JP7544547B2 - Processing Equipment - Google Patents

Description

The present invention relates to a processing device.

In a TSV wafer having a through silicon via (TSV) that is a through electrode, the back surface is planarized by grinding and CMP (chemical mechanical polishing), and the through electrode exposed on the front surface is planarized by CMP. In recent years, the wiring of the through electrodes has been switched from aluminum wiring to copper wiring, so the through electrodes are planarized by turning with a cutting tool and CMP. Therefore, as disclosed in Patent Document 1, by enabling turning with a cutting tool and CMP with the processing means of a single processing device, the device can be made smaller and productivity improved.

JP 2016-92281 A

In the device described in Patent Document 1, turning and CMP are performed in the same processing chamber. As a result, debris from the turning process may adhere to the underside of the polishing pad, potentially causing scratches on the polished surface of the wafer during CMP.

Even if the processing means is capable of performing both grinding and CMP, there is a possibility that grinding debris from the grinding process may adhere to the underside of the polishing pad, causing scratches on the polished surface of the wafer during CMP.

Therefore, the object of the present invention is to prevent processing waste generated during one process from adversely affecting the other process that is performed subsequently.

The processing device of the present invention (the present processing device) is a processing device that includes a chuck table that holds a wafer by a holding surface, processing means equipped with a processing tool for processing the wafer held on the chuck table, processing feed means that feeds the processing means in a direction perpendicular to the holding surface, and a processing chamber that accommodates the chuck table and the processing tool, and the processing means includes a first mount whose upper surface is connected to the lower end of a spindle that extends in the perpendicular direction and whose lower surface is equipped with a first processing tool, and a first mount whose inner diameter is larger than the outer diameter of the first mount. a second mount having a circular annular shape concentric with the first mount and a second processing tool attached to its underside; and a selection means for selectively bringing the first processing tool or the second processing tool closer to the holding surface by relatively moving the first mount and the second mount in the vertical direction, and the processing chamber surrounds the first processing tool and divides the processing chamber into upper and lower parts when the first processing tool processes a wafer held on the holding surface. a partition mechanism for protecting the second processing tool from chips produced by processing the first processing tool, the partition mechanism comprising a first partition plate having a first semicircular recess along an outer surface of the first processing tool and extending horizontally, a second partition plate having a second semicircular recess facing the first semicircular recess along the outer surface of the first processing tool and extending horizontally, a first horizontal movement mechanism for moving the first partition plate in the horizontal direction, and a second horizontal movement mechanism for moving the second partition plate in the horizontal direction, and when the wafer held on the holding surface is processed by the second processing tool, The partition plate and the second partition plate are moved away from the spindle in the horizontal direction, allowing the second processing tool to pass between the first semicircular recess and the second semicircular recess. When processing the wafer held on the holding surface by the first processing tool, the first partition plate and the second partition plate are moved toward the spindle in the horizontal direction, and the first processing tool is surrounded by a circle formed by connecting the first semicircular recess and the second semicircular recess, protecting the second processing tool from processing chips generated by the first processing tool processing the wafer.

In this processing device, the first processing tool may be a turning tool or a grinding wheel, and the second processing tool may be an abrasive pad.

The processing device may further include water outlets on the first and second partition plates for spraying water toward the first processing tool.

In this processing device, when processing a wafer with the first processing tool, the first partition plate and the second partition plate divide the processing chamber into upper and lower parts so that the first processing tool is surrounded by the first semicircular recess and the second semicircular recess. Therefore, the second processing tool located on the upper side of the processing chamber can be protected from processing debris generated when the tip of the first processing tool located on the lower side of the processing chamber processes the wafer. This makes it possible to prevent processing debris from adhering to the second processing tool. Therefore, it is possible to prevent the processing surface of the wafer being processed by the second processing tool from being damaged by processing debris.

FIG. 2 is a cross-sectional view showing a configuration of a processing device. FIG. 2 is a cross-sectional view showing a configuration of a processing device. FIG. 4 is an explanatory diagram showing a first partition plate and a second partition plate connected to each other. FIG. 2 is a cross-sectional view showing a configuration of a processing device. FIG. 11 is an explanatory diagram showing the first partition plate and the second partition plate being moved away from each other. FIG. 2 is an explanatory diagram showing a first partition plate and a second partition plate equipped with water outlets.

As shown in FIG. 1, the processing device 1 according to this embodiment is a device for grinding and polishing a wafer 100 as a workpiece, and includes a control unit 5 that controls each component of the processing device 1.

