JP7531233B2 - Color optical inspection device and system including the same - Google Patents

Description

The following embodiments relate to a color optical inspection device and a system including the same.

Recently, the miniaturization and high performance of electronic products have led to a change in the paradigm for inspecting fine circuits. In general, when inspecting fine circuits, the surface of the fine circuit is photographed with high-magnification optical inspection equipment, and the photographed image is inspected with the naked eye or through a program. In order to inspect the surface of a micro-unit fine circuit, the optical performance of the optical inspection equipment is extremely important. However, optical inspection equipment with high magnification and high resolution has a narrow F.O.V (Field of View) and takes a long time to inspect, which reduces productivity. In addition, when processing an image with high magnification and high resolution, various constraints are involved, such as a large image capacity and a long image processing time. Due to these problems, conventional optical inspection equipment uses a camera equipped with a black-and-white (Mono) CCD with a relatively small capacity. However, the black-and-white processed image has a limit in itself for inspecting various defect conditions. From this limit, it is necessary to increase the F.O.V while maintaining high optical resolution. There is a need to develop optical inspection equipment and systems that can increase productivity by widening the V and use color images without hindering image processing speed.

The above-mentioned background art was held or acquired by the inventors in the process of deriving the contents of this specification, and cannot necessarily be said to be publicly known art that was disclosed to the general public prior to the filing of this application.

The objective of the embodiment is to provide a color optical inspection device and a system including the same that can increase inspection accuracy while reducing processing speed by using color images.

The problems to be solved by the embodiments are not limited to those mentioned above, and other problems not mentioned will be clearly understood by those skilled in the art from the description below.

A color optical inspection device according to an embodiment and a system including the same are disclosed. The color optical inspection device includes a light source unit provided on the upper part of a substrate and irradiating light onto a via hole of the substrate, a lens assembly provided on one side of the light source unit and focusing light reflected from the via hole, a sensor unit provided on the upper part of the lens assembly and detecting the light focused by the lens assembly to form a color image, and a determination unit that determines the presence or absence of a defect and the type of the defect based on the color image received from the sensor unit.

According to one aspect, the sensor unit may include a CCD sensor having a pixel resolution of 1.0 μm to 1.5 μm.

According to one aspect, a beam splitter that changes the path of the light emitted from the light source unit may be provided inside the lens assembly.

According to one aspect, the beam splitter can reflect the light emitted from the light source unit toward the substrate, and transmit the light reflected from the via hole toward the sensor unit.

The color optical inspection system includes an optical inspection stage on which a substrate is placed, and a number of color optical inspection devices that are provided on the optical inspection stage and inspect the substrate. The color optical inspection devices include a light source unit that is provided on the top of the substrate and irradiates light onto via holes in the substrate, a lens assembly that is provided on one side of the light source unit and collects light reflected from the via holes, a sensor unit that is provided on the top of the lens assembly and detects the light collected by the lens assembly to form a color image, and a judgment unit that judges the presence or absence of defects and the type of defect based on the color image received from the sensor unit.

According to one aspect, three of the color optical inspection devices can be arranged to photograph the board in three equal parts.

According to one aspect, the optical inspection stage may include a table, a first transport unit provided on the table to transport the substrate in a first direction, and an inspection device mounting unit provided above the substrate to mount the color optical inspection device.

According to one aspect, the inspection device mounting section may include a second transport section that linearly transports the color optical inspection device along a second direction that perpendicularly intersects the first direction.

According to one aspect, the second conveying unit may be provided in three units so that the color optical inspection device can be mounted on each unit, and may be driven simultaneously.

According to one aspect, the sensor unit may include a CCD sensor having a pixel resolution of 1.0 μm to 1.5 μm.

According to one aspect, a beam splitter that changes the path of the light emitted from the light source unit may be provided inside the lens assembly.

According to one aspect, the beam splitter can reflect the light emitted from the light source unit toward the substrate, and transmit the light reflected from the via hole toward the sensor unit.

According to an embodiment, a color optical inspection device and a system including the same can capture color images to improve inspection accuracy and reduce inspection speed, thereby increasing productivity.

