JP7535699B2

JP7535699B2 - How a capacitor is manufactured

Info

Publication number: JP7535699B2
Application number: JP2020157935A
Authority: JP
Inventors: 武志今村; 寿久三浦; 英里子金谷
Original assignee: Panasonic Intellectual Property Management Co Ltd
Current assignee: Panasonic Intellectual Property Management Co Ltd
Priority date: 2020-09-18
Filing date: 2020-09-18
Publication date: 2024-08-19
Anticipated expiration: 2040-09-18
Also published as: JP2024133339A; JP2022051449A

Description

本発明は、コンデンサの製造方法に関する。 The present invention relates to a method for manufacturing a capacitor.

コンデンサ素子の両端面にメタリコン電極を形成し、それぞれのメタリコン電極にバスバーを接続し、一対のバスバーの一部を、絶縁性樹脂により形成された保持部材を間に挟んで重ね合わせ、相互インダクタンス（等価直列インダクタンス）を低減させるようにしたフィルムコンデンサが、特許文献１に記載されている。 Patent document 1 describes a film capacitor in which metallikon electrodes are formed on both end faces of a capacitor element, bus bars are connected to each metallikon electrode, and portions of the pair of bus bars are overlapped with a holding member formed of insulating resin sandwiched between them, thereby reducing mutual inductance (equivalent series inductance).

特許文献１のフィルムコンデンサでは、一対のバスバーの各第１部分が保持部材の平板部を挟んで重なる。各第１部分の一端には、外部接続端子部が形成されている。 In the film capacitor of Patent Document 1, the first portions of a pair of bus bars overlap with the flat plate portion of the holding member sandwiched between them. An external connection terminal portion is formed at one end of each of the first portions.

国際公開第２０１６／０２７４６２号International Publication No. 2016/027462

上記のフィルムコンデンサにおいて、平板部の厚みが小さくされると、重なり方向における２つのバスバーの間隔が小さくなるため、等価直列インダクタンスの低減効果が高まる。 In the above film capacitor, when the thickness of the flat plate portion is reduced, the distance between the two bus bars in the overlapping direction becomes smaller, thereby increasing the effect of reducing the equivalent series inductance.

しかしながら、平板部の厚みが小さくなると、保持部材が射出成形により製造される際、金型における平板部を形成する型部分を樹脂が流れにくくなるため、当該型部分に樹脂が行き渡りにくくなり、成形不良が発生することが懸念される。 However, if the thickness of the flat plate portion becomes smaller, when the holding member is manufactured by injection molding, the resin will have difficulty flowing through the mold portion that forms the flat plate portion in the metal mold, making it difficult for the resin to reach that mold portion, raising concerns that molding defects may occur.

そこで、本発明は、絶縁部材の成形不良が生じにくいコンデンサの製造方法を提供することを目的とする。 Therefore, the present invention aims to provide a method for manufacturing a capacitor that is less likely to cause molding defects in the insulating material.

本発明の第１の態様は、コンデンサ素子に接続された一対のバスバーの一部が、それらの間に絶縁部材を挟んで重ね合わされたコンデンサの製造方法に関する。本態様に係るコンデンサの製造方法は、前記絶縁部材を、金型を用いて射出成形により製造する成形工程を含む。前記絶縁部材は、前記一対のバスバーの間に介在する部分を有する板状の本体部を含む。前記金型の内部には、前記絶縁部材の形状を有する型部が形成される。前記型部は、前記本体部の第１表面を形成するための第１成形面と、前記第１表面に背向する前記本体部の第２表面を形成するための第２成形面と、前記第１成形面と前記第２成形面との間隔がその周囲よりも大きくされた大間隔部とを含む。前記成形工程では、前記第１成形面に設けられたゲートから前記型部内に溶融状態の樹脂が注入されて前記絶縁部材が形成される。前記ゲートは、前記大間隔部に開口する。
本発明の第２の態様は、コンデンサ素子に接続された一対のバスバーの一部が、それらの間に絶縁部材を挟んで重ね合わされたコンデンサの製造方法に関する。本態様に係るコンデンサの製造方法は、前記絶縁部材を、金型を用いて射出成形により製造する成形工程を含む。前記絶縁部材は、前記一対のバスバーの間に介在する部分を有する板状の本体部を含む。前記金型の内部には、前記絶縁部材の形状を有する型部が形成される。前記型部は、前記本体部の第１表面を形成するための第１成形面と、前記第１表面に背向する前記本体部の第２表面を形成するための第２成形面と、を含む。前記成形工程では、前記第１成形面に設けられたゲートから前記型部内に溶融状態の樹脂が注入されて前記絶縁部材が形成される。前記第１成形面は、前記第２成形面側に突出する第１突出部を含み、前記第２成形面は、前記第１突出部を収容する凹部を含む。前記第１突出部の先端面に前記ゲートが設けられる。前記本体部には、前記第１突出部と前記凹部の間に前記樹脂が充填されることにより、前記第１表面の一部が凹み、前記第２表面の一部が突出した第２突出部が形成される。前記第１表面には、凹んだ面にゲート跡が形成される。
本発明の第３の態様は、コンデンサ素子に接続された一対のバスバーの一部が、それらの間に絶縁部材を挟んで重ね合わされたコンデンサの製造方法に関する。本態様に係るコンデンサの製造方法は、本態様に係るコンデンサの製造方法は、前記絶縁部材を、金型を用いて射出成形により製造する成形工程を含む。前記絶縁部材は、前記一対のバスバーの間に介在する部分を有する板状の本体部を含む。前記金型の内部には、前記絶縁部材の形状を有する型部が形成される。前記型部は、前記本体部の第１表面を形成するための第１成形面と、前記第１表面に背向する前記本体部の第２表面を形成するための第２成形面と、を含む。前記成形工程では、前記第１成形面に設けられたゲートから前記型部内に溶融状態の樹脂が注入されて前記絶縁部材が形成される。前記一対のバスバーのうち、前記第１表面に接するバスバーには、前記第１表面に形成されるゲート跡と整合する位置に開口部が形成される。 A first aspect of the present invention relates to a method for manufacturing a capacitor in which parts of a pair of bus bars connected to a capacitor element are overlapped with an insulating member sandwiched between them. The method for manufacturing a capacitor according to this aspect includes a molding step of manufacturing the insulating member by injection molding using a mold. The insulating member includes a plate-shaped main body having a portion interposed between the pair of bus bars. A mold part having the shape of the insulating member is formed inside the mold. The mold part includes a first molding surface for forming a first surface of the main body, a second molding surface for forming a second surface of the main body facing the first surface, and a large gap part in which the gap between the first molding surface and the second molding surface is larger than the surrounding area . In the molding step, molten resin is injected into the mold part from a gate provided on the first molding surface to form the insulating member. The gate opens into the large gap part.
A second aspect of the present invention relates to a method for manufacturing a capacitor in which parts of a pair of bus bars connected to a capacitor element are overlapped with an insulating member sandwiched therebetween. The method for manufacturing a capacitor according to this aspect includes a molding step of manufacturing the insulating member by injection molding using a mold. The insulating member includes a plate-shaped main body having a portion interposed between the pair of bus bars. A mold part having a shape of the insulating member is formed inside the mold. The mold part includes a first molding surface for forming a first surface of the main body and a second molding surface for forming a second surface of the main body facing the first surface. In the molding step, molten resin is injected into the mold part from a gate provided on the first molding surface to form the insulating member. The first molding surface includes a first protruding portion protruding toward the second molding surface, and the second molding surface includes a recess for accommodating the first protruding portion. The gate is provided on a tip surface of the first protruding portion. The resin is filled between the first protrusion and the recess, so that a part of the first surface is recessed and a part of the second surface is protruding to form a second protrusion. A gate mark is formed on the recessed surface of the first surface.
A third aspect of the present invention relates to a method for manufacturing a capacitor in which parts of a pair of bus bars connected to a capacitor element are overlapped with an insulating member sandwiched between them. The method for manufacturing a capacitor according to this aspect includes a molding step of manufacturing the insulating member by injection molding using a mold. The insulating member includes a plate-shaped main body having a part interposed between the pair of bus bars. A mold part having a shape of the insulating member is formed inside the mold. The mold part includes a first molding surface for forming a first surface of the main body part, and a second molding surface for forming a second surface of the main body part facing away from the first surface. In the molding step, molten resin is injected into the mold part from a gate provided on the first molding surface to form the insulating member. An opening is formed in the bus bar in contact with the first surface of the pair of bus bars at a position aligned with a gate mark formed on the first surface.

本発明によれば、絶縁部材の成形不良が生じにくいコンデンサの製造方法を提供できる。 The present invention provides a method for manufacturing a capacitor that is less likely to cause molding defects in the insulating material.

本発明の効果ないし意義は、以下に示す実施の形態の説明により更に明らかとなろう。ただし、以下に示す実施の形態は、あくまでも、本発明を実施化する際の一つの例示であって、本発明は、以下の実施の形態に記載されたものに何ら制限されるものではない。 The effects and significance of the present invention will become clearer from the description of the embodiment shown below. However, the embodiment shown below is merely an example of how the present invention can be put into practice, and the present invention is in no way limited to the embodiment described below.

