JP7440995B2 - roll packaging - Google Patents

Description

The present invention relates to a roll package in which a resin film is wound on the outer peripheral surface of a core.

Conventionally, various resin films have been used to obtain electronic components such as semiconductor devices, laminates, and printed wiring boards. For example, in flexible printed wiring boards and multilayer printed wiring boards, resin films are used to form insulating layers to insulate between internal layers and to form insulating layers located on the surface layer. There is.

In flexible printed wiring boards and the like, polyimide films are often used to form flexible insulating layers. Further, before manufacturing a flexible printed wiring board or the like, a raw resin film may be wound into a roll. Further, raw film wound into a roll may be stored or transported. During storage and transportation, the raw film wound into a roll is exposed to various environments, and the raw film wound into a roll is subjected to impact.

Patent Document 1 below discloses a polyimide film roll in which a polyimide film having a thickness of 1 μm or more and 30 μm or less is wound into a roll, and the roll body of the polyimide film is wrapped with a packaging sheet material. There is. The packaging sheet material is made of a metal material.

On the other hand, in multilayer printed wiring boards, a resin film containing an inorganic filler is used to form an insulating layer with a low dielectric loss tangent.

JP2002-370788A

In a resin film containing an inorganic filler, cracks or breaks are likely to occur when the resin film is bent or when an impact is applied to the resin film. If the content of the inorganic filler is low, cracks or cracks may be prevented, but if the content of the inorganic filler in the resin film is high, the resin film may be bent or the resin may crack. Cracks or cracks are likely to occur when the film is subjected to impact.

Furthermore, when a resin film containing an inorganic filler is wound into a roll to form a roll body, cracks or cracks are significantly likely to occur.

A resin film with cracks or breaks is likely to cause voids or the like when laminated onto a substrate. Furthermore, if a resin film with cracks or cracks is used, the insulation reliability of the insulating layer will be greatly reduced.

An object of the present invention is to provide a roll package that can prevent the occurrence of cracks or cracks in the resin film.

According to a broad aspect of the present invention, the present invention includes a winding core, a resin film, and a packaging film, the axial dimension of the winding core being larger than the width direction dimension of the resin film, and an end portion of the winding core. The resin film is wound in a roll shape on the outer peripheral surface of the winding core in a region excluding the outer peripheral surface of the core, and the packaging film is wound on the outer peripheral surface of the roll body of the resin film. A roll packaging body is provided, wherein the packaging film extends onto a side surface of the roll body of the resin film, and the resin film contains an inorganic filler in an amount of 30% by weight or more.

In a particular aspect of the roll package according to the present invention, a cushioning material is arranged on the outer circumferential surface of the end of the winding core.

In a particular aspect of the roll package according to the present invention, the core has openings on both sides in the axial direction, and the packaging film is folded into the openings of the core.

In a particular aspect of the roll package according to the present invention, a cushioning material is disposed on the outer peripheral surface of the end of the core with the packaging film interposed therebetween.

In a particular aspect of the roll package according to the present invention, the roll package includes a holding member for holding the core, the resin film, and the packaging film in a suspended manner, and The holding members are attached to both sides in the axial direction.

In a particular aspect of the roll package according to the present invention, the core has openings on both sides in the axial direction, the holding member has a holding member main body and an insertion part, and the holding member has an opening on both sides in the axial direction, and the holding member has a holding member main body and an insertion part, The insertion portion of the member is inserted into the opening of the winding core.

In a particular aspect of the roll package according to the present invention, in the axial direction of the core, the tip of the insertion portion of the holding member inserted into the opening of the core is located at the end of the resin film. It is located inside the part.

In a particular aspect of the roll packaging body according to the present invention, a buffer film is disposed between the roll body of the resin film and the packaging film.

In a particular aspect of the roll package according to the present invention, the resin film contains the inorganic filler in an amount of 60% by weight or more.

In a particular aspect of the roll package according to the present invention, the resin film contains a thermosetting compound and a curing agent.

In a particular aspect of the roll package according to the present invention, the thermosetting compound is an epoxy resin.

In a particular aspect of the roll package according to the present invention, the resin film is a B-stage film.

The roll package according to the present invention includes a winding core, a resin film, and a packaging film. In the roll package according to the present invention, the axial dimension of the core is larger than the width dimension of the resin film. In the roll package according to the present invention, the resin film is wound in a roll shape on the outer peripheral surface of the winding core in a region excluding the outer peripheral surface of the end of the winding core, and the resin film is wound in a roll shape on the outer peripheral surface of the winding core. The packaging film is wound on the outer peripheral surface of the roll body, and the packaging film extends onto the side surface of the resin film roll body. In the roll package according to the present invention, the resin film contains an inorganic filler in an amount of 30% by weight or more. Since the roll package according to the present invention has the above configuration, it is possible to prevent the occurrence of cracks or breaks in the resin film.

FIG. 1 is a sectional view schematically showing a roll package according to a first embodiment of the present invention. FIG. 2 is a perspective view schematically showing a roll package according to a second embodiment of the present invention. FIG. 3 is a perspective view schematically showing a roll package according to a third embodiment of the present invention. FIG. 4 is a perspective view schematically showing the cushioning material. FIG. 5 is a perspective view schematically showing the holding member.

The present invention will be explained in detail below.

