JPH01194388A - Printed-circuit board manufacturing device - Google Patents

Abstract

PURPOSE:To secure plating treatment and washing treatment by selecting the spring constant of an elastic body so that a printed-circuit board resonates with the vibration of a vibration generator. CONSTITUTION:A printed-circuit board 3 is supported by a supporting body such as a supporting lever 8 through an elastic body 9 including a spring plate and spring constant of an elastic body 9 is selected to allow the printed-circuit board to resonate with vibration of a vibration generator 6. Thus, it is possible to fully vibrate a circuit-board 3 being dipped within treatment liquid tanks 1 and 2 and being treated in liquid by efficiently transmitting vibration energy from the generator 6 to the circuit-board 3. As a result, it is possible to completely and efficiently remove air bubbles being present within a small hole such as a through-hole 4 of the circuit-board 3, thus securing plating treatment and washing treatment.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a printed circuit board manufacturing apparatus that liquid-processes printed circuit boards, and in particular to a through-hole plating pretreatment apparatus for printed circuit boards, as well as electroless plating apparatus and electroplating apparatus. It is applicable to equipment, cleaning processing equipment, etc.

(Prior Art) As already proposed by the inventors of the present invention, this type of device uses a vibration generator to vibrate a printed circuit board that is immersed in a processing liquid tank such as a plating tank and is undergoing liquid treatment. There is a known method for removing air bubbles in through-holes (Japanese Patent Laid-Open No. 154797/1983).

(Problems to be Solved by the Invention) However, conventional devices are inefficient in completely removing air bubbles generated in through holes of printed circuit boards, and a solution to this problem has been desired.

In the process of investigating the cause, the inventors discovered that the natural frequency of the printed circuit board was larger than that of a practical vibration generator such as a vibration motor, and that the vibration energy of the vibration generator was It was discovered that the vibrations were not transmitted efficiently and the printed circuit board was not sufficiently vibrated.

Based on this knowledge, an object of the present invention is to sufficiently vibrate a printed circuit board, thereby efficiently and completely removing air bubbles generated within the through holes.

(Means for Solving the Problems) In order to achieve the above object, the present invention has the following configuration.

That is, the present invention provides a support that supports a printed circuit board having small holes with an elastic body interposed therebetween, a processing liquid tank in which the printed circuit board supported on the support is immersed, and a support that is immersed in the processing liquid tank. and a vibration generator that vibrates the body, and the spring constant of the elastic body is changed so that the printed circuit board resonates with the vibration of the vibration generator.

(Function) The present invention allows the printed circuit board 3 to be supported by a support such as a support rod 8 via an elastic body 9 such as a spring plate, and furthermore, the spring constant of the elastic body 9 is applied to the vibration of the vibration generator 6 on the printed circuit board. 3 is transitioning to resonate.

Therefore, the vibration energy from the vibration generator 6 can be efficiently transmitted to the printed circuit board 3 which is immersed in the treatment liquid tanks 1 and 2 and undergoing liquid treatment, so that the printed circuit board 3 can be sufficiently vibrated.

As a result, air bubbles existing in small holes such as the through holes 4 of the printed circuit board 3 can be efficiently and completely removed, thereby making plating and cleaning processes reliable.

(Example) Hereinafter, the present invention will be described in detail with reference to the drawings.

FIG. 1 is a schematic perspective view of a first embodiment of the present invention applied to a manufacturing process line for printed circuit boards.

In the figure, reference numerals 1 and 2 are various treatment liquid tanks that perform liquid treatments such as plating and cleaning when manufacturing the printed circuit board 3, respectively. The printed circuit board 3 has small holes such as through holes 4 and is multilayered.

In the arrangement direction of the processing liquid tanks 1 and 2, a pair of carrier bar supports 5.5 are respectively provided along the left and right sides of the arrangement direction. Then, the carrier bar holder is placed on the stand 5.5.
A pair of left and right vibration generators 6.6 are respectively arranged.

A pair of left and right support rods 8, 8 for supporting the printed circuit board 3 are connected to the carrier bar 7. At least one of the support rods 8 is made to penetrate through the carrier bar 7 so as to be slidable in the axial direction thereof and fixed at a predetermined position.

