JPH01161173A - Probe card automatic exchanging method for probe device - Google Patents

Abstract

PURPOSE:To shorten a working time and to improve yield by electrically wiring a connecting substrate to a probe card installed with elevating movement. CONSTITUTION:After the check of a semiconductor wafer, exchange to a probe card 9 corresponding to a next form is carried out. The exchange stops the supply of air from an air source 46. Thus, by the elastic force of a spring 48 provided by connection to a head plate and a holding board 40, a connecting substrate 36 elevates. Then, each POGO pin 37 of the substrate 36 and a probe card holder 12 is made into a non-contact condition. Next a holding arm is operated by a holding arm driving mechanism, a card 9 is conveyed to the prescribed position of a housing rack, and the card 9 corresponding to the next form is conveyed together with a holder 12 to an inserting ring 33. In such a way, the card 9 is automatically exchanged in the condition in which a test head 11 for high frequency checking/measuring is set at the upper part of the card 9, the exchanged card 9 and the test head 11 are automatically wired, thus, the wiring action of the test head 11 is made unnecessary, and the working time is shortened.

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Field of Industrial Application) The present invention relates to an automatic probe card exchange method for a probe device.

(Prior art) A wafer prober reduces costs and improves productivity by determining the electrical characteristics of each chip formed on a wafer and eliminating chips determined to be defective before the assembly process. This is a device to contribute to improvement.

Incidentally, in recent years, semiconductor manufacturing processes have been required to improve productivity, yield, and quality.Moreover, as wafers have become larger in diameter and manufacturing equipment has become more automated, , the same applies to the prober,
Probers have been developed that can automatically perform measurements simply by setting a workpiece set 1 containing wafers.

However, in recent years, due to the high integration and diversification of chips, the number of low-volume, high-mix production processes has increased, and as a result, the number of operations required by operators has increased significantly.

In particular, the probe card needs to be replaced for each type of chip to be specified.For example, 1ll11 chips of X type
If you then set the chip of X type to 4I,
It is necessary to replace the probe card with one suitable for X type.

In addition, when measuring high-performance chips such as those described in 1-1 above, in order to speed up the measurement time and increase the measurement frequency, it is necessary to embed the driver comparator and analog circuitry on a board called a pin electrotronic board. A test head with the board installed was placed directly above the probe card to perform high-frequency measurements. In this case, it is necessary to reinstall Dess 1 to Hes 1 each time the probe card described in - is replaced.

Conventionally, the method for replacing probe cars 1 to 1 as described in 1-1 was for the operator to loosen the screws on head plates 1 to J-, remove the probe card, and then install a probe card suitable for another type. All of these tasks were performed by artificial means.

In addition, each time the probe card is replaced, the eggplant 1 to head for high-frequency measurement is also evacuated to a position where it will not interfere with the probe card replacement, and when the replacement is completed, the eggplant 1 to head are placed in the specified position again. The work was performed manually by an operator.

(Problems to be solved by the invention) However, in conventional wafer probers, the operator manually replaces the probe card every time the type of wafer is changed, which is contrary to automation in the semiconductor manufacturing process. Of course, productivity,
It is extremely difficult to improve yield, quality, etc.

In particular, the stylus of the probe card lacks durability due to friction against the tip, so in order to obtain reliable MITI results, the probe card must be frequently replaced with a 4" to 11" probe. However, a lot of time is spent on replacing probe cards and selecting types, which not only becomes an obstacle to shortening work time, but also causes the operator to drop the probe card during transportation when installing the probe card. There was also a risk of damaging it.

Also, for high frequency measurements, eggplants 1 to 1 are placed on the probe card.
Even when the head is installed and measured, the operator has to repeat the installation operation every time the probe card is replaced, which results in a lot of time being spent on the work, and no reduction in work time can be expected.

This invention has been made in response to the above-mentioned problems, and it is possible to easily adapt the probe device to full automation, reduce working time, improve yield, and improve the safety of probe card replacement. ″): provides an automatic probe card replacement method.

[Structure of the invention]

(Means for Solving the Problems) The present invention automatically connects the probe card of a probe device that positions and connects a stylus attached to a probe card and an object to be measured to measure the electrical characteristics of the object to be measured using a tester. The present invention provides an automatic probe card exchange method for a probe device, characterized in that the tester is equipped with a means for moving up and down the connection board wired to the tester and electrically wiring it to the mounted probe card. be.

(Effects) By providing a means to move up and down the connection board wired to the tester and electrically wire it to the attached probe card, the probe cars 1 to 1 in the probe device can be replaced fully automatically, reducing the work time. and improvement of yield rate.)
and safety can be improved.