The roll package according to the present invention includes a winding core, a resin film, and a packaging film. In the roll package according to the present invention, the axial dimension of the core is larger than the width dimension of the resin film. In the roll package according to the present invention, the resin film is wound in a roll shape on the outer peripheral surface of the winding core in a region excluding the outer peripheral surface of the end of the winding core, and the resin film is wound in a roll shape on the outer peripheral surface of the winding core. The packaging film is wound on the outer peripheral surface of the roll body, and the packaging film extends onto the side surface of the resin film roll body. In the roll package according to the present invention, the resin film contains an inorganic filler in an amount of 30% by weight or more. Since the roll package according to the present invention has the above configuration, it is possible to prevent the occurrence of cracks or breaks in the resin film.

Generally, resin films containing inorganic fillers tend to crack or break when the resin film is bent or subjected to impact, making it difficult to obtain good roll packaging. be.

In the roll package according to the present invention, even though the resin film containing a relatively large amount of inorganic filler is wound into a roll shape, it is possible to prevent the occurrence of cracks or cracks in the resin film.

In addition, in the roll package according to the present invention, it is possible to prevent the occurrence of cracks or cracks in the resin film, so even if the resin film is laminated onto a substrate, voids are unlikely to occur. Furthermore, when the insulating layer is formed of a resin film, insulation reliability can be improved.

Further, in the roll package according to the present invention, occurrence of winding misalignment of the resin film can also be suppressed.

The resin film is preferably a resin film used to form an insulating layer in a printed wiring board.

Hereinafter, specific embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a sectional view schematically showing a roll package according to a first embodiment of the present invention. In addition, in FIG. 1 and the figures mentioned later, different parts can be replaced with each other.

The roll package 1 includes a core 3, a resin film 2, a packaging film 4, a buffer material 5, a holding member 6, and a buffer film 7.

The winding core 3 has openings 3a on both sides in the axial direction. The inside of the winding core 3 is hollow. The winding core 3 has a cylindrical shape.

The axial dimension of the winding core 3 is larger than the width direction dimension of the resin film 2.

The resin film 2 is wound in a roll shape on the outer peripheral surface of the winding core 3 in a region excluding the outer peripheral surface of the end portion of the winding core 3. The resin film 2 is not wound on the outer peripheral surface of the end of the winding core 3. The winding core 3 and the resin film 2 are in contact with each other on the outer peripheral surface of the winding core 3. Another film may be placed between the winding core and the resin film. The resin film 2 is wound into a roll from one end to the other end in the length direction. The width direction of the resin film 2 corresponds to the axial direction of the winding core 3.

Since the resin film 2 is wound into a roll, the resin film 2 is wound on the outer peripheral surface of the winding core 3 one turn or more. The resin film 2 is a roll body. On the outer circumferential surface of the winding core, the resin film is preferably wound two or more times, and the inner circumferential resin film and the outer circumferential resin film are preferably in a laminated state.

A buffer film 7 is arranged between the roll body of the resin film 2 and the packaging film 4. The resin film 2 and the buffer film 7 are in contact with each other on the outer peripheral surface of the resin film 2. The outer peripheral surface of the resin film 2 is protected by the buffer film 7. The buffer film 7 is wound around the outer peripheral surface of the resin film 2 once or more than once. The buffer film may be wound two or more times on the outer peripheral surface of the resin film. A buffer film may not be used.

A packaging film 4 is wound on the outer peripheral surface of the roll body of the resin film 2. In this embodiment, a packaging film 4 is wound on the outer peripheral surface of a roll of resin film 2 with a buffer film 7 interposed therebetween. The packaging film may be directly wound on the outer peripheral surface of the resin film roll body without using the buffer film. The packaging film 4 extends onto the end of the core 3. A packaging film 4 is wound on the outer peripheral surface of the end of the winding core 3. The buffer film 7 and the packaging film 4 are in contact with each other on the outer peripheral surface of the buffer film 7. The winding core 3 and the packaging film 4 are in contact with each other on the ends of the winding core 3. The resin film 2 and the packaging film 4 are not in contact with each other on the outer peripheral surface of the resin film 2. The packaging film 4 extends onto the side surface of the roll body of the resin film 2. The packaging film portion extending onto the side surface of the resin film roll body is located to the side of the side surface of the resin film roll body. As long as the packaging film reaches the side surface of the resin film roll body, the packaging film may or may not be in contact with the side surface of the resin film roll body. There may be a space between the packaging film and the side surface of the resin film roll, and other members may be arranged.

A packaging film 4 is folded into the opening 3a of the winding core 3. Therefore, the packaging film 4 is well held in the roll package 1. By folding the packaging film 4 into the opening 3a of the winding core 3, it is possible to prevent the packaging from losing its shape.

A cushioning material 5 is arranged on the outer peripheral surface of the end of the winding core 3 with a packaging film 4 interposed therebetween. In this embodiment, the cushioning material 5 shown in FIG. 4(a) is used. A cushioning material 5 is arranged on the outer peripheral surface of the end of the winding core 3 with a packaging film 4 interposed therebetween. The cushioning material 5 has the shape of a rectangular parallelepiped, and has an opening corresponding to the size of the end of the winding core 3 in the rectangular parallelepiped. The cushioning material 5 is fitted onto the winding core 3 so that the end of the winding core 3 is located within the opening of the cushioning material 5 from the outside in the axial direction of the winding core 3 toward the inside. The packaging form is well protected by the cushioning material 5, and the side surfaces of the roll body of the resin film 2 are protected. In the radial direction of the annularly wound packaging film 4, the cushioning material 5 reaches the outside of the packaging film 4. No cushioning material may be used.