The effects of the color optical inspection device and the system including the same according to one embodiment are not limited to those mentioned above, and further effects not mentioned will be clearly understood by those skilled in the art from the description below.

FIG. 1 illustrates a color optical inspection apparatus according to an embodiment. FIG. 2 is a diagram illustrating a schematic configuration of a light source unit illustrated in FIG. 1 . 2 is a photograph showing a result of a defective type detected by the determination unit shown in FIG. 1 . FIG. 1 illustrates a color optical inspection system according to one embodiment. FIG. 5 is a diagram showing the color optical inspection device shown in FIG. 4 being connected to a judgment unit.

The following drawings attached to this specification are illustrative of preferred embodiments of the present invention, and together with the detailed description of the invention, serve to further understand the technical concept of the present invention, and therefore the present invention should not be interpreted as being limited to only the matters depicted in such drawings.

Hereinafter, the embodiments will be described in detail with reference to the attached drawings. However, the specific structural or functional description disclosed in this specification is merely an example for the purpose of explaining the embodiments, and the embodiments may be implemented in various different forms, and the present invention is not limited to the embodiments described in this specification. It should be understood that all modifications, equivalents, or alternatives to the embodiments are included in the scope of the rights.

The terms used in the embodiments are merely used for the purpose of explanation and are not to be construed as limiting. The singular term includes the plural term unless the context clearly indicates otherwise. In this specification, the terms "include" and "have" indicate the presence of a feature, number, step, operation, component, part, or combination thereof described in the specification, and should be understood as not precluding the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof.

Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by a person of ordinary skill in the art to which the present invention pertains. Terms commonly used and predefined should be interpreted as having a meaning consistent with the meaning they have in the context of the relevant art, and should not be interpreted as having an ideal or overly formal meaning unless expressly defined in this specification.

In addition, in the description with reference to the attached drawings, the same components will be given the same reference symbols regardless of the drawing numbers, and duplicate descriptions thereof will be omitted. In the description of the embodiments, if a detailed description of related publicly known technology is deemed to unnecessarily obscure the gist of the embodiments, the detailed description will be omitted.

In addition, in describing the components of the embodiments, terms such as first, second, A, B, (a), (b), etc. may be used. Such terms are merely used to distinguish the components from other components, and do not limit the nature, order, or sequence of the components in question.

Components included in one embodiment and components having common functions will be described using the same names in other embodiments. Unless otherwise stated, the description of one embodiment will also apply to other embodiments, and detailed descriptions will be omitted to the extent that they overlap.

A color optical inspection device 1 and a system 2 using the same will be described with reference to the drawings. For reference, FIG. 1 is a diagram showing a color optical inspection device 1 according to one embodiment, FIG. 2 is a diagram showing a schematic configuration of the light source unit 10 shown in FIG. 1, FIG. 3 is a photograph showing the results according to the defective type detected by the judgment unit 13 shown in FIG. 1, FIG. 4 is a diagram showing a color optical inspection system 2 according to one embodiment, and FIG. 5 is a diagram showing the state in which the color optical inspection device 1 shown in FIG. 4 is connected to the judgment unit 13.

Referring to Figures 1 and 2, the color optical inspection device 1 is configured to include a light source unit 10, a lens assembly 11, a sensor unit 12, and a judgment unit 13.

The substrate S has a resin layer F laminated on a metal layer M, a protective film layer B laminated on the resin layer F, and a via hole V formed through the protective film layer B and the resin layer F. The metal layer M is exposed at the bottom surface R of the via hole V.

Here, when the via hole V is formed, if some of the resin layer F remains on the bottom surface R, if the surface roughness of the bottom surface R is uneven, or if the via hole V penetrates all the way to the metal layer, defects may occur.

The color optical inspection device 1 can form a color image of the via hole V and determine the defects and types of defects occurring in the via hole V.

The light source unit 10 is provided above the substrate S to be inspected, and irradiates light onto a via hole V formed in the substrate S. For example, the light emitted from the light source unit 10 may be white light in the visible light range.