図１は、実施の形態に係る、フィルムコンデンサの斜視図である。FIG. 1 is a perspective view of a film capacitor according to an embodiment. 図２（ａ）は、実施の形態に係る、前方上方から見たコンデンサ素子ユニットの斜視図であり、図２（ｂ）は、実施の形態に係る、後方上方から見たコンデンサ素子ユニットの斜視図である。FIG. 2(a) is a perspective view of a capacitor element unit according to the embodiment as viewed from above the front, and FIG. 2(b) is a perspective view of a capacitor element unit according to the embodiment as viewed from above the rear. 図３（ａ）は、実施の形態に係る、第１バスバーの斜視図であり、図３（ｂ）は、実施の形態に係る、第２バスバーの斜視図である。FIG. 3A is a perspective view of a first bus bar according to the embodiment, and FIG. 3B is a perspective view of a second bus bar according to the embodiment. 図４（ａ）は、実施の形態に係る、前方上方から見た絶縁部材の斜視図であり、図４（ｂ）は、実施の形態に係る、後方上方から見た絶縁部材の斜視図である。FIG. 4(a) is a perspective view of an insulating member according to the embodiment as viewed from above the front, and FIG. 4(b) is a perspective view of an insulating member according to the embodiment as viewed from above the rear. 図５は、実施の形態に係る、コンデンサ素子ユニットの要部の正面図である。FIG. 5 is a front view of a main part of a capacitor element unit according to an embodiment. 図６（ａ）は、実施の形態に係る、コンデンサ素子ユニットの要部の背面図であり、図６（ｂ）は、図６（ａ）のＡ－Ａ´断面図である。FIG. 6(a) is a rear view of a main part of a capacitor element unit according to an embodiment, and FIG. 6(b) is a cross-sectional view taken along line AA' of FIG. 6(a). 図７は、実施の形態に係る、絶縁部材の射出成形に用いられる金型の断面図である。FIG. 7 is a cross-sectional view of a mold used for injection molding of an insulating member according to an embodiment. 図８（ａ）および（ｂ）は、それぞれ、実施の形態に係る、金型を構成する第１部材および第２部材を、それらの分割面側から見た平面図である。8(a) and 8(b) are plan views of a first member and a second member constituting a mold according to an embodiment, respectively, viewed from their parting surfaces. 図９は、変更例に係る、金型を構成する第１部材を、その分割面側から見た平面図である。FIG. 9 is a plan view of a first member constituting a mold according to a modified example, as viewed from its parting surface side. 図１０（ａ）および（ｃ）は、変更例に係る、金型の要部の断面図であり、図１０（ｂ）および（ｄ）は、変更例に係る、絶縁部材の要部の断面図である。10(a) and (c) are cross-sectional views of a main part of a mold according to the modified example, and FIGS. 10(b) and (d) are cross-sectional views of a main part of an insulating member according to the modified example.

以下、本発明のコンデンサの一実施形態であるフィルムコンデンサ１について図を参照して説明する。便宜上、各図には、適宜、前後、左右および上下の方向が付記されている。なお、図示の方向は、あくまでフィルムコンデンサ１の相対的な方向を示すものであり、絶対的な方向を示すものではない。また、説明の便宜上、「前面」、「後面」など、一部の構成において、図示の方向に従った名称がつけられる場合がある。 The film capacitor 1, which is one embodiment of the capacitor of the present invention, will be described below with reference to the drawings. For convenience, the front-rear, left-right, and up-down directions are indicated in each drawing as appropriate. Note that the directions shown in the drawings indicate only the relative directions of the film capacitor 1, and do not indicate absolute directions. Also, for convenience of explanation, some configurations may be given names that correspond to the directions shown in the drawings, such as "front" and "rear."

本実施の形態において、フィルムコンデンサ１が、特許請求の範囲に記載の「コンデンサ」に対応する。また、第１バスバー５００および第２バスバー６００が、特許請求の範囲に記載の「バスバー」に対応する。さらに、開口部５１６が、特許請求の範囲に記載の「第１開口部」に対応し、開口部６１４が、特許請求の範囲に記載の「第２開口部」に対応する。さらに、前面７１０ａが、特許請求の範囲に記載の「第２表面」に対応し、後面７１０ｂが、特許請求の範囲に記載の「第１表面」に対応する。さらに、突出部７１４が、特許請求の範囲に記載の「第２突出部」に対応し、突出部８１３が、特許請求の範囲に記載の「第１突出部」に対応する。 In this embodiment, the film capacitor 1 corresponds to the "capacitor" described in the claims. The first bus bar 500 and the second bus bar 600 correspond to the "bus bar" described in the claims. The opening 516 corresponds to the "first opening" described in the claims, and the opening 614 corresponds to the "second opening" described in the claims. The front surface 710a corresponds to the "second surface" described in the claims, and the rear surface 710b corresponds to the "first surface" described in the claims. The protrusion 714 corresponds to the "second protrusion" described in the claims, and the protrusion 813 corresponds to the "first protrusion" described in the claims.

ただし、上記記載は、あくまで、特許請求の範囲の構成と実施形態の構成とを対応付けることを目的とするものであって、上記対応付けによって特許請求の範囲に記載の発明が実施形態の構成に何ら限定されるものではない。 However, the above description is intended only to correlate the configuration of the claims with the configuration of the embodiments, and the above correlation does not in any way limit the invention described in the claims to the configuration of the embodiments.

＜フィルムコンデンサの構成＞
図１は、フィルムコンデンサ１の斜視図である。 <Composition of film capacitor>
FIG. 1 is a perspective view of a film capacitor 1.

フィルムコンデンサ１は、コンデンサ素子ユニット１００と、コンデンサ素子ユニット１００が収容されるケース２００と、ケース２００内に充填される充填樹脂３００と、を備える。コンデンサ素子ユニット１００の充填樹脂３００に埋没した部分、特にコンデンサ素子４００が、ケース２００と充填樹脂３００とにより、湿気や衝撃から保護される。 The film capacitor 1 comprises a capacitor element unit 100, a case 200 in which the capacitor element unit 100 is housed, and a filling resin 300 that is filled into the case 200. The portion of the capacitor element unit 100 that is embedded in the filling resin 300, particularly the capacitor element 400, is protected from moisture and impact by the case 200 and the filling resin 300.

図２（ａ）は、前方上方から見たコンデンサ素子ユニット１００の斜視図であり、図２（ｂ）は、後方上方から見たコンデンサ素子ユニット１００の斜視図である。 Figure 2(a) is a perspective view of the capacitor element unit 100 seen from above the front, and Figure 2(b) is a perspective view of the capacitor element unit 100 seen from above the rear.

コンデンサ素子ユニット１００は、コンデンサ素子４００と、第１バスバー５００と、第２バスバー６００と、絶縁部材７００とを含む。 The capacitor element unit 100 includes a capacitor element 400, a first bus bar 500, a second bus bar 600, and an insulating member 700.

コンデンサ素子４００は、誘電体フィルム上にアルミニウムを蒸着させた２枚の金属化フィルムを重ね、重ねた金属化フィルムを巻回または積層し、扁平状に押圧することにより形成される。コンデンサ素子４００には、一方の端面に、亜鉛等の金属の吹付けにより第１電極４１０が形成され、他方の端面に、同じく亜鉛等の金属の吹付けにより第２電極４２０が形成される。 Capacitor element 400 is formed by stacking two metallized films, each of which has aluminum vapor-deposited on a dielectric film, rolling or laminating the stacked metallized films, and pressing them into a flat shape. Capacitor element 400 has a first electrode 410 formed on one end face by spraying a metal such as zinc, and a second electrode 420 formed on the other end face by spraying a metal such as zinc.

なお、本実施の形態のコンデンサ素子４００は、誘電体フィルム上にアルミニウムを蒸着させた金属化フィルムにより形成されたが、これ以外にも、亜鉛、マグネシウム等の他の金属を蒸着させた金属化フィルムにより形成されてもよい。あるいは、コンデンサ素子４００は、これらの金属のうち、複数の金属を蒸着させた金属化フィルムにより形成されてもよいし、これらの金属どうしの合金を蒸着させた金属化フィルムにより形成されてもよい。 In the present embodiment, the capacitor element 400 is formed from a metallized film in which aluminum is vapor-deposited onto a dielectric film, but it may also be formed from a metallized film in which other metals, such as zinc or magnesium, are vapor-deposited. Alternatively, the capacitor element 400 may be formed from a metallized film in which multiple of these metals are vapor-deposited, or from a metallized film in which an alloy of these metals is vapor-deposited.

図３（ａ）は、第１バスバー５００の斜視図である。 Figure 3(a) is a perspective view of the first bus bar 500.

第１バスバー５００は、所定形状の導電性材料である金属板、たとえば、銅板に、適宜切り起し、折り曲げ等の加工を施すことにより形成される。 The first busbar 500 is formed by cutting, bending, and otherwise processing a metal plate of a conductive material of a predetermined shape, such as a copper plate.

第１バスバー５００は、方形の平板状を有する本体部５１０を備える。本体部５１０は、上下方向において、第１重合部５１１となる部分と、第１重合部５１１と連続する非重合部５１２となる部分に分けられる。非重合部５１２は、第１重合部５１１の上方に位置する。図３（ａ）には、便宜上、第１重合部５１１と非重合部５１２との境界が二点鎖線により示されている。 The first busbar 500 has a main body 510 having a rectangular flat plate shape. The main body 510 is divided in the vertical direction into a portion that becomes the first overlapping portion 511 and a portion that becomes the non-overlapping portion 512 that is continuous with the first overlapping portion 511. The non-overlapping portion 512 is located above the first overlapping portion 511. For convenience, the boundary between the first overlapping portion 511 and the non-overlapping portion 512 is shown by a two-dot chain line in FIG. 3(a).

