JPH01140799A - Cooling structure for electronic device - Google Patents

Abstract

PURPOSE:To cool high heat quantity due to high density mounting and to remarkably improve cooling capacity by providing thermal conduction bases inserted in contact between pistons and ICs for transferring heat dissipated from ICs to the pistons and cold plates. CONSTITUTION:Thermal transfer bases 13 are mounted on the upper faces of a plurality of ICs placed on both side faces of a daughter board 2, and pistons 12 are provided corresponding to the positions of the LSIs 4. The pistons 12 are associated together with springs 10 with a cold plate 9 so that the pistons 12 and the plate 9 are brought into contact at the whole peripheries. That is, refrigerant flows in the plate 9, the LSIs 4 are cooled through the plates 9, the pistons 12 and the bases 13. Thus, its cooling capacity is improved, high heat quantity due to high density mounting can be cooled, and since a fan and the like are not employed, a noise is eliminated.

Description

[Detailed description of the invention] [Industrial application field] The present invention relates to a cooling structure for electronic equipment.

[Prior Art] Conventionally, as shown in FIGS. 4 and 5, the cooling structure of this type of electronic equipment consists of inserting a plurality of daughter boards 2 into grooves of card rails 5 provided on both sides of a motherboard 1. A plurality of LSIs 4 to which radiation fins 3 are attached are mounted on the upper surface of the daughter board 2. The LSI 4 is cooled by cooling the heat radiation fins 3 from the side of the door outer board 2 by natural air cooling or forced air cooling using a fan or the like. Note that 7.8 is a female contact and a male contact for fitting the motherboard 1 and the daughter board 2 together.

[Problems to be solved by the invention] However, since the conventional cooling structure described above uses a natural air cooling or forced air cooling method, it is easy to cool down the high heat generated per unit area due to recent high-density packaging. Moreover, in order to increase the cooling capacity, the number of rotations of the fan must be increased or the size of the fan must be increased, resulting in a large amount of noise.

[Means for Solving the Problems] An object of the present invention is to solve the above-mentioned problems and provide a cooling structure for electronic equipment that has a significantly improved cooling capacity that can cool a high amount of heat generated by high-density packaging. do.

In order to achieve the above object, a cooling structure for an electronic device according to the present invention includes a cooling structure for an electronic device that accommodates a plurality of modules, in which the module is arranged spaced apart from a board on which a plurality of ICs are mounted. A cold plate is provided with a thermally conductive piston attached via an elastic member at a position corresponding to each IC, and a cold plate is formed with a flow path for flowing a refrigerant therein, and is inserted between each piston and the IC in contact with each other. and a heat conduction stand that conducts heat radiated from each of the pistons and the cold plate.

In a preferred embodiment, each of the pistons and each heat-conducting table has a mutually inclined contact surface.

[Example] Next, an example of the present invention will be described with reference to the drawings.

FIG. 1 is a plan view showing the configuration of a cooling structure for an electronic device according to an embodiment of the present invention, FIG. 2 is a sectional view taken along line A-A'' in FIG. 1, and FIG. 3 is an enlarged view of FIG. be.

In these figures, a heat conduction stand 13 is attached to the upper surface of a plurality of LSIs 4 mounted on both sides of the daughter board 2, and a piston 12 is further provided corresponding to the position of each LSI 4. The piston 12 is assembled into the cold plate 9 together with the spring 10, so that the piston 12 and the cold plate 9 are in contact with each other on the entire circumferential surface.

In this state, in order to bring the top surface of the heat conduction table 13 onto the bottom surface of the piston 12 into contact with each other, as shown in FIG.
and the cold plates 9 attached to both sides of the daughter board 2 using female screws 15. At this time, since the contact surface between the top surface of the heat conduction table 13 and the bottom surface of the piston 12 is slanted, the contact area can be larger than that on a horizontal surface, and the efficiency of thermal conductivity can be increased. Furthermore, since the area of the bottom surface of the piston 12 is larger than the area of the top surface of the heat conduction table 13, it is possible to absorb deviations from side to side.

When tightened as described above, the piston 12
0, it comes into contact with the heat conduction table 13 with a certain amount of pressure.

The daughter board 2 set as described above is guided to the motherboard 1 by the card rail 5, and the male contacts 8 of the motherboard 1 and the female contacts 7 of the daughter board 2 are fitted. Furthermore, by setting refrigerant injection and discharge to the refrigerant inlet and outlet from the opposite side where the daughter board 2 and motherboard 1 are fitted, the refrigerant flows inside the cold plate 9, causing the cold plate 9, the piston 12, and the The LSI 4 is cooled through the conduction stand 13.

With such a configuration, the piston 12 absorbs variations in the upper surface of a plurality of LSIs 4 mounted by using the action of the spring 10, and furthermore, the piston 12 absorbs the heat generated from the LSI 4 through the diagonal contact area between the heat conduction table 13 and the piston 12. Therefore, the heat can be efficiently conducted and transferred to the refrigerant of the cold plate 9.

In this embodiment, the LSI 4 is mounted on the daughter board 2, but the LSI 4 is not limited to this and may be an IC or other heat dissipating electronic component.

[Effects of the Invention] As explained above, the present invention provides an I/O mounted on a board.
A heat conduction table is provided on C, and the contact surface between the heat conduction table and the piston is made oblique, for example, to increase the contact area and increase the heat conduction efficiency, and furthermore, the refrigerant is introduced into the cold plate in which the piston is incorporated. By flowing, I
The heat generated from C is indirectly cooled by liquid through the piston.

Therefore, the cooling capacity is improved, and the high heat generated by high-density packaging can be cooled.Furthermore, since no fan or the like is used, there is an effect of eliminating noise.

[Brief explanation of the drawing]

FIG. 1 is a plan view showing the configuration of a cooling structure for an electronic device according to an embodiment of the present invention, FIG. 2 is a sectional view taken along line A-A'' in FIG. 1, and FIG. 3 is an enlarged view of FIG. 2. Figure 4 is a plan view showing the configuration of a conventional cooling structure for electronic equipment, and Figure 5 is B-B in Figure 4.
FIG. 1: Motherboard 2 Daughterboard 3: Heat dissipation fin 4: LSI 5: Card rail 6, 7: Female contact 8: Male contact 9: Cold plate 10: Spring
11: Refrigerant 12: Piston 13: Heat conduction stand 14: Male screw 15: Female screw

Claims (2)

[Claims] (1) In a cooling structure for an electronic device that accommodates a plurality of modules, the module has a board on which a plurality of ICs are mounted, and is placed apart from the board, and is connected to a position corresponding to each IC via an elastic member. A cold plate having a thermally conductive piston attached thereto and having a flow path for flowing a refrigerant therein, is inserted between each of the pistons and the IC in contact with each other, and dissipates heat from each of the ICs. A cooling structure for electronic equipment characterized by comprising a heat conduction stand that conducts heat to a cold plate. (2) The cooling structure for an electronic device according to claim 1, wherein each of the pistons and each of the heat conduction stands have mutually inclined contact surfaces.