JPH01100293A - Method for partially plating one side of metal bar - Google Patents

Abstract

PURPOSE:To continuously carry out accurate partial plating by masking the part of one side of a metal bar not to be plated, bringing the other side not to be plated into contact with a freely rotatable cylinder, travelling the bar along the cylinder and jetting a plating soln. from a position under the cylinder. CONSTITUTION:A metal bar 1 is travelled and the part of one side of the bar 1 not to be plated is masked with a masking tape or resist ink by a masking tape sticker 2. After passing through pretreating stages 3, 3' such as degreasing and washing stages, the other side of the bar not to be plated is brought into contact with the cylinder of a rotary cylinder plating device 4, the bar is travelled along the cylinder and high-speed plating is carried out with a jet of a plating soln. The tape is then stripped by a masking tape stripper 5 and the bar 1 is passed through post-treating stages 6, 6' such as washing and drying stage. Accurate one-side partial plating can be continuously and efficiently carried out.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for efficiently selectively plating one side of a metal strip.

[Conventional technology and its problems]

Conventionally, the method of selectively plating one side of a metal strip is as follows:
There is the following method.

■A method of plating by aligning a metal strip along a rotating cylinder, pressing a masking belt made of elastic rubber or other material with holes in the area to be plated in stripes or spots, and passing it through the plating solution. , ■ A method of plating by running a metal strip vertically and spraying a plating solution. ■Method of plating by running the metal strip horizontally and bringing the bottom surface into contact with the plating solution. and so on. However, in the method (2) in which the metal strip is placed along the rotating cylinder, the plating solution seeps through the holes in the masking belt made of elastic rubber, making it difficult to perform high-precision plating. Furthermore, in the method (2) in which the metal strip is run vertically, it is necessary to attach masking tape or apply resist ink to surfaces that do not require plating, which increases the cost accordingly.

Furthermore, in the method of (■) in which the metal strip is run horizontally, the masking tape is applied only to the bottom surface, so if jet plating is performed at a strong flow rate, the plating solution will wrap around the top surface of the metal system and will be plated on the top surface, resulting in poor efficiency. Only low current density plating is possible, which reduces production capacity. There were various problems such as:

[Problem that the invention seeks to solve]

As a result of studies on the above-mentioned problems, the present invention has developed a plating method that can efficiently perform continuous partial plating with a high accumulation on one side of a metallic material by masking only one side.

[Means and effects for solving the problems] The present invention is to mask the non-plated parts on one side of a running horizontal metal strip using masking tape or resist ink, and then attach the metal strip to a rotatable cylinder. This is a method for partially plating one side of a metal strip, which is characterized in that the non-plated surfaces are brought into contact with each other and plated by spraying a plating solution from below.

That is, as shown in FIG.
After masking with tape, it goes through pretreatment steps (3) and (3') such as degreasing and cleaning, and then is transferred to a rotating cylindrical plating machine (4).
After high-speed jet plating is performed using (4'), the tape is removed using a masking tape peeling machine (5), and the product is made into a product through post-processing steps (6) and (6') such as washing with water and drying. It is.

However, the above-mentioned metals are copper and copper alloys such as brass, phosphor bronze, and nickel silver used in electronic parts and electrical parts, or Fe.
-Ni alloy, stainless steel, etc., and noble metals such as gold, silver, palladium, or alloys thereof are used as the metal for partial plating.

As the masking tape, a heat-fusible adhesive based on polyethylene or polypropylene is used, and as the resist ink, an ultraviolet curing type is used.

According to the present invention, for example, as shown in FIGS. 2 to 4, a stripe plating layer (
7) and (7') are obtained, and it is also possible to perform stripe plating (7) and spot plating (8) at the same time. Further, a base plating N (9) such as Ni may be provided as a base plating for the above-mentioned noble metal plating. According to the above-mentioned method of the present invention, single-sided partial plating strips with high precision in plating position and size can be plated continuously and efficiently at high speed.

〔Example] An embodiment of the present invention will be described below.

Example 1 First, a metal strip (1) was coated on one side of a bronze strip with a thickness of Q, 1 m+++, a diameter of 80 mm, and a diameter of 0.
After masking one side with masking tape applicator (2), degreasing and cleaning are performed in plating pretreatment steps (3) and (3'), and then rotating cylindrical plating equipment (4) and (4').
), followed by peeling off the tape with a masking tape peeling machine (5), followed by washing and drying with post-plating treatments (6) and (6') to obtain a product.

The obtained product is as shown in Fig. 2 and Fig. 3, in which two Au plating stripes are placed on the Ni underplating with a plating width of 111 IIIl, and two Au plating stripes are placed on the Ni underplating with a plating width of 21 at the same time. One piece is partially plated for a total of three pieces. The thickness of this base Ni plating is 0
．． 5-1 Au plating thickness is 1.0μ.

Table 1 shows the evaluation of products plated by the conventional method for comparison with the products according to the present invention.

As is clear from Table 1, although the method according to the present invention is inferior to the method using a masking belt in terms of running cost, it is superior to the conventional method in terms of dimensional accuracy, plating current density, productivity, and overall evaluation.

Example 2 One side of a phosphor bronze strip having a thickness of 0.0811 m+ and a width of 100 mm was plated with resist ink using the apparatus shown in FIG. 1 to plate a 1.5 mm wide striped portion of Au as a spot in 5IIIll. The obtained product is shown in Figure 4, and the base Ni plating thickness is 1.0tna, A
The U plating thickness was 0.5-, and a single-sided partially plated metal strip with good positional and dimensional accuracy and no plating bleeding was obtained.

[Effects] As explained above, according to the present invention, it is possible to continuously and efficiently perform selective plating on one side of a metal strip with high accuracy, and it has an industrially significant effect.

[Brief explanation of the drawing]

FIG. 1 is a side view of a plating device used in the method of the present invention;
2 and 4 are plan views of a single-sided partially plated metal strip obtained by the present invention, and FIG. 3 is a cross-sectional view of the single-sided partially plated metal strip obtained by the present invention. 1... Metal strip, 2... Masking tape pasting machine,
3.3'...Pretreatment process, 4.4'...Rotary cylindrical plating device, 5...Masking tape peeling machine, 6
... Post-processing step, 7... Stripe plating layer,
8... Spot plating layer, 9... Base plating layer.

Claims (1)

[Claims] After masking the non-plated part on one side of the running horizontal metal strip using masking tape or resist ink, place the non-plated surface of the metal strip in contact with a rotatable cylinder, and apply the plating solution from below. A method for partially plating one side of a metal strip, characterized by plating by spraying.