非重合部５１２に含まれる本体部５１０の上部には、本体部５１０の一部が切り起されることにより、方形状の４つの接続端子部５２０が左右方向に並ぶように形成される。本体部５１０の各接続端子部５２０が切り起された部分には、接続端子部５２０よりも大きな方形状の開口部５１３が形成される。各開口部５１３は、対応する接続端子部５２０に隣接し、左右方向に並ぶ。 At the top of the main body 510 included in the non-overlapping portion 512, a part of the main body 510 is cut and raised to form four rectangular connection terminals 520 aligned in the left-right direction. In the portion of the main body 510 where each connection terminal 520 is cut and raised, a rectangular opening 513 larger than the connection terminal 520 is formed. Each opening 513 is adjacent to the corresponding connection terminal 520 and aligned in the left-right direction.

第１重合部５１１に含まれる本体部５１０の中間部には、左右方向において４つの開口部５１３と同じ位置に、４つの方形状の開口部５１４が形成される。４つの開口部５１４は、４つの開口部５１３と同じ大きさを有する。また、本体部５１０の中間部には、左右の端部に、上下に長い方形状の貫通孔５１５が形成される。 Four rectangular openings 514 are formed in the middle of the main body 510 included in the first overlapping portion 511 at the same positions in the left-right direction as the four openings 513. The four openings 514 have the same size as the four openings 513. In addition, rectangular through holes 515 that are long in the vertical direction are formed at the left and right ends of the middle of the main body 510.

第１重合部５１１に含まれる本体部５１０の下部には、中央部に、円形の開口部５１６が形成される。 A circular opening 516 is formed in the center of the lower part of the main body 510 included in the first overlapping portion 511.

さらに、第１バスバー５００は、本体部５１０の下端部から、本体部５１０に対して直角に折れ曲がる電極端子部５３０を備える。電極端子部５３０は、左右方向に細長い方形の板状を有する。 The first busbar 500 further includes an electrode terminal portion 530 that is bent at a right angle to the main body portion 510 from the lower end of the main body portion 510. The electrode terminal portion 530 has a rectangular plate shape that is elongated in the left-right direction.

さらに、第１バスバー５００は、本体部５１０、即ち第１重合部５１１および非重合部５１２の左端部と左端部のそれぞれから、本体部５１０に対して直角に折れ曲がる折曲部５４０を備える。各折曲部５４０は、上下方向に細長い方形の板状を有する。各折曲部５４０に各貫通孔５１５が接する。 The first busbar 500 further includes bent portions 540 that bend at right angles to the main body 510 from the left end and the left end of the first overlapping portion 511 and the non-overlapping portion 512. Each bent portion 540 has a rectangular plate shape that is elongated in the vertical direction. Each bent portion 540 is in contact with each through hole 515.

図３（ｂ）は、第２バスバー６００の斜視図である。 Figure 3(b) is a perspective view of the second bus bar 600.

第２バスバー６００は、所定形状の導電性材料である金属板、たとえば、銅板に、適宜切り起し、折り曲げ等の加工を施すことにより形成される。 The second busbar 600 is formed by cutting, bending, and otherwise processing a metal plate of a conductive material of a predetermined shape, such as a copper plate.

第２バスバー６００は、方形の平板状を有する本体部６１０を備える。本体部６１０は、上下方向において、第２重合部６１１となる部分と、第２重合部６１１と連続する非重合部６１２となる部分に分けられる。非重合部６１２は、第２重合部６１１の下方に位置する。図３（ｂ）には、便宜上、第２重合部６１１と非重合部６１２との境界が二点鎖線により示されている。 The second busbar 600 has a main body 610 having a rectangular flat plate shape. The main body 610 is divided in the vertical direction into a portion that becomes the second overlapping portion 611 and a portion that becomes a non-overlapping portion 612 that is continuous with the second overlapping portion 611. The non-overlapping portion 612 is located below the second overlapping portion 611. For convenience, in FIG. 3(b), the boundary between the second overlapping portion 611 and the non-overlapping portion 612 is indicated by a two-dot chain line.

第２重合部６１１に含まれる本体部６１０の上部には、本体部６１０の一部が切り起されることにより、方形状の４つの接続端子部６２０が左右方向に並ぶように形成される。本体部６１０の各接続端子部６２０が切り起された部分には、接続端子部６２０よりも大きな方形状の開口部６１３が形成される。各開口部６１３は、対応する接続端子部６２０に隣接し、左右方向に並ぶ。４つの開口部６１３は、第１バスバー５００の４つの開口部５１４と同じ大きさを有する。 At the top of the main body 610 included in the second overlapping portion 611, a part of the main body 610 is cut and raised to form four rectangular connection terminals 620 aligned in the left-right direction. In the portion of the main body 610 where each connection terminal 620 is cut and raised, a rectangular opening 613 larger than the connection terminal 620 is formed. Each opening 613 is adjacent to the corresponding connection terminal 620 and aligned in the left-right direction. The four openings 613 are the same size as the four openings 514 of the first bus bar 500.

第２重合部６１１に含まれる本体部６１０の中間部には、中央部に、円形の開口部６１４が形成される。 A circular opening 614 is formed in the center of the middle portion of the main body portion 610 included in the second overlapping portion 611.

さらに、第２バスバー６００は、本体部６１０の下端部から、本体部６１０に対して直角に折れ曲がる電極端子部６３０を備える。電極端子部６３０は、左右方向に細長い方形の板状を有する。 The second busbar 600 further includes an electrode terminal portion 630 that is bent at a right angle to the main body portion 610 from the lower end of the main body portion 610. The electrode terminal portion 630 has a rectangular plate shape that is elongated in the left-right direction.

図４（ａ）は、前方上方から見た絶縁部材７００の斜視図であり、図４（ｂ）は、後方上方から見た絶縁部材７００の斜視図である。 Figure 4(a) is a perspective view of the insulating member 700 as viewed from above the front, and Figure 4(b) is a perspective view of the insulating member 700 as viewed from above the rear.

絶縁部材７００は、ポリフェニレンサルファイド（ＰＰＳ）等の樹脂を材料として、後述する射出成形により形成される。 The insulating member 700 is made of a resin such as polyphenylene sulfide (PPS) and is formed by injection molding, which will be described later.

絶縁部材７００は、左右方向に長いほぼ方形の板状を有する本体部７１０を備える。本体部７１０は、上下方向において、第１部分７１１と、第１部分７１１と連続する第２部分７１２と、第１部分７１１と連続する第３部分７１３とに分けられる。第２部分７１２は、第１部分７１１の上方に位置し、第３部分７１３は、第１部分７１１の下方に位置する。図４（ａ）および（ｂ）には、便宜上、第１部分７１１と第２部分７１２の境界および第１部分７１１と第３部分７１３の境界が二点鎖線により示されている。 The insulating member 700 includes a main body 710 having a generally rectangular plate shape that is long in the left-right direction. The main body 710 is divided in the up-down direction into a first portion 711, a second portion 712 that is continuous with the first portion 711, and a third portion 713 that is continuous with the first portion 711. The second portion 712 is located above the first portion 711, and the third portion 713 is located below the first portion 711. For convenience, the boundaries between the first portion 711 and the second portion 712 and the boundaries between the first portion 711 and the third portion 713 are indicated by two-dot chain lines in Figures 4(a) and (b).

本体部７１０の第１部分７１１には、中央部に、本体部７１０の前面７１０ａの一部が突出し、本体部７１０の後面７１０ｂの一部が凹むことにより、ほぼ円柱状の突出部７１４が形成される。突出部７１４は、裏側に凹部７１４ａを有する。本体部７１０の後面７１０ｂには、突出部７１４によって凹んだ面、即ち凹部７１４ａの底面に、ほぼ円柱状のゲート跡７１５が形成される。ゲート跡７１５は、射出成形により形成される。突出部７１４の外径は、第１バスバー５００の開口部５１６および第２バスバー６００の開口部６１４の内径よりも小さくされている。 In the first portion 711 of the main body 710, a part of the front surface 710a of the main body 710 protrudes in the center, and a part of the rear surface 710b of the main body 710 is recessed, forming a substantially cylindrical protrusion 714. The protrusion 714 has a recess 714a on the back side. A substantially cylindrical gate mark 715 is formed on the rear surface 710b of the main body 710, on the surface recessed by the protrusion 714, i.e., on the bottom surface of the recess 714a. The gate mark 715 is formed by injection molding. The outer diameter of the protrusion 714 is smaller than the inner diameter of the opening 516 of the first bus bar 500 and the opening 614 of the second bus bar 600.

さらに、第１部分７１１には、上部に、左右方向に並ぶ４つの方形状の開口部７１６が形成される。４つの開口部７１６は、第１バスバー５００の４つの開口部５１４と同じ大きさを有する。 Furthermore, four rectangular openings 716 are formed in the upper portion of the first portion 711 and aligned in the left-right direction. The four openings 716 have the same size as the four openings 514 of the first bus bar 500.

本体部７１０の第２部分７１２には、後面７１０ｂに、後方へ突出し、左端部から右端部に亘って左右方向に延びる２本の第１リブ７１７が形成される。２本の第１リブ７１７は、上下方向に、所定の間隔を開けて並ぶ。所定の間隔は、沿面距離に係る規定により２本の第１リブ７１７が離れていると見做される間隔（１ｍｍ）以上の間隔に設定される。 Two first ribs 717 are formed on the rear surface 710b of the second portion 712 of the main body 710, protruding rearward and extending in the left-right direction from the left end to the right end. The two first ribs 717 are arranged vertically with a predetermined distance between them. The predetermined distance is set to a distance equal to or greater than the distance (1 mm) at which the two first ribs 717 are considered to be apart according to regulations related to creepage distance.

