JP7568624B2 - 付加製造のための精密システム - Google Patents
付加製造のための精密システム Download PDFInfo
- Publication number
- JP7568624B2 JP7568624B2 JP2021532894A JP2021532894A JP7568624B2 JP 7568624 B2 JP7568624 B2 JP 7568624B2 JP 2021532894 A JP2021532894 A JP 2021532894A JP 2021532894 A JP2021532894 A JP 2021532894A JP 7568624 B2 JP7568624 B2 JP 7568624B2
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- JP
- Japan
- Prior art keywords
- oxetane
- ink
- photocurable material
- bis
- printing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000001514 detection method Methods 0.000 claims description 13
- 238000007639 printing Methods 0.000 claims description 13
- 229920002554 vinyl polymer Polymers 0.000 claims description 10
- -1 3-oxetanyl Chemical group 0.000 claims description 9
- 239000004971 Cross linker Substances 0.000 claims description 9
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- AHHWIHXENZJRFG-UHFFFAOYSA-N oxetane Chemical compound C1COC1 AHHWIHXENZJRFG-UHFFFAOYSA-N 0.000 claims description 9
- 125000003566 oxetanyl group Chemical group 0.000 claims description 9
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 6
- 238000005259 measurement Methods 0.000 claims description 6
- 125000000524 functional group Chemical group 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 5
- 230000002708 enhancing effect Effects 0.000 claims description 4
- MGFYSGNNHQQTJW-UHFFFAOYSA-N iodonium Chemical compound [IH2+] MGFYSGNNHQQTJW-UHFFFAOYSA-N 0.000 claims description 4
- 239000002245 particle Substances 0.000 claims description 4
- SUSQOBVLVYHIEX-UHFFFAOYSA-N phenylacetonitrile Chemical compound N#CCC1=CC=CC=C1 SUSQOBVLVYHIEX-UHFFFAOYSA-N 0.000 claims description 4
- AWOATHYNVXCSGP-UHFFFAOYSA-M (4-methylphenyl)-diphenylsulfanium;trifluoromethanesulfonate Chemical compound [O-]S(=O)(=O)C(F)(F)F.C1=CC(C)=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 AWOATHYNVXCSGP-UHFFFAOYSA-M 0.000 claims description 3
- CYIGRWUIQAVBFG-UHFFFAOYSA-N 1,2-bis(2-ethenoxyethoxy)ethane Chemical compound C=COCCOCCOCCOC=C CYIGRWUIQAVBFG-UHFFFAOYSA-N 0.000 claims description 3
- SAMJGBVVQUEMGC-UHFFFAOYSA-N 1-ethenoxy-2-(2-ethenoxyethoxy)ethane Chemical compound C=COCCOCCOC=C SAMJGBVVQUEMGC-UHFFFAOYSA-N 0.000 claims description 3
- JWYVGKFDLWWQJX-UHFFFAOYSA-N 1-ethenylazepan-2-one Chemical compound C=CN1CCCCCC1=O JWYVGKFDLWWQJX-UHFFFAOYSA-N 0.000 claims description 3
