nec Corporation | Housing of electronic apparatus |
US9226434B2 (en) | 2012-10-24 | 2015-12-29 | Pegatron Corporation | Electronic device and electrically-conducting assembly thereof |
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