JPH01145174U - - Google Patents
Info
- Publication number
- JPH01145174U JPH01145174U JP4025688U JP4025688U JPH01145174U JP H01145174 U JPH01145174 U JP H01145174U JP 4025688 U JP4025688 U JP 4025688U JP 4025688 U JP4025688 U JP 4025688U JP H01145174 U JPH01145174 U JP H01145174U
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- land
- conductive
- chip
- connection part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案の一実施例を示す正面図、第２
図は第１図のａ―ａ′間の断面図、第３図は本考
案の他の実施例を示す正面図、第４図は第３図の
ｂ―ｂ′間の断面図、第５図は従来の正面図であ
る。
１０……基板、１１，１７……パターン、１２
，１３……ランド、１４……チツプ部品、１９…
…レジスト。
Figure 1 is a front view showing one embodiment of the present invention;
3 is a front view showing another embodiment of the present invention, FIG. 4 is a sectional view taken along b-b' in FIG. 3, and FIG. The figure is a conventional front view. 10...Substrate, 11, 17...Pattern, 12
, 13... Land, 14... Chip parts, 19...
…Resist.
Claims (1)
く固着した導電性の第１のパターンと、このパタ
ーンの途中に所定の間隔をもつた非接続部を形成
し、対向する非接続部に形成したチツプ部品取付
用のランドと、このランドの近傍に沿つて形成し
た導電性の第２のパターンと、このパターンおよ
び前記第１のパターンで形成したランドに対向す
る部分を少なくとも残して塗布したレジストとを
備え、前記ランドにチツプ部品を載置したのち、
前記レジストの塗布されない前記第１および第２
のパターンに半田付けし、チツプ部品を固着して
なることを特徴とするチツプ部品の取付装置。 An insulating substrate, a conductive first pattern fixed on this substrate to form a circuit, a non-connection part with a predetermined interval in the middle of this pattern, and an opposite non-connection part. The formed land for mounting chip components, the conductive second pattern formed along the vicinity of this land, and at least the portion facing the land formed by this pattern and the first pattern were coated. After placing the chip component on the land,
the first and second portions to which the resist is not applied;
A device for attaching chip parts, characterized in that the chip parts are soldered to the pattern and fixed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4025688U JPH01145174U (en) | 1988-03-29 | 1988-03-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4025688U JPH01145174U (en) | 1988-03-29 | 1988-03-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01145174U true JPH01145174U (en) | 1989-10-05 |
Family
ID=31266730
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4025688U Pending JPH01145174U (en) | 1988-03-29 | 1988-03-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01145174U (en) |
-
1988
- 1988-03-29 JP JP4025688U patent/JPH01145174U/ja active Pending