CN115118248A - Vibrator package, piezoelectric vibrator, and oscillator - Google Patents

Abstract

The frequency indicated by the signal output from the signal output terminal of the oscillator is more accurate. The wiring (60) for the piezoelectric vibrating reed is provided, the wiring (60) for the piezoelectric vibrating reed is arranged across a region where the piezoelectric vibrating reed (3) is arranged without overlapping with an external power supply wiring (46) and a signal output wiring (47) when viewed from a normal direction of a chip mounting side surface, and the 1 st electrode pad (51) is connected with an electrode for the chip.

Description

Vibrator package, piezoelectric vibrator, and oscillator

Technical Field

The invention relates to a package for a vibrator, a piezoelectric vibrator, and an oscillator.

Background

For example, patent document 1 discloses a piezoelectric vibration device container used for a piezoelectric vibration device including a quartz vibrating reed. The container for a piezoelectric vibration device disclosed in patent document 1 has an internal wiring for electrically connecting the piezoelectric vibrator to the outside, and an external connection terminal is provided on an exposed surface. The external connection terminal is connected to the internal wiring, and the quartz resonator element can be electrically connected to the outside through the external connection terminal.

Prior art documents

Patent document

Patent document 1: japanese patent laid-open No. 2020 and 188340.

Disclosure of Invention

Problems to be solved by the invention

However, an integrated circuit chip may be directly mounted on a package for a vibrator such as a container for a piezoelectric vibrator disclosed in patent document 1, and the package may be unitized as an oscillator. In such a case, it is necessary to provide the package for the vibrator with a wiring for connecting the piezoelectric vibrating reed and the integrated circuit chip and a wiring for connecting the integrated circuit chip and the external connection terminal.

The external connection terminal is provided with an external power connection terminal as a terminal for connecting an external power supply or a signal output terminal for outputting a signal of the integrated circuit chip. Here, if the wiring connecting the external power supply connection terminal and the integrated circuit chip intersects the wiring connecting the piezoelectric vibrating reed and the integrated circuit chip as viewed from the normal direction of the surface on which the integrated circuit chip is mounted, a noise component may be carried on a signal flowing through the wiring connecting the piezoelectric vibrating reed and the integrated circuit chip, and the frequency indicated by the signal output from the signal output terminal may be affected. In addition, when the wiring connecting the signal output terminal and the integrated circuit chip crosses the wiring connecting the piezoelectric vibrating reed and the integrated circuit chip, the frequency indicated by the signal output from the signal output terminal may be affected in the same manner.

The present invention has been made in view of the above-described problems, and an object thereof is to provide a package for a vibrator, a piezoelectric vibrator, and an oscillator, which can make a frequency indicated by a signal output from a signal output terminal more accurate.

Means for solving the problems

The present invention adopts the following configuration as a means for solving the above problems.

The first aspect of the present invention is a package for a vibrator, including: the package for the vibrator includes a package main body having a chip mounting side surface on which an integrated circuit chip is mounted and a vibrating reed mounting side surface arranged on a side opposite to the chip mounting side surface and on which a piezoelectric vibrating reed is mounted, and includes: a plurality of chip electrodes provided on the chip mounting side surface and connected to terminals of the integrated circuit chip; an external power supply terminal provided on the chip mounting side surface and connected to an external power supply; a signal output terminal provided on the chip mounting side surface and outputting a signal to the outside; an external power supply wire which is provided on the chip mounting side surface and connects the chip electrode to the external power supply terminal; a signal output wiring provided on the chip mounting side surface and connecting the chip electrode to the signal output terminal; a vibrating piece mounting pad provided on the vibrating piece mounting side surface and connected to the piezoelectric vibrating piece; and a wiring for a piezoelectric vibrating reed, which is arranged across a region where the piezoelectric vibrating reed is arranged without overlapping with the wiring for an external power supply and the wiring for signal output when viewed from a normal direction of the chip mounting side surface, and connects the vibrating reed mounting pad and the electrode for a chip.

According to the present invention, the wiring for the piezoelectric vibrating reed is disposed so as to straddle the region where the piezoelectric vibrating reed is disposed when viewed from the normal direction of the chip mounting side surface, and further so as not to overlap with the wiring for the external power supply and the wiring for signal output when viewed from the same direction. Therefore, it is possible to suppress the noise component from being superimposed on the signal flowing through the wiring for the piezoelectric vibrating reed or the wiring for signal output, and to make the frequency indicated by the signal output from the terminal for signal output more accurate.

The invention according to claim 2 is configured as follows: in the above-described aspect 1, at least a part of the wiring for the piezoelectric vibrating piece is provided on the vibrating piece mounting side surface, and the wiring for the piezoelectric vibrating piece has an insulating coating layer covering a part of the wiring for the piezoelectric vibrating piece provided on the vibrating piece mounting side surface.

According to the present invention, a portion of the wiring for the piezoelectric vibrating piece provided on the vibrating piece mount side surface is covered with the insulating coating. Therefore, the foreign matter can be prevented from contacting the portion of the wiring for the piezoelectric vibrating piece provided on the vibrating piece mounting side surface. For example, if a part of the piezoelectric vibrating reed is cut in order to adjust the frequency of the piezoelectric vibrating reed at the time of manufacturing, metal chips are generated. Such chips can be prevented from contacting with the portion of the wiring for the piezoelectric vibrating piece provided on the vibrating piece mounting side surface.

The 3 rd aspect of the present invention employs the following configuration: in the above-described 1 st or 2 nd aspect, the wiring for the piezoelectric vibrating reed is disposed so as not to overlap with the tip portion of the vibrating arm portion of the piezoelectric vibrating reed when viewed from the normal direction of the chip mounting side surface.

In manufacturing, the tip of the vibrating arm of the piezoelectric vibrating reed is cut in order to adjust the frequency of the piezoelectric vibrating reed. According to the present invention, since the wiring for the piezoelectric vibrating reed is disposed so as to avoid the tip portion of the vibrating arm portion, it is possible to suppress adhesion of chips generated by cutting the tip portion to the wiring for the piezoelectric vibrating reed.

The invention according to claim 4 is configured as follows: in the above-described aspect 1, the package main body is composed of a multilayer body in which a plurality of layers are laminated, and the wiring for the piezoelectric vibrating reed is disposed at an interface between the two layers.

According to the present invention, the piezoelectric vibrating piece wiring is arranged at the interface of the two stacked layers. Therefore, chips generated by cutting a part of the piezoelectric vibrating reed in order to adjust the frequency of the piezoelectric vibrating reed during manufacturing can be prevented from contacting the wiring for the piezoelectric vibrating reed.

The 5 th aspect of the present invention employs the following configuration: in any one of the above aspects 1 to 4, the package main body is formed in a rectangular shape having a pair of long sides and a pair of short sides as viewed in a normal direction of the chip mounting side surface, the external power supply terminal and the signal output terminal are arranged on one long side in a direction along the short sides, and the chip electrode connected to the wiring for the piezoelectric vibrating reed is arranged on the other long side in the direction along the short sides.