Note that instead of the buffer material 5, for example, a buffer material 5A shown in FIG. 4(b) may be used. The buffer material 5A includes a first buffer member 5a and a second buffer member 5b. The cushioning material 5A has a shape obtained by cutting the cushioning material 5 at the center. The first buffer member 5a and the second buffer member 5b have semicircular recesses. The buffer material 5A, which is a combination of the first buffer member 5a and the second buffer member 5b, has the shape of a rectangular parallelepiped, and has an opening in the rectangular parallelepiped that corresponds to the size of the end of the winding core. . By fitting the recess of the first buffer member 5a and the recess of the second buffer member 5b of the cushioning material 5A onto the outer circumferential surface of the end of the winding core, the cushioning material 5A is attached to the end of the winding core. Can be easily placed on the outer peripheral surface. The cushioning material 5 is less likely to be unintentionally detached from the roll package than the cushioning material 5A. Furthermore, the cushioning material 5A is easier to remove than the cushioning material 5. Note that as the buffer material, only the first buffer member 5a or only the second buffer member 5b may be used.

Note that the shape of the opening of the cushioning material can be changed depending on the shape of the end of the winding core. The external shape of the above-mentioned cushioning material may be a polygon such as a quadrangle, or may be circular.

Holding members 6 are attached to both sides of the winding core 3 in the axial direction. In this embodiment, a holding member 6 shown in FIG. 5 is used. The holding member 6 is a member for holding the winding core 3, the resin film 2, and the packaging film 4 in a suspended manner. As shown in FIG. 1, the holding member 6 does not have to hold the cushioning material 5 in a suspended manner. The holding member may hold the cushioning material in a suspended manner.

In the radial direction of the annularly wound packaging film 4, the holding member 6 reaches the outside of the packaging film 4. The holding member 6 has a holding member main body 6a and an insertion portion 6b. The insertion portion 6b of the holding member 6 is inserted into the opening 3a of the winding core 3. The insertion portion 6b of the holding member 6 is inserted into the winding core 3 such that the insertion portion 6b of the holding member 6 is located within the opening 3a of the winding core 3 and within the opening of the buffer material 5. In the axial direction of the winding core 3, the tip of the insertion portion 6b of the holding member 6 inserted into the opening 3a of the winding core 3 is located inside the end of the resin film 2. Therefore, the winding core 3, the resin film 2, and the packaging film 4 can be held in a suspended state even better. In the axial direction of the winding core, the tip of the insertion part of the holding member inserted into the opening of the winding core may be located outside the end of the resin film, and may be aligned with the end of the resin film. It's okay. A retaining member may not be used.

The roll package 1 can be placed on a mounting surface as shown in FIG. A holding member 6 is in contact with the mounting surface. A cushioning material 5 is in contact with the mounting surface. The cushioning material does not need to be in contact with the mounting surface. In a state where the roll package 1 is placed on the mounting surface, the winding core 3, the resin film 2, and the packaging film 4 are held in a suspended state.

FIG. 2 is a perspective view schematically showing a roll package according to a second embodiment of the present invention.

The roll package 11A includes a winding core 3, a resin film 2, and a packaging film 4A. The roll core 3 and resin film 2 of the roll package 11A and the roll package 1 shown in FIG. 1 are configured in the same manner.

Unlike the roll package 1, the roll package 11A does not include a cushioning material, a holding member, and a buffer film.

A packaging film 4A is wound on the outer peripheral surface of the roll body of the resin film 2. The resin film 2 and the packaging film 4A are in contact with each other on the outer peripheral surface of the resin film 2. The packaging film 4A extends onto the side surface of the roll body of the resin film 2. The winding core 3 and the packaging film 4A are in contact with each other on the ends of the winding core 3. The end of the packaging film 4 is in contact with the outer peripheral surface of the end of the winding core 3.

In the roll package 11A, the packaging film 4A is not folded into the opening 3a of the winding core 3.

Note that for the roll package 11A shown in FIG. 2, a buffer material, a holding member, or a buffer film may be used.

FIG. 3 is a perspective view schematically showing a roll package according to a third embodiment of the present invention.

The roll package 11B includes a core 3, a resin film 2, and a packaging film 4. In the roll packaging body 11B and the roll packaging body 1 shown in FIG. 1, the winding core 3, resin film 2, and packaging film 4 are configured in the same manner.

Unlike the roll package 1, the roll package 11B does not include a cushioning material, a holding member, and a buffer film.

A packaging film 4 is folded into the opening 3a of the winding core 3. As described above, the packaging film 4 of the roll package 11B and the roll package 1 has the same structure. However, in the roll package 11B, the end of the packaging film 4 does not touch the outer circumferential surface of the end of the winding core 3 because a cushioning material and a holding member are not used.

Note that a cushioning material or a holding member may be used for the roll package 11B shown in FIG. 3. By using the cushioning material 5 for the roll package 11B shown in FIG. 3, the end of the packaging film 4 comes into contact with the outer peripheral surface of the end of the winding core 3. By using the cushioning material 5 and the holding member 6 for the roll package 11B shown in FIG. 3, a roll package can be obtained that differs from the roll package 1 shown in FIG. 1 only in the presence or absence of the use of a buffer film. I can do it.

