JP7650583B2 - How the chip is manufactured - Google Patents

Description

The present invention relates to a method for manufacturing chips by dividing a workpiece, on the surface side of each of a plurality of regions partitioned by a plurality of intersecting division lines, along the division lines to manufacture chips.

Device chips such as ICs (Integrated Circuits) and LSIs (Large Scale Integration) are essential components in various electronic devices such as mobile phones and personal computers. These chips are manufactured, for example, by dividing a workpiece such as a wafer along the planned division lines, in which devices are formed on the front side of each of a number of regions partitioned by a number of intersecting planned division lines.

A method known as pre-dicing is a method for dividing a workpiece in this way (see, for example, Patent Document 1). In this method, first, a groove is formed on the front side of the workpiece along the intended division line. Then, the back side of the workpiece is ground with a grinding wheel, and the grinding wheel presses against the workpiece while reducing the thickness of the part of the workpiece that overlaps with the groove in the thickness direction of the workpiece, dividing the workpiece along the intended division line.

JP 2003-7653 A

When dividing a workpiece by pre-dicing, the thickness of the portion of the workpiece that overlaps with the groove in the thickness direction of the workpiece is not necessarily strictly the same for all of the division lines included in one workpiece. Furthermore, even for multiple workpieces included in the same lot, the thickness of the portions of the workpiece that need to be removed to divide them is not necessarily strictly the same due to variations in the thickness of the workpieces, etc.

Therefore, in pre-dicing, in order to ensure that the workpiece is divided along the intended dividing lines, the depth of the grooves formed on the surface side of the workpiece is sometimes set to be slightly greater than the finished thickness of the chips. Also, in order to flatten the grinding surface of the chips, the chips may be ground even after the workpiece has been divided along the intended dividing lines.

That is, when chips are manufactured using pre-dicing, the chips may be ground even after the workpiece is divided into individual chips. In this case, there is a risk that the chips will be shaken in the planar direction of the workpiece. As a result, adjacent chips may come into contact with each other and be damaged.

In view of this, the object of the present invention is to prevent chip damage when manufacturing chips using pre-dicing.

According to one aspect of the present invention, there is provided a chip manufacturing method for manufacturing chips by dividing a workpiece, having devices formed on the surface side of each of a plurality of regions partitioned by a plurality of intersecting planned division lines, along the planned division lines, the method comprising: a groove forming step of forming grooves along the planned division lines on the surface side of the workpiece; a protective member adhering step of adhering the protective member to at least a portion of the inner surface of the groove by controlling the pressure so that the protective member is drawn into the groove; and a dividing step of dividing the workpiece along the planned division lines by grinding the back side of the workpiece, the protective member adhering step including a depressurizing step of depressurizing each of the first space and the second space while the workpiece arranged in the first space and the protective member are separated from each other; and a pressurizing step of pressurizing the second space after the depressurizing step, where the surface of the workpiece is in contact with and covered by the protective member .

According to another aspect of the present invention, there is provided a method for manufacturing chips by dividing a workpiece, having devices formed on the surface side of each of a plurality of regions defined by a plurality of intersecting planned division lines, along the planned division lines to manufacture chips, the method comprising: a groove forming step of forming grooves on the surface side of the workpiece along the planned division lines located inside the outer circumferential region of the workpiece; a protective member adhering step of adhering the protective member to at least a part of the inner surface of the groove by controlling the pressure so that the protective member is drawn into the groove; and a dividing step of dividing the workpiece along the planned division lines by grinding the back side of the workpiece, the protective member adhering step including: a depressurizing step of depressurizing each of the first space and the second space while the workpiece arranged in the first space and the protective member are separated from each other; and a pressurizing step of pressurizing the second space after the depressurizing step, where the surface of the workpiece is in contact with and covered by the protective member .

In the present invention, the back side of the workpiece is ground with the protective member in close contact with at least a portion of the inner surface of the groove formed on the front side of the workpiece. In this case, the protective member supports the chips after the back side of the workpiece is ground and the workpiece is divided into individual chips.

Therefore, in the present invention, the protective member is inserted between adjacent chips, suppressing shaking of the chips caused by grinding the chips. Furthermore, even if the chips are shaken, the presence of the protective member between adjacent chips reduces the likelihood of them coming into direct contact. As a result, damage to the chips is suppressed.