According to the present invention, as compared with the case where the chip electrode connected to the wiring for the piezoelectric vibrating reed is disposed on one long side, the chip electrode connected to the wiring for the piezoelectric vibrating reed can be disposed apart from the external power supply terminal and the signal output terminal. Therefore, it is possible to suppress the influence of the voltage applied to the external power supply terminal on the signal flowing through the chip electrode connected to the wiring for the piezoelectric vibrating reed, and to suppress the interference with the output signal flowing through the signal output terminal.

The 6 th aspect of the present invention is a piezoelectric vibrator having the following configuration: the package for a vibrator according to any one of the above 1 to 5 aspects and the piezoelectric vibrating reed mounted on the vibrating reed mounting side surface of the package for a vibrator are provided.

According to the present invention, since the package for a vibrator of the present invention is provided, the frequency indicated by the signal output from the signal output terminal can be more accurately obtained.

The 7 th aspect of the present invention is an oscillator, comprising: the piezoelectric vibrator according to the above 6 th aspect and an integrated circuit chip mounted on the chip mounting side surface of the package for a vibrator.

According to the present invention, the frequency indicated by the signal output from the signal output terminal can be made more accurate.

ADVANTAGEOUS EFFECTS OF INVENTION

According to the present invention, it is possible to provide a package for a vibrator, a piezoelectric vibrator, and an oscillator, which can make a frequency indicated by a signal output from a signal output terminal more accurate.

Drawings

Fig. 1 is an external perspective view of an oscillator according to embodiment 1 of the present invention.

Fig. 2 is a plan view showing the oscillator according to embodiment 1 of the present invention with the sealing plate removed.

Fig. 3 is a sectional view corresponding to line I-I of fig. 2.

Fig. 4 is an exploded perspective view of the oscillator according to embodiment 1 of the present invention.

Fig. 5 is a bottom view of the package main body and the conductive portion in embodiment 1 of the present invention.

Fig. 6 is a top view of a package main body and a conductive portion in embodiment 1 of the present invention.

Fig. 7 is a plan view of the piezoelectric vibrating reed according to embodiment 1 of the present invention.

Fig. 8 is a top view of a package main body and a conductive portion in embodiment 2 of the present invention.

Fig. 9 is a top view of a package main body and a conductive portion in embodiment 3 of the present invention.

Fig. 10 is a sectional view of a package in embodiment 4 of the present invention.

Fig. 11 is a top view of the package main body and the conductive portion in embodiment 5 of the present invention.

Fig. 12 is a top view of a package main body and a conductive portion in embodiment 6 of the present invention.

Detailed Description

Hereinafter, an embodiment of a package for a vibrator, a piezoelectric vibrator, and an oscillator according to the present invention will be described with reference to the drawings.

Fig. 1 is an external perspective view of an oscillator according to the present embodiment. Fig. 2 is a plan view of the oscillator showing a state where the sealing plate is detached. Fig. 3 is a sectional view corresponding to line I-I of fig. 2. Fig. 4 is an exploded perspective view of the oscillator according to the present embodiment. As shown in fig. 1 to 4, the oscillator 100 includes a piezoelectric vibrator 10 and an integrated circuit chip 20.

The piezoelectric vibrator 10 is a surface mount type vibrator of a so-called ceramic package type. The piezoelectric vibrator 10 includes a package 2 (a package for a vibrator) having a hermetically sealed cavity C therein and a piezoelectric vibrating reed 3 accommodated in the cavity C. The piezoelectric vibrator 10 has a rectangular parallelepiped shape. In the present embodiment, in a plan view, the longitudinal direction of the piezoelectric vibrator 10 is referred to as a longitudinal direction L, the short-side direction is referred to as a width direction W, and a direction perpendicular to the longitudinal direction L and the width direction W is referred to as a thickness direction T.

The package 2 includes a package main body 4, a sealing plate 5 joined to the package main body 4 and forming a cavity C with the package main body 4, and a conductive portion 6 through which current flows. The package main body 4 includes a1 st base substrate 2a (layer body), a 2 nd base substrate 2b (layer body), and a 3 rd base substrate 2c (layer body) bonded to each other in a state of being superposed on each other, and a seal ring 2d bonded to the 3 rd base substrate 2 c.

The 1 st base substrate 2a is a ceramic substrate having the same outer shape as the 2 nd base substrate 2b in a plan view, and is integrally joined by sintering or the like in a state of being in contact with the 2 nd base substrate 2 b. As shown in fig. 2 to 4, the 1 st base substrate 2a is formed with a1 st through-hole 2e penetrating the 1 st base substrate 2a in the thickness direction T. The 1 st through-hole 2e has a rounded rectangular shape in a plan view. The 1 st through-hole 2e accommodates an integrated circuit chip 20. That is, the 1 st through hole 2e surrounds the integrated circuit chip 20 in a plane including the longitudinal direction L and the width direction W. The surface (hereinafter referred to as the lower surface 2a1) of the 1 st base substrate 2a on the opposite side to the 2 nd base substrate 2b in the thickness direction T is a surface on which external connection terminals (the external power supply terminal 30, the signal output terminal 31, the ground connection terminal 32, and the switch terminal 33) described later as a part of the conductive portion 6 are formed.

The 2 nd base substrate 2b is a ceramic substrate having a rectangular shape in a plan view viewed from the thickness direction T. The upper surface 2b1 of the 2 nd base substrate 2b constitutes the bottom of the cavity C. The lower surface 2b2 of the 2 nd base substrate 2b is a surface on which chip electrodes (an external power supply electrode 40, a signal output electrode 41, a1 st vibrating reed electrode 42, a 2 nd vibrating reed electrode 43, a ground connection electrode 44, and a switch electrode 45) described later are formed as part of the conductive portion 6. These chip electrodes are portions to which terminals of the integrated circuit chip 20 are bonded. That is, the lower surface 2b2 of the 2 nd base substrate 2b on which the chip electrodes are provided is a mounting surface of the integrated circuit chip 20.

The 3 rd base substrate 2c is a ceramic substrate having the same outer shape as the 2 nd base substrate 2b in a plan view, and is integrally joined by sintering or the like in a state of being superimposed on the 2 nd base substrate 2 b. As shown in fig. 3 and 4, a 2 nd penetrating portion 2f penetrating the 3 rd base substrate 2c in the thickness direction T is formed in the 3 rd base substrate 2 c. The 2 nd through-hole 2f has a rounded rectangular shape in a plan view. On the inner surface of the 2 nd through-hole 2f, mounting portions (mounting portion 2g and mounting portion 2h) protruding inward in the width direction W are formed at portions located on both sides in the width direction W. Further, the mounting portions 2g and 2h are located at the central portion in the longitudinal direction L in the 3 rd base substrate 2 c.

The mounting portions 2g and 2h are formed with a1 st electrode pad 51 and a 2 nd electrode pad 52, which will be described later, as part of the conductive portion 6. The mounting portion 2g has a1 st electrode pad 51 formed thereon, and the mounting portion 2h has a 2 nd electrode pad 52 formed thereon. These 1 st electrode pad 51 and 2 nd electrode pad 52 are portions to which the piezoelectric vibrating reed 3 is bonded. That is, the upper surfaces of the mounting portions 2g and 2h (i.e., the upper surface 2c1 of the 3 rd base substrate 2 c) provided with the 1 st electrode pad 51 and the 2 nd electrode pad 52 are the mounting surfaces of the piezoelectric vibrating reed 3.