For example, with a test head compatible with high frequency measurement installed, you can replace probe car 1 and automatically wire the head and probe card from eggplant 1 to
It eliminates the need for head installation time, reducing work time.

(Example) Next, an example of the method of the present invention will be described with reference to the drawings.

The configuration of the probe device (1) is mainly composed of a prober section (2) and a probe card automatic exchange section (2).

The blower part (2) is connected to the cassettes 1 to (2) as shown in FIG.
In step 4), 25 wafers to be inspected, for example semiconductor wafers 0, are arranged in a column at predetermined intervals in the thickness direction. The cassette I/1) containing the wafer 0 is carried into the cassette storage part (6) manually or by a robot I/hand cap. The wafers (C) are taken out one by one from this storage section (6) and transported to the preliminary positioning stage (2). After rotating this preliminary positioning stage ω to perform preliminary positioning to an accuracy of ±]° based on the orientation flat of wafer 0, wafer 0 is conveyed to the inspection and measurement stage (8). This inspection H1l + wafer 0 transferred to fixed stage (8)
In order to accurately position the object, a pattern recognition mechanism using a CCD camera or a recognition mechanism using a laser is installed. After accurately positioning the wafer (C) based on the pattern using this recognition mechanism, the probe hook (10), which is the stylus of the probe card (9), is placed on the wafer 0 in the rough 1 position.
~, and the electrical characteristics of wafer 0 are automatically inspected and measured by the test head (11) installed with a pin electronics board incorporating analog circuits such as drivers and comparators provided above the probe card (9). When performing the inspection and measurement process for semiconductor wafer 0 using the prober section ■, which has such a continuous automatic inspection and measurement function, it is necessary to use a The probe card (b) needs to be replaced. Next, the probe card automatic exchange section (2) will be explained.

As shown in FIGS. 4 and 5, the various probe cards 0) are accurately positioned on the bottom surface of a ring-shaped probe card holder (12), and are fixed with screws. The holder (1z) is internally wired from the probe card (9) to the top surface of the holder (12) so as to be electrically conductive for a long time, and the two are integrated into one piece. Further, an annular groove (13) is formed in the inner wall of the holder (12).

The probe card holder (2) as shown in "-" and the probe card (9) as an object are stored in multiple types in advance in a probe card storage section, such as a probe card storage rack (14), with accurate positioning. has been done.

Means is provided for transporting the probe card 0) from this storage rack (14) to a predetermined position. As this means, a holding arm (15) made of a metal member such as an aluminum plate is provided, and the tip of this holding arm (15) has a rectangular convex portion (16) with symmetrical notches on both sides. It is formed.

On both sides of the convex portion (16), semi-arc-shaped butts (17) and (18) are arranged to maintain a gap from the sides of the convex portion (16), and the pads (17), (18) each has three telescopic pins (19a), (19b), (19c)
is connected to the protrusion (16) by.

The middle telescoping pin (+9b) is connected to the plunger tip of a double-acting air cylinder (20) housed in the convex portion (16), and by driving this air cylinder (20), the telescoping pin (+9b) 191)) expands and the pad (
17) and (18) are separated from the side wall of the convex portion (16). In addition, the telescopic pins (17) and (]8) are inserted into the linear bushing (21) inserted into the convex portion (16), and the movement during the movement of Para. 1 ((17) and (18)) Acts as a guide.

Probe card locking protrusions (22) are provided protruding from the lower side surfaces of the pads (17) and (18) along their circumferences.

The holding arm (15) as shown in 11- is mounted on the drive mechanism (23) as shown in FIG.

One end of the holding arm (15) is mounted on a mounting base (24) of the holding arm drive mechanism (z3), and this mounting base (24) is connected to a vertical quick-action screw vertically installed on the base (25). It is attached to the child (26) and the guide rod (27).

The holding arm (15) is rotated by a rotation motor (29) connected to the shaft via a timing belt (28), and a vertical drive screw is used to attach the holding arm (15) and the mounting base (24). The vertical drive motor (31) connected to the child (2G) via a timing belt (30) allows the robot to move up and down.