The rear ends of elastic bodies 9 such as leaf springs are fixed and movably connected to the support rods 8.8, and support parts 10 for supporting the four corners of the printed circuit board 3 are provided at each tip of each elastic body 9. . The printed circuit board 3 is supported by each elastic body 9 by moving one of the support rods 8 in the axial direction of the carrier bar 7.

The elastic body 9 is moved by the printed circuit board 3 due to the vibration of the vibration generator 6.
The support rod 8 of the elastic body 9 has a spring constant such that it resonates, and its surface is coated with a corrosion-resistant coating. For installation, as shown in FIG. is preferred.

At both left and right ends of the carrier bar 7, there are figure 7 parts 12.1 that fit into corresponding figure 7 receivers 11.11 provided on the vibration generator 6.
form 2. Further, in order to strengthen the connection between the figure 7 receiver 11 and the figure 7 portion 12, the connection may be made by a mechanical structure using electromagnetic force or air pressure.

Further, the carrier bar 7 is guided by a conveying device (not shown) to be movable in the arrangement direction of each processing liquid tank 1 and 2, and is raised and lowered at a position above each processing liquid tank 1 and 2. and when it descends, the carrier bar 7
The character 7 part 12 corresponds to the character 7 receiver 11. ! 1, the carrier bar 7 can be positioned and fixed at that position.

Next, the vibration generator 6 shown in FIG. 1 will be explained with reference to FIG. 2.

In the figure, reference numerals 13 and 13 indicate a pair of springs, the lower ends of which are fixed on the carrier bar holder 5, and the upper ends of which are respectively fixed to both ends of the lower surface of the diaphragm 14. The receiver is elastically supported on the stand 5. Further, the carrier bar holder fixes the figure 7 holder 11 onto the diaphragm 14 which is elastically supported on the base 5. Note that instead of the figure 7 receiver 11, it may be fixed on a receiver with a flat upper surface. In that case, the lower surfaces of both left and right ends of the carrier bar 7 are naturally formed flat, but in this way, the flat surfaces are in contact with each other. By fixing it in place, it is possible to prevent the printed circuit board from swinging in the direction of the board surface, allowing for stable fixation.

15 is a vibration motor as a vibration source that vibrates the diaphragm 14 at a predetermined frequency, and is fixed to the lower surface of the diaphragm 14;
When this vibration motor 15 rotates, unbalanced weights fixed to both ends of the motor shaft cause the diaphragm 1 to
4 is configured to vibrate against the elastic support of a pair of springs 13 and 13. Therefore, this diaphragm 14 vibrates once when the vibration motor 15 rotates once.

Furthermore, as a vibration source for the diaphragm 14, a so-called electromagnetic vibrator or an air pie break may be used instead of the vibration motor 15 described above.

Next, the operation of the first embodiment configured as described above will be explained. Here, the processing liquid tank 1 is assumed to be a plating tank for performing electroless plating, for example.

The printed circuit board 3 has now completed its pre-processing process.

When the carrier bar 7 is guided by the conveying device and reaches above the processing liquid tank 1 shown in FIG. 1, the carrier bar 7 is lowered at that position. When the carrier bar 7 is lowered and the 7-shaped portions 12.12 formed at both left and right ends are fitted into the corresponding 7-shaped receivers 11.11 and fixed in position, the carrier bar 7 is supported by the carrier bar 7. Stop and return to the designated position above.

Here, a pair of left and right support rods 8 are connected to the carrier bar 7.
．． The printed circuit board 3 supported by the elastic body 9 is
It is completely immersed in the liquid in the processing liquid tank 1.

Next, the vibration motors 15 in the pair of vibration generators 6.6 disposed at both left and right ends of the processing liquid tank 1 start operating, so that the diaphragms 14 start vibrating in the vertical direction. The vibration of this diaphragm 14 is as follows: 7-character receiver 1
1. The vibration is transmitted to the printed circuit board 3 via the carrier bar 7, the support rod 8, and the elastic body 9, so that the printed circuit board 3 starts to vibrate.

By the way, since the elastic body 9 has a spring constant such that the printed circuit board 3 resonates with the frequency of the vibration generator 6 which is the vibration generation source, the vibration from the vibration generator 6 is efficiently transmitted to the printed circuit board 3. be done.