FIG. 1 is a perspective view showing a schematic example of a workpiece. FIG. 2 is a flow chart showing an example of a method for manufacturing a chip. FIG. 3 is a perspective view that shows a cutting device and a workpiece for performing an example of a groove forming step. FIG. 4 is a cross-sectional view that illustrates a chamber and a workpiece for performing an example of a protective member adhering step. FIG. 5 is a perspective view that shows a grinding apparatus and a workpiece for performing an example of the dividing step. FIG. 6 is a perspective view that shows a schematic diagram of a cutting device and a workpiece for performing another example of the groove forming step. FIG. 7 is a cross-sectional view that illustrates a chamber and a workpiece for performing another example of the protective member adhering step.

An embodiment of the present invention will be described with reference to the accompanying drawings. FIG. 1 is a perspective view showing a schematic example of a workpiece to be divided to manufacture chips. The workpiece 11 shown in FIG. 1 is, for example, a disk-shaped wafer made of a semiconductor material such as silicon (Si).

The surface 11a of the workpiece 11 is divided into a number of regions by a number of mutually intersecting division lines 13, and a device 15 such as an IC or LSI is formed in each region. There are no limitations on the material, shape, structure, size, etc. of the workpiece 11.

For example, the workpiece 11 may be a substrate made of other semiconductor materials, ceramics, resin, metal, etc. Similarly, there are no restrictions on the type, number, shape, structure, size, arrangement, etc. of the devices 15.

Figure 2 is a flow chart showing an example of a method for manufacturing chips by dividing the workpiece 11 along the planned division lines 13. In this method, first, grooves are formed on the surface side of the workpiece 11 along the planned division lines 13 (groove formation step: S1).

Figure 3 is a perspective view showing a cutting device and a workpiece 11 for performing an example of the groove forming step (S1). Note that the X-axis direction (machining feed direction) and the Y-axis direction (indexing feed direction) shown in Figure 3 are directions perpendicular to each other on a horizontal plane, and the Z-axis direction (cutting feed direction) is a direction (vertical direction) perpendicular to the X-axis direction and the Y-axis direction.

The cutting device 2 shown in FIG. 3 has a chuck table 4 that has a circular holding surface that is roughly parallel to the X-axis and Y-axis directions and can hold the workpiece 11 on this holding surface. A porous plate (not shown) with an exposed top surface is provided on the top of the chuck table 4, and this porous plate is connected to a suction mechanism (not shown).

The suction mechanism, for example, has an ejector or the like, and can generate negative pressure on the upper surface of the porous plate (the holding surface of the chuck table 4). When the suction mechanism operates with the workpiece 11 placed on the holding surface, the workpiece 11 is sucked and held on the chuck table 4.

Furthermore, the chuck table 4 is connected to an X-axis direction movement mechanism (not shown). The X-axis direction movement mechanism has, for example, a ball screw and a motor. When the X-axis direction movement mechanism operates, the chuck table 4 moves along the X-axis direction.

The chuck table 4 is also connected to a rotation mechanism (not shown). The rotation mechanism includes, for example, a spindle and a motor. When the rotation mechanism operates, the chuck table 4 rotates around a straight line passing through the center of the holding surface along the Z-axis direction as the rotation axis.

A cutting unit 6 is provided above the chuck table 4. The cutting unit 6 has a spindle housing 8 that extends along the Y-axis direction. The spindle housing 8 accommodates the base end of the spindle 10 in a rotatable manner.

A rotary drive source (not shown), such as a motor, housed in the spindle housing 8 is connected to the base end of the spindle 10. The tip of the spindle 10 is exposed from the end of the spindle housing 8, and a cutting blade 12 is attached to this tip.

The cutting blade 12 has an annular base 12a made of aluminum or the like, and an annular cutting edge 12b fixed to the outer periphery of the base 12a and having a cutting surface (outer periphery) parallel to the X-axis direction. The cutting edge 12b is formed, for example, by fixing abrasive grains such as diamond with a binder such as resin or metal.

When the rotary drive source connected to the base end of the spindle 10 is operated, the spindle 10 and the cutting blade 12 attached to the tip of the spindle 10 rotate around a straight line passing through the center of the spindle 10 along the Y-axis direction.