The light source unit 10 includes a light irradiation unit 101 and a beam splitter 102. The light irradiation unit 101 is configured to irradiate light in the direction of the substrate S. The end of the light irradiation unit 101 may include an aperture 1011 for adjusting the amount of light. In addition, a polarizing filter 1012 is provided in front of the aperture 1011, and the light that passes through the aperture 1011 can be adjusted.

The beam splitter 102 changes the path of the light irradiated from the light source unit 10. The beam splitter 102 is composed of, for example, two mirrors 102a and 102b. Here, the beam splitter 102 is composed of a first mirror 102a provided on the upper part of the substrate S and a second mirror 102b provided on the path of the light irradiated from the light source unit 10. The second mirror 102b reflects the light incident from the light source unit 10 to the first mirror 102a, which reflects the incident light to the upper part of the substrate S so that it is incident on the via hole V. Then, the first mirror 102a transmits the light reflected from the via hole V in the direction of the sensor unit 12. Here, the reflection angle of the light reflected from the via hole V may change depending on the type of defect of the via hole V.

The arrangement and number of beam splitters 102 are not limited to those shown and can be varied.

The lens assembly 11 is provided on one side of the light source unit 10 and collects the light reflected by the via hole V. The lens assembly 11 is composed of a bundle of lenses arranged in a row on the optical axis. One end 111 of the lens assembly 11 collects the light reflected from the beam splitter 102 to form a focal point at the center of the via hole V. The light reflected from the via hole V passes through the one end 111 of the lens assembly 11 and the beam splitter 102 again to reach the sensor unit 12. Here, the one end 111 of the lens assembly 11 may be provided with a filter unit 1111 to block light of a specific band. For example, the filter unit 1111 may be a dichroic filter. The dichroic filter may improve imaging sensitivity and reduce flare effects by blocking ultraviolet and infrared rays and transmitting visible light. The sensor unit 12 uses the filter unit 1111 to use light in the visible light band from which ultraviolet and infrared light bands have been removed, allowing it to more accurately detect the presence or absence of defects in the via hole V.

The lens assembly 11 may also include a lens assembly drive unit (not shown) to control the focal length by moving the vertical distance of the lens assembly 11. For example, the lens assembly drive unit (not shown) may be provided on one side of the lens assembly 11 and provide a drive force to the lens assembly 11 to move the lens assembly 11 in the vertical distance to adjust the focus.

The sensor unit 12 detects the light collected by the lens assembly 11 and forms a color image. Here, the sensor unit 12 preferably has a resolution of 16K, which is approximately 16,000 pixels wide.

The sensor unit 12 may include a CCD sensor 121 with a pixel resolution of 1.0 μm to 1.5 μm. The sensor unit 12 includes a sensor control unit 123 that can adjust the pixel resolution and F.O.V. (Field of View). Here, the lower the pixel resolution, the higher the inspection accuracy, but the slower the inspection speed. Therefore, it is preferable to use a CCD sensor 121 with a pixel resolution of 1.5 μm.

The sensor unit 12 may also include a color filter 122 at the bottom to provide color imaging output.

The judgment unit 13 judges the presence or absence of a defect and the type of defect based on the color imaging received from the sensor unit 12.

Referring to FIG. 3, the judgment unit 13 can judge the presence or absence of a via hole V defect and the type of defect based on the color imaging f that is judged to be a pass product under the condition of a pixel resolution of 1.0 μm.

Defect types of via holes V include unprocessed, overprocessed, hole shift, transparent F/M (foreign material), resin residue at the bottom of the via hole, hole size defect, and roundness defect. As an example, contamination is when the bottom of the via hole V is contaminated by foreign matter (a), hole shift is when the via hole V is formed shifted from the set position (b), overprocessed is when the via hole V is formed beyond the set depth (c), resin residue is when the resin is not completely removed at the bottom of the via hole V and residue remains (d), and transparent F/M is when transparent foreign matter penetrates (e).