Hereinafter, the details of the roll package according to the present invention will be further explained.

(rolling core)
The material of the winding core is not particularly limited. The material of the winding core is preferably a plastic resin because it has excellent workability, lightness, and strength.

Examples of the plastic resin include polyethylene (PE) resin, polypropylene (PP) resin, polystyrene (PS) resin, acrylonitrile butadiene styrene (ABS) resin, nylon resin, and polyvinyl chloride resin.

The axial dimension of the winding core is larger than the width direction dimension of the resin film.

The axial dimension of the winding core is preferably 20 cm or more, more preferably 25 cm or more, preferably 100 cm or less, and more preferably 95 cm or less.

The axial dimension of the winding core is preferably 1 cm or more larger, and more preferably 2 cm or more larger than the width direction dimension of the resin film.

From the viewpoint of making the roll package lightweight, the winding core preferably has openings on both sides in the axial direction, and the winding core preferably has a cylindrical shape.

The resin film is wound into a roll on the outer circumferential surface of the winding core in a region excluding the outer circumferential surface of the end portion of the winding core. It is preferable that the outer shape of the portion of the winding core around which the resin film is wound is circular. It is preferable that the portion of the winding core around which the resin film is wound has a cavity inside.

When the winding core is cylindrical, the inner diameter and thickness of the winding core are appropriately set in consideration of the strength, lightness, etc. of the winding core. For example, a core having an inner diameter of 7.6 cm (3 inches) and a thickness of 4 mm can be used.

(resin film)
The resin film is wound in a roll onto the outer circumferential surface of the winding core in a region excluding the outer circumferential surface of the end portion of the winding core. Therefore, the resin film is wound one or more turns on the outer peripheral surface of the winding core. The resin film is in the form of a roll.

The length of the resin film is preferably 20 m or more, preferably 300 m or less. When the length of the resin film is equal to or less than the upper limit, even when the resin film is wound on the outer peripheral surface of the winding core, the winding shift of the resin film can be suppressed favorably.

The width direction dimension of the resin film is preferably 20 cm or more, more preferably 25 cm or more, preferably 100 cm or less, and more preferably 95 cm or less.

The resin film contains an inorganic filler described below. The resin film preferably contains a thermosetting compound and a curing agent, which will be described later.

The details of each component used in the resin film will be explained below.

[Inorganic filler]
The resin film contains an inorganic filler. By using an inorganic filler, dimensional changes in the cured product due to heat are reduced. Furthermore, the surface roughness of the surface of the cured product is further reduced, and the adhesive strength between the insulating layer and the metal layer is increased.

Examples of the inorganic filler include silica, talc, clay, mica, hydrotalcite, alumina, magnesium oxide, aluminum hydroxide, aluminum nitride, and boron nitride.

The surface roughness of the cured product is reduced, the adhesive strength between the insulating layer and the metal layer is further increased, finer wiring is formed on the surface of the insulating layer, and the insulating layer has better insulation reliability. From the viewpoint of imparting this, the inorganic filler is preferably silica or alumina, more preferably silica, and even more preferably fused silica. By using silica, the coefficient of thermal expansion of the cured product is further reduced, the surface roughness of the surface of the cured product is effectively reduced, and the adhesive strength between the insulating layer and the metal layer is effectively increased. The shape of the silica is preferably spherical.

The inorganic filler is spherical silica from the viewpoint of curing the resin, effectively increasing the glass transition temperature of the cured product, and effectively reducing the linear thermal expansion coefficient of the cured product regardless of the curing environment. It is preferable.

The average particle size of the inorganic filler is preferably 10 nm or more, more preferably 50 nm or more, still more preferably 100 nm or more, preferably 5 μm or less, more preferably 3 μm or less, even more preferably 1 μm or less, and particularly preferably 0.5 μm. It is as follows. When the average particle size of the inorganic filler is not less than the above lower limit and not more than the above upper limit, the adhesive strength between the insulating layer and the metal layer becomes even higher.

As the average particle size of the inorganic filler, a value of the median diameter (d50) that is 50% is adopted. The above average particle size can be measured using a laser diffraction scattering type particle size distribution measuring device.

Each of the above inorganic fillers is preferably spherical, and more preferably spherical silica. In this case, the surface roughness of the surface of the cured product is effectively reduced, and furthermore, the adhesive strength between the insulating layer and the metal layer is effectively increased. When each of the inorganic fillers is spherical, the aspect ratio of each of the inorganic fillers is preferably 2 or less, more preferably 1.5 or less.

The inorganic filler is preferably surface-treated, more preferably surface-treated with a coupling agent, and even more preferably surface-treated with a silane coupling agent. As a result, the surface roughness of the surface of the roughened cured product is further reduced, the adhesive strength between the insulating layer and the metal layer is further increased, and finer wiring is formed on the surface of the insulating layer. Better inter-wiring insulation reliability and interlayer insulation reliability can be imparted to the insulating layer.

Examples of the coupling agent include a silane coupling agent, a titanium coupling agent, and an aluminum coupling agent. Examples of the silane coupling agent include methacrylsilane, acrylicsilane, aminosilane, imidazolesilane, vinylsilane, and epoxysilane.