２本の第１リブ７１７は、左端と右端の位置において、第２リブ７１８により連結される。各第２リブ７１８の高さは、各第１リブ７１７の高さと同じにされている。 The two first ribs 717 are connected at their left and right ends by second ribs 718. The height of each second rib 718 is the same as the height of each first rib 717.

さらに、絶縁部材７００は、本体部７１０の前面７１０ａ側の左端部と右端部とにそれぞれ、挟持部７２０を備える。挟持部７２０は、絶縁部材７００において外側に位置する第１接触部７２１と内側に位置する第２接触部７２２により構成される。第１接触部７２１は、上下方向に細長い方形の板状を有する。第２接触部７２２は、上下方向に長い直方体の形状を有する。第１接触部７２１の上下方向の寸法は、第２接触部７２２の上下方向の寸法よりも大きく、第１接触部７２１の左右方向の寸法は、第２接触部７２２の左右方向の寸法よりも小さい。第１接触部７２１と第２接触部７２２は、前後方向の寸法同士が等しくされる。なお、第１バスバー５００の折曲部５４０の前後方向の寸法は、第１接触部７２１と第２接触部７２２の前後方向の寸法よりも大きくされる。 Furthermore, the insulating member 700 has a clamping portion 720 at each of the left end and the right end of the front surface 710a side of the main body portion 710. The clamping portion 720 is composed of a first contact portion 721 located on the outside of the insulating member 700 and a second contact portion 722 located on the inside. The first contact portion 721 has a rectangular plate shape that is elongated in the vertical direction. The second contact portion 722 has a rectangular parallelepiped shape that is elongated in the vertical direction. The vertical dimension of the first contact portion 721 is larger than the vertical dimension of the second contact portion 722, and the horizontal dimension of the first contact portion 721 is smaller than the horizontal dimension of the second contact portion 722. The first contact portion 721 and the second contact portion 722 have the same dimensions in the front-rear direction. The front-to-rear dimension of the bent portion 540 of the first busbar 500 is greater than the front-to-rear dimension of the first contact portion 721 and the second contact portion 722.

第１接触部７２１には、２本の第１リブ７２１ａが含まれる。２本の第１リブ７２１ａは、第１接触部７２１の第２接触部７２２に対向する側面であって第２接触部７２２の上部と下部の位置にそれぞれ形成され、前後方向に延びる。第２接触部７２２には、１本の第２リブ７２２ａが含まれる。第２リブ７２２ａは、第２接触部７２２の第１接触部７２１に対向する側面であって２本の第１リブ７２１ａの間の位置に形成され、前後方向に延びる。第１リブ７２１ａと第２リブ７２２ａとの間の隙間は、第１バスバー５００の折曲部５４０の厚み（左右方向の寸法）よりも僅かに小さくされている。 The first contact portion 721 includes two first ribs 721a. The two first ribs 721a are formed on the side surface of the first contact portion 721 facing the second contact portion 722 at the upper and lower positions of the second contact portion 722, respectively, and extend in the front-rear direction. The second contact portion 722 includes one second rib 722a. The second rib 722a is formed on the side surface of the second contact portion 722 facing the first contact portion 721 at a position between the two first ribs 721a, and extends in the front-rear direction. The gap between the first rib 721a and the second rib 722a is slightly smaller than the thickness (dimension in the left-right direction) of the bent portion 540 of the first bus bar 500.

図２（ａ）および（ｂ）に示すように、第１バスバー５００は、絶縁部材７００の前側に装着される。第１バスバー５００の本体部５１０が、絶縁部材７００の本体部７１０の前面７１０ａに接する。絶縁部材７００の突出部７１４が第１バスバー５００の開口部５１６を貫通する。第１バスバー５００の左右両側の折曲部５４０が絶縁部材７００の挟持部７２０により挟持される。第１バスバー５００の４つの開口部５１４が絶縁部材７００の４つの開口部７１６に重なる。 2(a) and (b), the first bus bar 500 is attached to the front side of the insulating member 700. The main body 510 of the first bus bar 500 contacts the front surface 710a of the main body 710 of the insulating member 700. The protruding portion 714 of the insulating member 700 penetrates the opening 516 of the first bus bar 500. The bent portions 540 on both the left and right sides of the first bus bar 500 are clamped by the clamping portions 720 of the insulating member 700. The four openings 514 of the first bus bar 500 overlap the four openings 716 of the insulating member 700.

第２バスバー６００は、絶縁部材７００の後側に装着される。第２バスバー６００の本体部６１０が、絶縁部材７００の本体部７１０の後面７１０ｂに接する。絶縁部材７００の凹部７１４ａが、第２バスバー６００の開口部６１４に重なり、ゲート跡７１５が開口部６１４と重なる。ゲート跡７１５の高さには、ある程度のばらつきが生じ得る。ゲート跡７１５が高くなって凹部７１４ａから後方に突出した場合、突出したゲート跡７１５の先端部は、開口部６１４内に挿入され、第２バスバー６００の本体部６１０とは干渉しない。 The second busbar 600 is attached to the rear side of the insulating member 700. The body 610 of the second busbar 600 contacts the rear surface 710b of the body 710 of the insulating member 700. The recess 714a of the insulating member 700 overlaps the opening 614 of the second busbar 600, and the gate mark 715 overlaps the opening 614. There may be some variation in the height of the gate mark 715. If the gate mark 715 becomes high and protrudes rearward from the recess 714a, the tip of the protruding gate mark 715 is inserted into the opening 614 and does not interfere with the body 610 of the second busbar 600.

第２バスバー６００の４つの開口部６１３が絶縁部材７００の４つの開口部７１６に重なり、第２バスバー６００の各接続端子部６２０が、重なった３つの各開口部５１４、７１６、６１３を通って第１バスバー５００の前方に突出する。４つの接続端子部６２０の端子列が、４つの接続端子部５２０の下方に位置する。４つの接続端子部５２０の前端の位置と、４つの接続端子部６２０の前端の位置とが揃った状態となる。 The four openings 613 of the second bus bar 600 overlap with the four openings 716 of the insulating member 700, and each connection terminal portion 620 of the second bus bar 600 protrudes forward of the first bus bar 500 through each of the three overlapping openings 514, 716, 613. The terminal row of the four connection terminal portions 620 is located below the four connection terminal portions 520. The positions of the front ends of the four connection terminal portions 520 and the front ends of the four connection terminal portions 620 are aligned.

第１バスバー５００の第１重合部５１１と第２バスバー６００の第２重合部６１１が前後方向に重なり合う。第１バスバー５００の非重合部５１２は第２重合部６１１と重なり合わず、第２バスバー６００の非重合部６１２は第１重合部５１１と重なり合わない。絶縁部材７００の第１部分７１１が第１重合部５１１と第２重合部６１１との間に介在する。絶縁部材７００の第２部分７１２が第１バスバー５００の非重合部５１２に重なる。絶縁部材７００の第３部分７１３が第２バスバー６００の非重合部６１２と、コンデンサ素子４００の周面との間に介在する。 The first overlapping portion 511 of the first busbar 500 and the second overlapping portion 611 of the second busbar 600 overlap in the front-rear direction. The non-overlapping portion 512 of the first busbar 500 does not overlap with the second overlapping portion 611, and the non-overlapping portion 612 of the second busbar 600 does not overlap with the first overlapping portion 511. The first portion 711 of the insulating member 700 is interposed between the first overlapping portion 511 and the second overlapping portion 611. The second portion 712 of the insulating member 700 overlaps with the non-overlapping portion 512 of the first busbar 500. The third portion 713 of the insulating member 700 is interposed between the non-overlapping portion 612 of the second busbar 600 and the peripheral surface of the capacitor element 400.

第１バスバー５００の電極端子部５３０と第２バスバー６００の電極端子部６３０との間に、コンデンサ素子４００が配置される。電極端子部５３０が、コンデンサ素子４００の第１電極４１０に半田付け等の接合方法で接合される。これにより、第１バスバー５００が第１電極４１０に電気的に接続される。同様に、電極端子部６３０が、コンデンサ素子４００の第２電極４２０に半田付け等の接合方法で接合される。これにより、第２バスバー６００が第２電極４２０に電気的に接続される。なお、電極端子部５３０、６３０にピン状の端子が形成され、この端子が電極４１０、４２０に半田付け等により接合されるようにしてもよい。 The capacitor element 400 is disposed between the electrode terminal portion 530 of the first bus bar 500 and the electrode terminal portion 630 of the second bus bar 600. The electrode terminal portion 530 is joined to the first electrode 410 of the capacitor element 400 by a joining method such as soldering. This electrically connects the first bus bar 500 to the first electrode 410. Similarly, the electrode terminal portion 630 is joined to the second electrode 420 of the capacitor element 400 by a joining method such as soldering. This electrically connects the second bus bar 600 to the second electrode 420. Note that pin-shaped terminals may be formed on the electrode terminal portions 530 and 630, and these terminals may be joined to the electrodes 410 and 420 by soldering or the like.

図５は、コンデンサ素子ユニット１００の要部の正面図である。 Figure 5 is a front view of the main parts of the capacitor element unit 100.