In this way, the judgment unit 13 can apply a defect judgment algorithm that can measure the color space value of the color imaging and the internal hole size of the pixel and judge defects. For example, the judgment unit 13 can measure the hole size within one pixel under the condition of a pixel resolution of 1.5 μm, and compare it with the color imaging f judged to be good to judge the presence or absence of defects such as unprocessed work, over-processed work, hole shift, hole size defect, and roundness defect.

In addition, the judgment unit 13 measures the color, saturation, and brightness of the color imaging to calculate a color space value, extracts the position coordinates of the via hole from the calculated color space value , and compares it with the color imaging f judged to be a non-defective product for the position of each via hole, thereby making it possible to judge the presence or absence of a defect in the transparent F/M or the resin remaining at the bottom of the via hole.

On the other hand, the color optical inspection device 1 and the optical inspection stage 20 form an optical inspection system 2.

Referring to FIG. 4, the color optical inspection system 2 includes an optical inspection stage 20 and multiple color optical inspection devices 1.

Here, multiple color optical inspection devices 1 are provided. For example, three color optical inspection devices 1 are provided: a first color optical inspection device 1a, a second color optical inspection device 1b, and a third color optical inspection device 1c, and each of the color optical inspection devices 1a, 1b, and 1c may be arranged to photograph the substrate S by dividing it into three equal parts.

The optical inspection stage 20 holds the substrate S to be inspected, prevents vibration from being applied to the substrate S, and allows each of the color optical inspection devices 1a, 1b, and 1c to move above the substrate S.

The optical inspection stage 20 includes a table 201, a first transport section 202, and an inspection device mounting section 203.

The table 201 is made of a porous ceramic material and has a rectangular base plate shape when viewed from above. The table 201 may be precision machined to have a flatness of 10 μm to 20 μm. The table 201 has a number of fine holes formed on its surface, allowing air to be sucked in from the bottom of the table 201 to fix the substrate S placed on the top of the table 201. For example, the fine holes are formed with a diameter of 10 μm to 15 μm, and when air is sucked in, an adhesive force of 7 kg to 9 kg is applied to the substrate S on the top of the table 201, thereby controlling the warpage of the substrate S.

The first conveying unit 202 is provided on the table 201 and conveys the substrate S in a first direction. For example, the first conveying unit 202 can convey the substrate S in the longitudinal direction of the table 201. For example, the first conveying unit 202 can be connected to one side of the substrate S and can linearly convey the substrate S along the first direction, which is the longitudinal direction of the table 201.

The inspection device mounting section 203 is provided above the substrate S, and the color optical inspection device 1 is mounted thereon. The inspection device mounting section 203 is provided at a predetermined distance above the surface of the table 201, and may be provided across the table.

The inspection device mounting section 203 includes a second transport section 204 that transports the color optical inspection device 1.

The second conveying unit 204 is capable of linearly conveying the color optical inspection device 1 along a second direction perpendicular to the first direction. Here, three second conveying units 204 may be provided so that the color optical inspection device 1 can be mounted on each of them, and they may be driven simultaneously.

In this embodiment, the color optical inspection device 1 is illustrated as moving the substrate S perpendicularly to the direction of transport while inspecting the substrate S. However, this is for ease of explanation, and inspection can also be performed while moving only one of the substrate S or the color optical inspection device 1.

The judgment unit 13 judges the presence or absence of a defect and the type of defect through the color imaging received from the sensor unit 12.

The judgment unit 13 includes preprocessing units 131, 132, and 133. The preprocessing units 131, 132, and 133 may be computers equipped with a CPU, memory, an input/output interface, etc.

Referring to FIG. 5, the first sensor unit 12a, the second sensor unit 12b, and the third sensor unit 12c of the sensor unit 12 are connected in parallel to external pre-processing units 131, 132, and 133, respectively, and each of the pre-processing units 131, 132, and 133 is connected to the judgment unit 13.

The three color optical inspection devices 1 photograph the substrate S by dividing it into three parts, and the color images photographed by each are transmitted to pre-processing units 131, 132, and 133 connected to the outside. The pre-processing units 131, 132, and 133 can send and receive color imaging data from the sensor unit 12 and process it. By providing multiple pre-processing units 131, 132, and 133, the judgment unit 13 can efficiently process high-resolution color imaging files and improve processing speed. The color imaging files that have passed through the pre-processing units 131, 132, and 133 are finally transmitted to the judgment unit 13, and the judgment unit 13 can determine the presence or absence of defects and the type of defects through the received color imaging.