The wafer 100 is, for example, a circular semiconductor wafer. The front surface 101 of the wafer 100 holds multiple devices and is protected by the application of a protective tape 103. The back surface 102 of the wafer 100 is the processing surface on which grinding and polishing are performed.

The processing device 1 is equipped with a holding means 30 for holding the workpiece. The holding means 30 includes a chuck table 31, a support member 33 that supports the chuck table 31, and a rotating means 34 that rotates the chuck table 31.

The chuck table 31 has a holding surface 32 that holds the wafer 100, and a frame 36 that surrounds the holding surface 32. In this embodiment, the upper surface of the frame 36 is formed to be substantially flush with the holding surface 32, and has the same height as the holding surface 32.

The holding surface 32 of the chuck table 31 is made of, for example, a porous material, and is connected to a suction source (not shown) to hold the wafer 100 by suction through the protective tape 103. That is, the chuck table 31 holds the wafer 100 by means of the holding surface 32.

The chuck table 31 can be rotated by the rotating means 34 provided below about a central axis extending in the Z-axis direction passing through the center of the holding surface 32 while holding the wafer 100 by the holding surface 32. Therefore, the wafer 100 is held by the holding surface 32 and rotated about the center of the holding surface 32.

A cover plate 37 is provided around the support member 33. A bellows cover (not shown) that expands and contracts in the Y-axis direction is connected to the +Y and -Y sides of the cover plate 37. And, a Y-axis direction moving means 40 is disposed below the holding means 30. The Y-axis direction moving means 40 moves the holding means 30 along the Y-axis direction.

The Y-axis direction moving means 40 moves the holding means 30 and the processing means 70 relative to each other in the Y-axis direction parallel to the holding surface 32. In this embodiment, the Y-axis direction moving means 40 is configured to move the holding means 30 in the Y-axis direction relative to the processing means 70.

In addition, the processing device 1 may have a turntable having multiple holding means 30 as a horizontal movement means instead of the Y-axis movement means 40.

The Y-axis direction moving means 40 includes a Y-axis guide rail 42 parallel to the Y-axis direction, a Y-axis moving table 45 that slides on the Y-axis guide rail 42, a Y-axis ball screw 43 parallel to the Y-axis guide rail 42, a Y-axis motor 44 connected to the Y-axis ball screw 43, and a holder 41 that holds these.

The Y-axis moving table 45 is slidably installed on the Y-axis guide rail 42 via a slide member 451. A nut portion 401 is fixed to the underside of the Y-axis moving table 45. The Y-axis ball screw 43 is screwed into this nut portion 401. The Y-axis motor 44 is connected to one end of the Y-axis ball screw 43.

In the Y-axis direction moving means 40, the Y-axis motor 44 rotates the Y-axis ball screw 43, causing the Y-axis moving table 45 to move in the Y-axis direction along the Y-axis guide rail 42. The support member 33 of the holding means 30 is placed on the Y-axis moving table 45 via the support pillar 35. Therefore, as the Y-axis moving table 45 moves in the Y-axis direction, the holding means 30 including the chuck table 31 moves in the Y-axis direction.

In this embodiment, the holding means 30 is moved along the Y-axis direction by the Y-axis moving means 40 between a processing position at the rear (+Y direction side) and a loading/unloading position at the front (-Y direction side).

As shown in FIG. 1, a column 3 is erected behind the holding means 30 (on the +Y direction side). A processing means 70 for processing the wafer 100 and a processing feed means 50 are provided in front of the column 3.

The processing feed means 50 is a vertical movement means that relatively feeds the holding means 30 and the processing means 70 in the Z-axis direction (processing feed direction) perpendicular to the holding surface 32. In this embodiment, the processing feed means 50 is configured to feed the processing means 70 relative to the holding means 30 in the Z-axis direction perpendicular to the holding surface 32.

The processing feed means 50 includes a Z-axis guide rail 51 parallel to the Z-axis direction, a Z-axis moving table 53 that slides on the Z-axis guide rail 51, a Z-axis ball screw 52 parallel to the Z-axis guide rail 51, a Z-axis motor 54, a Z-axis encoder 55 for detecting the rotation angle of the Z-axis motor 54, a memory unit 57 for storing the detection results of the Z-axis encoder 55, and a holder 56 attached to the front (surface) of the Z-axis moving table 53. The holder 56 holds the processing means 70.

