JPH01148762A - Method for joining metal body to ceramic and joined body - Google Patents
Method for joining metal body to ceramic and joined bodyInfo
- Publication number
- JPH01148762A JPH01148762A JP30834687A JP30834687A JPH01148762A JP H01148762 A JPH01148762 A JP H01148762A JP 30834687 A JP30834687 A JP 30834687A JP 30834687 A JP30834687 A JP 30834687A JP H01148762 A JPH01148762 A JP H01148762A
- Authority
- JP
- Japan
- Prior art keywords
- ceramic substrate
- metal body
- paste
- ceramic
- metallization
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 39
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 39
- 239000002184 metal Substances 0.000 title claims abstract description 39
- 238000000034 method Methods 0.000 title claims description 23
- 239000000758 substrate Substances 0.000 claims abstract description 31
- 238000005245 sintering Methods 0.000 claims abstract description 4
- 238000001465 metallisation Methods 0.000 claims description 20
- LTPBRCUWZOMYOC-UHFFFAOYSA-N Beryllium oxide Chemical compound O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 24
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 21
- 238000005219 brazing Methods 0.000 description 10
- 238000007747 plating Methods 0.000 description 9
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 7
- 229910052750 molybdenum Inorganic materials 0.000 description 7
- 239000011733 molybdenum Substances 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 229910052814 silicon oxide Inorganic materials 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 230000006835 compression Effects 0.000 description 4
- 238000007906 compression Methods 0.000 description 4
- 238000010304 firing Methods 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000000395 magnesium oxide Substances 0.000 description 3
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 3
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910000531 Co alloy Inorganic materials 0.000 description 2
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 1
- QXZUUHYBWMWJHK-UHFFFAOYSA-N [Co].[Ni] Chemical compound [Co].[Ni] QXZUUHYBWMWJHK-UHFFFAOYSA-N 0.000 description 1
- KGWWEXORQXHJJQ-UHFFFAOYSA-N [Fe].[Co].[Ni] Chemical compound [Fe].[Co].[Ni] KGWWEXORQXHJJQ-UHFFFAOYSA-N 0.000 description 1
- PCEXQRKSUSSDFT-UHFFFAOYSA-N [Mn].[Mo] Chemical compound [Mn].[Mo] PCEXQRKSUSSDFT-UHFFFAOYSA-N 0.000 description 1
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 1
- 239000000292 calcium oxide Substances 0.000 description 1
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- 229910000423 chromium oxide Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000009304 pastoral farming Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
- C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
- C04B37/023—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used
- C04B37/026—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used consisting of metals or metal salts
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
- C04B2237/12—Metallic interlayers
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/32—Ceramic
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/40—Metallic
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Ceramic Products (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明はセラミックに金属体を接合する方法およびこの
接合方法によって得られるセラミックと金属体との接合
体に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method for joining a metal body to a ceramic, and a joined body of a ceramic and a metal body obtained by this joining method.
（従来の技術）
セラミック基板にモリブデン、鉄−ニッケル合金、鉄−
ニッケルーコバルト合金等の金属線を接合する場合は、
一般にセラミック基板をメタライズし、メタライズ面に
ニッケルめっきを施してからろう材を介して金属線をろ
う付けするようにされている。(Conventional technology) Molybdenum, iron-nickel alloy, iron-
When joining metal wires such as nickel-cobalt alloy,
Generally, a ceramic substrate is metallized, the metallized surface is plated with nickel, and then metal wires are brazed with a brazing filler metal.
この他の接合方法としては、セラミック基板に厚膜印刷
を行い、この上に金めつきを施すとともに、あらかじめ
金属線に金めつきを施し、この金属線を数百度の温度で
セラミック基板に熱圧着して接合する方法がある。Another bonding method is to print a thick film on a ceramic substrate, apply gold plating on top of this, and then apply gold plating to a metal wire in advance, and then heat the metal wire to the ceramic substrate at a temperature of several hundred degrees. There is a method of joining by crimping.