Further, the vibration direction of the printed circuit board 8 is determined by each elastic body.

Depending on how the support rod 9 is attached to the support rod 8, the direction may be along the plate surface, perpendicular to the plate surface, or a combination of these directions.

In the process of forming the plating layer of the through hole 4,
Since the printed circuit board 3 is constantly vibrating in this way, the vibration can completely remove air bubbles in the through holes and air bubbles generated in the through holes. Therefore, a predetermined plating film is reliably formed on the inner surfaces of all the through holes of the printed circuit board 3.

After that, when the plating film formation of the through hole is completed,
The transport device moves again, and the substrate 3 integrated with the carrier bar 7 is lifted out of the processing liquid tank 1, and the process proceeds to the next processing step.

Note that the above operation example describes plating processing, but 1
The present invention is not limited thereto, and can of course be applied to various liquid treatment devices for pre-treatment and post-treatment for plating printed circuit boards, as well as electroplating devices. A second embodiment of the present invention will be described with reference to FIG. In this second embodiment, a plurality of printed circuit boards 3 can be processed at once.

In the figure, reference numeral 16 denotes a frame formed of pipes on each side, and this frame 16 is connected to the carrier bar 7.

The upper sides 16A, 18B and the lower side 18G of the frame 16,
160, movable rods 17A to 17D are respectively connected. These movable rods 17A to 170 are connected via a connecting member 18 that is movable in the axial direction of each side 16A to 16D of the frame 16, in other words, in the left and right direction, and that can be positioned with a screw.

A support rod 19A for supporting the printed circuit board 3 is fixed between the moving rods 17A and 17B. In addition, moving rod 17
A support rod 19B is connected between A and 17B via a connecting member 18 so as to be movable in the axial direction, in other words, in the vertical direction.

Similarly, a support rod 19C for supporting the printed circuit board 3 is fixed between the movable rods 17C and 170. Further, a support rod 19D is connected between the movable rods 17C and 17D via a connecting member 18 so as to be movable in the axial direction, in other words, in the vertical direction.

The rear ends of elastic bodies 9 are respectively fixed to the support rods 19A to 19D at predetermined intervals, and support parts 10 for supporting the four corners of the printed circuit board 3 are provided at each tip of each elastic body 9.

According to the second embodiment having such a configuration, the support rod 19A-
Since a plurality of printed circuit boards 3 can be supported by the elastic body 9 on 19D, there is an advantage that a plurality of printed circuit boards 3 can be processed at once in the processing liquid tank 1.2.

Further, in the second embodiment, the movable rods 17A-17D are movable and positionable in the left-right direction, and the support rods 19B, 190
Since it is made movable and positionable in the vertical direction, there is an advantage that it can support the printed circuit board 3 regardless of its size.

(Effects of the Invention) As described above, in the present invention, the printed circuit board is supported by a support body through an elastic body such as a spring plate, and the spring constant of the elastic body is used to cause the printed circuit board to resonate with the vibration of the vibration generator. Because of this transition, the vibration energy of the vibration generator can be efficiently transmitted to the printed circuit board, so that the printed circuit board can be sufficiently vibrated using the conventional vibration generator.

Therefore, in the present invention, since the printed circuit board can be sufficiently vibrated while immersed in various treatment liquid tanks such as plating tanks and cleaning tanks, air bubbles existing in the through holes of the printed circuit board can be completely removed. This makes plating and cleaning processes more reliable.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of the first embodiment, FIG. 2 is a schematic configuration diagram of the vibration device, and FIG. 3 is a perspective view of the second embodiment. 1.2 is a processing liquid tank, 3 is a printed circuit board, 4 is a through hole, 6 is a vibration generator, 8 is a support rod, and 9 is an elastic body. Patent applicant Plantex Co., Ltd. Agent
Maki Tobe (and 3 others) Figure 2

Claims (1)

[Claims] A support body that supports a printed circuit board having small holes through an elastic body, a processing liquid tank in which the printed circuit board supported by the support body is immersed, and vibration generation that vibrates the support body immersed in the processing liquid tank. and a spring constant of the elastic body is changed so that the printed circuit board resonates with the vibration of the vibration generator.