According to this embodiment, the color optical inspection device 1 and the system 2 including the same can capture a color image of the via hole V to improve the accuracy of the inspection.

In addition, the color optical inspection device 1 and the system 2 including the same can prevent vibration of the substrate S by using an optical inspection stage 20 made of a porous ceramic material with fine holes formed therein, thereby improving the precision of the via hole V inspection.

In addition, the color optical inspection device 1 and the system 2 including it are equipped with multiple pre-processing units 131, 132, and 133, which can increase the processing speed of color imaging and quickly process high-volume color imaging of via holes V, thereby improving productivity.

Although the embodiments of the present invention have been described above in detail with reference to the drawings, the present invention is not limited to the above-described embodiments, and a person having ordinary skill in the art can apply various technical modifications and variations based on the above. For example, the described techniques may be performed in an order different from that described, and/or the components of the described systems, structures, devices, circuits, etc. may be combined or combined in a form different from that described, or may be replaced or substituted by other components or equivalents, and still achieve suitable results.

Accordingly, other implementations, other embodiments, and equivalents of the claims are within the scope of the following claims.
[Configuration 1]
a light source unit provided on an upper portion of the substrate and configured to irradiate light onto a via hole of the substrate;
a lens assembly provided on one side of the light source unit and configured to collect light reflected from the via hole;
a sensor unit provided on an upper portion of the lens assembly, the sensor unit detecting light condensed by the lens assembly and forming a color image;
a determination unit that determines the presence or absence of a defect and the type of the defect through the color imaging received from the sensor unit;
A color optical inspection apparatus comprising:
[Configuration 2]
2. The color optical inspection apparatus of claim 1, wherein the sensor portion includes a CCD sensor having a pixel resolution of 1.0 μm to 1.5 μm.
[Configuration 3]
2. The color optical inspection device according to claim 1, wherein a beam splitter that converts the path of light irradiated from the light source unit is provided inside the lens assembly.
[Configuration 4]
4. The color optical inspection device according to configuration 3, wherein the beam splitter reflects the light irradiated from the light source unit toward the substrate, and transmits the light reflected from the via hole toward the sensor unit.
[Configuration 5]
an optical inspection stage on which the substrate is placed;
a plurality of color optical inspection devices provided on the optical inspection stage and configured to inspect the substrate;
Including,
The color optical inspection apparatus includes:
a light source unit provided on an upper portion of the substrate and configured to irradiate light onto a via hole of the substrate;
a lens assembly provided on one side of the light source unit and configured to collect light reflected from the via hole;
a sensor unit provided on an upper portion of the lens assembly, the sensor unit detecting light condensed by the lens assembly and forming a color image;
a determination unit that determines the presence or absence of a defect and the type of the defect through the color imaging received from the sensor unit;
A color optical inspection system comprising:
[Configuration 6]
The color optical inspection system of configuration 5, wherein three of the color optical inspection devices are arranged to photograph the substrate in three equal parts.
[Configuration 7]
The optical inspection stage includes:
A table and
a first transport unit provided on the table and configured to transport the substrate in a first direction;
an inspection device mounting portion provided on an upper portion of the substrate, on which the color optical inspection device is mounted;
6. The color optical inspection system of embodiment 5, comprising:
[Configuration 8]
8. The color optical inspection system of claim 7, wherein the inspection device mounting section includes a second transport section that linearly transports the color optical inspection device along a second direction perpendicular to and intersecting the first direction.
[Configuration 9]
The color optical inspection system according to configuration 8, wherein the second transport unit is provided in three units so that the color optical inspection device can be mounted on each of the second transport units, and the second transport units are driven simultaneously.
[Configuration 10]
6. The color optical inspection system of claim 5, wherein the sensor portion includes a CCD sensor having a pixel resolution of 1.0 μm to 1.5 μm.
[Configuration 11]
The color optical inspection system of configuration 5, wherein a beam splitter is provided inside the lens assembly to convert the path of light emitted from the light source unit.
[Configuration 12]
12. The color optical inspection system of claim 11, wherein the beam splitter reflects light emitted from the light source unit toward the substrate and transmits light reflected from the via hole toward the sensor unit.