The Z-axis moving table 53 is slidably mounted on the Z-axis guide rail 51 via a slide member 531. A nut portion 501 is fixed to the rear side (back side) of the Z-axis moving table 53. The Z-axis ball screw 52 is screwed into this nut portion 501. The Z-axis motor 54 is connected to one end of the Z-axis ball screw 52.

In the processing feed means 50, the Z-axis motor 54 rotates the Z-axis ball screw 52, causing the Z-axis moving table 53 to move in the Z-axis direction along the Z-axis guide rail 51. As a result, the holder 56 attached to the Z-axis moving table 53 and the processing means 70 held by the holder 56 also move in the Z-axis direction together with the Z-axis moving table 53.

The processing means 70 includes a spindle unit 71. The spindle unit 71 includes a spindle 72 extending in a direction perpendicular to the holding surface 32, a spindle motor 73 that rotates the spindle 72, and a casing 74 that surrounds the spindle 72 and the spindle motor 73.

The spindle 72 has a first shaft portion 721 and a second shaft portion 723 formed with a larger diameter than the first shaft portion 721. A thrust plate 722 is disposed between the first shaft portion 721 and the second shaft portion 723. The spindle 72 further has a large diameter cylinder portion 724 formed below the second shaft portion 723, and a small diameter cylinder portion 725 formed below the large diameter cylinder portion 724.

An air flow path 60 is formed inside the casing 74. The air flow path 60 is connected to the air supply source 39. The air flow path 60 branches into multiple branch paths inside the casing 74. The air flow path 60 is connected to openings on the upper surface 61, side surface 62, and lower surface 63 of the casing 74.

Air supplied from the air supply source 39 passes through the air flow path 60 of the casing 74 and is ejected to the outside of the casing 74 from openings on the top surface 61, side surfaces 62, and bottom surface 63 of the casing 74.

By blowing air from the top surface 61, side surface 62, and bottom surface 63 of the casing 74, gaps are formed between the casing 74 and the thrust plate 722 of the spindle 72, between the casing 74 and the second shaft portion 723 of the spindle 72, and between the casing 74 and the large diameter cylinder portion 724 of the spindle 72. As a result, bearings are formed in these gaps that support the spindle 72 rotatably without contact using air.

The upper surface of a disk mount 95 serving as a first mount is connected to the lower end of the small diameter cylinder portion 725, which is the lower end of the spindle 72. In addition, a guide portion 84 is provided between the lower surface of the large diameter cylinder portion 724 of the spindle 72 and the disk mount 95 to connect the two.

A grinding wheel 96 is attached to the lower surface of the disk mount 95. The grinding wheel 96 includes a wheel base 97 and a plurality of grinding stones 98, each of which has a substantially rectangular parallelepiped shape and is arranged in an annular shape at the lower end of the wheel base 97.
The grinding wheel 98 can be rotated by the spindle motor 73 via the spindle 72 , the disc mount 95 and the wheel base 97 .

In addition, a reciprocating mechanism 80 is provided in the large diameter cylinder portion 724 and the small diameter cylinder portion 725 of the spindle 72. The reciprocating mechanism 80 includes a housing chamber 81 that is provided in the large diameter cylinder portion 724 of the spindle 72. A piston 82 is housed in the housing chamber 81.

A number of piston rods 83 are connected to the bottom of the piston 82. The piston rods 83 are arranged at equal intervals around the circumference of the piston 82. Note that only one piston rod 83 is shown in FIG. 1.

An annular plate 90 is connected to the lower end of the piston rod 83. The annular plate 90 also has a through hole 901 through which the above-mentioned guide portion 84 passes.

An annular mount 91 serving as a second mount is connected to the underside of the annular plate 90. An annular polishing pad 93 serving as a second processing tool for polishing the workpiece is attached to the underside of the annular mount 91 via a platen 92.

The annular mount 91, platen 92 and polishing pad 93 have an inner diameter larger than the outer diameters of the disc mount 95 and grinding wheel 96, and are formed in a circular ring shape concentric with the disc mount 95.

The polishing pad 93 can be rotated around its center by the spindle motor 73 via the spindle 72, the annular plate 90, the annular mount 91 and the platen 92.

The polishing pad 93 and the grinding wheel 98 described above are examples of processing tools for processing the wafer 100 held on the chuck table 31. The grinding wheel 98 is an example of a first processing tool provided on the inside, and the polishing pad 93 is an example of a second processing tool provided on the outside.