As the Ceramic material used for the 1 st base substrate 2a, the 2 nd base substrate 2b, and the 3 rd base substrate 2c, for example, alumina HTCC (High Temperature Co-Fired Ceramic) or LTCC (Low Temperature Co-Fired Ceramic) made of glass Ceramic can be used.

In four corners of the 1 st base substrate 2a, the 2 nd base substrate 2b, and the 3 rd base substrate 2c, an arcuate cutout portion 2i of 1/4 is formed over the entire thickness direction T of the 1 st base substrate 2a, the 2 nd base substrate 2b, and the 3 rd base substrate 2c in a plan view. The 1 st base substrate 2a, the 2 nd base substrate 2b, and the 3 rd base substrate 2c are produced by: for example, after three wafer-shaped ceramic substrates are stacked and bonded, a plurality of through holes penetrating the three ceramic substrates are formed in a matrix, and the three ceramic substrates are simultaneously cut into a lattice shape with reference to each through hole. At this time, the through hole is divided into four parts to form the above-described notch portion 2 i.

In the present embodiment, as shown in fig. 3 and the like, the integrated circuit chip 20 is disposed on the 1 st base substrate 2a side of the 2 nd base substrate 2b, and the piezoelectric vibrating reed 3 is disposed on the 3 rd base substrate 2c side of the 2 nd base substrate 2 b. That is, in the present embodiment, the lower surface 2a1 of the 1 st base substrate 2a and the lower surface 2b2 of the 2 nd base substrate 2b form the integrated circuit chip mounting side surface of the package main body 4. In addition, the upper surface 2b1 of the 2 nd base substrate 2b and the upper surface 2c1 of the 3 rd base substrate 2c form a vibrating piece mounting side surface. Note that "up and down" attached to the names of the lower surface 2a1, the upper surface 2b1, the lower surface 2b2, and the upper surface 2c1 indicates directions for convenience of explanation, and does not limit the installation posture of the actual oscillator 100 with respect to the vertical direction.

The seal ring 2d is a conductive frame-like member having a smaller outer shape than the 1 st base substrate 2a, the 2 nd base substrate 2b, and the 3 rd base substrate 2c, and is bonded to the upper surface of the 3 rd base substrate 2 c. Specifically, the seal ring 2d is joined to the 3 rd base substrate 2c by soldering with brazing material such as silver solder or soft solder, or by welding or the like of a metal joining layer formed on the 3 rd base substrate 2 c. The seal ring 2d forms a sidewall of the cavity C together with the inner surface of the 3 rd base substrate 2C (the 2 nd penetrating part 2 f). In the illustrated example, the inner surface of the seal ring 2d is disposed coplanar with the inner surface of the 3 rd base substrate 2 c.

The material of the seal ring 2d may be, for example, a nickel-based alloy, and specifically, may be selected from Kovar (Kovar), einvar (Elinvar), Invar (Invar), 42 alloy, and the like. In particular, as the material of the seal ring 2d, it is preferable to select a material having a thermal expansion coefficient close to that of the 2 nd base substrate 2b and the 3 rd base substrate 2c made of ceramic. For example, a thermal expansion coefficient of 6.8X 10 is used for the 2 nd base substrate 2b and the 3 rd base substrate 2c ^-6 In the case of alumina of/° C, it is preferable to use a thermal expansion coefficient of 5.2X 10 as the seal ring 2d ^-6 Kovar alloys or thermal expansion coefficients of 4.5-6.5X 10 at/° C ^-6 42 alloy at/° c.

The sealing plate 5 is made of a conductive substrate, and is bonded to the seal ring 2d to hermetically seal the inside of the package main body 4. The space defined by the seal ring 2d, the sealing plate 5, the 2 nd base substrate 2b, and the 3 rd base substrate 2C constitutes a hermetically sealed chamber C.

The conductive portion 6 is a portion serving as a conduction path for power supply power or signals in the package 2. The conductive portion 6 is formed of a single-layer film made of a single metal or a laminated film formed by laminating different metals, which is formed by vapor deposition, sputtering, or the like.

Fig. 5 is a bottom view of the package main body 4 and the conductive portion 6. In addition, fig. 6 is a top view of the package main body 4 and the conductive portion 6. Note that, in fig. 6, the seal ring 2d is omitted and shown. As shown in fig. 5, in the present embodiment, the conductive portion 6 includes an external power supply terminal 30, a signal output terminal 31, a ground connection terminal 32, and a switch terminal 33 as external connection terminals formed on the lower surface 2a1 of the 1 st base substrate 2 a. The conductive portion 6 includes an external power supply electrode 40, a signal output electrode 41, a1 st vibrating reed electrode 42, and a 2 nd vibrating reed electrode 43 as chip electrodes formed on the lower surface 2b2 of the 2 nd base substrate 2 b. The conductive portion 6 includes an external power supply wiring 46, a signal output wiring 47, a ground connection wiring 48, and a switch wiring 49 formed on the lower surface 2b2 of the 2 nd base substrate 2 b. The external power supply terminal 30, the signal output terminal 31, the ground connection terminal 32, the switch terminal 33, the external power supply electrode 40, the signal output electrode 41, the 1 st vibrating reed electrode 42, the 2 nd vibrating reed electrode 43, the ground connection electrode 44, the switch electrode 45, the external power supply wiring 46, the signal output wiring 47, the ground connection wiring 48, and the switch wiring 49 are formed on the lower surface 2a1 of the 1 st base substrate 2a or the lower surface 2b2 of the 2 nd base substrate 2b, i.e., the side of the package body 4 on which the integrated circuit chip is mounted.

In addition, as shown in fig. 6, the conductive portion 6 has the 1 st electrode pad 51 and the 2 nd electrode pad 52 formed on the upper surface 2c1 of the 3 rd base substrate 2 c. The conductive portion 6 includes the wiring 60 for the piezoelectric vibrating reed formed on the upper surface 2b1 of the 2 nd base substrate 2 b. The 1 st electrode pad 51, the 2 nd electrode pad 52, and the wiring 60 for the piezoelectric vibrating piece are formed on the upper surface 2b1 of the 2 nd base substrate 2b or the upper surface 2c1 of the 3 rd base substrate 2c, that is, the vibrating piece mounting side surface of the package main body 4. The conductive portion 6 also has a plurality of through holes (ビア)70 that connect portions provided at different positions in the thickness direction T to each other in the thickness direction T.

The external connection terminals (the external power supply terminal 30, the signal output terminal 31, the ground connection terminal 32, and the switch terminal 33) are terminals for connecting the oscillator 100 to the outside, and are provided on the lower surface 2a1 of the 1 st base substrate 2a and four corners of the 1 st base substrate 2a as shown in fig. 5. As shown in fig. 5 and 6, the package main body 4 is formed in a rectangular shape having a pair of long sides ( long sides 4a and 4b) and a pair of short sides ( short sides 4c and 4d) as viewed from the normal direction (thickness direction T) of the chip mounting side surface. As shown in fig. 5, the external power supply terminal 30 and the signal output terminal 31 are arranged on one long side 4a side in the direction along the short side. The ground connection terminal 32 and the switch terminal 33 are arranged on the other long side 4b side in the direction along the short side.

The external power supply terminal 30 is a terminal for connecting the oscillator 100 to the external power supply D, and is disposed at a position where the long side 4a and the short side 4D intersect. The signal output terminal 31 is a terminal for outputting a signal (output signal S) from the oscillator 100 to the outside, and is disposed at a position where the long side 4a and the short side 4c intersect. The output signal S contains a frequency component output from the piezoelectric vibrator 10. The ground connection terminal 32 is a terminal for connecting the oscillator 100 to a ground, not shown, and is disposed at a position where the long side 4b and the short side 4d intersect. The switch terminal 33 is a terminal for inputting a command signal for outputting the output signal S to the integrated circuit chip 20, and is disposed at a position where the long side 4b and the short side 4c intersect.

The chip electrodes (the external power supply electrode 40, the signal output electrode 41, the 1 st vibrating reed electrode 42, the 2 nd vibrating reed electrode 43, the ground connection electrode 44, and the switch electrode 45) are electrodes for bonding the integrated circuit chip 20, and are provided on the lower surface 2b2 of the 2 nd base substrate 2b and in the central portion of the 2 nd base substrate 2b as shown in fig. 5.

The external power supply electrode 40 is an electrode to which a power supply input terminal of the integrated circuit chip 20 is joined. The external power supply electrode 40 is disposed on the longer side 4a side than the center portion in the direction along the shorter side (width direction W). The signal output electrode 41 is an electrode to which a signal output terminal of the integrated circuit chip 20 is joined. The signal output electrode 41 is disposed on the longer side 4a side of the central portion in a direction along the shorter side (width direction W).

The 1 st vibrating reed electrode 42 is an electrode to which a terminal of the integrated circuit chip 20 electrically connected to the piezoelectric vibrating reed 3 via the 1 st electrode pad 51 is bonded. The 1 st resonator element electrode 42 is disposed on the longer side 4b side than the center portion in the direction along the shorter side (width direction W). The 2 nd vibration plate electrode 43 is an electrode to which a terminal of the integrated circuit chip 20 electrically connected to the piezoelectric vibration plate 3 via the 2 nd electrode pad 52 is bonded. The 2 nd resonator element electrode 43 is disposed on the longer side 4b side than the center portion in the direction along the shorter side (width direction W).

As described above, in the present embodiment, as shown in fig. 5, the external power supply terminal 30 and the signal output terminal 31, and the 1 st resonator element electrode 42 and the 2 nd resonator element electrode 43 are arranged so as to sandwich the center portion of the 2 nd base substrate 2b in the direction along the short side (width direction W). That is, the external power supply terminal 30 and the signal output terminal 31 are arranged on the one long side 4a side in the direction along the short side, and the 1 st vibrating reed electrode 42 (chip electrode connected to the piezoelectric vibrating reed wire 60) and the 2 nd vibrating reed electrode 43 are arranged on the other long side 4b side in the direction along the short side.

The ground connection electrode 44 is an electrode to which a ground terminal of the integrated circuit chip 20 is joined. The ground connection electrode 44 is disposed in the center of the 2 nd base substrate 2b in a direction along the short side (width direction W). The switching electrode 45 is an electrode to which a switching signal input terminal of the integrated circuit chip 20 is bonded. The switching electrode 45 is disposed in the center of the 2 nd base substrate 2b in a direction along the short side (width direction W).

The external power supply wiring 46 has one end connected to the external power supply terminal 30 and the other end connected to the external power supply electrode 40 via a through hole 70 penetrating the 1 st base substrate 2 a. That is, the external power supply wiring 46 electrically connects the external power supply terminal 30 and the external power supply electrode 40. As shown in fig. 5, the external power supply wiring 46 is disposed on one long side 4a side and linearly extends along the long side direction L.

The signal output wiring 47 has one end connected to the signal output terminal 31 and the other end connected to the signal output electrode 41 via a through hole 70 penetrating the 1 st base substrate 2 a. That is, the signal output wiring 47 connects the signal output terminal 31 and the signal output electrode 41 so as to be able to conduct electricity. As shown in fig. 5, the signal output wiring 47 is disposed on one long side 4a side and formed to extend linearly along the long side direction L.

The ground connection wiring 48 has one end connected to the ground connection terminal 32 and the other end connected to the ground connection electrode 44 via a through hole 70 penetrating the 1 st base substrate 2 a. In other words, the ground connection wiring 48 connects the ground connection terminal 32 and the ground connection electrode 44 so as to be able to conduct electricity. As shown in fig. 5, the ground connection wiring 48 extends from the ground connection terminal 32 to the ground connection electrode 44 so as to be inclined with respect to the longitudinal direction L and the width direction W.

The switch wiring 49 has one end connected to the switch terminal 33 and the other end connected to the switch electrode 45 via a through hole 70 penetrating the 1 st base substrate 2 a. That is, the switching wire 49 conductively connects the switching terminal 33 and the switching electrode 45. As shown in fig. 5, the switching wire 49 extends from the switching terminal 33 to the switching electrode 45 so as to be inclined with respect to the longitudinal direction L and the width direction W.

The 1 st electrode pad 51 and the 2 nd electrode pad 52 are pads to be bonded to an electrode film, not shown, provided on the piezoelectric vibrating reed 3. As shown in fig. 6, the 1 st electrode pad 51 is formed on the upper surface of the mounting portion 2g (the upper surface 2c1 of the 3 rd base substrate 2 c) provided on the long side 4a side. The 2 nd electrode pad 52 is formed on the upper surface of the mounting portion 2h (the upper surface 2c1 of the 3 rd base substrate 2 c) provided on the long side 4b side.

The wiring 60 for the piezoelectric vibrating reed is disposed on the upper surface 2b1 of the 2 nd base substrate 2 b. Further, one end of the wiring 60 for the piezoelectric vibrating reed is connected to the 1 st electrode pad 51 via a through hole 70 penetrating the 3 rd base substrate 2 c. The other end of the piezoelectric vibrating reed wire 60 is connected to the 1 st vibrating reed electrode 42 via a through hole 70 penetrating the 2 nd base substrate 2 b. That is, the wiring 60 for the piezoelectric vibrating reed electrically connects the 1 st electrode pad 51 and the 1 st vibrating reed electrode 42.

As shown in fig. 6, the wiring 60 for the piezoelectric vibrating reed extends in the width direction W from the mounting portion 2g toward the mounting portion 2h and then bends so as to linearly extend to a position overlapping the 1 st vibrating reed electrode 42 when viewed in the thickness direction T (the normal direction of the chip mounting side surface). As shown in fig. 5 and 6, in the present embodiment, the wiring 60 for the piezoelectric vibrating reed is disposed across the region where the piezoelectric vibrating reed 3 is disposed, without overlapping the external power supply wiring 46 and the signal output wiring 47 when viewed from the thickness direction T.

Further, the fact that the wiring 60 for the piezoelectric vibrating reed does not overlap the external power supply wiring 46 and the signal output wiring 47 when viewed in the thickness direction T means that a region where the wiring 60 for the piezoelectric vibrating reed exists when only the wiring 60 for the piezoelectric vibrating reed is left and viewed in the thickness direction T and a region where the wiring 46 for the external power supply and the signal output wiring 47 exist when only the wiring 46 for the external power supply and the signal output wiring 47 are left and viewed in the same direction do not overlap when they are arranged in the same coordinate space and viewed in the same direction.

In the present embodiment, the wiring 60 for the piezoelectric vibrating reed is provided at a different position from the external power supply wiring 46 and the signal output wiring 47 in the thickness direction T. Further, the wiring 60 for the piezoelectric vibrating reed is disposed so as not to intersect with the external power supply wiring 46 and the signal output wiring 47 when viewed from the thickness direction T.

In the present embodiment, the wiring 60 for the piezoelectric vibrating reed is similarly disposed so as not to overlap the external power supply terminal 30 and the signal output terminal 31 when viewed in the thickness direction T. Further, the wiring 60 for the piezoelectric vibrating reed is similarly disposed so as not to overlap the wiring 48 for the ground connection and the wiring 49 for the switch when viewed in the thickness direction T.

In the present embodiment, the 2 nd electrode pad 52 and the 2 nd vibrating reed electrode 43 are disposed at positions overlapping each other when viewed in the thickness direction T. The 2 nd electrode pad 52 and the 2 nd vibrating reed electrode 43 are connected and electrically connected by a through hole 70 penetrating the 3 rd base substrate 2 c.

The piezoelectric vibrating reed 3 is accommodated in the cavity C of the hermetically sealed package 2. In the present embodiment, the piezoelectric vibrating reed 3 includes a piezoelectric plate 3a made of quartz crystal. The piezoelectric plate 3a has a pair of vibrating arm portions (1 st vibrating arm portion 3b and 2 nd vibrating arm portion 3c) and a pair of supporting arm portions (1 st supporting arm portion 3d and 2 nd supporting arm portion 3 e). In the cavity C, the 1 st support arm 3d is supported by the mounting portion 2g and the 2 nd support arm 3e is supported by the mounting portion 2h by a conductive adhesive, and the piezoelectric vibrating reed 3 is mounted on the package 2. Thereby, the piezoelectric vibrating reed 3 is supported in the cavity C in a state where the 1 st vibrating arm portion 3b and the 2 nd vibrating arm portion 3C are floated from the 2 nd base substrate 2 b. On the outer surfaces of the 1 st vibrating arm portion 3b and the 2 nd vibrating arm portion 3c, not-shown excitation electrodes of a dual system for vibrating the 1 st vibrating arm portion 3b and the 2 nd vibrating arm portion 3c when a predetermined voltage is applied are arranged.

Fig. 7 is a plan view of the piezoelectric vibrating piece. The piezoelectric vibrating reed 3 includes a piezoelectric plate 3a and an electrode film, not shown, disposed on an outer surface including a front surface and a back surface of the piezoelectric plate 3 a. In the present embodiment, the longitudinal direction L, the width direction W, and the thickness direction T of the piezoelectric vibrator 10 coincide with the longitudinal direction, the width direction, and the thickness direction of the piezoelectric vibrating reed 3, respectively. Therefore, in the following description of the piezoelectric vibrating reed 3, the longitudinal direction L, the width direction W, and the thickness direction T of the piezoelectric vibrator 10 are used.

The piezoelectric plate 3a includes the pair of vibrating arm portions (the 1 st vibrating arm portion 3b and the 2 nd vibrating arm portion 3c), the pair of supporting arm portions (the 1 st supporting arm portion 3d and the 2 nd supporting arm portion 3e), and the base portion 3 f. The 1 st vibrating arm portion 3b and the 2 nd vibrating arm portion 3c are formed to extend in the longitudinal direction L from the base portion 3 f. The 1 st support arm portion 3d and the 2 nd support arm portion 3e are located on both sides in the width direction W with respect to the base portion 3 f. The piezoelectric plate 3a is formed so that its shape in plan view as viewed in the thickness direction T is substantially symmetrical with respect to a central axis O along the longitudinal direction L. In addition, in the present embodiment, the piezoelectric material forming the piezoelectric plate 3a is quartz. The piezoelectric plate 3a may be formed using a piezoelectric material such as lithium tantalate or lithium niobate.

The 1 st vibrating arm portion 3b and the 2 nd vibrating arm portion 3c are arranged side by side and in parallel in the width direction W, and are each connected to the base portion 3 f. The 1 st vibrating arm portion 3b and the 2 nd vibrating arm portion 3c vibrate in directions (width directions W) approaching to and separating from each other with the base end on the base portion 3f side as a fixed end and the tip end as a free end. The 1 st and 2 nd vibrating arm portions 3b and 3c have main body portions 3g extending from the base ends toward the tip ends of the 1 st and 2 nd vibrating arm portions 3b and 3c, and weight portions 3h located at the tip ends of the 1 st and 2 nd vibrating arm portions 3b and 3 c.

The main body 3g has grooves 3 i. The groove portion 3i is recessed in the thickness direction T on both main surfaces of the body portion 3g and extends in the longitudinal direction L. The groove portion 3i is formed from the vicinity of the base ends of the 1 st and 2 nd vibrating arm portions 3b and 3c to the vicinity of the tip end of the main body portion 3 g.

The weight portions 3h extend in the longitudinal direction L from the distal end portions of the body portion 3 g. The weight portion 3h is rectangular in plan view, and is formed wider than the body portion 3g in the width direction W. This can increase the mass of the tip portions of the 1 st and 2 nd vibrating arm portions 3b, 3c and the moment of inertia during vibration, and can shorten the length of the 1 st and 2 nd vibrating arm portions 3b, 3c as compared with the piezoelectric vibrating reed 3 without the weight portion 3 h.

Further, a metal film 3j is provided on the surface of the weight portion 3 h. The metal film 3j increases the mass of the tip portions of the 1 st and 2 nd vibrating arm portions 3b and 3c and the moment of inertia at the time of vibration. In manufacturing the piezoelectric vibrator 10, a pulsed laser (for example, a picosecond laser or a femtosecond laser) is used to trim the metal film 3j as needed. The mass of the tip portions of the 1 st and 2 nd vibrating arm portions 3b and 3c can be adjusted by trimming the metal film 3 j. The metal film 3j is made of, for example, gold (Au) or silver (Ag), and has a thickness of about 1 to 10 μm.

The 1 st support arm portion 3d and the 2 nd support arm portion 3e are L-shaped in plan view, and surround the base portion 3f, the 1 st vibrating arm portion 3b (main body portion 3g), and the 2 nd vibrating arm portion 3c (main body portion 3g) from the outside in the width direction W. The 1 st support arm 3d is disposed on the same side as the 1 st vibrating arm 3b with respect to the central axis O. The 2 nd support arm portion 3e is disposed on the same side as the 2 nd vibrating arm portion 3c with respect to the central axis O.

The electrode film is, for example, a laminated film of chromium (Cr) and gold (Au), and is a film formed by laminating a thin gold film on a chromium film after the chromium film having excellent adhesion to quartz is formed as a base. However, the film structure of the electrode film is not limited to this, and for example, a gold thin film may be further laminated on a laminated film of chromium (Cr) and nickel-chromium alloy (NiCr), or a single-layer film of chromium (Cr), nickel (Ni), aluminum (Al), titanium (Ti), or the like may be used.

The electrode film is provided with: excitation electrodes provided on the 1 st vibrating arm portion 3b and the 2 nd vibrating arm portion 3c, respectively; a mount electrode serving as a mount portion when the 1 st support arm portion 3d and the 2 nd support arm portion 3e are mounted on the package 2; and a connection wiring connecting the excitation electrode or the mount electrode.

As shown in fig. 3 and 4, the integrated circuit chip 20 is accommodated in a space (1 st through-hole 2e) surrounded by the lower surface 2b2 of the 2 nd base substrate 2b and the inner surface of the 1 st base substrate 2a, and is mounted on the lower surface 2b2 of the 2 nd base substrate 2 b. The terminals of the integrated circuit chip 20 are conductively bonded to the chip electrodes (the external power supply electrode 40, the signal output electrode 41, the 1 st vibrating reed electrode 42, the 2 nd vibrating reed electrode 43, the ground connection electrode 44, and the switching electrode 45) provided on the lower surface 2b2 of the 2 nd base substrate 2 b. The integrated circuit chip 20 generates and outputs an output signal S containing a frequency component by performing various arithmetic processes on the electric signal input from the piezoelectric vibrator 10.

When the oscillator 100 is operated, an external power supply is supplied to the external power supply electrode 40. Then, power is supplied to the piezoelectric vibrating reed 3, and a current flows through the excitation electrode to generate an electric field. The 1 st vibration arm portion 3b and the 2 nd vibration arm portion 3c vibrate at a predetermined resonance frequency in a direction (width direction W) in which they approach/separate from each other, for example, due to the inverse piezoelectric effect caused by the above-described electric field. The vibrations of the 1 st vibrating arm 3b and the 2 nd vibrating arm 3c are converted into electric signals according to the piezoelectric characteristics of the piezoelectric vibrating reed 3. The electrical signal is input to the integrated circuit chip 20. The integrated circuit chip 20 outputs an output signal S generated by performing various arithmetic operations on the electrical signal if a command signal is input from a host control system via the switching electrode 45. The output signal S is output from the signal output electrode 41 to the outside via the signal output wiring 47.

As described above, the package 2 included in the oscillator 100 of the present embodiment includes the package main body 4. The package 2 has a chip mounting side surface on which the integrated circuit chip 20 is mounted, and a vibrating reed mounting side surface on which the piezoelectric vibrating reed 3 is mounted, the vibrating reed mounting side surface being disposed on the side opposite to the chip mounting side surface. The package 2 includes a plurality of chip electrodes (an external power supply electrode 40, a signal output electrode 41, a1 st vibrating reed electrode 42, a 2 nd vibrating reed electrode 43, a ground connection electrode 44, and a switch electrode 45) provided on the chip mounting side surface and connected to terminals of the integrated circuit chip 20.

Further, the package 2 includes: an external power supply terminal 30 provided on the chip mounting side surface and connected to an external power supply D; and a signal output terminal 31 provided on the chip mounting side surface and outputting a signal (output signal S) to the outside. Further, the package 2 includes: an external power supply wire 46 provided on the chip mounting side surface and connecting the chip electrode to the external power supply terminal 30; and a signal output wiring 47 provided on the chip mounting side surface and connecting the chip electrode to the signal output terminal 31.

The package 2 further includes a1 st electrode pad 51 provided on the vibrating reed mounting side surface and connected to the piezoelectric vibrating reed 3. Further, the package 2 includes a wiring 60 for the piezoelectric vibrating reed. The wiring 60 for the piezoelectric vibrating reed is arranged across a region where the piezoelectric vibrating reed 3 is arranged without overlapping the external power supply wiring 46 and the signal output wiring 47 when viewed from a direction normal to the chip-mounting side surface, and connects the 1 st electrode pad 51 and the chip electrode.

According to the package 2 of the present embodiment, the wiring 60 for the piezoelectric vibrating reed is disposed so as to straddle the region where the piezoelectric vibrating reed 3 is disposed when viewed from the normal direction of the chip-mounted side surface, and further so as not to overlap the external power supply wiring 46 and the signal output wiring 47 when viewed from the same direction. Therefore, it is possible to suppress the noise component from being superimposed on the signal flowing through the wiring 60 for the piezoelectric vibrating reed or the wiring 47 for signal output, and to make the frequency indicated by the signal output from the terminal 31 for signal output more accurate.

In the package 2 of the present embodiment, the package main body 4 is formed in a rectangular shape having a pair of long sides and a pair of short sides as viewed from the normal direction of the chip mounting side surface. The external power supply terminal 30 and the signal output terminal 31 are disposed on the one long side 4a side in the direction along the short side, and the chip electrodes (the 1 st vibrating reed electrode 42 and the 2 nd vibrating reed electrode 43) connected to the wiring 60 for the piezoelectric vibrating reed are disposed on the other long side 4b side in the direction along the short side.

According to the package of the present embodiment, as compared with the case where the chip electrodes (the 1 st vibrating reed electrode 42 and the 2 nd vibrating reed electrode 43) connected to the wiring 60 for the piezoelectric vibrating reed are arranged on the side of the one long side 4a, the chip electrodes connected to the wiring 60 for the piezoelectric vibrating reed can be arranged apart from the external power supply terminal 30 and the signal output terminal 31. Therefore, it is possible to suppress the influence of the voltage applied to the external power supply terminal 30 on the signal flowing through the chip electrodes (the 1 st vibrating reed electrode 42 and the 2 nd vibrating reed electrode 43) connected to the wiring 60 for the piezoelectric vibrating reed and to suppress the interference with the output signal flowing through the signal output terminal 31.

In the present embodiment, the piezoelectric vibrator 10 includes the package 2 and the piezoelectric vibrating reed 3 mounted on the vibrating reed mounting side surface of the package 2. Therefore, the frequency indicated by the signal output from the signal output terminal 31 can be made more accurate.

In the present embodiment, the oscillator 100 includes the piezoelectric vibrator 10 and the integrated circuit chip 20 mounted on the chip mounting side surface of the package 2. Therefore, the frequency indicated by the signal output from the signal output terminal 31 can be made more accurate.

(embodiment 2)

Next, embodiment 2 of the present invention will be described with reference to fig. 8. In the description of the present embodiment, the same portions as those of embodiment 1 are omitted or simplified.

In the above-described embodiment 1, the wiring 60 for the piezoelectric vibrating reed is exposed inside the cavity C. In contrast, the package 2A of the present embodiment includes the insulating coating 61 covering the portion of the wiring 60 for the piezoelectric vibrating reed exposed in the cavity C.

Fig. 8 is a top view of the package main body 4 and the conductive portion 6. As shown in the drawing, in the present embodiment, an insulating coating 61 is provided so as to cover the wiring 60 for the piezoelectric vibrating reed. The insulating coating 61 is a coating material formed of, for example, aluminum oxide (alumina). Further, the insulating coating 61 may be formed of other materials, or may be formed of, for example, resin.

The insulating coating 61 can be formed by locally applying a coating material including a material for forming an insulating coating to the wiring 60 for the piezoelectric vibrating reed and drying the coating material. The insulating coating 61 may be formed on the entire or a part of the upper surface 2b1 of the 2 nd base substrate 2b exposed to the cavity C.

In this way, in the package 2A of the present embodiment, the piezoelectric vibrating piece wiring 60 is provided on the vibrating piece mounting side surface, and the insulating coating 61 covers a portion of the piezoelectric vibrating piece wiring 60 provided on the vibrating piece mounting side surface.

According to the package 2A of the present embodiment, the portion of the wiring 60 for a piezoelectric vibrating reed provided on the vibrating reed mounting side surface is covered with the insulating coating 61. Therefore, the foreign matter can be prevented from contacting the portion of the wiring 60 for the piezoelectric vibrating piece provided on the vibrating piece mounting side surface. For example, if the metal film 3j which is a part of the piezoelectric vibrating reed 3 is cut in order to adjust the frequency of the piezoelectric vibrating reed 3 at the time of manufacturing, metal chips are generated. Such chips (cut ) can be prevented from coming into contact with the portion of the wiring 60 for the piezoelectric vibrating reed provided on the vibrating reed mounting side surface.

(embodiment 3)

Next, embodiment 3 of the present invention will be described with reference to fig. 9. In the description of the present embodiment, the same portions as those of embodiment 1 are omitted or simplified.

In the above-described embodiment 1, the 1 st resonator element electrode 42 is disposed on the tip end side of the piezoelectric resonator element 3 with respect to the central portion of the 2 nd base substrate 2b in the longitudinal direction L. In contrast, in the package 2B of the present embodiment, the 1 st resonator element electrode 42 is disposed on the opposite side of the center portion of the 2 nd base substrate 2B from the tip end portion of the piezoelectric resonator element 3 in the longitudinal direction L.

Fig. 9 is a top view of the package main body 4 and the conductive portion 6. As shown in the drawing, in the present embodiment, a wiring 62 for a piezoelectric vibrating reed is provided instead of the wiring 60 for a piezoelectric vibrating reed of the above-described embodiment 1. The wiring 62 for the piezoelectric vibrating reed is disposed on the upper surface 2b1 of the 2 nd base substrate 2 b. Further, one end of the wiring 62 for the piezoelectric vibrating reed is connected to the 1 st electrode pad 51 via a through hole 70 penetrating the 3 rd base substrate 2 c. The other end of the piezoelectric vibrating reed wire 62 is connected to the 1 st vibrating reed electrode 42 via a through hole 70 penetrating the 2 nd base substrate 2 b. That is, the wiring 62 for the piezoelectric vibrating reed electrically connects the 1 st electrode pad 51 and the 1 st vibrating reed electrode 42.

The wiring 62 for the piezoelectric vibrating reed extends in the width direction W from the mounting portion 2g toward the mounting portion 2h and then bends as viewed in the thickness direction T (the normal direction of the chip mounting side surface), extends so as to be separated from the tip portions of the 1 st vibrating arm portion 3b and the 2 nd vibrating arm portion 3c (see fig. 2 and the like) of the piezoelectric vibrating reed 3, and is provided so as to linearly extend to a position overlapping the 1 st vibrating reed electrode 42. In the present embodiment, the wiring 62 for the piezoelectric vibrating reed is arranged across the region where the piezoelectric vibrating reed 3 is arranged, without overlapping the external power supply wiring 46 and the signal output wiring 47 when viewed from the thickness direction T.

Further, in the present embodiment, the wiring 62 for the piezoelectric vibrating reed extends so as to be separated from the tip portions of the 1 st vibrating arm portion 3b and the 2 nd vibrating arm portion 3c (see fig. 2 and the like) of the piezoelectric vibrating reed 3 as going from the mounting portion 2g to the 1 st vibrating reed electrode 42. Therefore, in the present embodiment, the wiring 62 for the piezoelectric vibrating reed is disposed so as not to overlap with the distal end portion of the piezoelectric vibrating reed 3 when viewed from the normal direction of the chip-mounted side surface. Therefore, the adhesion of chips generated by cutting the tip portion of the piezoelectric vibrating reed 3 to the wiring 62 for the piezoelectric vibrating reed can be suppressed.

(embodiment 4)

Next, embodiment 4 of the present invention will be described with reference to fig. 10. In the description of the present embodiment, the same portions as those of embodiment 1 are omitted or simplified.

In the above embodiment 1, the 2 nd base substrate 2b is a member of one layer. In contrast, in the package 2C of the present embodiment, the 2 nd base substrate 2b is divided into the lower portion 2b3 and the upper portion 2b 4.

Fig. 10 is a sectional view of the package 2C. As shown in the drawing, in the package 2C of the present embodiment, the 2 nd base substrate 2b is divided into the lower portion 2b3 and the upper portion 2b 4. That is, in the present embodiment, the package 2C is composed of a multilayer body in which a plurality of layer bodies of the 1 st base substrate 2a, the lower layer portion 2b3 of the 2 nd base substrate 2b, the upper layer portion 2b4 of the 2 nd base substrate 2b, and the 3 rd base substrate 2C are laminated in this order from the lower side.

Further, in the present embodiment, the wiring 60 for the piezoelectric vibrating reed is disposed at the interface between the lower layer portion 2b3 of the 2 nd base substrate 2b and the upper layer portion 2b4 of the 2 nd base substrate 2 b. Therefore, the wiring 60 for the piezoelectric vibrating reed is covered by the upper portion 2b4 of the 2 nd base substrate 2b and is not exposed to the inside of the cavity C. Therefore, the adhesion of chips generated by cutting the tip portion of the piezoelectric vibrating reed 3 to the wiring 60 for the piezoelectric vibrating reed can be suppressed.

(embodiment 5)

Next, embodiment 5 of the present invention will be described with reference to fig. 11. In the description of the present embodiment, the same portions as those in embodiment 1 above will be omitted or simplified.

In embodiment 1 described above, the package 2 is provided with the so-called side arm type piezoelectric vibrating reed 3. In contrast, the package 2D of the present embodiment is provided with a so-called cantilever-type piezoelectric vibrating reed 3A.

Fig. 11 is a top view of the package main body 4 and the conductive portion 6 of the present embodiment. As shown in the drawing, the piezoelectric vibrating reed 3A mounted on the package 2D is formed in a cantilever type in which the 1 st vibrating arm portion 3m and the 2 nd vibrating arm portion 3n extend in parallel from the base portion 3k in the longitudinal direction L.

In the package 2D of the present embodiment, the mounting portions 2g and 2h are disposed on one side in the longitudinal direction L of the cavity C. The wiring 63 for the piezoelectric vibrating reed is provided to connect the 1 st electrode pad 51 and the 1 st vibrating reed electrode 42. In the present embodiment, the 2 nd electrode pad 52 and the 2 nd vibrating reed electrode 43 are connected to each other through the through hole 70.