As mentioned above, the probe cars 1 to (■) conveying means are provided. By this means, the probe card 0) is
The predetermined position example is conveyed to the insert ring (33) provided on the lower surface of the heladbrae 1-(32). A positioning pin (34) is provided at a predetermined position of this insert ring (33), and a through hole (35) provided in the probe card holder (12)
is inserted and positioned. As shown in Figures 1 and 2, above the probe car 1-〇) installed at the position shown in Figure 1, a circular wire made of insulating material such as Loan is wired to the test head (11). A connection board (36) made of Bakelite, for example, is provided. This connection board (
36), there is a circular bath 1 which is the wiring terminal of the probe car F (9) provided in the probe card holder (12).
A large number of through holes, for example 300, are provided at positions corresponding to < (not shown). A conductive terminal such as a pogo pin (37) is press-fitted into each of the through holes, and is fixed with an insulating adhesive as a safety measure. The pogo pin (37) is led out vertically upward by about 7 to 8 m, for example, on the side of the test spatula F (11,), and led out vertically down, for example, about 10 mm on the side of the probe card (9). In addition, the tip of the pogo pin (37) led out to the probe card (■) side has a spring (not shown) installed inside the pogo pin (37), so it can be slid up and down by about 4 m, for example. It has become. Furthermore, the pogo pin (37) led out from the device 1 to the head (11) side.
) is Death 1~ fixed on Head Play 1-(32)
The head (11) is wired by a performance port (38) which is a relay board and a shield wire (39) which is a conductive wire coated with an insulating material. As the connection board (36) moves down 1", this wiring group
In response to this, the length is designed with a little extra margin. The connection board (36) provided with a large number of pogo pins (37) as described above is fixed to the ring-shaped holding port (40) at the peripheral edge with screws or the like (not shown). The holding board (40) is provided with through holes at, for example, three locations at predetermined angular intervals. A bush (41), which is a sliding material, is provided in each of the through holes to prevent friction. A shaft (42) is installed to pass through each of the through holes through this bush (41). There is.

This shaft 1~(42) has one end with head play 1~
(32), and using the shirts 1 to (42) as guides, the holding board F holds the connection board (36).
(40) is configured to move up and down. This mechanism is a so-called air cylinder, and includes a moving ring (43) provided around the shaft (42) and the shirt h (42) in a sealed state, and an outer periphery of the moving ring (43) and an outer thigh wall in a sealed state. Closed space (45) due to (44)
is provided. This sealed space (45) has a variable capacity, and air is supplied from an air source (46), and this air moves the movable ring (43) surrounding the shaft (42) to the shirt h (42). ). In order to prevent air from flowing out during this movement, the contact portion of the shaft (42) of the moving ring (43) and the contact portion of the external wall (44) are sealed with an O-ring (47). Further, springs (48) connecting the holding board (40) and the blade 1-1 (32) are provided at, for example, three locations at predetermined angular intervals. -4- As mentioned above, each pogo pin (37) of the connection board (36) and the performance port (38) are wired by the shield wire (39), and the performance port (38) and the pin electronics port of the test head (11) are wired by the shield wire (39). By connecting the circular pad of the probe car 1 holder (12) and the pogo pin (37), each probe needle (10) of the probe card (9) is connected to each probe needle (10) of the probe card (9). ) will be wired.

The operation and manufacturing method of the above-mentioned probe device (1) will be explained.

First, based on the type information of the object to be inspected, for example, a semiconductor wafer (C), which is programmed in advance into the memory mechanism of the CPU of the probe device (1), a probe card (9) corresponding to the type of wafer (C) is selected. . The selected probe card (9) is stored in the storage rack (14) as an integral part with the probe card holder (12), so it is held above the holder (12) by the drive mechanism (23). Install the arm (15). That is, the drive motor (3
1) Rotate the timing belt (30) in the specified direction,
After installing the mounting base (24) at a predetermined height, the holding arm (15)
), the timing belt (28) engaged with the drive motor (
29) in a predetermined direction and hold the holding arm (15) about 9
Rotate 0° and set it in place. Here, Fig. 5 (A
), the holding arm (15) is lowered by a predetermined amount by the drive mechanism (23), or the storage rack (14) is lowered.
Raise the pad (17) of the holding arm (15), (]8
) into the inner hole of the probe card holder (12).

At this time, the pads (17) and (18) are attached to the holding arms (15).
It is in a state where it is closest to the side surface of the convex part (16).

Next, drive the air cylinder (20) to
b) and hold the pads (17) and (18) with the arms (
The convex portion (]6) of 15) is separated from the side surface. At this time, the telescopic pins (], 9a), (+, 9c) are
, 9b), expands and contracts in conjunction with pads (17) and (18).
Acts as a movement guide. Also, para F (17), (
The arcuate locking protrusion (z2) formed on the probe card holder (18) is aligned so as to fit into the annular groove (13) formed on the inner wall surface of the probe card holder (12). In this way, after the locking convex portion (22) and the annular groove (13) are tightly fitted together as shown in the fifth I(13)L, the holding arm drive mechanism (23) moves the holding arm (15). and transport the probe card (3) to a predetermined position, the insert ring (33). At this time, insert the insert ring (
The probe card 0 is installed in a positioned state by inserting the through hole (35) provided in the probe card holder (12) into the positioning pin (34) provided in the probe card holder (33). Here, attach the probe card holder (12
) and the connection board (36) are connected and wired.