図５に示すように、絶縁部材７００の各挟持部７２０では、第１接触部７２１の第１リブ７２１ａが第１バスバー５００の外側から折曲部５４０に接触し、第１バスバー５００の貫通孔５１５を貫通した第２接触部７２２の第２リブ７２２ａが第１バスバー５００の内側から折曲部５４０に接触する。第１リブ７２１ａと第２リブ７２２ａは、いわゆるクラッシュリブであり、折曲部５４０が第１接触部７２１と第２接触部７２２の間に挿入されたときに、折曲部５４０により、その先端部が削られたり変形したりする。第１接触部７２１と第２接触部７２２が両側から折曲部５４０に接触することにより、絶縁部材７００に、前後方向において第１バスバー５００を保持する力（動きを抑制する力）が生じる。 5, in each clamping portion 720 of the insulating member 700, the first rib 721a of the first contact portion 721 contacts the bent portion 540 from the outside of the first bus bar 500, and the second rib 722a of the second contact portion 722 that penetrates the through hole 515 of the first bus bar 500 contacts the bent portion 540 from the inside of the first bus bar 500. The first rib 721a and the second rib 722a are so-called crush ribs, and when the bent portion 540 is inserted between the first contact portion 721 and the second contact portion 722, the tip portion is scraped or deformed by the bent portion 540. The first contact portion 721 and the second contact portion 722 contact the bent portion 540 from both sides, and thus a force (force suppressing movement) that holds the first bus bar 500 in the front-rear direction is generated in the insulating member 700.

第１バスバー５００は、折曲部５４０と挟持部７２０とによる位置決め構造により、絶縁部材７００に対して、前後および左右方向に位置決めされる。 The first bus bar 500 is positioned in the front-rear and left-right directions relative to the insulating member 700 by a positioning structure formed by the bent portion 540 and the clamping portion 720.

貫通孔５１５の上下方向の寸法は、第２接触部７２２の上下方向の寸法よりも大きく、第２接触部７２２と貫通孔５１５との間には、上方と下方に比較的大きな隙間が生じている。よって、本実施の形態では、第１バスバー５００と絶縁部材７００との間に、図示しない他の位置決め構造が設けられ、この位置決め構造により、第１バスバー５００が絶縁部材７００に対して、上下方向に位置決めされる。さらに、第２バスバー６００と絶縁部材７００の間にも、図示しない位置決め構造が設けられ、この位置決め構造により、第２バスバー６００が絶縁部材７００に対して、上下、前後および左右方向に位置決めされる。 The vertical dimension of the through hole 515 is larger than the vertical dimension of the second contact portion 722, and a relatively large gap is generated above and below between the second contact portion 722 and the through hole 515. Therefore, in this embodiment, another positioning structure (not shown) is provided between the first bus bar 500 and the insulating member 700, and this positioning structure positions the first bus bar 500 in the vertical direction relative to the insulating member 700. Furthermore, a positioning structure (not shown) is also provided between the second bus bar 600 and the insulating member 700, and this positioning structure positions the second bus bar 600 in the vertical, front-back, and left-right directions relative to the insulating member 700.

図６（ａ）は、コンデンサ素子ユニット１００の要部の背面図であり、図６（ｂ）は、図６（ａ）のＡ－Ａ´断面図である。 Figure 6(a) is a rear view of the main parts of the capacitor element unit 100, and Figure 6(b) is a cross-sectional view taken along line A-A' in Figure 6(a).

図６（ａ）および（ｂ）に示すように、第１バスバー５００の４つの接続端子部５２０は、非重合部５１２から絶縁部材７００の第２部分７１２と反対側（前側）に突出する。第２部分７１２の上端は、第１バスバー５００の４つの開口部５１３の下端と同じ高さ位置を有しており、第２部分７１２は、前後方向において、４つの開口部５１３および４つの接続端子部５２０と重ならない。なお、第２部分７１２は、僅かであれば、４つの開口部５１３の下端部に重なってもよい。 As shown in Figures 6(a) and (b), the four connection terminal portions 520 of the first bus bar 500 protrude from the non-overlapping portion 512 to the side opposite (the front side) the second portion 712 of the insulating member 700. The upper end of the second portion 712 has the same height position as the lower ends of the four openings 513 of the first bus bar 500, and the second portion 712 does not overlap the four openings 513 and the four connection terminal portions 520 in the front-to-rear direction. Note that the second portion 712 may overlap the lower ends of the four openings 513, if only slightly.

絶縁部材７００の第２部分７１２において、２本の第１リブ７１７は、第１バスバー５００の非重合部５１２と反対側（後側）に突出し、上下方向から見て非重合部５１２と第２バスバー６００の第２重合部６１１とが重なる重複範囲Ｒに存在するよう、左右方向に重複範囲Ｒよりも少し長くなる寸法を有する。また、２本の第２リブ７１８は、左右方向における重複範囲Ｒの外側において、２本の第１リブ７１７を連結する。 In the second portion 712 of the insulating member 700, the two first ribs 717 protrude on the opposite side (rear side) from the non-overlapping portion 512 of the first bus bar 500, and have a dimension that is slightly longer in the left-right direction than the overlapping range R so that they are present in the overlapping range R where the non-overlapping portion 512 and the second overlapping portion 611 of the second bus bar 600 overlap when viewed from the top-bottom direction. In addition, the two second ribs 718 connect the two first ribs 717 outside the overlapping range R in the left-right direction.

図６（ｂ）に太線で示されるように、上下方向において、第１バスバー５００の非重合部５１２と第２バスバー６００の第２重合部６１１との間には、絶縁部材７００の第２部分７１２と２本の第１リブ７１７により、沿面距離Ｄが確保される。第２部分７１２の後面側は、２本の第１リブ７１７によって凹凸面状となる。このため、第２部分７１２の後面側が平面状である場合に比べて、沿面距離Ｄが長くなる。 As shown by the thick line in FIG. 6(b), in the vertical direction, a creepage distance D is ensured between the non-overlapped portion 512 of the first bus bar 500 and the second overlapped portion 611 of the second bus bar 600 by the second portion 712 of the insulating member 700 and the two first ribs 717. The rear side of the second portion 712 has an uneven surface due to the two first ribs 717. Therefore, the creepage distance D is longer than when the rear side of the second portion 712 is flat.

図１を参照して、ケース２００は、樹脂製であり、たとえば、熱可塑性樹脂であるポリフェニレンサルファイド（ＰＰＳ）により形成される。ケース２００は、ほぼ直方体の箱状に形成され、上面に開口部２０１を有する。 Referring to FIG. 1, the case 200 is made of resin, for example, polyphenylene sulfide (PPS), which is a thermoplastic resin. The case 200 is formed in a substantially rectangular box shape, and has an opening 201 on the top surface.

ケース２００には、左右の外側面と外底面とに取付タブ２１０が設けられる。各取付タブ２１０には、前後方向に貫通する挿通孔２１１が形成される。挿通孔２１１には、孔の強度を上げるために金属製のカラー２１２が嵌め込まれる。フィルムコンデンサ１が外部装置等の設置部に設置される際、これら取付タブ２１０がネジ等によって設置部に固定される。 The case 200 has mounting tabs 210 on the left and right outer sides and the outer bottom surface. Each mounting tab 210 has an insertion hole 211 that penetrates in the front-to-rear direction. A metal collar 212 is fitted into the insertion hole 211 to increase the strength of the hole. When the film capacitor 1 is installed in an installation portion of an external device, etc., these mounting tabs 210 are fixed to the installation portion with screws or the like.

充填樹脂３００は、エポキシ樹脂等の熱硬化性樹脂である。 The filling resin 300 is a thermosetting resin such as epoxy resin.

ケース２００内に、開口部２０１を通じて、コンデンサ素子ユニット１００が収容される。コンデンサ素子ユニット１００が収容されたケース２００内に、開口部２０１を通じて、液相状態の充填樹脂３００が注入される。充填樹脂３００は、開口部２０１の近傍までケース２００内に満たされ、充填樹脂３００の注入が完了すると、ケース２００が加熱される。これにより、ケース２００内の充填樹脂３００が硬化する。こうして、フィルムコンデンサ１が完成する。 The capacitor element unit 100 is housed in the case 200 through the opening 201. Filling resin 300 in a liquid state is injected through the opening 201 into the case 200 housing the capacitor element unit 100. The filling resin 300 fills the case 200 up to the vicinity of the opening 201, and when the injection of the filling resin 300 is completed, the case 200 is heated. This causes the filling resin 300 in the case 200 to harden. In this way, the film capacitor 1 is completed.

フィルムコンデンサ１は、外部装置等に搭載される。外部装置等には、たとえばバスバーの形態をとる正極側の４つの外部端子２ａと負極側の４つの外部端子２ｂとが備えられる。たとえば、第１バスバー５００が正極側のバスバーであり、第２バスバー６００が負極側のバスバーである場合、図１に示すように、４つの外部端子２ａが、後方から、開口部５１３を通って第１バスバー５００の４つの接続端子部５２０に接触し、それら接続端子部５２０に半田付け等の接合方法により接続される。さらに、４つの外部端子２ｂが、後方から、前後に重なる３つの開口部６１３、７１６、５１４を通って第２バスバー６００の４つの接続端子部６２０に接触し、それら接続端子部６２０に半田付け等の接合方法により接続される。 The film capacitor 1 is mounted on an external device or the like. The external device or the like is provided with four external terminals 2a on the positive side and four external terminals 2b on the negative side, for example, in the form of a bus bar. For example, when the first bus bar 500 is a bus bar on the positive side and the second bus bar 600 is a bus bar on the negative side, as shown in FIG. 1, the four external terminals 2a contact the four connection terminals 520 of the first bus bar 500 from the rear through the openings 513 and are connected to the connection terminals 520 by a joining method such as soldering. Furthermore, the four external terminals 2b contact the four connection terminals 620 of the second bus bar 600 from the rear through three overlapping openings 613, 716, 514, and are connected to the connection terminals 620 by a joining method such as soldering.