In the present embodiment, as shown in fig. 11, the wiring 63 for the piezoelectric vibrating reed is disposed so as to straddle the region where the piezoelectric vibrating reed 3A is disposed when viewed from the normal direction of the chip-mounting side surface, and further so as not to overlap the external power supply wiring 46 and the signal output wiring 47 when viewed from the same direction. Therefore, it is possible to suppress the noise component from being superimposed on the signal flowing through the wiring 63 for the piezoelectric vibrating reed and the wiring 47 for signal output, and to make the frequency indicated by the signal output from the terminal 31 for signal output more accurate.

(embodiment 6)

Next, embodiment 6 of the present invention will be described with reference to fig. 12. In the description of the present embodiment, the same portions as those of embodiment 1 are omitted or simplified.

In embodiment 1 described above, the package 2 is provided with the so-called side arm type piezoelectric vibrating reed 3. In contrast, the package 2E of the present embodiment is provided with the center arm type piezoelectric vibrating reed 3B.

Fig. 12 is a top view of the package main body 4 and the conductive portion 6 of the present embodiment. As shown in the figure, the piezoelectric vibrating reed 3B mounted on the package 2E is formed in a center arm type having: a single support arm portion 3q extending from the base portion 3p in the longitudinal direction L; and a pair of 1 st and 2 nd vibrating arm portions 3r and 3s arranged to sandwich the support arm portion 3q in the width direction W.

In the package 2E of the present embodiment, a single mounting portion 2j is provided at the center portion in the longitudinal direction L of the cavity C instead of the mounting portions 2g and 2 h. The mounting portion 2j is provided with a1 st electrode pad 51 and a 2 nd electrode pad 52.

The package 2E is provided with a wiring 64 for the piezoelectric vibrating reed, which connects the 1 st electrode pad 51 and the 1 st vibrating reed electrode 42.

In the present embodiment, as shown in fig. 12, the wiring 64 for the piezoelectric vibrating reed is disposed so as to straddle the region where the piezoelectric vibrating reed 3B is disposed when viewed from the normal direction of the chip-mounting side surface, and further so as not to overlap the external power supply wiring 46 and the signal output wiring 47 when viewed from the same direction. Therefore, it is possible to suppress the noise component from being superimposed on the signal flowing through the wiring 64 for the piezoelectric vibrating reed and the wiring 47 for signal output, and to make the frequency indicated by the signal output from the terminal 31 for signal output more accurate.

While the preferred embodiments of the present invention have been described above with reference to the drawings, it is needless to say that the present invention is not limited to the above embodiments. The various shapes, combinations, and the like of the respective constituent members shown in the above-described embodiments are examples, and various modifications can be made based on design requirements and the like without departing from the spirit of the present invention.

Description of the symbols

10 … … piezoelectric vibrator, 20 … … integrated circuit chip, 100 … … oscillator, 2 … … package (package for vibrator), 2a … … package (package for vibrator), 2B … … package (package for vibrator), 2C … … package (package for vibrator), 2D … … package (package for vibrator), 2E … … package (package for vibrator), 2a … … 1 th base substrate (layer), 2a1 … … lower surface, 2B … … nd base substrate (layer), 2B1 … … upper surface, 2B2 … … lower surface, 2B3 … … lower layer (layer), 2B4 … … upper layer (layer), 2C … … rd 3 base substrate (layer), 2C1 … … upper surface, 3 … … piezoelectric vibrating piece, 3a … … piezoelectric plate, 3a … … piezoelectric vibrating piece, 4 … … package body, a long side 4a … …, a long side 4b … …, a short side 4c … …, a short side 4D … …, a 6 … … conductive part, a 30 … … external power supply terminal, a 31 … … signal output terminal, a 40 … … external power supply electrode (chip electrode), a 41 … … signal output electrode (chip electrode), a 42 … … 1 st vibrating reed electrode (chip electrode), a 43 … … nd vibrating reed electrode (chip electrode), a 44 … … ground electrode (chip electrode), a 45 … … switching electrode (chip electrode), a 46 … … external power supply wiring, a 60 … … piezoelectric vibrating reed wiring, a 61 … … insulating coating, a 62 … … piezoelectric vibrating reed wiring, a 63 … … piezoelectric vibrating reed wiring, a 64 … … piezoelectric vibrating reed wiring, a D … … external power supply, and an S … … output signal.

Claims (8)

1. A package for a vibrator, which is a package for a vibrator having a package main body including a chip mounting side surface on which an integrated circuit chip is mounted and a vibrating reed mounting side surface which is disposed on a side opposite to the chip mounting side surface and on which a piezoelectric vibrating reed is mounted, the package for a vibrator comprising:

a plurality of chip electrodes provided on the chip mounting side surface and connected to terminals of the integrated circuit chip;

an external power supply terminal provided on the chip mounting side surface and connected to an external power supply;

a signal output terminal provided on the chip mounting side surface and outputting a signal to the outside;

an external power supply wire provided on the chip mounting side surface and connecting the chip electrode to the external power supply terminal;

a signal output wire provided on the chip mounting side surface and connecting the chip electrode to the signal output terminal;

a vibrating piece mounting pad provided on the vibrating piece mounting side surface and connected to the piezoelectric vibrating piece; and

and a wiring for a piezoelectric vibrating reed, which is arranged across a region where the piezoelectric vibrating reed is arranged without overlapping with the wiring for an external power supply and the wiring for signal output when viewed from a normal direction of the chip mounting side surface, and connects the vibrating reed mounting pad and the electrode for a chip.

2. The package for a vibrator according to claim 1, wherein,

at least a part of the wiring for the piezoelectric vibrating piece is provided on the vibrating piece mounting side surface,

and an insulating coating layer covering a portion of the wiring for the piezoelectric vibrating piece, the portion being provided on the vibrating piece mounting side surface.

3. The package for a vibrator according to claim 1, wherein the wiring for the piezoelectric vibrating reed is provided so as not to overlap with a tip portion of a vibrating arm portion of the piezoelectric vibrating reed when viewed from a normal direction of the chip mounting side surface.

4. The package for a vibrator according to claim 2, wherein the wiring for the piezoelectric vibrating reed is provided so as not to overlap with a tip portion of a vibrating arm portion of the piezoelectric vibrating reed when viewed from a normal direction of the chip mounting side surface.

5. The package for an oscillator according to claim 1,

the package main body is composed of a multilayer body in which a plurality of layer bodies are laminated,

the wiring for the piezoelectric vibrating reed is disposed at an interface between the two layers.

6. The package for a vibrator according to any one of claims 1 to 5,

the package main body is formed in a rectangular shape having a pair of long sides and a pair of short sides when viewed from a normal direction of the chip mounting side surface,

the external power supply terminal and the signal output terminal are arranged on one long side in a direction along the short side,

the chip electrode connected to the wiring for the piezoelectric vibrating reed is disposed on the other long side in the direction along the short side.

7. A piezoelectric vibrator includes:

the package for a vibrator according to any one of claims 1 to 5; and

and a piezoelectric vibrating reed mounted on the vibrating reed mounting side surface of the vibrator package.

8. An oscillator, comprising:

the piezoelectric vibrator according to claim 7; and

and an integrated circuit chip mounted on the chip mounting side surface of the package for a vibrator.

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