- WVXLLHWEQSZBLW-UHFFFAOYSA-N 2-(4-acetyl-2-methoxyphenoxy)acetic acid Chemical compound COC1=CC(C(C)=O)=CC=C1OCC(O)=O WVXLLHWEQSZBLW-UHFFFAOYSA-N 0.000 claims description 3
- JGTNAGYHADQMCM-UHFFFAOYSA-N perfluorobutanesulfonic acid Chemical compound OS(=O)(=O)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F JGTNAGYHADQMCM-UHFFFAOYSA-N 0.000 claims description 3
- 239000004094 surface-active agent Substances 0.000 claims description 3
- KFUSXMDYOPXKKT-VIFPVBQESA-N (2s)-2-[(2-methylphenoxy)methyl]oxirane Chemical compound CC1=CC=CC=C1OC[C@H]1OC1 KFUSXMDYOPXKKT-VIFPVBQESA-N 0.000 claims description 2
- UNMJLQGKEDTEKJ-UHFFFAOYSA-N (3-ethyloxetan-3-yl)methanol Chemical compound CCC1(CO)COC1 UNMJLQGKEDTEKJ-UHFFFAOYSA-N 0.000 claims description 2
- RSHKWPIEJYAPCL-UHFFFAOYSA-N (3-ethyloxetan-3-yl)methyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC1(CC)COC1 RSHKWPIEJYAPCL-UHFFFAOYSA-N 0.000 claims description 2
- NLQMSBJFLQPLIJ-UHFFFAOYSA-N (3-methyloxetan-3-yl)methanol Chemical compound OCC1(C)COC1 NLQMSBJFLQPLIJ-UHFFFAOYSA-N 0.000 claims description 2
- DWUGZIQLSUEMEO-UHFFFAOYSA-M (4-bromophenyl)-diphenylsulfanium;trifluoromethanesulfonate Chemical compound [O-]S(=O)(=O)C(F)(F)F.C1=CC(Br)=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 DWUGZIQLSUEMEO-UHFFFAOYSA-M 0.000 claims description 2
- WHQDLCHSPLKATA-UHFFFAOYSA-M (4-iodophenyl)-diphenylsulfanium;trifluoromethanesulfonate Chemical compound [O-]S(=O)(=O)C(F)(F)F.C1=CC(I)=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 WHQDLCHSPLKATA-UHFFFAOYSA-M 0.000 claims description 2
- WBUSZOLVSDXDOC-UHFFFAOYSA-M (4-methoxyphenyl)-diphenylsulfanium;trifluoromethanesulfonate Chemical compound [O-]S(=O)(=O)C(F)(F)F.C1=CC(OC)=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 WBUSZOLVSDXDOC-UHFFFAOYSA-M 0.000 claims description 2
- DFSWKIGXUOJVAC-UHFFFAOYSA-M (4-phenoxyphenyl)-diphenylsulfanium;trifluoromethanesulfonate Chemical compound [O-]S(=O)(=O)C(F)(F)F.C=1C=C([S+](C=2C=CC=CC=2)C=2C=CC=CC=2)C=CC=1OC1=CC=CC=C1 DFSWKIGXUOJVAC-UHFFFAOYSA-M 0.000 claims description 2
- RLAWXWSZTKMPQQ-UHFFFAOYSA-M (4-tert-butylphenyl)-diphenylsulfanium;trifluoromethanesulfonate Chemical compound [O-]S(=O)(=O)C(F)(F)F.C1=CC(C(C)(C)C)=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 RLAWXWSZTKMPQQ-UHFFFAOYSA-M 0.000 claims description 2
- YSUQLAYJZDEMOT-UHFFFAOYSA-N 2-(butoxymethyl)oxirane Chemical compound CCCCOCC1CO1 YSUQLAYJZDEMOT-UHFFFAOYSA-N 0.000 claims description 2