＜絶縁部材の製造方法＞
次に、絶縁部材７００の製造方法について説明する。 <Method of manufacturing insulating member>
Next, a method for manufacturing the insulating member 700 will be described.

図７は、絶縁部材７００の射出成形に用いられる金型８００の断面図である。図８（ａ）および（ｂ）は、それぞれ、金型８００を構成する第１部材８０１および第２部材８０２を、それらの分割面側から見た平面図である。なお、図８（ａ）には、便宜上、第１成形面８１１の外形が破線で示されており、図８（ｂ）には、便宜上、ゲート８２０が破線で示されている。 Figure 7 is a cross-sectional view of a mold 800 used for injection molding of an insulating member 700. Figures 8(a) and (b) are plan views of a first member 801 and a second member 802 constituting the mold 800, respectively, as viewed from their parting surfaces. Note that for convenience, the outline of the first molding surface 811 is shown by a dashed line in Figure 8(a), and for convenience, the gate 820 is shown by a dashed line in Figure 8(b).

絶縁部材７００は、成形工程において、金型８００を用いて射出成形により形成される。 In the molding process, the insulating member 700 is formed by injection molding using a mold 800.

金型８００は、鋼材により形成され、コアである第１部材８０１と、キャビティである第２部材８０２とが結合されることにより構成される。金型８００の内部には、絶縁部材７００の形状を有する型部８１０が形成される。型部８１０は、絶縁部材７００の本体部７１０の後面７１０ｂを形成するための第１成形面８１１と、後面７１０ｂに背向する本体部７１０の前面７１０ａを形成するための第２成形面８１２と、を含む。 The mold 800 is made of steel and is constructed by joining a first member 801, which is a core, and a second member 802, which is a cavity. Inside the mold 800, a mold portion 810 having the shape of the insulating member 700 is formed. The mold portion 810 includes a first molding surface 811 for forming the rear surface 710b of the main body portion 710 of the insulating member 700, and a second molding surface 812 for forming the front surface 710a of the main body portion 710 facing away from the rear surface 710b.

第１成形面８１１は、本体部７１０の中央部に相当する位置に、第２成形面８１２側に突出するほぼ円柱状の突出部８１３を含む。また、第２成形面８１２は、突出部８１３を収容するほぼ円柱状の凹部８１４を含む。突出部８１３と凹部８１４との間には隙間が形成される。突出部８１３の先端面８１３ａと凹部８１４の底面８１４ａとの間の間隔は、その周囲の第１成形面８１１と第２成形面８１２との間隔よりも大きくされ、これら先端面８１３ａと底面８１４ａとの間の部分が大間隔部８１５となる。 The first molding surface 811 includes a substantially cylindrical protrusion 813 that protrudes toward the second molding surface 812 at a position corresponding to the center of the main body 710. The second molding surface 812 also includes a substantially cylindrical recess 814 that accommodates the protrusion 813. A gap is formed between the protrusion 813 and the recess 814. The distance between the tip surface 813a of the protrusion 813 and the bottom surface 814a of the recess 814 is larger than the distance between the first molding surface 811 and the second molding surface 812 around it, and the portion between the tip surface 813a and the bottom surface 814a becomes the large gap portion 815.

第１成形面８１１には、突出部８１３の先端面８１３ａに、型部８１０内への樹脂の注入口であるゲート８２０が形成される。ゲート８２０は、円形であり、大間隔部８１５に開口する。金型８００には、第１部材８０１に、ゲート８２０に繋がるランナー８３０が形成される。 A gate 820, which is an inlet for injecting resin into the mold section 810, is formed on the tip surface 813a of the protrusion 813 on the first molding surface 811. The gate 820 is circular and opens into the large gap section 815. In the mold 800, a runner 830 connected to the gate 820 is formed in the first member 801.

成形工程では、図示しないバルブによりゲート８２０が開放され、溶融状態の樹脂が、ランナー８３０を通じてゲート８２０から型部８１０内に注入される。図７および図８の矢印に示すように、樹脂は、まず、型部８１０の大間隔部８１５に流れ込む。その後、樹脂は、大間隔部８１５から放射状に流れて周囲に拡がる。これにより、型部８１０内全体に樹脂が充填される。 In the molding process, the gate 820 is opened by a valve (not shown), and molten resin is injected from the gate 820 through the runner 830 into the mold section 810. As shown by the arrows in Figures 7 and 8, the resin first flows into the large gap section 815 of the mold section 810. The resin then flows radially from the large gap section 815 and spreads around. This causes the entire mold section 810 to be filled with resin.

ここで、ゲート８２０は、絶縁部材７００の本体部７１０の表面（後面７１０ｂ）を構成する型部８１０の第１成形面８１１に設けられているため、板状の本体部７１０における中央に近い部分から樹脂を注入できる。これにより、型部８１０内で樹脂が流れる距離を短くできるので、型部８１０内全体に樹脂が行き渡りやすくなる。さらに、大間隔部８１５が、ゲート８２０から型部８１０内に流入した樹脂の溜り場となるため、型部８１０内での樹脂の流動性が良くなって、型部８１０内全体に樹脂が行き渡る時間が短くなる。 Since the gate 820 is provided on the first molding surface 811 of the mold portion 810 that constitutes the surface (rear surface 710b) of the main body portion 710 of the insulating member 700, resin can be injected from a portion close to the center of the plate-shaped main body portion 710. This shortens the distance that the resin flows within the mold portion 810, making it easier for the resin to spread throughout the entire mold portion 810. Furthermore, since the large gap portion 815 serves as a reservoir for the resin that flows into the mold portion 810 from the gate 820, the fluidity of the resin within the mold portion 810 is improved, and the time it takes for the resin to spread throughout the entire mold portion 810 is shortened.

型部８１０内に充填された樹脂が冷えて絶縁部材７００が形成される。型部８１０内への樹脂の充填が完了すると、バルブによりゲート８２０が閉塞される。この際、ゲート８２０の近傍に樹脂が残り、この樹脂が冷えてゲート跡７１５となる。その後、金型８００が分離されて、内部から絶縁部材７００が取り出される。 The resin filled in the mold part 810 cools to form the insulating member 700. When filling of the resin into the mold part 810 is completed, the gate 820 is closed by the valve. At this time, resin remains near the gate 820, and this resin cools to become the gate mark 715. The mold 800 is then separated, and the insulating member 700 is removed from the inside.

こうして、図４（ａ）および（ｂ）に示す絶縁部材７００が完成する。絶縁部材７００の本体部７１０には、型部８１０の突出部８１３と凹部８１４の間に樹脂が充填されることにより、突出部７１４が形成される。突出部７１４の先端部は、本体部７１０の他の部分よりも肉厚となる。突出部７１４の裏側の凹んだ面に、後方へ突出するゲート跡７１５が形成される。 In this way, the insulating member 700 shown in Figures 4(a) and (b) is completed. A protruding portion 714 is formed in the main body portion 710 of the insulating member 700 by filling the space between the protruding portion 813 and the recessed portion 814 of the mold portion 810 with resin. The tip portion of the protruding portion 714 is thicker than the other portions of the main body portion 710. A gate mark 715 protruding backward is formed on the recessed surface on the back side of the protruding portion 714.

＜実施の形態の効果＞
以上、本実施の形態によれば、以下の効果が奏される。 <Effects of the embodiment>
As described above, according to the present embodiment, the following effects are achieved.

絶縁部材７００は、第１バスバー５００と第２バスバー６００との間に介在する部分を有する板状の本体部７１０を含み、成形工程において、金型８００を用いて射出成形により製造される。金型８００の内部には、絶縁部材７００の形状を有する型部８１０が形成される。型部８１０は、本体部７１０の後面７１０ｂを形成するための第１成形面８１１と、後面７１０ｂに背向する本体部７１０の前面７１０ａを形成するための第２成形面８１２と、を含む。成形工程では、第１成形面８１１に設けられたゲート８２０から型部８１０内に溶融状態の樹脂が注入されて絶縁部材７００が形成される。 The insulating member 700 includes a plate-shaped main body 710 having a portion interposed between the first bus bar 500 and the second bus bar 600, and is manufactured by injection molding using a mold 800 in a molding process. A mold part 810 having the shape of the insulating member 700 is formed inside the mold 800. The mold part 810 includes a first molding surface 811 for forming the rear surface 710b of the main body 710, and a second molding surface 812 for forming the front surface 710a of the main body 710 facing away from the rear surface 710b. In the molding process, molten resin is injected into the mold part 810 from a gate 820 provided on the first molding surface 811 to form the insulating member 700.

絶縁部材７００の本体部７１０の表面（後面７１０ｂ）を構成する型部８１０の第１成形面８１１にゲート８２０が設けられているため、板状の本体部７１０における中央に近い部分から樹脂を注入できる。これにより、型部８１０内で樹脂が流れる距離を短くできるので、型部８１０内全体に樹脂が行き渡りやすくなり、絶縁部材７００の成形不良が生じにくくなる。 Since a gate 820 is provided on the first molding surface 811 of the mold part 810 that constitutes the surface (rear surface 710b) of the main body part 710 of the insulating member 700, resin can be injected from a portion close to the center of the plate-shaped main body part 710. This shortens the distance that the resin flows within the mold part 810, making it easier for the resin to spread throughout the entire mold part 810, and reducing the likelihood of molding defects in the insulating member 700.