The content of the inorganic filler in 100% by weight of the resin film is 30% by weight or more. The content of the inorganic filler in 100% by weight of the resin film is preferably 50% by weight or more, more preferably 60% by weight or more, still more preferably 70% by weight or more, preferably 90% by weight or less, and more preferably It is 85% by weight or less, more preferably 83% by weight or less, particularly preferably 80% by weight or less. When the content of the inorganic filler is above the above lower limit and below the above upper limit, the surface roughness of the surface of the insulating layer becomes even smaller, the adhesive strength between the insulating layer and the metal layer becomes even higher, and the insulating Finer wiring is formed on the surface of the layer. Furthermore, with this amount of inorganic filler, it is possible to lower the coefficient of thermal expansion of the insulating layer and improve smear removability at the same time. When the content of the inorganic filler is equal to or higher than the lower limit, the dielectric loss tangent effectively decreases.

[Thermosetting compound]
The resin film preferably contains a thermosetting compound. The above thermosetting compound is not particularly limited. As the thermosetting compound, conventionally known thermosetting compounds can be used.

Examples of the thermosetting compounds include styrene compounds, phenoxy compounds, oxetane compounds, epoxy compounds, episulfide compounds, (meth)acrylic compounds, phenol compounds, amino compounds, unsaturated polyester compounds, polyurethane compounds, silicone compounds, and polyimide compounds. Can be mentioned. The above thermosetting compounds may be used alone or in combination of two or more.

The thermosetting compound is preferably an epoxy compound. The epoxy compound refers to an organic compound having at least one epoxy group. The thermosetting compound and the epoxy compound may be used alone or in combination of two or more.

The above-mentioned epoxy compounds include bisphenol A type epoxy compounds, bisphenol F type epoxy compounds, bisphenol S type epoxy compounds, phenol novolak type epoxy compounds, biphenyl type epoxy compounds, biphenyl novolac type epoxy compounds, biphenol type epoxy compounds, and naphthalene type epoxy compounds. , fluorene type epoxy compound, phenol aralkyl type epoxy compound, naphthol aralkyl type epoxy compound, dicyclopentadiene type epoxy compound, anthracene type epoxy compound, epoxy compound having an adamantane skeleton, epoxy compound having a tricyclodecane skeleton, naphthylene ether type Examples include epoxy compounds and epoxy compounds having a triazine nucleus in their skeleton.

From the viewpoint of further increasing the adhesive strength between the insulating layer and the metal layer, the epoxy compound preferably has an aromatic skeleton, preferably a biphenyl skeleton, and is preferably a biphenyl-type epoxy compound.

From the viewpoint of further increasing the adhesive strength between the insulating layer and the metal layer, the content of the thermosetting compound is preferably 10% by weight or more, more preferably 20% by weight or more in 100% by weight of the resin film. , preferably 70% by weight or less, more preferably 65% by weight or less, even more preferably 60% by weight or less, particularly preferably 55% by weight or less.

It is more preferable that the molecular weight of the epoxy compound is 1000 or less. In this case, when the resin film is laminated onto the base material, the inorganic filler can be uniformly present.

The molecular weight of the epoxy compound and the molecular weight of the curing agent described below mean the molecular weight that can be calculated from the structural formula, if the epoxy compound or curing agent is not a polymer, and if the structural formula of the epoxy compound or curing agent can be specified. do. Moreover, when the epoxy compound or curing agent is a polymer, it means the weight average molecular weight.

[Curing agent]
The resin film preferably contains a curing agent. The above curing agent is not particularly limited. As the curing agent, conventionally known curing agents can be used. Only one kind of the above curing agent may be used, or two or more kinds thereof may be used in combination.

Examples of the curing agent include cyanate ester compounds (cyanate ester curing agents), phenol compounds (phenol curing agents), amine compounds (amine curing agents), thiol compounds (thiol curing agents), imidazole compounds, phosphine compounds, acid anhydrides, Examples include active ester compounds and dicyandiamide. When the thermosetting compound is an epoxy compound, the curing agent preferably has a functional group capable of reacting with the epoxy group of the epoxy compound.

Examples of the cyanate ester compound include novolak-type cyanate ester resins, bisphenol-type cyanate ester resins, and prepolymers obtained by partially trimerizing these. Examples of the novolac cyanate ester resins include phenol novolac cyanate ester resins and alkylphenol cyanate ester resins. Examples of the bisphenol type cyanate ester resin include bisphenol A type cyanate ester resin, bisphenol E type cyanate ester resin, and tetramethylbisphenol F type cyanate ester resin.

Commercial products of the above cyanate ester compounds include phenol novolak cyanate ester resins (PT-30 and PT-60 manufactured by Lonza Japan), and prepolymers in which bisphenol cyanate ester resins are trimerized (Lonza Japan). ``BA-230S'', ``BA-3000S'', ``BTP-1000S'', and ``BTP-6020S'' manufactured by the company.

Examples of the above-mentioned phenol compounds include novolac-type phenol, biphenol-type phenol, naphthalene-type phenol, dicyclopentadiene-type phenol, aralkyl-type phenol, and dicyclopentadiene-type phenol.