- HHRACYLRBOUBKM-UHFFFAOYSA-N 2-[(4-tert-butylphenoxy)methyl]oxirane Chemical compound C1=CC(C(C)(C)C)=CC=C1OCC1OC1 HHRACYLRBOUBKM-UHFFFAOYSA-N 0.000 claims description 2
- SHKUUQIDMUMQQK-UHFFFAOYSA-N 2-[4-(oxiran-2-ylmethoxy)butoxymethyl]oxirane Chemical compound C1OC1COCCCCOCC1CO1 SHKUUQIDMUMQQK-UHFFFAOYSA-N 0.000 claims description 2
- FEJVJGYJIPXMJD-UHFFFAOYSA-N 3-(cyclohexyloxymethyl)-3-ethyloxetane Chemical compound C1CCCCC1OCC1(CC)COC1 FEJVJGYJIPXMJD-UHFFFAOYSA-N 0.000 claims description 2
- JUXZNIDKDPLYBY-UHFFFAOYSA-N 3-ethyl-3-(phenoxymethyl)oxetane Chemical compound C=1C=CC=CC=1OCC1(CC)COC1 JUXZNIDKDPLYBY-UHFFFAOYSA-N 0.000 claims description 2
- LMIOYAVXLAOXJI-UHFFFAOYSA-N 3-ethyl-3-[[4-[(3-ethyloxetan-3-yl)methoxymethyl]phenyl]methoxymethyl]oxetane Chemical compound C=1C=C(COCC2(CC)COC2)C=CC=1COCC1(CC)COC1 LMIOYAVXLAOXJI-UHFFFAOYSA-N 0.000 claims description 2
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- UEJFJTOGXLEPIV-UHFFFAOYSA-M bis(4-tert-butylphenyl)iodanium;4-methylbenzenesulfonate Chemical compound CC1=CC=C(S([O-])(=O)=O)C=C1.C1=CC(C(C)(C)C)=CC=C1[I+]C1=CC=C(C(C)(C)C)C=C1 UEJFJTOGXLEPIV-UHFFFAOYSA-M 0.000 claims description 2
- VGZKCAUAQHHGDK-UHFFFAOYSA-M bis(4-tert-butylphenyl)iodanium;trifluoromethanesulfonate Chemical compound [O-]S(=O)(=O)C(F)(F)F.C1=CC(C(C)(C)C)=CC=C1[I+]C1=CC=C(C(C)(C)C)C=C1 VGZKCAUAQHHGDK-UHFFFAOYSA-M 0.000 claims description 2
- DJUWPHRCMMMSCV-UHFFFAOYSA-N bis(7-oxabicyclo[4.1.0]heptan-4-ylmethyl) hexanedioate Chemical compound C1CC2OC2CC1COC(=O)CCCCC(=O)OCC1CC2OC2CC1 DJUWPHRCMMMSCV-UHFFFAOYSA-N 0.000 claims description 2
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- PJANXHGTPQOBST-UHFFFAOYSA-N stilbene Chemical compound C=1C=CC=CC=1C=CC1=CC=CC=C1 PJANXHGTPQOBST-UHFFFAOYSA-N 0.000 claims description 2
- KEDGSDIAPIAOGT-UHFFFAOYSA-N triethoxy-[3-[(3-ethyloxetan-2-yl)methoxy]propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1OCC1CC KEDGSDIAPIAOGT-UHFFFAOYSA-N 0.000 claims description 2
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Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/10—Processes of additive manufacturing
- B29C64/106—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
- B29C64/112—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using individual droplets, e.g. from jetting heads
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
- B29C64/205—Means for applying layers
- B29C64/209—Heads; Nozzles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