As for this wiring, air is first supplied from an air source (46) to each sealed space (45) provided at three locations. Due to this air pressure, each moving ring (43) simultaneously moves downward using each shaft (43) as a guide. Along with this movement, the holding board (38) provided in a ring shape descends while maintaining parallelism, and the connection board (36) attached to this holding board (38) descends by a predetermined amount. As a result, each pogo pin (37) provided on the connection board (36) comes into contact with each electrode pad (not shown) provided on two surfaces of the probe card holder (12).

At this time, the pogo pin (37) is compressed by about 2 m due to an internal spring (not shown) for protection.

When each pogo pin (37) of the connection board (36) described in -1- is brought into contact with each electrode pad of the probe car 1 to holder (12), each probe needle (10) of the probe card (9)
Each electrode pad of the and probe card holder (12) is wired, and from each pogo pin (37) to the pin electronics port of the test head (11) is a shield wire (39) and a performance port (38).
Since the probe needles (10) and the test head (11) are wired through each other, each probe needle (10) and the test head (11) are wired while maintaining an insulated state.

With the wires wired as described above, the probe needle 00) is connected to the electrode pad C formed on the semiconductor wafer (C) by a predetermined operation in the prober section (2), and in this connected state, the test head ( 11) to transmit and receive high-frequency test signals to perform test and measurement of the electrical characteristics of the IC.

After inspecting the semiconductor wafer 0 of the relevant type, it is replaced with a probe card 0) corresponding to the next type. In this exchange, first, the supply of air from the air source (46) is stopped. By this, the head plate (32) and the holding board (40
) The connection board (36) is raised by the elastic force of a spring (48) connected to the spring (48). Then, the connection board (36
) and each pogo pin (37) and probe card holder (]2
) is in a non-contact state. Next, the holding arm drive mechanism (23
) held by 1111I! (15) to transport the probe card (9) to a predetermined position in the storage rack (14), and insert the probe card (9) corresponding to the next type into the insert ring (33) along with the holder (12). Transport this.

As described above, with the test head for high-frequency inspection and measurement installed above the probe card, the probe card is automatically replaced, and the replaced probe card and test head are automatically wired. This eliminates the need for installation operations, reducing work time.

The present invention is not limited to the above embodiments, and for example, the connection board may be moved up and down by a high-precision motor without using an air cylinder mechanism.

Further, it is also effective for wiring with an external tester during normal inspection without providing a test head for high frequency inspection. Furthermore, although the probe card may be raised and lowered without raising and lowering the connection board, in order to protect the probe card and maintain parallelism, it is desirable to raise and lower the connection board. Furthermore, when transporting the probe card, do not install the holder, for example, place a dust seal on the outer peripheral surface of the
It is also possible to attach a member with high frictional resistance and excellent flexibility, such as ~, to press and hold the rubber seat 1 against the inner circumferential surface of the central through hole of the probe card.
Any means for holding the inner hole i''91X may be used.

[Brief explanation of the drawing]

Fig. 1 is an explanatory diagram of the wiring mechanism of the test head and probe card to explain one embodiment of the method of the present invention, Fig. 2 is an enlarged view of the main part of Fig. 1-Fig. FIG. 4 is an explanatory diagram of the mechanism for conveying the probe card in FIG. 1, FIG. 5 is a side view of FIG. 4, and FIG.
The figure is a diagram of the drive part of the holding arm in FIG. 4. 9.Flower card holder 10.Probe needle 1 test 1-Head 12.Flower card holder

Claims (4)

[Claims] (1) When automatically replacing the probe card of a probe device that measures the electrical characteristics of the object to be measured using a tester by positioning and connecting the stylus attached to the probe card to the object to be measured, 1. An automatic probe card exchange method for a probe device, comprising means for electrically wiring a mounted probe card by moving the connection board up and down. (2) The method for automatically replacing a probe card in a probe device according to claim 1, wherein the tester is a test head for high frequency measurement provided above the probe card. (3) An automatic probe card exchange method for a probe device according to claim 1, characterized in that the connection terminals provided on the connection board are brought into contact with the probe card for electrical wiring. (4) The automatic probe card exchange method for a probe device according to claim 3, wherein the connection terminal expands and contracts under the pressure of contact with the probe card.