JP7650590B2 - 研磨装置 - Google Patents
研磨装置 Download PDFInfo
- Publication number
- JP7650590B2 JP7650590B2 JP2021054661A JP2021054661A JP7650590B2 JP 7650590 B2 JP7650590 B2 JP 7650590B2 JP 2021054661 A JP2021054661 A JP 2021054661A JP 2021054661 A JP2021054661 A JP 2021054661A JP 7650590 B2 JP7650590 B2 JP 7650590B2
- Authority
- JP
- Japan
- Prior art keywords
- cleaning
- holding surface
- polishing
- wafer
- slurry
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
- B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
- B24B37/107—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
- B24B41/061—Work supports, e.g. adjustable steadies axially supporting turning workpieces, e.g. magnetically, pneumatically
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/06—Dust extraction equipment on grinding or polishing machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Description
4:チャックテーブル、4a:保持面
6:枠体、6a:上面、8:多孔質板、8a:上面
10:回転機構、10a:回転台、10b:固定台、10c:従動ギア
10d:モーター、10e:主動ギア、10f:回転軸
11:ウェーハ、11a:表面、11b:裏面、13:保護テープ
12:研磨ユニット、14:スピンドルハウジング
16:スピンドル、16a:流路、18:マウント、18a:貫通孔
20:研磨パッド、20a:貫通孔、22:スラリー供給ユニット、22a:スラリー
24:保持部材、26:Z軸移動板、28:ガイドレール、30:ボールねじ
32:パルスモーター、34:Z軸移動ユニット
40:洗浄ユニット、42:位置付けユニット
44:ガイドレール、46:Z軸移動板、48:ボールねじ、50:パルスモーター
52:洗浄砥石ホルダー、54:洗浄砥石、54a:下面
56:ブラケット、58:ボルト、60:上板、60a:貫通孔、60b:下面
62:軸部、62a:頭部、62b: 支持部、62c:上面
64:圧縮コイルばね、66:下板、68a:第1の板部、68b:第2の板部
70:ボルト、72:ノズル
Claims (6)
- ウェーハを吸引保持可能な保持面を有するチャックテーブルと、
該チャックテーブルを所定の回転軸の周りに回転させる回転機構と、
スピンドルを有し、該保持面で吸引保持される該ウェーハを研磨するための研磨パッドが該スピンドルの下端部に装着される研磨ユニットと、
該保持面で吸引保持された該ウェーハ及び該研磨パッドの少なくとも一方にスラリーを供給するスラリー供給ユニットと、
該保持面を洗浄する洗浄ユニットと、
を備え、
該洗浄ユニットは、
該保持面に接触して、該保持面に付着した該スラリーを除去するための洗浄砥石と、
該洗浄砥石が該保持面に接触する洗浄位置と、該洗浄砥石が該保持面から離れた退避位置とに、該洗浄砥石を位置付ける位置付けユニットと、を有し、
該洗浄砥石の硬度は、該保持面の硬度よりも低く、
該スピンドルは、第1軸方向に沿って配置されており、
該洗浄砥石の位置は、該第1軸方向と各々直交する第2軸方向及び第3軸方向で規定される平面内において固定されていることを特徴とする研磨装置。 - 該位置付けユニットは、該洗浄砥石を該保持面へ押圧するための弾性部材を含むことを特徴とする請求項1に記載の研磨装置。
- 該位置付けユニットは、該保持面の洗浄時に、該洗浄砥石を該洗浄位置に位置付けて、該洗浄砥石を該保持面の外周部の一部に接触させることを特徴とする請求項1又は2に記載の研磨装置。
- 該保持面は、セラミックスで構成されており、
該洗浄砥石の該硬度は、ビッカース硬さで680HV以下であることを特徴とする請求項1から3のいずれかに記載の研磨装置。 - 該洗浄砥石は、砥粒と、該砥粒を固定する結合材と、を有するPVA砥石であることを特徴とする請求項1から4のいずれかに記載の研磨装置。
- 該洗浄砥石は、酸化セリウム製の該砥粒を含むことを特徴とする請求項5に記載の研磨装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021054661A JP7650590B2 (ja) | 2021-03-29 | 2021-03-29 | 研磨装置 |
KR1020220026858A KR20220135164A (ko) | 2021-03-29 | 2022-03-02 | 연마 장치 |
US17/655,811 US11858088B2 (en) | 2021-03-29 | 2022-03-22 | Polishing apparatus |
CN202210287807.2A CN115139218A (zh) | 2021-03-29 | 2022-03-23 | 研磨装置 |
TW111111193A TW202237335A (zh) | 2021-03-29 | 2022-03-24 | 研磨裝置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021054661A JP7650590B2 (ja) | 2021-03-29 | 2021-03-29 | 研磨装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2022152042A JP2022152042A (ja) | 2022-10-12 |
JP7650590B2 true JP7650590B2 (ja) | 2025-03-25 |
Family
ID=83362955
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021054661A Active JP7650590B2 (ja) | 2021-03-29 | 2021-03-29 | 研磨装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US11858088B2 (ja) |
JP (1) | JP7650590B2 (ja) |
KR (1) | KR20220135164A (ja) |
CN (1) | CN115139218A (ja) |
TW (1) | TW202237335A (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN118848714B (zh) * | 2024-09-27 | 2025-02-14 | 浙江丽水中欣晶圆半导体科技有限公司 | 外延片背面平整度处理装置及处理方法 |
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-
2021
- 2021-03-29 JP JP2021054661A patent/JP7650590B2/ja active Active
-
2022
- 2022-03-02 KR KR1020220026858A patent/KR20220135164A/ko active Pending
- 2022-03-22 US US17/655,811 patent/US11858088B2/en active Active
- 2022-03-23 CN CN202210287807.2A patent/CN115139218A/zh active Pending
- 2022-03-24 TW TW111111193A patent/TW202237335A/zh unknown
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001137794A (ja) | 1999-11-18 | 2001-05-22 | Seiko Epson Corp | 洗浄方法及び活性洗浄媒体発生装置 |
WO2004059714A1 (ja) | 2002-12-26 | 2004-07-15 | Nikon Corporation | 研磨装置及び半導体デバイスの製造方法 |
JP2009302401A (ja) | 2008-06-16 | 2009-12-24 | Tokyo Seimitsu Co Ltd | チャックテーブル洗浄方法、チャックテーブル洗浄装置及び半導体ウェーハ平面加工装置 |
US20170040202A1 (en) | 2015-08-03 | 2017-02-09 | Samsung Electronics Co., Ltd. | Chuck table and substrate processing system including the same |
Also Published As
Publication number | Publication date |
---|---|
CN115139218A (zh) | 2022-10-04 |
US11858088B2 (en) | 2024-01-02 |
US20220305612A1 (en) | 2022-09-29 |
TW202237335A (zh) | 2022-10-01 |
JP2022152042A (ja) | 2022-10-12 |
KR20220135164A (ko) | 2022-10-06 |
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