（発明が解決しようとする問題点）
しかしながら、上述したろう付けによる方法でも金属線
の接合強度は十分ではなく、また、余熱圧着の方法でも
十分な接合強度が得られないという問題点がある。また
、高温で使用する場合にあっては、前記ろう付げによる
方法ではろう材により１０００℃程度が限度であり、ま
た、余熱圧着の方法では５００℃以上では使用できなく
なる等の使用上の制限があり、大発熱量の部品には十分
な保証ができない。(Problems to be Solved by the Invention) However, there is a problem in that even the brazing method described above does not provide sufficient bonding strength of metal wires, and even the preheat pressure bonding method does not provide sufficient bonding strength. In addition, when using at high temperatures, the brazing method described above has a limit of about 1000°C due to the brazing material, and the preheat compression method cannot be used at temperatures above 500°C. Therefore, we cannot provide sufficient guarantees for parts that generate a large amount of heat.
また、上述したろう付けによる接合方法では、メタライ
ズ面と金属線にあらかじめめっき処理を施す必要があり
、余熱圧着の方法でもあらかじめセラミックと金属線と
に金めつきを施す必要があって、工程が複雑になるとい
う問題点があり、また、ニッケルめっきを施した場合に
は僅かに磁性を帯びるため高周波特性が劣化するという
問題点がある。また、金属線がモリブデン線の場合はモ
リブデンに金めつきを施すことが難しいという問題点も
ある。In addition, the above-mentioned joining method by brazing requires plating on the metallized surface and the metal wire in advance, and the preheat pressure bonding method also requires gold plating on the ceramic and the metal wire in advance, which slows down the process. There is a problem in that it becomes complicated, and there is also a problem in that when nickel plating is applied, it becomes slightly magnetic, resulting in deterioration of high frequency characteristics. Furthermore, when the metal wire is a molybdenum wire, there is also the problem that it is difficult to apply gold plating to the molybdenum.
そこで、本発明は上記問題点を解消すべくなされたもの
であり、その目的とするところは、セラミック基板に容
易に金属体を接合することができる接合方法と、この金
属体の接合方法によって得られるセラミックと金属体と
の接合体を提供するにある６
（問題点を解決するための手段）
本発明は上記目的を達成するため次の構成をそなえる。Therefore, the present invention has been made to solve the above-mentioned problems, and its purpose is to provide a joining method that can easily join a metal body to a ceramic substrate, and to provide benefits obtained by this method of joining the metal body. (Means for solving the problems) The present invention has the following configuration in order to achieve the above object.
すなわち、
セラミック基板と金属体とがメタライズ部により直接一
体化されていることを特徴とし、また、メタライズペー
ストが塗布されたセラミック基板と、メタライズペース
トが塗布された金属体とを、上記両メタライズペースト
の少なくとも一方を未焼成のペーストの状態のままで他
方側のメタライズ部またはメタライズペーストに接触さ
せた状態で焼結して一体化させることを特徴とする。That is, the ceramic substrate and the metal body are directly integrated by the metallized portion, and the ceramic substrate coated with the metallize paste and the metal body coated with the metallize paste are bonded to each other by the above-mentioned metallization paste. The present invention is characterized in that at least one of the metallized parts or the metallized paste is sintered in an unfired paste state and brought into contact with the other metallized part or metallized paste so as to be integrated.
（作用） 次に作用について述べる。(effect) Next, we will discuss the effect.
セラミック基板と金属体とはめっき面あるいはろう材を
介することなくメタライズ部によって直接一体化して接
合される。金属体とセラミック基板とはメタライズペー
ストの焼結により強固に接合される。The ceramic substrate and the metal body are directly integrated and joined by the metallized portion without using a plating surface or a brazing material. The metal body and the ceramic substrate are firmly joined by sintering the metallized paste.
（実施例） 以下本発明の好適な実施例を詳細に説明する。(Example) Preferred embodiments of the present invention will be described in detail below.
〔第１実施例〕
第１実施例はべりリアセラミック基板にモリブデン線を
接合したものである。[First Example] In the first example, a molybdenum wire is bonded to a Berria ceramic substrate.