- B29C64/227—Driving means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/30—Auxiliary operations or equipment
- B29C64/386—Data acquisition or data processing for additive manufacturing
- B29C64/393—Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y10/00—Processes of additive manufacturing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y50/00—Data acquisition or data processing for additive manufacturing
- B33Y50/02—Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y70/00—Materials specially adapted for additive manufacturing
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
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Description
本出願は、参照により本明細書に援用される、2018年12月10日に出願された米国仮特許出願第62/777,422号明細書の利益を主張する。
Claims (30)
- インクジェットプリンタと、光硬化性インクとを含む3D印刷システムであって、
前記インクジェットプリンタは、光学フィードバックスキャナと、噴射されたインクの光学フィードバックによりプリンタジェットからの材料の放出を制御するためのコントローラと、を含み、
前記インクは、光硬化性のカチオン重合性成分と、光増強成分とを含むことを特徴とする3D印刷システム。 - 前記インクジェットプリンタは、前記光硬化性インクを装填された印刷ヘッドを含む、請求項1に記載のシステム。
- 材料の層の堆積間に前記カチオン重合性成分を硬化させるように構成されたUVランプをさらに含む、請求項1又は2に記載のシステム。
- 非接触フィードバック手法を用いた3D印刷によるオブジェクトの製造方法であって、以下の方法:
カチオン重合性の光硬化性材料を含むインクを選択的に噴射し、オブジェクトの層を形成すること;
光重合によって前記光硬化性材料を硬化させること;
前記硬化の少なくとも一部が行われた後、部分的に硬化した前記光硬化性材料を光学的に検出すること;
前記インクをさらに選択的に噴射し、前記オブジェクトの後続の層を形成すること;および
前記検出によって生成された検出データに従って、前記さらなる噴射を修正すること;
を含み、
前記インクを選択的に噴射することは、カチオン重合性成分と光増強成分とを堆積することを含む方法。 - 非接触フィードバック手法を用いた3D印刷によるオブジェクトの製造方法であって、以下の方法:
カチオン重合性の光硬化性材料を含むインクを選択的に噴射し、オブジェクトの層を形成すること;
光重合によって前記光硬化性材料を硬化させること;
前記硬化の少なくとも一部が行われた後、部分的に硬化した前記光硬化性材料を光学的に検出すること;
前記インクをさらに選択的に噴射し、前記オブジェクトの後続の層を形成すること;および
前記検出によって生成された検出データに従って、前記さらなる噴射を修正すること;
を含み、
後続の層は、先に形成された層の前記光硬化性材料が部分的に硬化されるときに形成され、
前記インクを選択的に噴射することは、カチオン重合性成分と光増強成分とを堆積することを含む方法。 - 前記光増強成分は、スチルベン又はチオフェンの材料を含む、請求項4または5に記載の方法。
- カチオン重合性成分を堆積することは、光酸発生剤(PAG)を堆積することを含む、請求項4~6のいずれか一項に記載の方法。
- 前記カチオン重合性成分は、エポキシ官能基を有する分子、オキセタン官能基を有する分子、ビニル官能基を有する分子又はそれらの組み合わせからなる群から選択される、請求項4~7のいずれか一項に記載の方法。
- 前記エポキシ官能基を有する分子は、エポキシモノマー、エポキシオリゴマー、エポキシ架橋剤又はそれらの任意の組み合わせを含む、請求項8に記載の方法。
- 前記エポキシ官能基を有する分子は、2,3-エポキシプロピルフェニルエーテル、o-クレシルグリシジルエーテル、p-tert-ブチルフェニルグリシジルエーテル、ブチルグリシジルエーテル、1,4-ブタンジオールジグリシジルエーテル、(3-4-エポキシシクロヘキサン)メチル3’-4’-エポキシシクロヘキシル-カルボキシレート、ビス(7-オキサビシクロ[4.1.0]ヘプタ-3-イルメチル)アジペート、変性ビスフェノールA液体エポキシ樹脂及びビスフェノールFエポキシ樹脂からなる群から選択される、請求項8に記載の方法。
- 前記オキセタン官能基を有する分子は、オキセタンモノマー、オキセタンオリゴマー、オキセタン架橋剤又はそれらの任意の組み合わせを含む、請求項8に記載の方法。