また、型部８１０は、第１成形面８１１と第２成形面８１２との間隔がその周囲よりも大きくされた大間隔部８１５を含み、ゲート８２０は、大間隔部８１５に開口する。 In addition, the mold section 810 includes a large gap section 815 in which the gap between the first molding surface 811 and the second molding surface 812 is larger than the surrounding area, and the gate 820 opens into the large gap section 815.

大間隔部８１５が、ゲート８２０から型部８１０内に流入した樹脂の溜り場となるため、型部８１０内での樹脂の流動性が良くなって、型部８１０内全体に樹脂が行き渡る時間が短くなる。これにより、絶縁部材７００の成形不良が、一層生じにくくなる。 The large gap portion 815 serves as a reservoir for the resin that flows into the mold portion 810 from the gate 820, improving the fluidity of the resin within the mold portion 810 and shortening the time it takes for the resin to spread throughout the entire mold portion 810. This makes it even less likely that molding defects will occur in the insulating member 700.

さらに、第１成形面８１１は、第２成形面８１２側に突出する突出部８１３を含み、第２成形面８１２は、突出部８１３を収容する凹部８１４を含む。突出部８１３の先端面８１３ａにゲート８２０が設けられる。絶縁部材７００の本体部７１０には、突出部８１３と凹部８１４の間に樹脂が充填されることにより、後面７１０ｂの一部が凹み、前面７１０ａの一部が突出した突出部７１４が形成される。後面７１０ｂには、凹んだ面にゲート跡７１５が形成される。 Furthermore, the first molding surface 811 includes a protruding portion 813 that protrudes toward the second molding surface 812, and the second molding surface 812 includes a recessed portion 814 that accommodates the protruding portion 813. A gate 820 is provided on the tip surface 813a of the protruding portion 813. In the main body portion 710 of the insulating member 700, resin is filled between the protruding portion 813 and the recessed portion 814, so that a part of the rear surface 710b is recessed and a part of the front surface 710a protrudes, forming a protruding portion 714. A gate mark 715 is formed on the recessed surface of the rear surface 710b.

突出部７１４の裏側に形成された凹部７１４ａ内にゲート跡７１５が収容されるため、ゲート跡７１５が本体部７１０の後面７１０ｂから突出しにくくなる。 The gate mark 715 is accommodated in the recess 714a formed on the back side of the protruding portion 714, so that the gate mark 715 is less likely to protrude from the rear surface 710b of the main body portion 710.

さらに、本体部７１０の前面７１０ａに接する第１バスバー５００には、突出部７１４が貫通する開口部５１６が形成される。これにより、突出部７１４と第１バスバー５００との干渉を回避できる。 Furthermore, the first bus bar 500 that contacts the front surface 710a of the main body 710 has an opening 516 through which the protrusion 714 passes. This makes it possible to avoid interference between the protrusion 714 and the first bus bar 500.

本体部７１０の後面７１０ｂに接する第２バスバー６００には、後面７１０ｂに形成されるゲート跡７１５と整合する位置に開口部６１４が形成される。これにより、ゲート跡７１５と第２バスバー６００との干渉を回避できる。 The second bus bar 600, which contacts the rear surface 710b of the main body 710, has an opening 614 formed at a position that aligns with the gate mark 715 formed on the rear surface 710b. This makes it possible to avoid interference between the gate mark 715 and the second bus bar 600.

以上、本発明の実施の形態について説明したが、本発明は、上記実施の形態に限定されるものではなく、また、本発明の適用例も、上記実施の形態の他に、種々の変更が可能である。 Although the embodiment of the present invention has been described above, the present invention is not limited to the above embodiment, and various modifications of the application examples of the present invention are possible in addition to the above embodiment.

たとえば、上記実施の形態では、金型８００の型部８１０の１か所にゲート８２０が設けられた。しかしながら、型部８１０の複数か所、たとえば、２か所にゲート８２０が設けられてもよい。たとえば、絶縁部材７００の本体部７１０は、左右方向に長いため、図９に示すように、型部８１０において、本体部７１０の右半分の中央位置と左半分の中央位置に相当する２か所の位置に、ゲート８２０が設けられてもよい。 For example, in the above embodiment, the gate 820 is provided at one location on the mold portion 810 of the mold 800. However, the gate 820 may be provided at multiple locations, for example, two locations, on the mold portion 810. For example, since the main body portion 710 of the insulating member 700 is long in the left-right direction, the gate 820 may be provided at two locations on the mold portion 810, which correspond to the center position of the right half and the center position of the left half of the main body portion 710, as shown in FIG. 9.

また、上記実施の形態では、金型８００の型部８１０が、第１成形面８１１に突出部８１３を有し、第２成形面８１２に凹部８１４を有する。この結果、絶縁部材７００の本体部７１０には、前面７１０ａから突出し、裏面に凹部７１４ａを有する突出部７１４が形成され、凹部７１４ａの底面にゲート跡７１５が形成される。これにより、ゲート跡７１５が本体部７１０の後面７１０ｂから突出しない、あるいは、突出しにくい。 In addition, in the above embodiment, the mold portion 810 of the mold 800 has a protrusion 813 on the first molding surface 811 and a recess 814 on the second molding surface 812. As a result, the main body portion 710 of the insulating member 700 is formed with a protrusion 714 that protrudes from the front surface 710a and has a recess 714a on the back surface, and a gate mark 715 is formed on the bottom surface of the recess 714a. As a result, the gate mark 715 does not protrude, or is unlikely to protrude, from the rear surface 710b of the main body portion 710.

しかしながら、ゲート跡７１５が本体部７１０の後面７１０ｂから突出することが許容される場合、図１０（ａ）に示すように、金型８００の型部８１０には、第２成形面８１２に、大間隔部８１５を構成するための凹部８１６が形成され、第１成形面８１１に突出部８１３が形成されなくてもよい。この場合、図１０（ｂ）に示すように、絶縁部材７００の本体部７１０には、他の部分よりも肉厚が大きい分だけ前面７１０ａから突出する突出部７１９ａが形成され、後面７１０ｂからゲート跡７１５が突出する。突出部７１９ａの突出量は、上記実施の形態の突出部７１４の突出量より少なくなる。第１バスバー５００、第２バスバー６００および絶縁部材７００が組み合わされると、突出部７１９ａが、第１バスバー５００の開口部５１６を貫通し、ゲート跡７１５が、第２バスバー６００の開口部６１４を貫通する。 However, if the gate mark 715 is allowed to protrude from the rear surface 710b of the main body 710, as shown in Fig. 10(a), the mold part 810 of the mold die 800 has a recess 816 for forming the large gap portion 815 formed in the second molding surface 812, and the protrusion 813 does not have to be formed in the first molding surface 811. In this case, as shown in Fig. 10(b), the main body 710 of the insulating member 700 has a protrusion 719a that protrudes from the front surface 710a by an amount that is thicker than other parts, and the gate mark 715 protrudes from the rear surface 710b. The protrusion amount of the protrusion 719a is less than the protrusion amount of the protrusion 714 in the above embodiment. When the first bus bar 500, the second bus bar 600, and the insulating member 700 are assembled, the protrusion 719a penetrates the opening 516 of the first bus bar 500, and the gate mark 715 penetrates the opening 614 of the second bus bar 600.

あるいは、図１０（ｃ）に示すように、金型８００の型部８１０には、第１成形面８１１に、大間隔部８１５を構成するための凹部８１７が形成され、突出部８１３が形成されなくてもよい。この場合、図１０（ｄ）に示すように、絶縁部材７００の本体部７１０には、他の部分よりも肉厚が大きい分だけ後面７１０ｂから突出する突出部７１９ｂが形成され、この突出部７１９ｂからゲート跡７１５が突出する。この場合、本体部７１０の前面７１０ａが平坦となるため、第１バスバー５００に開口部５１６が形成されなくなる。第１バスバー５００、第２バスバー６００および絶縁部材７００が組み合わされると、突出部７１９ｂおよびゲート跡７１５が、第２バスバー６００の開口部６１４を貫通する。 Alternatively, as shown in FIG. 10(c), the mold part 810 of the mold die 800 may have a recess 817 for forming the large gap part 815 on the first molding surface 811, and the protrusion 813 may not be formed. In this case, as shown in FIG. 10(d), the main body part 710 of the insulating member 700 has a protrusion 719b that protrudes from the rear surface 710b by an amount that is thicker than other parts, and the gate mark 715 protrudes from this protrusion 719b. In this case, since the front surface 710a of the main body part 710 becomes flat, the opening 516 is not formed in the first bus bar 500. When the first bus bar 500, the second bus bar 600, and the insulating member 700 are combined, the protrusion 719b and the gate mark 715 penetrate the opening 614 of the second bus bar 600.

さらに、上記実施の形態では、樹脂の溜り場を形成するために、金型８００の型部８１０内に大間隔部８１５が設けられた。しかしながら、溜り場が無くても樹脂の流動性が十分に得られる場合は、型部８１０内に大間隔部８１５が設けられなくてもよい。 Furthermore, in the above embodiment, a large gap portion 815 is provided in the mold portion 810 of the mold 800 to form a reservoir for the resin. However, if sufficient fluidity of the resin can be obtained without a reservoir, the large gap portion 815 does not need to be provided in the mold portion 810.