この実施例では、まず、ベリリアセラミック基板上に、
モリブデン粉末９５重量％、酸化マグネシウム２．５重
量％、酸化ケイ素２．５重量％を含有するメタライズペ
ーストを塗布し、１２００℃〜１５００℃の還元性雰囲
気中で焼成して前記ベリリアセラミック基板上にメタラ
イズ層を形成する。In this example, first, on a beryllia ceramic substrate,
A metallizing paste containing 95% by weight of molybdenum powder, 2.5% by weight of magnesium oxide, and 2.5% by weight of silicon oxide was applied and fired in a reducing atmosphere at 1200°C to 1500°C to form a coating on the beryllia ceramic substrate. Form a metallized layer on.
次いで、前記ベリリアセラミック基板に接合するモリブ
デン線の下端に前記メタライズペーストを付着させ、前
記ベリリアセラミック基板上にモリブデン線を位置決め
する。Next, the metallization paste is attached to the lower end of the molybdenum wire to be bonded to the beryllia ceramic substrate, and the molybdenum wire is positioned on the beryllia ceramic substrate.
モリブデン線に付けられたメタライズペーストが乾燥し
た後、再度１２００℃〜１５００℃の還元性雰囲気中で
焼成して、モリブデン線とベリリアセラミック基板とを
接合する。After the metallization paste applied to the molybdenum wire is dried, it is fired again in a reducing atmosphere at 1200° C. to 1500° C. to bond the molybdenum wire and the beryllia ceramic substrate.
焼成完了後のモリブデン線とベリリアセラミックの接合
体は前記メタライズペーストが焼結される際に接合する
ので、従来のろう付けによる接合方法や、余熱圧着の接
合方法とくらべて接合強度を向上させることができた。After completion of firing, the bonded body of molybdenum wire and beryllia ceramic is bonded when the metallized paste is sintered, so the bonding strength is improved compared to the conventional bonding method using brazing or preheat compression bonding. I was able to do that.
なお、上述したように続けて２度焼成を行ってモリブデ
ン線の接合を行うかわりに、ベリリアセラミック基板に
メタライズペーストを塗布した際に同時にモリブデン線
をメタライズペーストに接触させておき、１回の焼成で
ベリリアセラミック基板とモリブデン線との接合を行う
ようにすることも可能である。In addition, instead of performing two consecutive firings to bond the molybdenum wires as described above, the molybdenum wires are brought into contact with the metallization paste at the same time when the metallization paste is applied to the beryllia ceramic substrate, and the molybdenum wires are fired once. It is also possible to bond the beryllia ceramic substrate and the molybdenum wire by firing.
なお、ベリリアセラミックにたいして、一般に使用され
ているモリブデン−マンガン系のメタライズペーストを
使用した場合はペースト中のマンガンがベリリアセラミ
ック中に拡散する性質によってメタライズ層とベリリア
セラミック基板間では十分な接合力を有しないが、前記
モリブデン粉末、酸化マグネシウム、酸化ケイ素からな
るメタライズペーストはべりリアセラミック基板とのマ
ツチングが良好であり、ベリリアセラミック基板とメタ
ライズ層間で好適な接合力を有するものである。ここで
、ベリリアセラミック基板用に好適に使用できるメタラ
イズペーストの組成は、モリブデン粉末８０重量％以上
、酸化マグネシウム１５重量％以下、酸化ケイ素１５重
足％以下の組成のものである。なお、このメタライズペ
ーストには適宜アルミナ、酸化クロム、酸化カルシウム
を添加して用いてもよい。Note that when a commonly used molybdenum-manganese metallization paste is used for beryllia ceramic, sufficient bonding between the metallized layer and the beryllia ceramic substrate is not achieved due to the property of manganese in the paste diffusing into the beryllia ceramic. Although the metallization paste is not strong, the metallization paste made of molybdenum powder, magnesium oxide, and silicon oxide has good matching with the Bereria ceramic substrate and has a suitable bonding force between the Bereria ceramic substrate and the metallization layer. Here, the composition of the metallizing paste that can be suitably used for the beryllia ceramic substrate is one containing 80% by weight or more of molybdenum powder, 15% by weight or less of magnesium oxide, and 15% by weight or less of silicon oxide. Note that alumina, chromium oxide, and calcium oxide may be added to this metallization paste as appropriate.