Commercially available products of the above-mentioned phenol compounds include novolac type phenol ("TD-2091" manufactured by DIC Corporation), biphenyl novolac type phenol ("MEH-7851" manufactured by Meiwa Kasei Co., Ltd.), and aralkyl type phenol compound ("MEH" manufactured by Meiwa Kasei Co., Ltd.). -7800''), and phenols having an aminotriazine skeleton (“LA1356” and “LA3018-50P” manufactured by DIC Corporation).

From the viewpoint of further lowering the dielectric loss tangent, the curing agent preferably contains an active ester compound. The above-mentioned active ester compound refers to a compound that contains at least one ester bond in its structure and has aromatic rings bonded to both sides of the ester bond. A preferable example of the active ester compound is a compound represented by the following formula (1).

In the above formula (1), X1 and X2 each represent a group containing an aromatic ring. Preferred examples of the group containing the aromatic ring include a benzene ring which may have a substituent, a naphthalene ring which may have a substituent, and the like. Examples of the above-mentioned substituents include hydrocarbon groups. The number of carbon atoms in the hydrocarbon group is preferably 12 or less, more preferably 6 or less, still more preferably 4 or less.

Examples of the combination of X1 and A combination with a naphthalene ring which may have a group is exemplified. Further, examples of the combination of X1 and X2 include a combination of a naphthalene ring that may have a substituent and a naphthalene ring that may have a substituent.

The above active ester compound is not particularly limited. Examples of commercially available active ester compounds include "HPC-8000-65T", "EXB9416-70BK", "EXB8100-65T", and "EXB-8000L-65MT" manufactured by DIC.

The molecular weight of the curing agent is preferably 1000 or less. In this case, when the resin film is laminated onto the base material, the inorganic filler can be uniformly present.

The total content of the thermosetting compound and the curing agent and the total content of the epoxy compound and the curing agent in 100% by weight of the components excluding the inorganic filler in the resin film are preferably is 75% by weight or more, more preferably 80% by weight or more, preferably 99% by weight or less, more preferably 97% by weight or less. When the total content of the thermosetting compound and the curing agent and the total content of the epoxy compound and the curing agent are at least the above lower limit and at most the above upper limit, an even better cured product can be obtained. Since the melt viscosity can be adjusted, the dispersibility of the inorganic filler is improved. Furthermore, it is possible to prevent the resin film from getting wet and spreading to unintended areas during the curing process. Furthermore, dimensional changes due to heat of the cured product can be further suppressed. In addition, when the total content of the thermosetting compound and the curing agent and the total content of the epoxy compound and the curing agent are at least the above lower limit, the melt viscosity does not become too low and the curing process This tends to make it difficult for the insulating film to excessively wet and spread in unintended areas. Further, when the total content of the thermosetting compound and the curing agent and the total content of the epoxy compound and the curing agent are below the above upper limit, it is easy to fill holes or irregularities in the circuit board. This tends to make it difficult for the inorganic filler to exist unevenly.

The content of the curing agent is preferably 30% by weight or more, more preferably 40% by weight or more, and preferably 70% by weight or less, based on 100% by weight of the components other than the inorganic filler in the resin film. Preferably it is 60% by weight or less. When the content of the curing agent is not less than the lower limit and not more than the upper limit, a cured product of even better quality is obtained, and the dielectric loss tangent is effectively lowered.

[Thermoplastic resin]
The resin film preferably contains a thermoplastic resin. Examples of the thermoplastic resin include polyvinyl acetal resin and phenoxy resin. Only one kind of the above-mentioned thermoplastic resin may be used, or two or more kinds thereof may be used in combination.

From the viewpoint of effectively lowering the dielectric loss tangent and effectively increasing the adhesion of metal wiring regardless of the curing environment, the thermoplastic resin is preferably a phenoxy resin. By using the phenoxy resin, deterioration in the ability of the resin film to fill holes or irregularities in the circuit board and non-uniformity of the inorganic filler can be suppressed. Further, by using a phenoxy resin, the melt viscosity can be adjusted, so the dispersibility of the inorganic filler is improved, and the resin film is less likely to wet and spread in unintended areas during the curing process. The above phenoxy resin is not particularly limited. As the phenoxy resin, conventionally known phenoxy resins can be used. Only one type of the above phenoxy resin may be used, or two or more types may be used in combination.

Examples of the phenoxy resin include phenoxy resins having skeletons such as a bisphenol A type skeleton, a bisphenol F type skeleton, a bisphenol S type skeleton, a biphenyl skeleton, a novolak skeleton, a naphthalene skeleton, and an imide skeleton.

Commercially available products of the above phenoxy resin include, for example, "YP50", "YP55" and "YP70" manufactured by Nippon Steel & Sumitomo Metal Chemical Co., Ltd., and "1256B40", "4250", "4256H40" and "4256H40" manufactured by Mitsubishi Chemical Corporation. 4275'', ``YX6954BH30'', and ``YX8100BH30''.

From the viewpoint of obtaining a resin film with even better storage stability, the weight average molecular weight of the thermoplastic resin is preferably 5,000 or more, more preferably 10,000 or more, preferably 100,000 or less, and more preferably 50,000 or less.

The weight average molecular weight of the thermoplastic resin indicates the weight average molecular weight in terms of polystyrene measured by gel permeation chromatography (GPC).