- 前記オキセタン官能基を有する分子は、3-エチル-3-(メタクリロイルオキシ)メチルオキセタン、ビス[1-エチル(3-オキセタニル)]メチルエーテル、3-エチル-3-ヒドロキシメチルオキセタン、3-メチル-3-オキセタンメタノール、1,4-ビス[(3-エチル-3-オキセタニルメトキシ)メチル]ベンゼン、3-エチル-3-シクロヘキシルオキシメチル-オキセタン、3-エチル-3-フェノキシメチル-オキセタン及び3-エチル-[(トリエトキシシリルプロポキシ)メチル]オキセタンからなる群から選択される、請求項8に記載の方法。
- 前記ビニル官能基を有する分子は、ビニルモノマー、ビニルオリゴマー、ビニル架橋剤又はそれらの任意の組み合わせを含む、請求項8に記載の方法。
- 前記ビニル官能基を有する分子は、1,4-シクロヘキサンジメタノールジビニルエーテル、ジエチレングリコールジビニルエーテル、トリエチレングリコールジビニルエーテル及びN-ビニル-カプロラクタムからなる群から選択される、請求項8に記載の方法。
- 前記光酸発生剤は、ベンゼンアセトニトリル,2-メチル-α-[2-[[(プロピルスルホニル)オキシ]イミノ]-3(2H)-チエニリデン]、-エタノン,1,1’-(1,3-プロパンジイルビス(オキシ-4,1-フェニレン))ビス(2,2,2-トリフルオロ-,1,1’-ビス(O-(プロピルスルホニル)オキシム)、ビス(4-tert-ブチルフェニル)ヨードニウムトリフレート(99%min)、ビス(4-tert-ブチルフェニル)ヨードニウムパーフルオロ-1-ブタンスルホネート(99%min)、ビス(4-tert-ブチルフェニル)ヨードニウムp-トルエンスルホネート(99%min)、(4-tert-ブチルフェニル)ジフェニルスルホニウムトリフレート、トリフェニルスルホニウムパーフルオロ-1-ブタンスルホネート(9%min)、トリフェニルスルホニウムトリフレート(λmax233nm)、(4-フルオロフェニル)ジフェニルスルホニウムトリフレート、(4-ブロモフェニル)ジフェニルスルホニウムトリフレート(λmax242nm)、(4-メチルフェニル)ジフェニルスルホニウムトリフレート、(4-メトキシフェニル)ジフェニルスルホニウムトリフレート(λmax260nm)、(4-ヨードフェニル)ジフェニルスルホニウムトリフレート(λmax262nm)、(4-フェニルチオフェニル)ジフェニルスルホニウムトリフレート(λmax298nm)、(4-フェノキシフェニル)ジフェニルスルホニウムトリフレート(λmax256nm)、スルホニウムテトラキス[ペンタフルオロフェニル]ボレート及びプロピレンカーボネート中のヨードニウム,(4-メチルフェニル)[4-(2-メチルプロピル)フェニル]-,ヘキサフルオロホスフェート(1-)の75%溶液からなる群から選択される、請求項7~14のいずれか一項に記載の方法。
- 前記光酸発生剤は、前記光硬化性材料の全重量を基準として0.1%~10%である、請求項7~14のいずれか一項に記載の方法。
- 前記光酸発生剤は、前記光硬化性材料の全重量を基準として0.5%~5%である、請求項7~14のいずれか一項に記載の方法。
- 前記光硬化性材料の機械的、熱的及び/又は光学的性質を高める粒子を堆積することをさらに含む、請求項4~17のいずれか一項に記載の方法。
- 界面活性剤を前記光硬化性材料とともに堆積することをさらに含む、請求項4~17のいずれか一項に記載の方法。
- 増感剤を堆積することをさらに含む、請求項4~17のいずれか一項に記載の方法。
- 前記光硬化性材料を検出することは、印刷される物体の表面をキャプチャすることを含む、請求項4~20のいずれか一項に記載の方法。
- 前記光硬化性材料を検出することは、印刷される物体の体積データ又はトモグラフィーデータをキャプチャすることを含む、請求項4~20のいずれか一項に記載の方法。
- 前記さらなる噴射を修正することは、前記検出によって生成された検出データにしたがって前記さらなる噴射を修正するための能動的フィードバックループを使用することを含む、請求項4~22のいずれか一項に記載の方法。
- 前記さらなる噴射を修正することは、印刷される物体の表面の測定に基づく、請求項23に記載の方法。
- 前記さらなる噴射を修正することは、印刷される物体の体積データ/トモグラフィーデータの測定を使用する、請求項23に記載の方法。
- 印刷プラットフォーム又は印刷チャンバーを加熱し、それにより光硬化性材料の硬化を加速させることをさらに含む、請求項4~25のいずれか一項に記載の方法。
- 非一時的機械可読媒体上に記憶された命令を含むソフトウェアであって、前記命令の実行は、請求項4~26のいずれか一項に記載の方法の制御を引き起こす、ソフトウェア。
- 請求項4~26のいずれか一項に記載の3D印刷のための方法に使用するための光硬化性材料を提供することを含む方法。
- 請求項4~26のいずれか一項に記載のすべてのステップを行うように構成された3D印刷システム。
- 請求項4~17のいずれか一項に記載のすべてのステップを行うように構成されている、請求項1~3のいずれか一項に記載のシステム。
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AU2019397442A1 (en) | 2021-07-15 |
WO2020123479A1 (en) | 2020-06-18 |
EP3883745A1 (en) | 2021-09-29 |
US20200338832A1 (en) | 2020-10-29 |
US11173667B2 (en) | 2021-11-16 |
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