〔第２実施例〕
第２実施例はアルミナセラミック基板にモリブデンある
いは、タングステン、鉄−ニッケル合金、鉄−ニッケル
ーコバルト合金等からなる金属線を接合する例である。[Second Embodiment] The second embodiment is an example in which a metal wire made of molybdenum, tungsten, iron-nickel alloy, iron-nickel-cobalt alloy, etc. is bonded to an alumina ceramic substrate.
この実施例でも第１実施例と同様にアルミナセラミック
基板にメタライズペーストを塗布した後１２００℃〜１
５００℃の還元性雰囲気中で焼成し、ついで金属線にメ
タライズペーストを付着させるとともに、焼成されたメ
タライズ層に位置決めした後再度１２００℃〜１５００
℃の還元性雰囲気中で焼成し、金属線をアルミナセラミ
ック基板上に接合する。In this example, as in the first example, after applying the metallization paste to the alumina ceramic substrate,
It is fired in a reducing atmosphere at 500°C, and then the metallization paste is attached to the metal wire, and after being positioned on the fired metallized layer, it is heated again at 1200°C to 1500°C.
The metal wire is bonded onto the alumina ceramic substrate by firing in a reducing atmosphere at ℃.
ここで、アルミナセラミック基板用として以下のメタラ
イズペーストが好適に使用できる。Here, the following metallization pastes can be suitably used for alumina ceramic substrates.
■ モリブデン粉末８０重量％以上、酸化ケイ素１５型
組％以下、酸化マグネジ９４１５重景％以下、■ モリ
ブデン粉末８０重量％以上、酸化ケイ素１５型組％以下
、アルミナ１５重量％以下、■ モリブデン粉末８０重
量％以上、酸化ケイ素１５重量％以下。■ Molybdenum powder 80% by weight or more, silicon oxide 15% or less, magneth oxide 9415 grazing% or less, ■ Molybdenum powder 80% or more, silicon oxide 15% or less, alumina 15% by weight or less, ■ Molybdenum powder 80% % by weight or more, and 15% by weight or less of silicon oxide.
この第２実施例においても、メタライズペーストの焼結
によって金属線はメタライズ層を介してアルミナセラミ
ック基板と一体に接合するから、従来のろう付は接合方
法および余熱圧着接合方法とくらべて大きな接合強度を
得ることができる。In this second embodiment as well, the metal wire is integrally joined to the alumina ceramic substrate through the metallized layer by sintering the metallized paste, so the conventional brazing has a higher joining strength than the joining method and the preheat compression joining method. can be obtained.
また、上述した第１実施例および第２実施例かられかる
ように、本実施例の方法によればメタライズペーストを
介して金属線をそのまま接合しているので、ろう付は方
法や全熱圧着方法のときのようにめっき処理を施す必要
がなく接合操作が一層容易である。In addition, as can be seen from the first and second embodiments described above, according to the method of this embodiment, the metal wires are directly joined via the metallization paste, so brazing is performed using the full heat compression method. Unlike the conventional method, there is no need to perform plating treatment, making the joining operation easier.
なお、上述した実施例においてはモリブデン等の金属線
を接合する例について述べたが、セラミックに接合され
る金属体は金属線に限定されるものではなく、金属の板
状体等であっても同様に接合できる。In addition, in the above-mentioned embodiment, an example was described in which a metal wire such as molybdenum was bonded, but the metal body to be bonded to the ceramic is not limited to a metal wire, and may be a metal plate-shaped body or the like. It can be joined in the same way.
以上、本発明について好適な実施例を挙げて種々説明し
たが、本発明はこの実施例に限定されるものではなく、
発明の精神を逸脱しない範囲内で多くの改変を施し得る
のはもちろんのことである。As mentioned above, various explanations have been given of the present invention by giving preferred examples, but the present invention is not limited to these examples.
Of course, many modifications can be made without departing from the spirit of the invention.
（発明の効果）
本発明のセラミックと金属体の接合方法ではメタライズ
ペーストを用いてセラミック基板と金属体とを直接接合
するようにしているから、ろう付は接合の場合のように
めっき処理やろう材が不必要であり、金属体をそのまま
接合することができるので、接合作業をきわめて容易に
行うことができる。(Effect of the invention) Since the ceramic and metal body bonding method of the present invention uses a metallization paste to directly bond the ceramic substrate and the metal body, brazing can be performed by plating as in the case of bonding. Since no materials are required and the metal bodies can be joined as they are, the joining work can be performed extremely easily.
また、この接合方法によれば、焼結されたメタライズ部
によってセラミックと金属体が直接接合されるから、従
来の接合方法によるものと比較して接合強度を向上させ
ることができる。また、メタライズ層によって一体化し
ているから接合個所の耐熱性が高く、高温にさらされる
部品に使用しても十分な信頼性を保証することができる
。Further, according to this joining method, the ceramic and the metal body are directly joined by the sintered metallized portion, so that the joining strength can be improved compared to the conventional joining method. In addition, since they are integrated by a metallized layer, the joints have high heat resistance, and sufficient reliability can be guaranteed even when used in parts exposed to high temperatures.
Claims (1)
接一体化されていることを特徴とするセラミックと金属
体との接合体。 ２、メタライズペーストが塗布されたセラミック基板と
、メタライズペーストが塗布された金属体とを、上記両
メタライズペーストの少なくとも一方を未焼成のペース
トの状態のままで他方側のメタライズ部またはメタライ
ズペーストに接触させた状態で焼結して一体化させるこ
とを特徴とするセラミックと金属体との接合方法。[Claims] 1. A joined body of a ceramic and a metal body, characterized in that the ceramic substrate and the metal body are directly integrated through a metallized portion. 2. Contact the ceramic substrate coated with the metallization paste and the metal body coated with the metallization paste with the metallization part or metallization paste on the other side, with at least one of the two metallization pastes remaining in an unfired paste state. A method of joining a ceramic and a metal body, which is characterized by sintering the ceramic body and integrating the metal body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62308346A JP2771810B2 (en) | 1987-12-05 | 1987-12-05 | Method of joining ceramic and metal body and joined body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62308346A JP2771810B2 (en) | 1987-12-05 | 1987-12-05 | Method of joining ceramic and metal body and joined body |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01148762A true JPH01148762A (en) | 1989-06-12 |
| JP2771810B2 JP2771810B2 (en) | 1998-07-02 |
Family
ID=17979955
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62308346A Expired - Lifetime JP2771810B2 (en) | 1987-12-05 | 1987-12-05 | Method of joining ceramic and metal body and joined body |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2771810B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116052922A (en) * | 2022-12-30 | 2023-05-02 | 河北中瓷电子科技股份有限公司 | A kind of electronic slurry for beryllium oxide ceramics and its preparation method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5864283A (en) * | 1981-10-13 | 1983-04-16 | トヨタ自動車株式会社 | How to join ceramics and metal |
| JPS59223280A (en) * | 1983-06-02 | 1984-12-15 | 日本特殊陶業株式会社 | Method of bonding ceramic and metal |
| JPS6246975A (en) * | 1985-08-23 | 1987-02-28 | 株式会社東芝 | Method of joining ti to ceramic |
-
1987
- 1987-12-05 JP JP62308346A patent/JP2771810B2/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5864283A (en) * | 1981-10-13 | 1983-04-16 | トヨタ自動車株式会社 | How to join ceramics and metal |
| JPS59223280A (en) * | 1983-06-02 | 1984-12-15 | 日本特殊陶業株式会社 | Method of bonding ceramic and metal |
| JPS6246975A (en) * | 1985-08-23 | 1987-02-28 | 株式会社東芝 | Method of joining ti to ceramic |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116052922A (en) * | 2022-12-30 | 2023-05-02 | 河北中瓷电子科技股份有限公司 | A kind of electronic slurry for beryllium oxide ceramics and its preparation method |
| CN116052922B (en) * | 2022-12-30 | 2025-03-04 | 河北中瓷电子科技股份有限公司 | Electronic slurry for beryllium oxide ceramics and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2771810B2 (en) | 1998-07-02 |
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