A blade cover 14 is provided around the cutting blade 12, surrounding the upper part of the cutting blade 12. The blade cover 14 is fixed to the end of the spindle housing 8, and a pair of nozzles 16 are provided at the lower part of the blade cover 14, which are arranged to sandwich the lower part of the cutting blade 12 in the Y-axis direction.

When cutting the workpiece 11, cutting water is supplied to the cutting blade 12 and the workpiece 11 from a pair of nozzles 16. The cutting water is, for example, water (pure water) or a liquid in which chemicals have been added to water.

Furthermore, the cutting unit 6 is connected to a Y-axis direction moving mechanism (not shown) and a Z-axis direction moving mechanism (not shown). Each of the Y-axis direction moving mechanism and the Z-axis direction moving mechanism has, for example, a ball screw and a motor. When the Y-axis direction moving mechanism and/or the Z-axis direction moving mechanism operates, the cutting unit 6 moves along the Y-axis direction and/or the Z-axis direction.

In addition, an imaging unit (not shown) capable of imaging the holding surface side of the chuck table 4 is provided at a position adjacent to the cutting blade 12 in the X-axis direction. This imaging unit has a light source such as an LED (Light Emitting Diode) that emits visible light or infrared light, an objective lens, and an imaging element such as a CCD (Charge Coupled Device) image sensor or a CMOS (Complementary Metal Oxide Semiconductor) image sensor.

The groove forming step (S1) using the cutting device 2 is performed, for example, in the following order. First, the workpiece 11 is placed on the holding surface of the chuck table 4 with the surface 11a facing up. Next, the suction mechanism is operated so that the workpiece 11 is held by suction on the chuck table 4.

Next, the workpiece 11 and the cutting unit 6 are aligned based on an image of the surface 11a of the workpiece 11 formed by the imaging unit. Specifically, the rotation mechanism rotates the chuck table 4 so that the planned division lines 13 are parallel to the X-axis direction, and the Y-axis movement mechanism moves the cutting unit 6 so that the cutting edge 12b of the cutting blade 12 is positioned directly above one of the multiple planned division lines 13.

Next, the X-axis direction movement mechanism moves the chuck table 4 in the X-axis direction so that the workpiece 11 moves away from the cutting blade 12. Next, the Z-axis direction movement mechanism moves the cutting unit 6 so that the lower end of the cutting blade 12 is positioned higher than the back surface 11b of the workpiece 11 and lower than the front surface 11a.

Then, the rotary drive source rotates the spindle 10 and the cutting blade 12 attached to the tip of the spindle 10. Next, while the cutting blade 12 is rotating, the X-axis direction movement mechanism moves the chuck table 4 so that the workpiece 11 passes from one end of the cutting blade 12 to the other end in the X-axis direction.

As a result, grooves 17 are formed along the planned division lines 13 on the surface 11a side of the workpiece 11. The same process is then performed sequentially on the remaining planned division lines 13, so that grooves 17 are formed along all of the multiple planned division lines 13.

In the chip manufacturing method shown in FIG. 2, after the groove forming step (S1), the pressure is controlled so that the protective member is drawn into the inside of the groove 17, and the protective member is adhered to at least a part of the inner surface of the groove 17 (protective member adhesion step: S2). FIG. 4 is a cross-sectional view that shows a schematic of a chamber and workpiece 11 for performing an example of the protective member adhesion step. Note that in FIG. 4, some of the components are depicted as blocks for convenience.

The chamber 20 shown in FIG. 4 has a separable upper portion 20a and a lower portion 20b, which are joined together to define a cylindrical internal space. In the chamber 20, the internal space is closed with a protective member 19 interposed over the entire boundary between the upper portion 20a and the lower portion 20b.

That is, in the chamber 20, the upper space (second space) A and the lower space (first space) B, which are partitioned by the disk-shaped protective member 19, are each closed. The protective member 19 is configured in the form of a film having one surface 19a and the other surface 19b that are generally parallel to each other, and is made of, for example, resin.

A mounting table 22 for mounting the workpiece 11 is provided in the lower space B. The upper end of a rod 24 extending vertically is fixed to the lower part of the mounting table 22. The rod 24 extends to the outside through an opening (not shown) provided in the lower part 20b of the chamber 20, and a lifting mechanism 26 such as an air cylinder is connected to its lower end.