An air source 86 is connected to the storage chamber 81 of the advance/retract mechanism 80 via a regulator 85. In the advance/retract mechanism 80, air from the air source 86 is supplied to the storage chamber 81 from above via the regulator 85, applying a pressing force to the piston 82 in the -Z direction, causing the piston 82 to descend in the Z-axis direction.

In addition, by supplying air to the storage chamber 81 from below, a pressing force can be applied to the piston 82 in the +Z direction, causing the piston 82 to rise in the Z-axis direction.

When the piston 82 moves up and down in the Z-axis direction, the annular plate 90 connected to the piston 82 via the piston rod 83 moves up and down while being guided by the guide portion 84. Accordingly, the polishing pad 93 attached to the annular plate 90 moves up and down. In this way, the polishing pad 93 and the grinding wheel 98 move forward and backward relative to each other along the Z-axis direction.

In this way, the advance/retract mechanism 80 functions as a selection means for selectively bringing the grinding wheel 98 or the polishing pad 93 closer to the holding surface 32 by relatively moving the disc mount 95 and the annular mount 91 in the Z-axis direction, which is a direction perpendicular to the holding surface 32.

As described above, the annular mount 91, the platen 92, and the polishing pad 93 have inner diameters larger than the outer diameters of the disc mount 95 and the grinding wheel 96. Therefore, the disc mount 95 and the grinding wheel 96 are housed inside the annular mount 91, the platen 92, and the polishing pad 93 without contacting each other, and the polishing pad 93 can move vertically relative to the grinding wheel 98.

As shown in FIG. 1 and FIG. 2, which is a cross-sectional view of the processing device 1 along the Y-axis direction, the processing device 1 has a processing chamber 20 that is substantially box-shaped below the processing means 70. The processing chamber 20 is formed to accommodate the chuck table 31 of the holding means 30 that holds the wafer 100 when the wafer 100 is processed, and the grinding wheel 98 and polishing pad 93 that are the processing tools of the processing means 70.

1 and 2, the processing chamber 20 includes an upper plate 21 having a processing tool introduction hole 211. The processing tool introduction hole 211 is provided to allow a grinding wheel 98 and a polishing pad 93, which are processing tools of the processing means 70, to be introduced into the processing chamber 20. The processing chamber 20 is configured to include the upper plate 21, side plates 22, a front plate 23 on the -Y side, a rear plate 24 on the +Y side, and a cover plate 37 of the holding means 30, which serves as a bottom plate. The front plate 23 is provided to hang down from the upper plate 21 by a length that allows the holding means 30 to move into the processing chamber 20 along the Y-axis direction.
In addition, a cylindrical bellows cover that connects the upper plate 21 of the machining chamber 20 and the lower surface of the holder 56 and covers the machining tool introduction hole 211 and is capable of expanding and contracting in the vertical direction is provided to prevent machining chips from spraying out of the machining tool introduction hole 211.

As shown in Figs. 1 and 2, the processing chamber 20 is also provided with a partition mechanism 10. The partition mechanism 10 moves the grinding wheel 98 closer to the holding surface 32 than the polishing pad 93 by the forward/backward mechanism 80, and when the wafer 100 held on the holding surface 32 is being processed by the grinding wheel 98, the partition mechanism 10 surrounds the grinding wheel 98, partitioning the processing chamber 20 into upper and lower parts, and protecting the polishing pad 93 from the processing debris produced by the grinding wheel 98 processing the wafer 100.

As shown in FIG. 2, the partition mechanism 10 includes a first partition plate 11 and a second partition plate 12 that both extend in the horizontal direction.
3 shows the machining chamber 20 and the partition mechanism 10 from above. As shown in this Fig. 3, the first partition plate 11 has a first semicircular recess 111 along the outer surface of the grinding wheel 98. In addition, the second partition plate has a second semicircular recess 121 along the outer surface of the grinding wheel 98 facing the first semicircular recess 111.

Furthermore, as shown in Figure 2, the partition mechanism 10 is equipped with a first horizontal movement mechanism 13 that moves the first partition plate 11 horizontally along the X-axis direction, and a second horizontal movement mechanism 14 that moves the second partition plate 12 horizontally along the X-axis direction.
The first horizontal movement mechanism 13 and the second horizontal movement mechanism 14 are attached to the lower surface of an upper plate 21 in the processing chamber 20 .

As shown in FIG. 3, the first horizontal movement mechanism 13 and the second horizontal movement mechanism 14 each include an arm portion 201 connected to the first partition plate 11 and the second partition plate 12, and a drive device 200 that moves the arm portion 201 along the X-axis direction. In the first horizontal movement mechanism 13 and the second horizontal movement mechanism 14, the drive device 200 moves the arm portion 201 along the X-axis direction, thereby moving the first partition plate 11 and the second horizontal movement mechanism 14 horizontally along the X-axis direction, making it possible to bring them closer to each other and connect them.

That is, in the partition mechanism 10, the first partition plate 11 and the second partition plate 12 are moved close to each other and connected by the first horizontal movement mechanism 13 and the second horizontal movement mechanism 14, so that the first partition plate 11 and the second partition plate 12 divide the processing chamber 20 into upper and lower parts so as to surround the grinding wheel 98 by the first semicircular recess 111 and the second semicircular recess 121. At this time, the first semicircular recess 111 and the second semicircular recess 121 are connected to each other to form a circle smaller than the outer diameter of the polishing pad 93 shown by the dashed line in Fig. 3, and this circle surrounds the grinding wheel 98. Therefore, the partition mechanism 10 can protect the polishing pad 93 from processing chips generated by the grinding wheel 98 processing the wafer 100.
In addition, a guide rail extending in the X-axis direction may be provided to facilitate the movement of the first partition plate 11 and the second partition plate 12.

In the processing device 1 having such a configuration, when the wafer 100 held on the holding surface 32 is polished by the polishing pad 93, the control unit 5 moves the first partition plate 11 and the second partition plate 12 away from the spindle 72 in the horizontal direction, as shown in Figs. 4 and 5. This allows the polishing pad 93 to pass between the first semicircular recess 111 of the first partition plate 11 and the second semicircular recess 121 of the second partition plate 12. The control unit 5 then controls the forward/backward mechanism 80 to move the polishing pad 93 closer to the holding surface 32 than the grinding wheel 98. In this state, the control unit 5 performs polishing by the polishing pad 93 on the wafer 100 held by the holding surface 32.

On the other hand, when the wafer 100 held on the holding surface 32 is ground by the grinding wheel 98, the control unit 5 controls the forward/backward mechanism 80 to bring the grinding wheel 98 closer to the holding surface 32 than the polishing pad 93, as shown in Figs. 2 and 3. The control unit 5 then moves the first partition plate 11 and the second partition plate 12 closer to the spindle in the horizontal direction, and surrounds the grinding wheel 98 with a circle formed by connecting the first semicircular recess 111 and the second semicircular recess 121. In this state, the control unit 5 performs grinding by the grinding wheel 98 on the wafer 100 held by the holding surface 32.

As described above, in this embodiment, when the wafer 100 is processed by the grinding wheel 98, the first partition plate 11 and the second partition plate 12 divide the processing chamber 20 into upper and lower parts so as to surround the grinding wheel 98 by the first semicircular recess 111 and the second semicircular recess 121. Therefore, the polishing pad 93 located on the upper side of the processing chamber 20 can be protected from processing debris generated when the tip (lower surface) of the grinding wheel 98 located on the lower side of the processing chamber 20 processes the wafer 100. This makes it possible to prevent processing debris from adhering to the polishing pad 93. Therefore, it is possible to prevent the back surface 102 of the wafer 100, which is polished by the polishing pad 93, from being damaged by the processing debris.

In this embodiment, as shown in FIG. 6, the upper surfaces of the first partition plate 11 and the second partition plate 12 may be provided with a plurality of water outlets 16 for spraying water toward the grinding wheel 98. The water outlets 16 are for spraying processing water from a water source (not shown) from the side toward the grinding wheel 98, as shown by the arrow in FIG. 6, during processing by the grinding wheel 98 to which the first partition plate 11 and the second partition plate 12 are connected.

In this configuration, by spraying processing water from the side of the grinding wheel 98 while the grinding wheel 98 is processing the wafer 100, processing debris generated by the grinding wheel 98 can be prevented from reaching the polishing pad 93 through the gap between the first and second partition plates 11 and 12 and the grinding wheel 98. Therefore, the polishing pad 93 can be better protected from processing debris.

In addition, the water outlet 16 may be provided on the underside or inside of the first partition plate 11 and the second partition plate 12 instead of on the upper surface of the first partition plate 11 and the second partition plate 12 so as to be able to spray water toward the grinding wheel 98.
In addition, water outlets 16 may be provided on the inner surface of the first semicircular recess 111 of the first partition plate 11 and the inner surface of the second semicircular recess 121 of the second partition plate 12 .