REFERENCE SIGNS LIST 1 Color optical inspection device 10 Light source unit 101 Light irradiation unit 1011 Aperture 1012 Polarizing filter 102 Beam splitter 11 Lens assembly 111 End of lens assembly 1111 Filter unit 12 Sensor unit 121 CCD sensor 122 Color filter 123 Sensor control unit 13 Determination unit 2 Color optical inspection system 20 Optical inspection stage 201 Table 202 First transport unit 203 Inspection device mounting unit 204 Second transport unit S Substrate V Via hole

Claims (12)

a light source unit provided on an upper portion of the substrate and configured to irradiate light onto a via hole of the substrate;
a lens assembly provided on one side of the light source unit and configured to collect light reflected from the via hole;
a sensor unit provided on an upper portion of the lens assembly, the sensor unit detecting light condensed by the lens assembly and forming a color image;
a determination unit that determines whether or not there is a defect in the via hole and the type of the defect based on the color imaging received from the sensor unit;
Including,
the determining unit measures the color, saturation, and brightness of the color imaging to calculate a color space value, calculates position coordinates of the via hole from the calculated color space value , and determines whether or not the via hole is defective by comparing with a color imaging determined to be non-defective for each via hole position;
Color optical inspection equipment. The color optical inspection device of claim 1, wherein the sensor unit includes a CCD sensor with a pixel resolution of 1.0 μm to 1.5 μm. The color optical inspection device according to claim 1, wherein the lens assembly is provided with a beam splitter inside to change the path of the light emitted from the light source unit. The color optical inspection device according to claim 3, wherein the beam splitter reflects the light emitted from the light source unit toward the substrate and transmits the light reflected from the via hole toward the sensor unit. an optical inspection stage on which the substrate is placed;
a plurality of color optical inspection devices provided on the optical inspection stage and configured to inspect the substrate;
Including,
The color optical inspection apparatus includes:
a light source unit provided on an upper portion of the substrate and configured to irradiate light onto a via hole of the substrate;
a lens assembly provided on one side of the light source unit and configured to collect light reflected from the via hole;
a sensor unit provided on an upper portion of the lens assembly, the sensor unit detecting light condensed by the lens assembly and forming a color image;
a determination unit that determines whether or not there is a defect in the via hole and the type of the defect based on the color imaging received from the sensor unit;
Including,
the determining unit measures the color, saturation, and brightness of the color imaging to calculate a color space value, calculates position coordinates of the via hole from the calculated color space value , and determines whether or not the via hole is defective by comparing with a color imaging determined to be non-defective for each via hole position;
Color optical inspection system. The color optical inspection system according to claim 5, wherein three of the color optical inspection devices are arranged to photograph the board in three equal parts. The optical inspection stage includes:
A table and
a first transport unit provided on the table and configured to transport the substrate in a first direction;
an inspection device mounting portion provided on an upper portion of the substrate, on which the color optical inspection device is mounted;
The color optical inspection system of claim 5 . The color optical inspection system according to claim 7, wherein the inspection device mounting section is provided with a second transport section that linearly transports the color optical inspection device along a second direction that perpendicularly intersects with the first direction. The color optical inspection system according to claim 8, wherein the second transport unit is provided in three units so that the color optical inspection device can be mounted on each of them, and the three units are driven simultaneously. The color optical inspection system of claim 5, wherein the sensor section includes a CCD sensor having a pixel resolution of 1.0 μm to 1.5 μm. The color optical inspection system of claim 5, wherein a beam splitter that changes the path of light emitted from the light source unit is provided inside the lens assembly. The color optical inspection system of claim 11, wherein the beam splitter reflects the light emitted from the light source unit toward the substrate and transmits the light reflected from the via hole toward the sensor unit.