The upper space A is connected to the suction mechanism 30 via valve 28a, and to the outside space via valve 28b. The suction mechanism 30 has, for example, an ejector. When the suction mechanism 30 operates with valve 28a open and valve 28b closed, the pressure in the upper space A is reduced.

Similarly, the lower space B is connected to the suction mechanism 34 via the valve 32a, and is also connected to the external space via the valve 32b. The suction mechanism 34 has, for example, an ejector. When the suction mechanism 34 operates with the valve 32a open and the valve 32b closed, the pressure in the lower space B is reduced.

The protective member adhesion step (S2) using the chamber 20 is performed, for example, in the following order: First, the workpiece 11 is placed on the mounting table 22 with the surface 11a facing up, with the upper part 20a of the chamber 20 separated from the lower part 20b.

Next, the upper part 20a and the lower part 20b of the chamber 20 are joined together with the protective member 19 interposed between the upper part 20a and the lower part 20b. Next, the valves 28a and 32a are opened, and the valves 28b and 32b are closed.

Next, with the workpiece 11 and the protective member 19 separated from each other, the suction mechanisms 30, 34 are operated to reduce the pressure in the upper space A and the lower space B. Next, the lifting mechanism 26 raises the rod 24 so that the surface 11a of the workpiece 11 comes into contact with the protective member 19. This causes the surface 11a of the workpiece 11 to be covered by the protective member 19.

Next, valve 28a is closed and then valve 28b is opened. This allows upper space A to communicate with the outside space, and pressurizes upper space A. In other words, the pressure on the other side 19b of protective member 19 becomes higher than the pressure on one side 19a of protective member 19.

As a result, a portion of the protective member 19 is drawn into the groove 17, and the protective member 19 adheres closely to at least a portion of the inner surface of the groove 17. The excess portion of the protective member 19 that is not in contact with the surface 11a of the workpiece 11 is removed by an appropriate method.

In the chip manufacturing method shown in FIG. 2, after the protective member adhesion step (S2), the back surface 11b side of the workpiece 11 is ground to divide the workpiece 11 along the intended division line 13 (division step: S3). FIG. 5 is a perspective view showing a grinding device and the workpiece 11 for performing an example of the grinding step (S3).

The grinding device 40 shown in FIG. 5 has a holding surface shaped like the side of a cone whose center protrudes slightly beyond the outer periphery, and has a chuck table 42 that can hold the workpiece 11 on this holding surface. A porous plate (not shown) with an exposed top surface is provided on the top of the chuck table 42, and this porous plate is connected to a suction mechanism (not shown).

The suction mechanism has, for example, an ejector, and can generate negative pressure on the upper surface of the porous plate (the holding surface of the chuck table 42). When the suction mechanism operates with the workpiece 11 placed on the holding surface, the workpiece 11 is sucked and held on the chuck table 42.

Furthermore, the chuck table 42 is connected to a horizontal movement mechanism (not shown). The horizontal movement mechanism has, for example, a ball screw and a motor. When the horizontal movement mechanism operates, the chuck table 42 moves in the horizontal direction.

The chuck table 42 is also connected to a rotation mechanism (not shown). The rotation mechanism includes, for example, a spindle and a motor. When the rotation mechanism operates, the chuck table 42 rotates in the direction of arrow a shown in FIG. 5 around a rotation axis that passes through the center of the holding surface and is a straight line along the vertical direction or a straight line that is slightly inclined relative to the vertical direction.

A grinding unit 44 is provided above the chuck table 42. The grinding unit 44 has a spindle 46 whose upper end is connected to a rotational drive source such as a motor. A disk-shaped wheel mount 48 is fixed to the lower end of the spindle 46.

The wheel mount 48 has a number of openings (not shown) that penetrate the wheel mount 48 in the up-down direction. The openings are arranged at roughly equal intervals along the circumferential direction of the wheel mount 48. A bolt 50 is inserted into each of the openings.

A grinding wheel 52 is attached to the bottom of the wheel mount 48. Specifically, the grinding wheel 52 has an annular base 54. The top of the base 54 is provided with multiple female threads (not shown), and the lower ends of the bolts 50 are screwed into each female thread, thereby attaching the grinding wheel 52 to the bottom of the wheel mount 48.

Furthermore, a plurality of grinding wheels 56 are fixed to the lower end of the base 54 and are arranged at approximately equal intervals along the circumferential direction of the base 54. The lower surfaces of the grinding wheels 56 are arranged at approximately the same height, and these lower surfaces become the grinding surfaces of the grinding unit 44.

Furthermore, the spindle 46 is connected to a vertical movement mechanism (not shown). The vertical movement mechanism has, for example, a ball screw and a motor. When the vertical movement mechanism operates, the spindle 46, the wheel mount 48, and the grinding wheel 52 move in the vertical direction.

The spindle 46 is also connected to a rotary drive source (not shown) such as a motor. When the rotary drive source operates, the spindle 46 rotates in the direction of arrow b shown in FIG. 5, with a vertical line passing through the center of the spindle 46 as its rotation axis.

The grinding step (S3) using the grinding device 40 is performed, for example, in the following order. First, with the chuck table 42 and the grinding unit 44 separated in both the horizontal and vertical directions, the workpiece 11 is placed on the holding surface of the chuck table 42 with the back surface 11b of the workpiece 11 facing upward. That is, the workpiece 11 is placed on the holding surface of the chuck table 42 via the protective member 19 that is in close contact with the front surface 11a of the workpiece 11.

Next, the suction mechanism operates so that the workpiece 11 is sucked and held on the chuck table 42. Next, the horizontal movement mechanism moves the chuck table 42 so that the rotation axis of the chuck table 42 overlaps with the annular area in which the multiple grinding wheels 56 are arranged.

Then, the rotation mechanism rotates the chuck table 42, and the motor connected to the upper end of the spindle 46 rotates the spindle 46, the wheel mount 48, and the grinding wheel 52.

Next, the vertical movement mechanism lowers the spindle 46, the wheel mount 48, and the grinding wheel 52 so that the back surface 11b of the workpiece 11 comes into contact with the undersides of the multiple grinding wheels 56. This causes the back surface 11b of the workpiece 11 to be ground.

As a result, the workpiece 11 is pressed against the grinding wheel 56 while the thickness of the workpiece 11 at the portion overlapping the groove 17 in the thickness direction is reduced. As a result, the workpiece 11 is divided along the intended division line 13. This grinding continues even after the workpiece 11 is divided, for the purpose of flattening the grinding surface of the chip, etc.

In the chip manufacturing method shown in FIG. 2, the back surface 11b side of the workpiece 11 is ground (grinding step (S3)) while the protective member 19 is in close contact with at least a portion of the inner surface of the groove 17 formed on the front surface 11a side of the workpiece 11. In this case, the protective member 19 supports the chips after the back surface 11b side of the workpiece 11 is ground to separate the workpiece 11 into individual chips.

Therefore, in the chip manufacturing method shown in FIG. 2, the protective member 19 is inserted between adjacent chips, suppressing shaking of the chips caused by grinding the chips. Even if the chips are shaken, the presence of the protective member 19 between adjacent chips reduces the likelihood of them coming into direct contact. As a result, damage to the chips is suppressed.

The above-mentioned method is merely one aspect of the present invention, and the present invention is not limited to the above-mentioned method. For example, the protective member adhesion step in the present invention may be performed by any method that can adhere the protective member 19 to at least a portion of the groove formed on the surface 11a side of the workpiece 11. An example of such a method will be described below with reference to Figures 6 and 7.

FIG. 6 is a schematic perspective view of a cutting device 2 and a workpiece 11 for performing an example of the groove forming step (S1) in this method, and FIG. 7 is a schematic cross-sectional view of a chamber and a workpiece 11 for performing an example of the protective member adhering step (S2) in this method.

The cutting device 2 shown in FIG. 6 has the same structure as the cutting device 2 shown in FIG. 3. Therefore, a description of the structure of the cutting device 2 will be omitted here. For convenience, some of the components are depicted as blocks in FIG. 7.

In the groove forming step (S1) using the cutting device 2 shown in FIG. 6, a groove is formed on the surface 11a side of the workpiece 11 along the planned division line 13, the groove being located inside the outer peripheral region 11c of the workpiece 11. In other words, in this groove forming step (S1), no groove is formed in the outer peripheral region 11c of the workpiece 11.

Specifically, first, the workpiece 11 is placed on the holding surface of the chuck table 4 with the surface 11a facing up. Next, the suction mechanism is operated so that the workpiece 11 is held by suction on the chuck table 4.