In this embodiment, the processing device 1 is equipped with a grinding wheel 98 as a first inner processing tool, and a polishing pad 93 as a second outer processing tool. This polishing pad 93 may be either a polishing pad for CMP polishing or a polishing pad for dry polishing.

In addition, the combination of the first processing tool and the second processing tool that can be used in the processing device 1 is not limited to the combination of the grinding wheel 98 and the polishing pad 93. For example, the processing device 1 may have a turning tool as the first processing tool on the inside and a polishing pad 93 as the second processing tool on the outside. Alternatively, the processing device 1 may have a grinding wheel 98 as the first processing tool on the inside and a turning tool or a grinding wheel 98 as the second processing tool on the outside. Alternatively, the processing device 1 may have a turning tool as the first processing tool on the inside and a grinding wheel 98 as the second processing tool on the outside. Alternatively, the processing device 1 may have a polishing pad 93 as the first processing tool on the inside and a turning tool, a grinding wheel 98, or a polishing pad 93 as the second processing tool on the outside.

1: processing device, 3: column, 5: control unit,
100: wafer, 101: front surface, 102: back surface, 103: protective tape,
10: partition mechanism, 11: first partition plate, 12: second partition plate,
111: first semicircular recess, 121: second semicircular recess,
13: first horizontal movement mechanism, 14: second horizontal movement mechanism, 16: water spout,
20: processing chamber, 21: upper plate, 22: side plate, 23: front plate, 24: rear plate,
211: tool introduction hole,
30: holding means, 31: chuck table, 32: holding surface, 36: frame body,
33: Support member, 34: Rotation means, 35: Support column, 37: Cover plate,
39: air supply source, 60: air flow path,
40: Y-axis direction moving means, 50: processing feed means,
70: Processing means, 71: Spindle unit,
72: spindle, 73: spindle motor, 74: casing,
721: first shaft portion, 722: thrust plate, 723: second shaft portion,
724: large diameter cylinder portion, 725: small diameter cylinder portion,
80: advance/retreat mechanism, 81: accommodation chamber, 82: piston,
83: piston rod, 84: guide portion,
85: regulator, 86: air source,
90: annular plate; 91: annular mount; 92: platen; 93: polishing pad;
95: disc mount, 96: grinding wheel, 97: wheel base, 98: grinding stone

Claims (3)

A processing apparatus comprising: a chuck table that holds a wafer by a holding surface; processing means having a processing tool for processing the wafer held on the chuck table; processing feed means that feeds the processing means in a direction perpendicular to the holding surface; and a processing chamber that contains the chuck table and the processing tool,
The processing means is
a first mount having an upper surface connected to a lower end of the spindle extending in the vertical direction and having a first processing tool attached to a lower surface;
a second mount having an inner diameter larger than an outer diameter of the first mount, a circular shape concentric with the first mount, and a second processing tool attached to a lower surface of the second mount;
a selection means for selectively bringing the first processing tool or the second processing tool close to the holding surface by relatively moving the first mount and the second mount in the perpendicular direction;
The processing chamber comprises:
a partition mechanism that surrounds the first processing tool, divides the processing chamber into upper and lower parts, and protects the second processing tool from processing chips generated when the first processing tool processes the wafer, while the first processing tool is moved closer to the holding surface than the second processing tool by the selection means and the wafer held on the holding surface is processed by the first processing tool,
The partition mechanism includes:
a first partition plate extending horizontally and including a first semicircular recess along an outer surface of the first processing tool;
a second partition plate extending horizontally and including a second semicircular recess facing the first semicircular recess along an outer surface of the first processing tool;
a first horizontal movement mechanism that moves the first partition plate in a horizontal direction;
a second horizontal movement mechanism that moves the second partition plate in a horizontal direction,
When processing the wafer held on the holding surface by the second processing tool, the first partition plate and the second partition plate are moved away from the spindle in a horizontal direction to allow the second processing tool to pass between the first semicircular recess and the second semicircular recess;
When the wafer held on the holding surface is processed by the first processing tool, the first partition plate and the second partition plate are moved toward the spindle in the horizontal direction, and the first processing tool is surrounded by a circle formed by connecting the first semicircular recess and the second semicircular recess, thereby protecting the second processing tool from processing chips generated by the first processing tool processing the wafer.
Processing equipment. The first tool is a turning tool or a grinding wheel, and the second tool is an abrasive pad.
The processing device according to claim 1. The first partition plate and the second partition plate further include water outlets for ejecting water toward the first processing tool.
The processing device according to claim 1.

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