さらに、上記実施の形態では、第２バスバー６００の本体部６１０に開口部６１４が形成された。しかしながら、絶縁部材７００の本体部７１０において、凹部７１４ａの深さ、即ち突出部７１４の突出量が、ゲート跡７１５が、その高さがばらついても、本体部７１０の後面７１０ｂから突出しない程度に大きくされた場合は、第２バスバー６００の本体部６１０に開口部６１４が形成されなくてもよい。 Furthermore, in the above embodiment, the opening 614 is formed in the body 610 of the second busbar 600. However, if the depth of the recess 714a in the body 710 of the insulating member 700, i.e., the amount of protrusion of the protrusion 714, is increased to such an extent that the gate mark 715 does not protrude from the rear surface 710b of the body 710 even if its height varies, the opening 614 does not need to be formed in the body 610 of the second busbar 600.

さらに、上記実施の形態では、絶縁部材７００の本体部７１０の後面７１０ｂおよび前面７１０ａが、それぞれ、金型８００の型部８１０の第１成形面８１１および第２成形面８１２により形成された。しかしながら、反対に、絶縁部材７００の本体部７１０の前面７１０ａおよび後面７１０ｂが、それぞれ、型部８１０の第１成形面８１１および第２成形面８１２により形成されてもよい。この場合、絶縁部材７００には、本体部７１０の後面７１０ｂ側に突出部７１４が形成され、前面７１０ａ側にゲート跡７１５が形成される。 Furthermore, in the above embodiment, the rear surface 710b and the front surface 710a of the main body 710 of the insulating member 700 are formed by the first molding surface 811 and the second molding surface 812 of the mold part 810 of the mold 800, respectively. However, conversely, the front surface 710a and the rear surface 710b of the main body 710 of the insulating member 700 may be formed by the first molding surface 811 and the second molding surface 812 of the mold part 810, respectively. In this case, the insulating member 700 has a protrusion 714 formed on the rear surface 710b side of the main body 710, and a gate mark 715 formed on the front surface 710a side.

さらに、上記実施の形態では、フィルムコンデンサ１に１個のコンデンサ素子４００が備えられた。しかしながら、コンデンサ素子４００の個数は、２個以上であってもよく、適宜、変更されてよい。 Furthermore, in the above embodiment, the film capacitor 1 is provided with one capacitor element 400. However, the number of capacitor elements 400 may be two or more and may be changed as appropriate.

さらに、上記実施の形態では、コンデンサ素子４００は、誘電体フィルム上にアルミニウムを蒸着させた２枚の金属化フィルムを重ね、重ねた金属化フィルムを巻回または積層することで形成されたものであるが、これ以外にも、誘電体フィルムの両面にアルミニウムを蒸着させた金属化フィルムと絶縁フィルムとを重ね、これを巻回または積層することにより、これらコンデンサ素子４００が形成されてもよい。 Furthermore, in the above embodiment, the capacitor element 400 is formed by stacking two metallized films with aluminum vapor-deposited on a dielectric film, and then rolling or laminating the stacked metallized films. However, in addition to this, these capacitor elements 400 may also be formed by stacking a metallized film with aluminum vapor-deposited on both sides of a dielectric film and an insulating film, and then rolling or laminating the resulting structure.

さらに、上記実施の形態では、本発明のコンデンサの一例として、フィルムコンデンサ１が挙げられた。しかしながら、本発明は、フィルムコンデンサ１以外のコンデンサに適用することもできる。 Furthermore, in the above embodiment, a film capacitor 1 is given as an example of a capacitor of the present invention. However, the present invention can also be applied to capacitors other than the film capacitor 1.

この他、本発明の実施の形態は、特許請求の範囲に示された技術的思想の範囲内において、適宜、種々の変更が可能である。 In addition, various modifications of the embodiment of the present invention are possible within the scope of the technical ideas set forth in the claims.

なお、上記実施の形態の説明において「上方」「下方」等の方向を示す用語は、構成部材の相対的な位置関係にのみ依存する相対的な方向を示すものであり、鉛直方向、水平方向等の絶対的な方向を示すものではない。 In the above description of the embodiment, terms indicating directions such as "upper" and "lower" indicate relative directions that depend only on the relative positional relationship of the components, and do not indicate absolute directions such as vertical or horizontal.

本発明は、各種電子機器、電気機器、産業機器、車両の電装等に使用されるコンデンサに有用である。 The present invention is useful for capacitors used in various electronic devices, electrical devices, industrial equipment, vehicle electrical equipment, etc.

１フィルムコンデンサ（コンデンサ）
４００コンデンサ素子
５００第１バスバー（バスバー）
５１６開口部（第１開口部）
６００第２バスバー（バスバー）
６１４開口部（第２開口部）
７００絶縁部材
７１０本体部
７１０ａ前面（第２表面）
７１０ｂ後面（第１表面）
７１４突出部（第２突出部）
７１５ゲート跡
８００金型
８１０型部
８１１第１成形面
８１２第２成形面
８１３突出部（第１突出部）
８１３ａ先端面
８１４凹部
８２０ゲート 1. Film capacitor (capacitor)
400 Capacitor element 500 First bus bar (bus bar)
516 Opening (first opening)
600 Second bus bar (bus bar)
614 Opening (second opening)
700: Insulating member 710: Main body 710a: Front surface (second surface)
710b Rear surface (first surface)
714 Projection (second projection)
715 Gate mark 800 Mold 810 Mold section 811 First molding surface 812 Second molding surface 813 Protruding portion (first protruding portion)
813a: tip surface 814: recess 820: gate

Claims

A method for manufacturing a capacitor in which a pair of bus bars connected to a capacitor element are overlapped with an insulating member sandwiched therebetween, comprising the steps of:
The method includes a molding step of manufacturing the insulating member by injection molding using a mold,
the insulating member includes a plate-shaped main body having a portion interposed between the pair of bus bars,
A mold portion having a shape of the insulating member is formed inside the mold,
the mold portion includes a first molding surface for forming a first surface of the main body portion, a second molding surface for forming a second surface of the main body portion opposite to the first surface, and a large gap portion in which the gap between the first molding surface and the second molding surface is larger than the gap around the first molding surface and the second molding surface ;
In the molding step, molten resin is injected into the mold portion through a gate provided on the first molding surface to form the insulating member ,
The gate opens into the large gap portion.
A method for manufacturing a capacitor comprising the steps of:

2. The method for producing a capacitor according to claim 1,
the first molding surface includes a first protruding portion protruding toward the second molding surface,
the second molding surface includes a recess that accommodates the first protrusion,
The gate is provided on a tip surface of the first protrusion,
The resin is filled between the first protruding portion and the recessed portion, so that a second protruding portion is formed in the main body portion such that a portion of the first surface is recessed and a portion of the second surface is protruding,
A gate mark is formed on the first surface at a recessed surface.
A method for manufacturing a capacitor comprising the steps of:

The method for producing a capacitor according to claim 2 ,
a first opening through which the second protrusion passes is formed in the bus bar in contact with the second surface of the pair of bus bars;
A method for manufacturing a capacitor comprising the steps of:

The method for manufacturing a capacitor according to any one of claims 1 to 3 ,
a second opening is formed in the bus bar in contact with the first surface at a position aligned with a gate mark formed on the first surface, of the pair of bus bars;
A method for manufacturing a capacitor comprising the steps of:

A method for manufacturing a capacitor in which a pair of bus bars connected to a capacitor element are overlapped with an insulating member sandwiched therebetween, comprising the steps of:
The method includes a molding step of manufacturing the insulating member by injection molding using a mold,
the insulating member includes a plate-shaped main body having a portion interposed between the pair of bus bars,
A mold portion having a shape of the insulating member is formed inside the mold,
the mold portion includes a first molding surface for forming a first surface of the body portion and a second molding surface for forming a second surface of the body portion opposite to the first surface;
In the molding step, molten resin is injected into the mold portion through a gate provided on the first molding surface to form the insulating member,
the first molding surface includes a first protruding portion protruding toward the second molding surface,
the second molding surface includes a recess that accommodates the first protrusion,
The gate is provided on a tip surface of the first protrusion,
The resin is filled between the first protruding portion and the recessed portion, so that a second protruding portion is formed in the main body portion such that a portion of the first surface is recessed and a portion of the second surface is protruding,
A gate mark is formed on the first surface at a recessed surface.
A method for manufacturing a capacitor comprising the steps of:

6. The method for producing a capacitor according to claim 5,
a first opening through which the second protrusion passes is formed in the bus bar in contact with the second surface of the pair of bus bars;
A method for manufacturing a capacitor comprising the steps of:

7. The method for producing a capacitor according to claim 5,
a second opening is formed in the bus bar in contact with the first surface at a position aligned with a gate mark formed on the first surface, of the pair of bus bars;
A method for manufacturing a capacitor comprising the steps of:

A method for manufacturing a capacitor in which a pair of bus bars connected to a capacitor element are overlapped with an insulating member sandwiched therebetween, comprising the steps of:
The method includes a molding step of manufacturing the insulating member by injection molding using a mold,
the insulating member includes a plate-shaped main body having a portion interposed between the pair of bus bars,
A mold portion having a shape of the insulating member is formed inside the mold,
the mold portion includes a first molding surface for forming a first surface of the body portion and a second molding surface for forming a second surface of the body portion opposite to the first surface;
In the molding step, molten resin is injected into the mold portion through a gate provided on the first molding surface to form the insulating member,
an opening is formed in the bus bar in contact with the first surface at a position aligned with a gate mark formed on the first surface, of the pair of bus bars;
A method for manufacturing a capacitor comprising the steps of: