JP7588531B2 - Resonator packages, piezoelectric resonators and oscillators - Google Patents

Description

The present invention relates to a vibrator package, a piezoelectric vibrator, and an oscillator.

For example, Patent Document 1 discloses a container for a piezoelectric vibration device used in a piezoelectric vibration device that includes a quartz crystal vibrating piece. The container for a piezoelectric vibration device disclosed in Patent Document 1 has internal wiring for electrically connecting the piezoelectric vibrator to the outside, and an external connection terminal is provided on the exposed surface. The external connection terminal is connected to the internal wiring, and the quartz crystal vibrating piece can be electrically connected to the outside via the external connection terminal.

JP 2020-188340 A

Incidentally, an integrated circuit chip may be directly mounted on a resonator package, such as the container for a piezoelectric resonator device disclosed in Patent Document 1, to form an oscillator as a unit. In such cases, it is necessary to provide wiring for connecting the piezoelectric resonator piece and the integrated circuit chip, and wiring for connecting the integrated circuit chip and an external connection terminal, on the resonator package.

The above-mentioned external connection terminals include an external power supply connection terminal to which an external power supply is connected, and a signal output terminal to which a signal from the integrated circuit chip is output. When viewed from the normal direction of the surface on which the integrated circuit chip is mounted, if the wiring connecting the external power supply connection terminal and the integrated circuit chip and the wiring connecting the piezoelectric vibrating piece and the integrated circuit chip intersect, noise components may be carried on the signal flowing through the wiring connecting the piezoelectric vibrating piece and the integrated circuit chip, affecting the frequency indicated by the signal output terminal. Similarly, if the wiring connecting the signal output terminal and the integrated circuit chip and the wiring connecting the piezoelectric vibrating piece and the integrated circuit chip intersect, this may affect the frequency indicated by the signal output terminal.

The present invention was made in consideration of the above-mentioned problems, and aims to provide a resonator package, a piezoelectric resonator, and an oscillator that can more accurately indicate the frequency of the signal output from the signal output terminal.

The present invention adopts the following configuration as a means for solving the above problems.

A first aspect of the present invention is a package for a vibrator, the package for a vibrator comprising a package body having a chip mounting side on which an integrated circuit chip is mounted, and a vibrating piece mounting side arranged on the opposite side to the chip mounting side on which a piezoelectric vibrating piece is mounted, the package body comprising: a plurality of chip electrodes provided on the chip mounting side and to which terminals of the integrated circuit chip are connected; an external power supply terminal provided on the chip mounting side and connected to an external power supply; a signal output terminal provided on the chip mounting side and for outputting a signal to the outside; a signal output wire provided on the chip mounting side and connecting the chip electrode and the signal output terminal, a vibrator piece mounting pad provided on the vibrator piece mounting side and to which the piezoelectric vibrator piece is connected, and a piezoelectric vibrator piece wiring that is arranged across an area in which the piezoelectric vibrator piece is arranged without overlapping with the external power supply wiring and the signal output wiring when viewed from a normal direction of the chip mounting side, and that connects the vibrator piece mounting pad and the chip electrode . Further, a configuration is adopted in which at least a portion of the piezoelectric vibrator piece wiring is provided on the vibrator piece mounting side, and an insulating coat is provided to cover a portion of the piezoelectric vibrator piece wiring provided on the vibrator piece mounting side .

According to the present invention, the wiring for the piezoelectric vibrating piece is arranged so as to straddle the area where the piezoelectric vibrating piece is arranged when viewed from the normal direction of the chip mounting side, and further does not overlap with the wiring for the external power supply and the wiring for the signal output when viewed from the same direction. Therefore, it is possible to suppress the superposition of noise components on the signal flowing through the wiring for the piezoelectric vibrating piece and the wiring for the signal output, and to make the frequency indicated by the signal output from the terminal for the signal output more accurate. Furthermore, the part of the wiring for the piezoelectric vibrating piece provided on the side where the vibrating piece is mounted is covered with an insulating coat. Therefore, it is possible to prevent foreign matter from coming into contact with the part of the wiring for the piezoelectric vibrating piece provided on the side where the vibrating piece is mounted. For example, when a part of the piezoelectric vibrating piece is cut to adjust the frequency of the piezoelectric vibrating piece during manufacturing, metal cutting dust is generated. It is possible to prevent such cutting dust from coming into contact with the part of the wiring for the piezoelectric vibrating piece provided on the side where the vibrating piece is mounted.

A second aspect of the present invention is the same as the first aspect, in that the wiring for the piezoelectric vibrating piece is arranged without overlapping with the tip of the vibrating arm of the piezoelectric vibrating piece when viewed from the normal direction of the chip mounting side.

During manufacturing, the tips of the vibrating arms of the piezoelectric vibrating piece are cut to adjust the frequency of the piezoelectric vibrating piece. According to the present invention, the wiring for the piezoelectric vibrating piece is arranged to avoid the tips of the vibrating arms, so it is possible to prevent cutting dust generated by cutting the tips from adhering to the wiring for the piezoelectric vibrating piece.

An aspect of the present invention adopts a configuration in which, in the first aspect, the package body is made of a multilayer body formed by stacking a plurality of layers, and the wiring for the piezoelectric vibrating piece is arranged at the interface between the two layers.

According to the present invention, the piezoelectric resonator wiring is disposed at the interface between the two layers that are laminated. This makes it possible to prevent cutting dust generated when cutting a portion of the piezoelectric resonator to adjust the frequency of the piezoelectric resonator during manufacturing from coming into contact with the piezoelectric resonator wiring.

A third aspect of the present invention adopts a configuration in which, in either the first or second aspect, the package body is formed in a rectangular shape having a pair of long sides and a pair of short sides when viewed from the normal direction of the chip mounting side, the external power supply terminal and the signal output terminal are arranged on one of the long sides in a direction along the short sides, and the chip electrode to which the piezoelectric vibrating piece wiring is connected is arranged on the other long side in a direction along the short sides.

According to the present invention, compared to when the chip electrode to which the piezoelectric vibrating piece wiring is connected is arranged on one of the long sides, the chip electrode to which the piezoelectric vibrating piece wiring is connected can be arranged away from the external power supply terminal and the signal output terminal. This prevents the signal flowing through the chip electrode to which the piezoelectric vibrating piece wiring is connected from being affected by the voltage applied to the external power supply terminal, and also prevents interference with the output signal flowing through the signal output terminal.

A fourth aspect of the present invention is a piezoelectric vibrator comprising a vibrator package of any one of the first to third aspects described above, and a piezoelectric vibrating piece mounted on the vibrating piece mounting side of the vibrator package.

According to the present invention, by using the resonator package of the present invention, it is possible to make the frequency indicated by the signal output from the signal output terminal more accurate.

A fifth aspect of the present invention provides an oscillator comprising the piezoelectric vibrator of the fourth aspect and an integrated circuit chip mounted on the chip mounting side of the vibrator package.

The present invention makes it possible to more accurately determine the frequency of the signal output from the signal output terminal.

The present invention makes it possible to provide a resonator package, a piezoelectric resonator, and an oscillator that can more accurately adjust the frequency of the signal output from the signal output terminal.

1 is an external perspective view of an oscillator according to a first embodiment of the present invention; FIG. 2 is a plan view showing a state in which a sealing plate of the oscillator according to the first embodiment of the present invention is removed. 3 is a cross-sectional view corresponding to line II in FIG. 2. FIG. 2 is an exploded perspective view of the oscillator according to the first embodiment of the present invention. 3 is a bottom view of a package body and a conductive portion according to the first embodiment of the present invention. FIG. FIG. 2 is a top view of a package body and a conductive portion according to the first embodiment of the present invention. 1 is a plan view of a piezoelectric vibrating reed according to a first embodiment of the present invention; FIG. 11 is a top view of a package body and a conductive portion according to a second embodiment of the present invention. FIG. 13 is a top view of a package body and a conductive portion according to a third embodiment of the present invention. FIG. 13 is a top view of a package body and a conductive portion in a fourth embodiment of the present invention. FIG. 13 is a top view of a package body and a conductive portion in a fifth embodiment of the present invention. FIG. 23 is a top view of a package body and a conductive portion in a sixth embodiment of the present invention.

Below, an embodiment of a vibrator package, a piezoelectric vibrator, and an oscillator according to the present invention will be described with reference to the drawings.

Figure 1 is an external perspective view of the oscillator according to this embodiment. Figure 2 is a plan view of the oscillator with the sealing plate removed. Figure 3 is a cross-sectional view corresponding to line I-I in Figure 2. Figure 4 is an exploded perspective view of the oscillator according to this embodiment. As shown in Figures 1 to 4, the oscillator 100 includes a piezoelectric vibrator 10 and an integrated circuit chip 20.

The piezoelectric vibrator 10 is a so-called ceramic package type surface mount vibrator. The piezoelectric vibrator 10 includes a package 2 (vibrator package) having an airtightly sealed cavity C inside, and a piezoelectric vibrating piece 3 housed in the cavity C. The piezoelectric vibrator 10 has a rectangular parallelepiped shape. In this embodiment, the longitudinal direction of the piezoelectric vibrator 10 in a plan view is called the longitudinal direction L, the transverse direction is called the width direction W, and the direction perpendicular to the longitudinal direction L and the width direction W is called the thickness direction T.

The package 2 comprises a package body 4, a sealing plate 5 that is joined to the package body 4 and forms a cavity C between the package body 4 and a conductive part 6 through which a current flows. The package body 4 comprises a first base substrate 2a (layer), a second base substrate 2b (layer), and a third base substrate 2c (layer) that are joined together in a superimposed state, and a seal ring 2d that is joined onto the third base substrate 2c.

The first base substrate 2a is a ceramic substrate having the same shape as the second base substrate 2b in plan view, and is joined to the second base substrate 2b by sintering or the like while being in contact with the bottom of the second base substrate 2b. As shown in Figs. 2 to 4, the first base substrate 2a has a first through portion 2e penetrating the first base substrate 2a in the thickness direction T. The first through portion 2e has a rounded rectangular shape in plan view. The first through portion 2e accommodates an integrated circuit chip 20. In other words, the first through portion 2e surrounds the integrated circuit chip 20 in a plane including the longitudinal direction L and the width direction W. The surface of the first base substrate 2a opposite the second base substrate 2b in the thickness direction T (hereinafter referred to as the lower surface 2a1) is a surface on which external connection terminals (external power supply terminal 30, signal output terminal 31, ground connection terminal 32, and switch terminal 33) described later, which are part of the conductive portion 6, are formed.

The second base substrate 2b is a ceramic substrate having a rectangular shape in a plan view from the thickness direction T. The upper surface 2b1 of the second base substrate 2b constitutes the bottom of the cavity C. The lower surface 2b2 of the second base substrate 2b is a surface on which chip electrodes (external power supply electrode 40, signal output electrode 41, first vibrating bar electrode 42, second vibrating bar electrode 43, ground connection electrode 44, and switch electrode 45) described later, which are part of the conductive portion 6, are formed. These chip electrodes are the portions to which the terminals of the integrated circuit chip 20 are joined. In other words, the lower surface 2b2 of the second base substrate 2b on which such chip electrodes are provided is the mounting surface of the integrated circuit chip 20.

The third base substrate 2c is a ceramic substrate having the same shape as the second base substrate 2b in plan view, and is bonded integrally by sintering or the like while being stacked on the second base substrate 2b. As shown in Figs. 3 and 4, the third base substrate 2c has a second through-hole 2f penetrating the third base substrate 2c in the thickness direction T. The second through-hole 2f has a rounded rectangular shape in plan view. On the inner surface of the second through-hole 2f, mounting parts (mounting parts 2g and 2h) that protrude toward the inside in the width direction W are formed separately on both sides of the width direction W. The mounting parts 2g and 2h are located in the center of the third base substrate 2c in the longitudinal direction L.

A first electrode pad 51 and a second electrode pad 52, which are part of the conductive portion 6 and will be described later, are formed on the mounting portion 2g and the mounting portion 2h. The first electrode pad 51 is formed on the mounting portion 2g, and the second electrode pad 52 is formed on the mounting portion 2h. These first electrode pad 51 and second electrode pad 52 are the portions to which the piezoelectric vibrating piece 3 is bonded. In other words, the upper surfaces of the mounting portion 2g and the mounting portion 2h on which the first electrode pad 51 and the second electrode pad 52 are provided (i.e., the upper surface 2c1 of the third base substrate 2c) are the mounting surfaces of the piezoelectric vibrating piece 3.

The ceramic material used for the first base substrate 2a, the second base substrate 2b, and the third base substrate 2c can be, for example, alumina-made HTCC (High Temperature Co-Fired Ceramic) or glass-ceramic-made LTCC (Low Temperature Co-Fired Ceramic).

At the four corners of the first base substrate 2a, the second base substrate 2b, and the third base substrate 2c, a cutout portion 2i having a 1/4 circular arc shape in a plan view is formed over the entire thickness direction T of the first base substrate 2a, the second base substrate 2b, and the third base substrate 2c. The first base substrate 2a, the second base substrate 2b, and the third base substrate 2c are fabricated, for example, by stacking and bonding three wafer-shaped ceramic substrates, forming a matrix of through holes penetrating both ceramic substrates, and cutting both ceramic substrates into a lattice shape using each through hole as a reference. At this time, the through holes are divided into four to form the above-mentioned cutout portion 2i.

In this embodiment, as shown in FIG. 3, the integrated circuit chip 20 is arranged on the first base substrate 2a side of the second base substrate 2b, and the piezoelectric vibrating piece 3 is arranged on the third base substrate 2c side of the second base substrate 2b. That is, in this embodiment, the lower surface 2a1 of the first base substrate 2a and the lower surface 2b2 of the second base substrate 2b form the integrated circuit chip mounting side of the package body 4. In addition, the upper surface 2b1 of the second base substrate 2b and the upper surface 2c1 of the third base substrate 2c form the vibrating piece mounting side. Note that the "upper and lower" attached to the names of the lower surface 2a1, the upper surface 2b1, the lower surface 2b2, and the upper surface 2c1 indicate directions for convenience of explanation and do not limit the actual installation posture of the oscillator 100 in the vertical direction.

The seal ring 2d is a conductive frame-shaped member that is slightly smaller than the outer shape of the first base substrate 2a, the second base substrate 2b, and the third base substrate 2c, and is joined to the upper surface of the third base substrate 2c. Specifically, the seal ring 2d is joined to the third base substrate 2c by baking with a brazing material such as silver brazing or a solder material, or by welding to a metal bonding layer formed on the third base substrate 2c. The seal ring 2d constitutes the side wall of the cavity C together with the inner surface of the third base substrate 2c (the second through portion 2f). In the illustrated example, the inner surface of the seal ring 2d is disposed flush with the inner surface of the third base substrate 2c.

The material of the seal ring 2d may be, for example, a nickel-based alloy, and may be selected from Kovar, Elinvar, Invar, 42-alloy, etc. In particular, it is preferable to select a material for the seal ring 2d that has a thermal expansion coefficient close to that of the second base substrate 2b and the third base substrate 2c, which are made of ceramics. For example, if alumina with a thermal expansion coefficient of 6.8×10-6/°C is used for the second base substrate 2b and the third base substrate 2c, it is preferable to use Kovar with a thermal expansion coefficient of 5.2×10-6/°C or 42-alloy with a thermal expansion coefficient of 4.5 to 6.5×10-6/°C for the seal ring 2d.

The sealing plate 5 is made of a conductive substrate and is joined onto the seal ring 2d to hermetically seal the inside of the package body 4. The space defined by the seal ring 2d, the sealing plate 5, the second base substrate 2b, and the third base substrate 2c constitutes a hermetically sealed cavity C.

The conductive portion 6 is a portion of the package 2 that serves as a conductive path for power supply and signals. The conductive portion 6 is composed of a single layer film of a single metal formed by, for example, vapor deposition or sputtering, or a laminate film in which different metals are layered.

5 is a bottom view of the package body 4 and the conductive part 6. FIG. 6 is a top view of the package body 4 and the conductive part 6. Note that the seal ring 2d is omitted in FIG. 6. As shown in FIG. 5, in this embodiment, the conductive part 6 has an external power supply terminal 30, a signal output terminal 31, a ground connection terminal 32, and a switch terminal 33 as external connection terminals formed on the lower surface 2a1 of the first base substrate 2a. The conductive part 6 also has an external power supply electrode 40, a signal output electrode 41, a first vibrating bar electrode 42, and a second vibrating bar electrode 43 as chip electrodes formed on the lower surface 2b2 of the second base substrate 2b. The conductive part 6 also has an external power supply wiring 46, a signal output wiring 47, a ground connection wiring 48, and a switch wiring 49 formed on the lower surface 2b2 of the second base substrate 2b. These external power supply terminal 30, signal output terminal 31, ground connection terminal 32, switch terminal 33, external power supply electrode 40, signal output electrode 41, first vibrating bar electrode 42, second vibrating bar electrode 43, ground connection electrode 44, switch electrode 45, external power supply wiring 46, signal output wiring 47, ground connection wiring 48, and switch wiring 49 are formed on the lower surface 2a1 of the first base substrate 2a or the lower surface 2b2 of the second base substrate 2b, that is, on the integrated circuit chip mounting side of the package body 4.

As shown in FIG. 6, the conductive portion 6 has a first electrode pad 51 and a second electrode pad 52 formed on the upper surface 2c1 of the third base substrate 2c. The conductive portion 6 also has a piezoelectric vibrating piece wiring 60 formed on the upper surface 2b1 of the second base substrate 2b. The first electrode pad 51, the second electrode pad 52, and the piezoelectric vibrating piece wiring 60 are formed on the upper surface 2b1 of the second base substrate 2b or the upper surface 2c1 of the third base substrate 2c, i.e., on the vibrating piece mounting side of the package body 4. In addition, the conductive portion 6 has a plurality of vias 70 that connect parts provided at different positions in the thickness direction T in the thickness direction T.

The external connection terminals (external power supply terminal 30, signal output terminal 31, ground connection terminal 32, switch terminal 33) are terminals for connecting the oscillator 100 to the outside, and are provided on the lower surface 2a1 of the first base substrate 2a at the four corners of the first base substrate 2a as shown in FIG. 5. As shown in FIG. 5 and FIG. 6, the package body 4 is formed in a rectangular shape having a pair of long sides (long sides 4a and 4b) and a pair of short sides (short sides 4c and 4d) when viewed from the normal direction (thickness direction T) of the chip mounting side. As shown in FIG. 5, the external power supply terminal 30 and the signal output terminal 31 are arranged on one long side 4a in the direction along the short sides. The ground connection terminal 32 and the switch terminal 33 are arranged on the other long side 4b in the direction along the short sides.

The external power supply terminal 30 is a terminal that connects the oscillator 100 to an external power supply D, and is located at the intersection of the long side 4a and the short side 4c. The signal output terminal 31 is a terminal for outputting a signal (output signal S) from the oscillator 100 to the outside, and is located at the intersection of the long side 4a and the short side 4d. This output signal S contains a frequency component output from the piezoelectric vibrator 10. The ground connection terminal 32 is a terminal that connects the oscillator 100 to a ground (not shown), and is located at the intersection of the long side 4b and the short side 4c. The switch terminal 33 is a terminal for inputting a command signal that causes the integrated circuit chip 20 to output an output signal S, and is located at the intersection of the long side 4b and the short side 4d.

The chip electrodes (external power supply electrode 40, signal output electrode 41, first vibrating bar electrode 42, second vibrating bar electrode 43, ground connection electrode 44, and switch electrode 45) are electrodes for joining the integrated circuit chip 20, and are provided on the lower surface 2b2 of the second base substrate 2b, in the center of the second base substrate 2b, as shown in FIG. 5.

The external power supply electrode 40 is an electrode to which the power supply input terminal of the integrated circuit chip 20 is joined. This external power supply electrode 40 is arranged closer to the long side 4a than the center in the direction along the short side (width direction W). The signal output electrode 41 is an electrode to which the signal output terminal of the integrated circuit chip 20 is joined. This signal output electrode 41 is arranged closer to the long side 4a than the center in the direction along the short side (width direction W).

The first vibrating bar electrode 42 is an electrode to which a terminal of the integrated circuit chip 20, which is electrically connected to the piezoelectric vibrating bar 3 via the first electrode pad 51, is joined. This first vibrating bar electrode 42 is arranged closer to the long side 4b than the center in the direction along the short side (width direction W). The second vibrating bar electrode 43 is an electrode to which a terminal of the integrated circuit chip 20, which is electrically connected to the piezoelectric vibrating bar 3 via the second electrode pad 52, is joined. This second vibrating bar electrode 43 is arranged closer to the long side 4b than the center in the direction along the short side (width direction W).

5, in this embodiment, the external power supply terminal 30 and the signal output terminal 31, and the first vibrating bar electrode 42 and the second vibrating bar electrode 43 are arranged on either side of the center of the second base substrate 2b in the direction along the short side (width direction W). In other words, the external power supply terminal 30 and the signal output terminal 31 are arranged on one long side 4a in the direction along the short side, and the first vibrating bar electrode 42 (chip electrode to which the piezoelectric vibrating bar wiring 60 is connected) and the second vibrating bar electrode 43 are arranged on the other long side 4b in the direction along the short side.

The ground connection electrode 44 is an electrode to which the ground terminal of the integrated circuit chip 20 is joined. This ground connection electrode 44 is disposed in the center of the second base substrate 2b in the direction along the short side (width direction W). The switch electrode 45 is an electrode to which the switch signal input terminal of the integrated circuit chip 20 is joined. This switch electrode 45 is disposed in the center of the second base substrate 2b in the direction along the short side (width direction W).

The external power supply wiring 46 has one end connected to the external power supply terminal 30 through a via 70 penetrating the first base substrate 2a, and the other end connected to the external power supply electrode 40. In other words, the external power supply wiring 46 electrically connects the external power supply terminal 30 and the external power supply electrode 40. As shown in FIG. 5, the external power supply wiring 46 is disposed on one of the long sides 4a and is formed to extend linearly along the longitudinal direction L.

One end of the signal output wiring 47 is connected to the signal output terminal 31 through a via 70 that penetrates the first base substrate 2a, and the other end is connected to the signal output electrode 41. In other words, the signal output wiring 47 electrically connects the signal output terminal 31 and the signal output electrode 41. As shown in FIG. 5, the signal output wiring 47 is disposed on one of the long sides 4a and is formed to extend linearly along the longitudinal direction L.

One end of the ground connection wiring 48 is connected to the ground connection terminal 32 through a via 70 that penetrates the first base substrate 2a, and the other end is connected to the ground connection electrode 44. In other words, the ground connection wiring 48 electrically connects the ground connection terminal 32 and the ground connection electrode 44. As shown in FIG. 5, the ground connection wiring 48 extends from the ground connection terminal 32 to the ground connection electrode 44 so as to be inclined with respect to the longitudinal direction L and the width direction W.

One end of the switch wiring 49 is connected to the switch terminal 33 through a via 70 that penetrates the first base substrate 2a, and the other end is connected to the switch electrode 45. In other words, the switch wiring 49 electrically connects the switch terminal 33 and the switch electrode 45. As shown in FIG. 5, the switch wiring 49 extends from the switch terminal 33 to the switch electrode 45 so as to be inclined with respect to the longitudinal direction L and the width direction W.

The first electrode pad 51 and the second electrode pad 52 are pads that are bonded to an electrode film (not shown) provided on the piezoelectric vibrating piece 3. As shown in FIG. 6, the first electrode pad 51 is formed on the upper surface of the mounting portion 2g (upper surface 2c1 of the third base substrate 2c) provided on the long side 4a. The second electrode pad 52 is formed on the upper surface of the mounting portion 2h (upper surface 2c1 of the third base substrate 2c) provided on the long side 4b.

The wiring 60 for the piezoelectric vibrating piece is disposed on the upper surface 2b1 of the second base substrate 2b. One end of the wiring 60 for the piezoelectric vibrating piece is connected to the first electrode pad 51 through a via 70 that penetrates the third base substrate 2c. The other end of the wiring 60 for the piezoelectric vibrating piece is connected to the first vibrating piece electrode 42 through a via 70 that penetrates the second base substrate 2b. In other words, the wiring 60 for the piezoelectric vibrating piece electrically connects the first electrode pad 51 and the first vibrating piece electrode 42.

As shown in FIG. 6, when viewed from the thickness direction T (the normal direction of the chip mounting side), the wiring 60 for the piezoelectric vibrating piece extends from the mounting portion 2g toward the mounting portion 2h along the width direction W, then bends and extends linearly to a position where it overlaps with the first vibrating piece electrode 42. As shown in FIG. 5 and FIG. 6, in this embodiment, the wiring 60 for the piezoelectric vibrating piece is arranged across the area where the piezoelectric vibrating piece 3 is arranged without overlapping with the external power supply wiring 46 and the signal output wiring 47 when viewed from the thickness direction T.

When viewed from the thickness direction T, the wiring 60 for the piezoelectric vibrating piece does not overlap with the wiring 46 for the external power supply and the wiring 47 for the signal output means that the area in which the wiring 60 for the piezoelectric vibrating piece exists when viewed from the thickness direction T with only the wiring 60 for the piezoelectric vibrating piece remaining, and the area in which the wiring 46 for the external power supply and the wiring 47 for the signal output exist when viewed from the same direction with only the wiring 46 for the external power supply and the wiring 47 for the signal output remaining, do not overlap when viewed from the same direction, arranged in the same coordinate space.

In this embodiment, the wiring 60 for the piezoelectric vibrating piece, the wiring 46 for the external power supply, and the wiring 47 for the signal output are provided at different positions in the thickness direction T. Furthermore, the wiring 60 for the piezoelectric vibrating piece, the wiring 46 for the external power supply, and the wiring 47 for the signal output are arranged so as not to intersect when viewed from the thickness direction T.

In addition, in this embodiment, the wiring 60 for the piezoelectric vibrating piece is arranged without overlapping with the external power supply terminal 30 and the signal output terminal 31 when viewed from the thickness direction T. Furthermore, the wiring 60 for the piezoelectric vibrating piece is arranged without overlapping with the ground connection wiring 48 and the switch wiring 49 when viewed from the thickness direction T.

In this embodiment, the second electrode pad 52 and the second vibrating bar electrode 43 are arranged in a position where they overlap when viewed from the thickness direction T. These second electrode pads 52 and the second vibrating bar electrode 43 are connected and conductive by vias 70 that penetrate the third base substrate 2c.

The piezoelectric vibrating piece 3 is housed in a cavity C of the hermetically sealed package 2. In this embodiment, the piezoelectric vibrating piece 3 includes a piezoelectric plate 3a formed of quartz crystal. The piezoelectric plate 3a has a pair of vibrating arms (first vibrating arm 3b and second vibrating arm 3c) and a pair of supporting arms (first supporting arm 3d and second supporting arm 3e). The piezoelectric vibrating piece 3 is mounted on the package 2 in the cavity C by the first supporting arm 3d being supported on the mounting portion 2g by a conductive adhesive, and the second supporting arm 3e being supported on the mounting portion 2h. As a result, the piezoelectric vibrating piece 3 is supported in the cavity C with the first vibrating arm 3b and the second vibrating arm 3c floating above the second base substrate 2b. Two systems of excitation electrodes (not shown) are arranged on the outer surfaces of the first vibrating arm 3b and the second vibrating arm 3c, which vibrate the pair of first vibrating arm 3b and second vibrating arm 3c when a predetermined voltage is applied.

Figure 7 is a plan view of a piezoelectric vibrating piece. The piezoelectric vibrating piece 3 comprises a piezoelectric plate 3a and an electrode film (not shown) arranged on the outer surface including the front and back surfaces of the piezoelectric plate 3a. In this embodiment, the longitudinal direction L, width direction W and thickness direction T of the piezoelectric vibrator 10 coincide with the longitudinal direction, width direction and thickness direction of the piezoelectric vibrating piece 3, respectively. Therefore, in the following description of the piezoelectric vibrating piece 3, the longitudinal direction L, width direction W and thickness direction T of the piezoelectric vibrator 10 will be used.

The piezoelectric plate 3a includes the pair of vibrating arms (first vibrating arm 3b and second vibrating arm 3c), a pair of supporting arms (first supporting arm 3d and second supporting arm 3e), and a base 3f. The first vibrating arm 3b and the second vibrating arm 3c are formed extending from the base 3f in the longitudinal direction L. The first supporting arm 3d and the second supporting arm 3e are located on both sides of the base 3f in the width direction W. The piezoelectric plate 3a is formed so that the planar shape seen from the thickness direction T is approximately symmetrical with respect to the central axis O along the longitudinal direction L. In this embodiment, the piezoelectric material forming the piezoelectric plate 3a is quartz. It is also possible to form the piezoelectric plate 3a using piezoelectric materials such as lithium tantalate and lithium niobate.

The first vibrating arm 3b and the second vibrating arm 3c are arranged in parallel in the width direction W, and each is connected to a base 3f. The first vibrating arm 3b and the second vibrating arm 3c have their base ends on the base 3f side as fixed ends and their tips as free ends, and vibrate in a direction approaching and moving away from each other (width direction W). The first vibrating arm 3b and the second vibrating arm 3c have a main body portion 3g extending from the base ends of the first vibrating arm 3b and the second vibrating arm 3c toward their tips, and a weight portion 3h located at the tips of the first vibrating arm 3b and the second vibrating arm 3c.

A groove 3i is formed in the main body 3g. The groove 3i is recessed in the thickness direction T on both main surfaces of the main body 3g and extends along the longitudinal direction L. The groove 3i is formed from near the base ends of the first vibrating arm 3b and the second vibrating arm 3c to near the tip of the main body 3g.

The weights 3h each extend in the longitudinal direction L from the tip of the main body 3g. The weights 3h are rectangular in plan view and are wider in the width direction W than the main body 3g. This increases the mass of the tips of the first vibrating arm 3b and the second vibrating arm 3c and the moment of inertia during vibration, and shortens the length of the first vibrating arm 3b and the second vibrating arm 3c compared to a piezoelectric vibrating piece 3 that does not have the weights 3h.

A metal film 3j is provided on the surface of the weight portion 3h. The metal film 3j increases the mass of the tips of the first vibrating arm portion 3b and the second vibrating arm portion 3c and the moment of inertia during vibration. This metal film 3j is trimmed as necessary using a pulsed laser (e.g., a picosecond laser or a femtosecond laser) during the manufacture of the piezoelectric vibrator 10. By trimming the metal film 3j, it is possible to adjust the mass of the tips of the first vibrating arm portion 3b and the second vibrating arm portion 3c. The metal film 3j is made of, for example, gold (Au) or silver (Ag), and has a thickness of about 1 to 10 μm.

The first support arm 3d and the second support arm 3e are L-shaped in a plan view and surround the base 3f, the first vibrating arm 3b (main body 3g), and the second vibrating arm 3c (main body 3g) from the outside in the width direction W. The first support arm 3d is arranged on the same side of the central axis O as the first vibrating arm 3b. The second support arm 3e is arranged on the same side of the central axis O as the second vibrating arm 3c.

The electrode film is, for example, a laminated film of chromium (Cr) and gold (Au), which is formed by depositing a chromium film, which has good adhesion to quartz crystal, as a base, and then laminating a thin film of gold on the chromium film. However, the film configuration of the electrode film is not limited to this, and for example, a thin film of gold may be further laminated on a laminated film of chromium (Cr) and nichrome (NiCr), or a single layer film of chromium (Cr), nickel (Ni), aluminum (Al), titanium (Ti), etc. may also be used.

The electrode film includes excitation electrodes provided on the first vibrating arm 3b and the second vibrating arm 3c, mount electrodes that serve as mounts when the first support arm 3d and the second support arm 3e are mounted on the package 2, and connection wiring that connects the excitation electrodes and the mount electrodes.

3 and 4, the integrated circuit chip 20 is accommodated in a space (first through-hole 2e) surrounded by the lower surface 2b2 of the second base substrate 2b and the inner surface of the first base substrate 2a, and is mounted on the lower surface 2b2 of the second base substrate 2b. The terminals of the integrated circuit chip 20 are conductively connected to the chip electrodes (external power supply electrode 40, signal output electrode 41, first vibrating bar electrode 42, second vibrating bar electrode 43, ground connection electrode 44, and switch electrode 45) provided on the lower surface 2b2 of the second base substrate 2b. The integrated circuit chip 20 generates and outputs an output signal S including a frequency component by performing various arithmetic processing on the electrical signal input from the piezoelectric vibrator 10.

When operating such an oscillator 100, an external power source is supplied to the external power source electrode 40. Then, power is supplied to the piezoelectric vibrating piece 3, and a current flows through the excitation electrode to generate an electric field. The first vibrating arm 3b and the second vibrating arm 3c vibrate at a predetermined resonance frequency, for example, in a direction in which they approach and move away from each other (width direction W) due to the inverse piezoelectric effect caused by the electric field. The vibration of the first vibrating arm 3b and the second vibrating arm 3c is converted into an electric signal by the piezoelectric characteristics of the piezoelectric vibrating piece 3. This electric signal is input to the integrated circuit chip 20. When a command signal is input from a higher-level control system via the switch electrode 45, the integrated circuit chip 20 outputs an output signal S generated by performing various arithmetic processing on the electric signal. This output signal S is output to the outside from the signal output electrode 41 via the signal output wiring 47.

The package 2 included in the oscillator 100 of this embodiment as described above includes a package body 4. The package 2 also has a chip mounting side on which the integrated circuit chip 20 is mounted, and a vibrating piece mounting side that is disposed on the opposite side to the chip mounting side and on which the piezoelectric vibrating piece 3 is mounted. The package 2 also includes a plurality of chip electrodes (external power supply electrode 40, signal output electrode 41, first vibrating piece electrode 42, second vibrating piece electrode 43, ground connection electrode 44, and switch electrode 45) that are provided on the chip mounting side and to which the terminals of the integrated circuit chip 20 are connected.

The package 2 also includes an external power supply terminal 30 that is provided on the chip mounting side and is connected to an external power supply D, and a signal output terminal 31 that is provided on the chip mounting side and outputs a signal (output signal S) to the outside. The package 2 also includes an external power supply wire 46 that is provided on the chip mounting side and connects the chip electrode and the external power supply terminal 30, and a signal output wire 47 that is provided on the chip mounting side and connects the chip electrode and the signal output terminal 31.

The package 2 also includes a first electrode pad 51 that is provided on the resonator piece mounting side and to which the piezoelectric resonator piece 3 is connected. The package 2 also includes a wiring 60 for the piezoelectric resonator piece. When viewed from the normal direction of the chip mounting side, the wiring 60 for the piezoelectric resonator piece is arranged across the area in which the piezoelectric resonator piece 3 is disposed without overlapping with the external power supply wiring 46 and the signal output wiring 47, and connects the first electrode pad 51 to the chip electrode.

According to the package 2 of this embodiment, the wiring 60 for the piezoelectric vibrating piece is arranged so as to straddle the area in which the piezoelectric vibrating piece 3 is arranged when viewed from the normal direction of the chip mounting side, and further, when viewed from the same direction, does not overlap with the wiring 46 for the external power supply and the wiring 47 for the signal output. This prevents noise components from being superimposed on the signal flowing through the wiring 60 for the piezoelectric vibrating piece and the wiring 47 for the signal output, making it possible to make the frequency indicated by the signal output from the terminal for signal output 31 more accurate.

In the package 2 of this embodiment, the package body 4 is formed in a rectangular shape having a pair of long sides and a pair of short sides when viewed from the normal direction of the chip mounting side. The external power supply terminal 30 and the signal output terminal 31 are arranged on one of the long sides 4a in the direction along the short sides, and the chip electrodes (first vibrating piece electrode 42, second vibrating piece electrode 43) to which the piezoelectric vibrating piece wiring 60 is connected are arranged on the other long side 4b in the direction along the short sides.

According to this embodiment of the package of the present invention, the chip electrodes (first vibrating piece electrode 42, second vibrating piece electrode 43) to which the piezoelectric vibrating piece wiring 60 is connected can be arranged away from the external power supply terminal 30 and the signal output terminal 31, compared to when the chip electrodes (first vibrating piece electrode 42, second vibrating piece electrode 43) to which the piezoelectric vibrating piece wiring 60 is connected are arranged on one of the long sides 4a. Therefore, the signal flowing through the chip electrodes (first vibrating piece electrode 42, second vibrating piece electrode 43) to which the piezoelectric vibrating piece wiring 60 is connected can be prevented from being affected by the voltage applied to the external power supply terminal 30, and can also be prevented from interfering with the output signal flowing through the signal output terminal 31.

In addition, in this embodiment, the piezoelectric vibrator 10 includes a package 2 and a piezoelectric vibrating piece 3 mounted on the vibrating piece mounting side of the package 2. This makes it possible to make the frequency indicated by the signal output from the signal output terminal 31 more accurate.

In addition, in this embodiment, the oscillator 100 includes a piezoelectric vibrator 10 and an integrated circuit chip 20 mounted on the chip mounting side of the package 2. This makes it possible to make the frequency indicated by the signal output from the signal output terminal 31 more accurate.

Second Embodiment
Next, a second embodiment of the present invention will be described with reference to Fig. 8. In the description of this embodiment, the description of the same parts as those of the first embodiment will be omitted or simplified.

In the first embodiment, the wiring 60 for the piezoelectric vibrating piece was exposed inside the cavity C. In contrast, the package 2A of this embodiment is provided with an insulating coat 61 that covers the portion of the wiring 60 for the piezoelectric vibrating piece that is exposed in the cavity C.

Figure 8 is a top view of the package body 4 and the conductive portion 6. As shown in this figure, in this embodiment, an insulating coat 61 is provided to cover the wiring 60 for the piezoelectric vibrating piece. This insulating coat 61 is a coating material made of, for example, alumina (aluminum oxide). Note that the insulating coat 61 may be made of other materials, for example, resin.

Such an insulating coat 61 can be formed, for example, by locally applying a coating material containing a material for forming the insulating coat onto the piezoelectric vibrating piece wiring 60 and then drying the coating material. Note that the insulating coat 61 may also be formed on the entire or part of the upper surface 2b1 of the second base substrate 2b exposed to the cavity C.

In this way, the package 2A of this embodiment has the wiring 60 for the piezoelectric vibrating piece provided on the vibrating piece mounting side, and has an insulating coat 61 that covers the portion of the wiring 60 for the piezoelectric vibrating piece provided on the vibrating piece mounting side.

According to the package 2A of this embodiment, the portion of the wiring 60 for the piezoelectric vibrating piece provided on the vibrating piece mounting side is covered with an insulating coat 61. This makes it possible to prevent foreign matter from coming into contact with the portion of the wiring 60 for the piezoelectric vibrating piece provided on the vibrating piece mounting side. For example, when the metal film 3j, which is part of the piezoelectric vibrating piece 3, is cut to adjust the frequency of the piezoelectric vibrating piece 3 during manufacturing, metal cutting dust is generated. It is possible to prevent such cutting dust from coming into contact with the portion of the wiring 60 for the piezoelectric vibrating piece provided on the vibrating piece mounting side.

Third Embodiment
Next, a third embodiment of the present invention will be described with reference to Fig. 9. In the description of this embodiment, the description of the same parts as those in the first embodiment will be omitted or simplified.

In the first embodiment described above, the first vibrating bar electrode 42 was disposed closer to the tip of the piezoelectric vibrating bar 3 than the center of the second base substrate 2b in the longitudinal direction L. In contrast, in the package 2B of this embodiment, the first vibrating bar electrode 42 is disposed on the opposite side to the tip of the piezoelectric vibrating bar 3 than the center of the second base substrate 2b in the longitudinal direction L.

Figure 9 is a top view of the package body 4 and the conductive part 6. As shown in this figure, in this embodiment, instead of the piezoelectric vibrating piece wiring 60 of the first embodiment, a piezoelectric vibrating piece wiring 62 is provided. This piezoelectric vibrating piece wiring 62 is disposed on the upper surface 2b1 of the second base substrate 2b. In addition, one end of the piezoelectric vibrating piece wiring 62 is connected to the first electrode pad 51 through a via 70 that penetrates the third base substrate 2c. In addition, the other end of the piezoelectric vibrating piece wiring 62 is connected to the first vibrating piece electrode 42 through a via 70 that penetrates the second base substrate 2b. In other words, the piezoelectric vibrating piece wiring 62 electrically connects the first electrode pad 51 and the first vibrating piece electrode 42.

When viewed from the thickness direction T (the normal direction of the chip mounting side), the wiring 62 for the piezoelectric vibrating piece extends from the mounting portion 2g toward the mounting portion 2h along the width direction W, then bends, extends away from the tips of the first vibrating arm portion 3b and the second vibrating arm portion 3c (see FIG. 2, etc.) of the piezoelectric vibrating piece 3, and is provided by extending linearly to a position overlapping with the first vibrating piece electrode 42. In this embodiment, the wiring 62 for the piezoelectric vibrating piece is arranged across the area where the piezoelectric vibrating piece 3 is arranged without overlapping with the external power supply wiring 46 and the signal output wiring 47 when viewed from the thickness direction T.

Furthermore, in this embodiment, the wiring 62 for the piezoelectric vibrating piece is extended so as to move away from the tips of the first vibrating arm 3b and the second vibrating arm 3c (see FIG. 2, etc.) of the piezoelectric vibrating piece 3 as it moves from the mounting portion 2g toward the first vibrating piece electrode 42. For this reason, in this embodiment, the wiring 62 for the piezoelectric vibrating piece is arranged without overlapping with the tip of the piezoelectric vibrating piece 3 when viewed from the normal direction of the chip mounting side. For this reason, it is possible to prevent cutting chips generated by cutting the tip of the piezoelectric vibrating piece 3 from adhering to the wiring 62 for the piezoelectric vibrating piece.

Fourth Embodiment
Next, a fourth embodiment of the present invention will be described with reference to Fig. 10. In the description of this embodiment, the description of the same parts as those in the first embodiment will be omitted or simplified.

In the first embodiment, the second base substrate 2b was a single-layer member. In contrast, in the package 2C of this embodiment, the second base substrate 2b is divided into a lower layer 2b3 and an upper layer 2b4.

Figure 10 is a cross-sectional view of package 2C. As shown in this figure, in package 2C of this embodiment, second base substrate 2b is divided into lower layer 2b3 and upper layer 2b4. In other words, in this embodiment, package 2C is made of a multilayer body in which multiple layers of first base substrate 2a, lower layer 2b3 of second base substrate 2b, upper layer 2b4 of second base substrate 2b, and third base substrate 2c are stacked in order from the bottom.

Furthermore, in this embodiment, the wiring 60 for the piezoelectric vibrating piece is disposed at the interface between the lower layer 2b3 of the second base substrate 2b and the upper layer 2b4 of the second base substrate 2b. Therefore, the wiring 60 for the piezoelectric vibrating piece is covered by the upper layer 2b4 of the second base substrate 2b and is not exposed inside the cavity C. This makes it possible to prevent cutting chips generated by cutting the tip of the piezoelectric vibrating piece 3 from adhering to the wiring 60 for the piezoelectric vibrating piece.

Fifth Embodiment
Next, a fifth embodiment of the present invention will be described with reference to Fig. 11. In the description of this embodiment, the description of the same parts as those in the first embodiment will be omitted or simplified.

In the first embodiment, the package 2 is provided with a so-called side-arm type piezoelectric vibrating piece 3. In contrast, the package 2D of this embodiment is provided with a so-called cantilever type piezoelectric vibrating piece 3A.

Figure 11 is a top view of the package body 4 and conductive portion 6 of this embodiment. As shown in this figure, the piezoelectric vibrating piece 3A mounted in the package 2D is formed as a cantilever type in which the first vibrating arm portion 3m and the second vibrating arm portion 3n extend in parallel from the base portion 3k along the longitudinal direction L.

In the package 2D of this embodiment, the mounting portion 2g and the mounting portion 2h are arranged on one side in the longitudinal direction L of the cavity C. A piezoelectric vibrating piece wiring 63 is provided to connect the first electrode pad 51 and the first vibrating piece electrode 42. In this embodiment, the second electrode pad 52 and the second vibrating piece electrode 43 are connected via a via 70.

In this embodiment, as shown in FIG. 11, the wiring 63 for the piezoelectric vibrating piece is arranged so as to straddle the area in which the piezoelectric vibrating piece 3A is arranged when viewed from the normal direction of the chip mounting side, and further does not overlap with the wiring 46 for the external power supply and the wiring 47 for the signal output when viewed from the same direction. This prevents noise components from being superimposed on the signal flowing through the wiring 63 for the piezoelectric vibrating piece and the wiring 47 for the signal output, making it possible to more accurately obtain the frequency indicated by the signal output from the terminal 31 for the signal output.

Sixth Embodiment
Next, a sixth embodiment of the present invention will be described with reference to Fig. 12. In the description of this embodiment, the description of the same parts as those of the first embodiment will be omitted or simplified.

In the first embodiment, the package 2 is equipped with a so-called side-arm type piezoelectric vibrating piece 3. In contrast, the package 2E of this embodiment is equipped with a center-arm type piezoelectric vibrating piece 3B.

Figure 12 is a top view of the package body 4 and conductive portion 6 of this embodiment. As shown in this figure, the piezoelectric vibrating piece 3B mounted in the package 2E is formed as a center arm type having a single support arm 3q extending from the base 3p along the longitudinal direction L, and a pair of first vibrating arms 3r and second vibrating arms 3s arranged to sandwich the support arm 3q in the width direction W.

In the package 2E of this embodiment, instead of the mounting portion 2g and the mounting portion 2h, a single mounting portion 2j is provided in the center of the cavity C in the longitudinal direction L. A first electrode pad 51 and a second electrode pad 52 are provided on the mounting portion 2j.

The package 2E also includes wiring 64 for the piezoelectric vibrating piece that connects the first electrode pad 51 and the first vibrating piece electrode 42.

In this embodiment, as shown in FIG. 12, the wiring 64 for the piezoelectric vibrating piece is arranged so as to straddle the area in which the piezoelectric vibrating piece 3B is arranged when viewed from the normal direction of the chip mounting side, and further does not overlap with the wiring 46 for the external power supply and the wiring 47 for the signal output when viewed from the same direction. This prevents noise components from being superimposed on the signal flowing through the wiring 64 for the piezoelectric vibrating piece and the wiring 47 for the signal output, making it possible to more accurately obtain the frequency indicated by the signal output from the terminal 31 for the signal output.

The above describes a preferred embodiment of the present invention with reference to the attached drawings, but it goes without saying that the present invention is not limited to the above embodiment. The shapes and combinations of the components shown in the above embodiment are merely examples, and various modifications can be made based on design requirements, etc., without departing from the spirit of the present invention.

10...piezoelectric vibrator, 20...integrated circuit chip, 100...oscillator, 2...package (vibrator package), 2A...package (vibrator package), 2B...package (vibrator package), 2C...package (vibrator package), 2D...package (vibrator package), 2E...package (vibrator package), 2a...first base substrate (layer), 2a1...lower surface, 2b...second base substrate (layer), 2b1...upper surface, 2b2...lower surface, 2b3...lower layer (layer), 2b4...upper layer (layer), 2c...third base substrate (layer), 2c1...upper surface, 3...piezoelectric vibrating piece, 3a...piezoelectric plate, 3A...piezoelectric Vibration piece, 4... package body, 4a... long side, 4b... long side, 4c... short side, 4d... short side, 6... conductive part, 30... terminal for external power supply, 31... terminal for signal output, 40... electrode for external power supply (electrode for chip), 41... electrode for signal output (electrode for chip), 42... electrode for first vibration piece (electrode for chip), 43... electrode for second vibration piece (electrode for chip), 44... electrode for ground connection (electrode for chip), 45... electrode for switch (electrode for chip), 46... wiring for external power supply, 60... wiring for piezoelectric vibration piece, 61... insulating coating, 62... wiring for piezoelectric vibration piece, 63... wiring for piezoelectric vibration piece, 64... wiring for piezoelectric vibration piece, D... external power supply, S... output signal

Claims (5)

A package for a vibrator, comprising a package body having a chip mounting side on which an integrated circuit chip is mounted, and a vibrating piece mounting side arranged on the opposite side to the chip mounting side and on which a piezoelectric vibrating piece is mounted,
a plurality of chip electrodes provided on the chip mounting side surface and connected to terminals of the integrated circuit chip;
an external power supply terminal provided on the chip mounting side and connected to an external power supply;
a signal output terminal provided on the chip mounting side for outputting a signal to an outside;
an external power supply wiring provided on the chip mounting side and connecting the chip electrode and the external power supply terminal;
a signal output wiring provided on the chip mounting side and connecting the chip electrode and the signal output terminal;
a vibration piece mounting pad provided on the vibration piece mounting side and to which the piezoelectric vibration piece is connected;
Wires for a piezoelectric vibrating piece are arranged across an area in which the piezoelectric vibrating piece is arranged without overlapping with the external power supply wiring and the signal output wiring when viewed from a normal direction of the chip mounting side surface, and connect the vibrating piece mounting pad and the chip electrode ;
At least a portion of the piezoelectric vibrating piece wiring is provided on the vibrating piece mounting side,
The piezoelectric vibrating piece wiring has an insulating coat that covers a portion of the wiring provided on the vibrating piece mounting side.
Package for transducer . 2. The resonator package according to claim 1 , wherein the wiring for the piezoelectric resonator piece is disposed so as not to overlap a tip end of the vibrating arm portion of the piezoelectric resonator piece when viewed from a normal direction of the chip mounting side surface. the package body is formed in a rectangular shape having a pair of long sides and a pair of short sides when viewed in a normal direction of the chip mounting side surface,
the external power supply terminal and the signal output terminal are disposed on one of the long sides in a direction along the short sides,
3. The resonator package according to claim 1, wherein the chip electrodes to which the piezoelectric resonator piece wiring is connected are disposed on the other long side in a direction along the short side. A resonator package according to any one of claims 1 to 3 ;
a piezoelectric vibrating piece mounted on the vibrating piece mounting side of the vibrator package. The piezoelectric vibrator according to claim 4 ,
and an integrated circuit chip mounted on the chip mounting side of the resonator package.

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