Next, the workpiece 11 and the cutting unit 6 are aligned based on an image of the surface 11a of the workpiece 11 formed by the imaging unit. Specifically, the rotation mechanism rotates the chuck table 4 so that the planned division lines 13 are parallel to the X-axis direction, and the Y-axis movement mechanism moves the cutting unit 6 so that the cutting edge 12b of the cutting blade 12 is positioned directly above one of the multiple planned division lines 13.

Next, the X-axis direction movement mechanism moves the chuck table 4 so that the lower end of the cutting blade 12 is positioned directly above a position slightly inside the inner circumference of the outer circumferential region 11c of the workpiece 11. Next, the rotation drive source rotates the spindle 10 and the cutting blade 12 attached to the tip of the spindle 10.

Then, the Z-axis direction movement mechanism moves the cutting unit 6 so that the lower end of the cutting blade 12 is positioned higher than the back surface 11b of the workpiece 11 and lower than the front surface 11a. Next, the X-axis direction movement mechanism moves the chuck table 4 so that the cutting blade 12 cuts the area inside the outer peripheral area 11c of the workpiece 11. This movement, i.e., cutting of the front surface 11a side of the workpiece 11, continues until the lower end of the cutting blade 12 reaches a position slightly inside the inner circumference of the outer peripheral area 11c of the workpiece 11.

As a result, grooves 21 are formed on the surface 11a side of the workpiece 11 along the planned division lines 13 and located inside the outer peripheral region 11c of the workpiece 11. Furthermore, by sequentially performing the same process on the remaining planned division lines 13, grooves 21 are formed on all of the multiple planned division lines 13.

Then, the protective member adhesion step (S2) is performed on the workpiece 11 with the grooves 21 formed in this way. The chamber 60 shown in FIG. 4 has a separable upper portion 60a and a lower portion 60b, and the upper portion 60a and the lower portion 60b are joined to define a cylindrical internal space C.

A mounting table 62 for mounting the workpiece 11 and the like is provided in the internal space C. The upper end of a rod 64 extending vertically is fixed to the lower part of the mounting table 62. The rod 64 extends to the outside through an opening (not shown) provided in the lower part 60b of the chamber 60, and a lifting mechanism 66 such as an air cylinder is connected to its lower end.

The internal space C is connected to the suction mechanism 70 via the valve 68a, and to the external space via the valve 68b. The suction mechanism 70 has, for example, an ejector. When the suction mechanism 70 operates with the valve 68a open and the valve 68b closed, the internal space C is depressurized.

Furthermore, a chuck table 72 having a circular holding surface capable of holding the protective member 19 is provided in the internal space C. The lower end of a rod 74 extending vertically is fixed to the upper portion of the chuck table 72. The rod 74 extends to the outside through an opening (not shown) provided in the upper portion 60a of the chamber 60.

A porous plate with an exposed underside is provided below the chuck table 72, and this porous plate is connected to the suction mechanism 76 via a flow path provided in the rod 74. The suction mechanism has, for example, an ejector, and can generate negative pressure on the underside of the porous plate (the holding surface of the chuck table 72). When the suction mechanism operates with the holding surface in contact with the protective member 19, the protective member 19 is held by suction to the chuck table 72.

The protective member adhesion step (S2) using the chamber 60 is performed, for example, in the following order. First, the protective member 19 is placed on the mounting table 62 with the upper portion 60a of the chamber 60 separated from the lower portion 60b. Next, the lifting mechanism 66 raises the rod 64 so that the protective member 19 contacts the holding surface of the chuck table 72.

The suction mechanism 76 then operates so that the protective member 19 is held by suction on the chuck table 72. The lifting mechanism 66 then lowers the rod 64 so that the protective member 19 and the mounting table 62 are separated. Next, with the upper part 60a of the chamber 60 separated from the lower part 60b, the workpiece 11 is placed on the mounting table 62 with the surface 11a facing up.

Next, the upper part 20a and the lower part 20b of the chamber 60 are connected. Next, the valve 68a is opened and the valve 68b is closed. Next, with the workpiece 11 and the protective member 19 separated from each other, the suction mechanism 70 is operated to reduce the pressure in the internal space C.

