JPH01110380U - - Google Patents
Info
- Publication number
- JPH01110380U JPH01110380U JP625688U JP625688U JPH01110380U JP H01110380 U JPH01110380 U JP H01110380U JP 625688 U JP625688 U JP 625688U JP 625688 U JP625688 U JP 625688U JP H01110380 U JPH01110380 U JP H01110380U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- bonding pad
- package
- wire
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Description
第１図は本考案の第１の実施例の回路図、第２
図は第２の実施例の回路図である。
１，２，３……ノンコネクシヨンピンと接続す
るボンデイングパツド、Ｑ１，Ｑ２……ＭＯＳＦ
ＥＴ、ＶＳＳ……ＧＮＤ電源。
Figure 1 is a circuit diagram of the first embodiment of the present invention;
The figure is a circuit diagram of the second embodiment. 1, 2, 3...Bonding pads connected to non-connection pins, Q1 , Q2 ...MOSF
ET, VSS...GND power supply.
Claims (1)
するパツケージに封入されてなる半導体装置にお
いて、前記リード端子とワイヤーで接続されるボ
ンデイングパツトと、前記ボンデイングパツドか
ら金属配線で接続されるトランジスタを有するこ
とを特徴とする半導体装置。 A semiconductor device enclosed in a package having lead terminals that are not electrically connected, comprising a bonding pad connected to the lead terminal with a wire, and a transistor connected to the bonding pad with metal wiring. A semiconductor device characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP625688U JPH01110380U (en) | 1988-01-20 | 1988-01-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP625688U JPH01110380U (en) | 1988-01-20 | 1988-01-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01110380U true JPH01110380U (en) | 1989-07-25 |
Family
ID=31210333
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP625688U Pending JPH01110380U (en) | 1988-01-20 | 1988-01-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01110380U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011047733A (en) * | 2009-08-26 | 2011-03-10 | Nec Corp | Deterioration detection circuit, deterioration detection system, and deterioration detection method |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50113764A (en) * | 1974-02-20 | 1975-09-06 |
-
1988
- 1988-01-20 JP JP625688U patent/JPH01110380U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50113764A (en) * | 1974-02-20 | 1975-09-06 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011047733A (en) * | 2009-08-26 | 2011-03-10 | Nec Corp | Deterioration detection circuit, deterioration detection system, and deterioration detection method |