In addition, even if the internal space C is depressurized, the suction mechanism 76 operates to generate a pressure on the holding surface of the chuck table 72 that is lower than the internal pressure of the depressurized internal space C so that the protective member 19 continues to be sucked and held by the chuck table 72. Next, the lifting mechanism 66 raises the rod 64 so that the surface 11a of the workpiece 11 comes into contact with the protective member 19.

Then, the operation of the suction mechanism 76 is stopped so that the protective member 19 and the chuck table 72 are separated. Next, the lifting mechanism 66 lowers the rod 64 so that the protective member 19 and the chuck table 72 are separated. As a result, the surface 11a of the workpiece 11 is covered by the protective member 19, and the groove 21 formed on the surface 11a side of the workpiece 11 is sealed.

Next, valve 68a is closed and valve 68b is opened. This allows internal space C to communicate with the external space, and internal space C is pressurized. In other words, the pressure outside groove 21 becomes higher than the pressure inside.

As a result, a portion of the protective member 19 is drawn into the groove 21, and the protective member 19 adheres to at least a portion of the inner surface of the groove 21. Then, as described above, the dividing step (S3) is performed to divide the workpiece 11 along the planned dividing lines 13 to produce individual chips.

In addition, in order to divide the workpiece 11 in the dividing step (S3), it is preferable that the width of the outer peripheral region 11c along the radial direction of the workpiece 11 is short. For example, the width of the outer peripheral region 11c is preferably 1 mm or less, more preferably 800 μm or less, and most preferably 600 μm or less.

In addition, the structures and methods of the above-described embodiments and variations can be modified as appropriate without departing from the scope of the present invention.

11: Workpiece (11a: front surface, 11b: back surface, 11c: outer peripheral area)
13: Planned division line 15: Device 17: Groove 19: Protective member 21: Groove 2: Grinding device 4: Chuck table 6: Cutting unit 8: Spindle housing 10: Spindle 12: Cutting blade (12a: Base, 12b: Cutting blade)
14: Blade cover 16: Nozzle 20: Chamber (20a: upper part, 20b: lower part)
22: Placement table 24: Rod 26: Lifting mechanism 28a, 28b, 32a, 32b: Valves 30, 34: Suction mechanism 40: Grinding device 42: Chuck table 44: Grinding unit 46: Spindle 48: Wheel mount 50: Bolt 52: Grinding wheel 54: Base 56: Grinding stone 60: Chamber (60a: upper part, 60b: lower part)
62: Placement table 64: Rod 66: Lifting mechanism 68a, 68b: Valve 70: Suction mechanism 72: Chuck table 74: Rod 76: Suction mechanism

Claims (2)

A method for manufacturing chips by dividing a workpiece, in which a device is formed on a front surface side of each of a plurality of regions partitioned by a plurality of intersecting division lines, along the division lines to manufacture chips, comprising:
a groove forming step of forming a groove along the intended division line on the front surface side of the workpiece;
a protective member contact step of contacting the protective member with at least a part of the inner surface of the groove by controlling pressure so that the protective member is drawn into the groove;
A dividing step of dividing the workpiece along the dividing lines by grinding a back surface side of the workpiece,
The protective member adhesion step includes:
a depressurizing step of depressurizing each of the first space and the second space, the first space and the second space being partitioned by the protective member and the workpiece disposed in the first space being separated from the protective member;
a pressurizing step of pressurizing the second space after the depressurizing step and bringing the surface of the workpiece into contact with and covered by the protective member;
A method for producing a chip , comprising: A method for manufacturing chips by dividing a workpiece, in which a device is formed on a front surface side of each of a plurality of regions partitioned by a plurality of intersecting division lines, along the division lines to manufacture chips, comprising:
a groove forming step of forming a groove on a front surface side of the workpiece, the groove being located inside an outer circumferential region of the workpiece and extending along the intended division line;
a protective member contact step of contacting the protective member with at least a part of the inner surface of the groove by controlling pressure so that the protective member is drawn into the groove;
A dividing step of dividing the workpiece along the dividing lines by grinding a back surface side of the workpiece,
The protective member adhesion step includes:
a depressurizing step of depressurizing each of the first space and the second space, the first space and the second space being partitioned by the protective member and the workpiece disposed in the first space being separated from the protective member;
a pressurizing step of pressurizing the second space after the depressurizing step and bringing the surface of the workpiece into contact with and covered by the protective member;
A method for producing a chip , comprising:

Images