The contents of the thermoplastic resin and the phenoxy resin are not particularly limited. The content of the thermoplastic resin (if the thermoplastic resin is a phenoxy resin, the content of the phenoxy resin) is preferably 1% by weight or more in 100% by weight of the components excluding the inorganic filler in the resin film, The content is more preferably 5% by weight or more, preferably 30% by weight or less, and even more preferably 15% by weight or less. When the content of the thermoplastic resin is not less than the lower limit and not more than the upper limit, the resin film has good embedding properties in holes or irregularities of the circuit board. When the content of the thermoplastic resin is equal to or higher than the lower limit, the resin film can be formed even more easily, and an even better insulating layer can be obtained. When the content of the thermoplastic resin is below the upper limit, the thermal expansion coefficient of the insulating layer becomes even lower. The surface roughness of the cured product becomes even smaller, and the adhesive strength between the insulating layer and the metal layer becomes even higher.

[Curing accelerator]
The resin film preferably contains a curing accelerator. By using the above-mentioned curing accelerator, the curing speed becomes even faster. By rapidly curing the resin film, the crosslinked structure in the cured product becomes uniform, the number of unreacted functional groups decreases, and the crosslinking density increases as a result. The curing accelerator is not particularly limited, and conventionally known curing accelerators can be used. As for the said hardening accelerator, only 1 type may be used, and 2 or more types may be used together.

Examples of the curing accelerator include imidazole compounds, phosphorus compounds, amine compounds, and organometallic compounds.

The above imidazole compounds include 2-undecylimidazole, 2-heptadecyl imidazole, 2-methylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl- 2-Methylimidazole, 1-benzyl-2-phenylimidazole, 1,2-dimethylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-un Decylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazolium trimellitate, 1-cyanoethyl-2-phenylimidazolium trimellitate, 2,4-diamino-6-[2' -Methylimidazolyl-(1')]-ethyl-s-triazine, 2,4-diamino-6-[2'-undecylimidazolyl-(1')]-ethyl-s-triazine, 2,4-diamino- 6-[2'-ethyl-4'-methylimidazolyl-(1')]-ethyl-s-triazine, 2,4-diamino-6-[2'-methylimidazolyl-(1')]-ethyl-s -triazine isocyanuric acid adduct, 2-phenylimidazole isocyanuric acid adduct, 2-methylimidazole isocyanuric acid adduct, 2-phenyl-4,5-dihydroxymethylimidazole and 2-phenyl-4-methyl-5-dihydroxymethylimidazole etc.

Examples of the phosphorus compound include triphenylphosphine.

Examples of the above amine compounds include diethylamine, triethylamine, diethylenetetramine, triethylenetetramine, and 4,4-dimethylaminopyridine.

Examples of the organometallic compound include zinc naphthenate, cobalt naphthenate, tin octylate, cobalt octylate, cobalt (II) bisacetylacetonate, and cobalt (III) trisacetylacetonate.

The content of the curing accelerator is not particularly limited. The content of the curing accelerator is preferably 0.005% by weight or more, more preferably 0.01% by weight or more, preferably 5% by weight or less, out of 100% by weight of the components other than the inorganic filler in the resin film. More preferably, it is 3% by weight or less. When the content of the curing accelerator is not less than the above lower limit and not more than the above upper limit, the resin film is efficiently cured. If the content of the curing accelerator is in a more preferable range, the storage stability of the resin film will be even higher, and an even better cured product will be obtained.

[solvent]
The resin film does not contain or contains a solvent. Moreover, the above-mentioned solvent may be used to obtain a slurry containing the above-mentioned inorganic filler. Only one type of the above solvent may be used, or two or more types may be used in combination.

The above solvents include acetone, methanol, ethanol, butanol, 2-propanol, 2-methoxyethanol, 2-ethoxyethanol, 1-methoxy-2-propanol, 2-acetoxy-1-methoxypropane, toluene, xylene, methyl ethyl ketone, Examples include N,N-dimethylformamide, methyl isobutyl ketone, N-methyl-pyrrolidone, n-hexane, cyclohexane, cyclohexanone, and naphtha as a mixture.

Most of the above solvents are removed when forming the above resin film using the resin composition. On the other hand, the solvent may remain in the resin film. The remaining amount of this solvent is preferably small. Therefore, the boiling point of the above solvent is preferably 200°C or lower, more preferably 180°C or lower. The content of the solvent in the resin film is not particularly limited. The content of the solvent can be changed as appropriate to the extent that the layer shape of the resin film can be maintained.

[Other ingredients]
In order to improve impact resistance, heat resistance, resin compatibility, workability, etc., the above resin film contains leveling agents, flame retardants, coupling agents, coloring agents, antioxidants, ultraviolet deterioration inhibitors, and erasers. Foaming agents, thickeners, thixotropic agents, thermosetting resins other than the above-mentioned thermosetting compounds, etc. may be added.

Examples of the coupling agent include a silane coupling agent, a titanium coupling agent, and an aluminum coupling agent. Examples of the silane coupling agent include vinylsilane, aminosilane, imidazolesilane, and epoxysilane.

Examples of the other thermosetting resins include polyphenylene ether resin, divinylbenzyl ether resin, polyarylate resin, diallyl phthalate resin, polyimide resin, benzoxazine resin, benzoxazole resin, bismaleimide resin, and acrylate resin.

Methods for obtaining the resin film include, for example, an extrusion method in which resin film materials are melt-kneaded using an extruder, extruded, and then molded into a film using a T-die or a circular die, or a resin containing a solvent. Examples include a casting method in which a film material is cast and molded into a film, and other conventionally known film molding methods. Alternatively, a resin film can also be obtained by laminating a resin film material on a base material and drying it by heating. An extrusion molding method or a casting molding method is preferable because it is possible to reduce the thickness. The film includes sheets.

A resin film that is a B-stage film can be obtained by forming a resin film material into a film shape and heating and drying it at, for example, 50 to 150° C. for 1 to 10 minutes to an extent that curing by heat does not proceed too much.

A film-like resin film that can be obtained by the drying process as described above is referred to as a B-stage film. The B-stage film is in a semi-cured state. A semi-cured product is not completely cured and may be further cured.

It is preferable that the resin film is a B-stage film.

From the viewpoint of further improving the lamination properties of the resin film (or B-stage film when the resin film is a B-stage film) and further suppressing uneven curing of the resin film, the thickness of the resin film is preferably 5 μm. The thickness is more preferably 10 μm or more, preferably 200 μm or less, and even more preferably 100 μm or less.

[others]
A base material may be laminated on the first surface of the resin film, and a protective film may be laminated on the second surface of the resin film opposite to the first surface. .

From the viewpoint of improving the operability and protection properties of the resin film, it is preferable that a base material is laminated on the first surface of the resin film, and a second layer opposite to the first surface of the resin film is laminated on the first surface of the resin film. Preferably, a protective film is laminated on the surface.

Examples of the base material include metal foils, polyester resin films such as polyethylene terephthalate films and polybutylene terephthalate films, olefin resin films such as polyethylene films and polypropylene films, and polyimide films. The surface of the base material may be subjected to a mold release treatment, if necessary. The base material may be a metal foil or a resin film. The base material is preferably a resin film. When using metal foil as the base material, the metal foil is preferably copper foil.

From the viewpoint of improving the operability of the resin film and the lamination properties of the resin film, the thickness of the base material is preferably 5 μm or more, more preferably 10 μm or more, preferably 75 μm or less, and more preferably It is 60 μm or less.

Examples of the material for the protective film include polyolefins such as polypropylene and polyethylene, and polyethylene terephthalate. The material of the protective film is preferably polyolefin, more preferably polypropylene.

From the viewpoint of further improving the protective properties of the resin film, the thickness of the protective film is preferably 5 μm or more, more preferably 10 μm or more, preferably 75 μm or less, and more preferably 60 μm or less.

In the roll package according to the present invention, when the base material and the protective film are laminated on the resin film, the base material or the protective film is in contact with the outer peripheral surface of the core, and the base material or the protective film is in contact with the outer peripheral surface of the core. A film contacts the packaging film or the buffer film.

(packaging film)
The packaging film is wound on the outer peripheral surface of the resin film roll. The packaging film extends onto the side surface of the resin film roll. If the packaging film does not reach the side surface of the resin film roll body, the resin film is likely to crack or break on the side surface. When the packaging film does not reach the side surface of the resin film roll body, the reason why the resin film cracks or breaks on the above side surface is not clear, but the solvent remaining in the resin film may cause the resin film roll body to crack or crack. This is considered to be because the bending resistance and impact resistance of the resin film decrease due to volatilization from the side surfaces.

From the viewpoint of suppressing misalignment of the packaging film and from the viewpoint of suppressing misalignment of the resin film, when the winding core has openings on both sides in the axial direction, the inside of the opening of the winding core is Preferably, the packaging film is folded.

From the viewpoint of suppressing misalignment of the packaging film, the packaging film is preferably wound on the surface of the resin film roll for one or more turns, and preferably for two or more turns. More preferred.

The material for the packaging film is not particularly limited, and examples thereof include polyethylene, polypropylene, polyvinylidene chloride, and the like.

The thickness of the packaging film is preferably 5 μm or more, more preferably 10 μm or more, preferably 50 μm or less, and more preferably 45 μm or less.

(buffer material)
In the roll package according to the present invention, it is preferable that a cushioning material is arranged on the outer peripheral surface of the end of the core.

By disposing the cushioning material on the outer circumferential surface of the end portion of the winding core, it is possible to satisfactorily suppress winding misalignment of the resin film. In addition, by placing the cushioning material on the outer circumferential surface of the end of the core, the impact resistance of the roll package is increased and damage to the core (particularly the end of the core) can be prevented. .

From the viewpoint of increasing the impact resistance of the roll package by absorbing external impact, the material for the cushioning material is preferably expanded polystyrene, polyurethane foam, polyethylene foam, or polypropylene foam.

When the winding core has openings on both sides in the axial direction, and the packaging film is folded into the openings of the winding core, on the outer peripheral surface of the end of the winding core, It is preferable that a cushioning material is placed through the packaging film. In this case, the winding misalignment of the resin film can be suppressed even better.

In order to further increase the impact resistance of the roll package and further prevent damage to the core (particularly the ends of the core), the above-mentioned cushioning material is arranged so as to cover the entire surface of the outer peripheral surface of the end of the core. It is preferable that

(Holding member)
It is preferable that the roll package according to the present invention includes a holding member. The holding member is a member for holding the winding core, the resin film, and the packaging film in a suspended manner. When the roll packaging body according to the present invention includes the above-mentioned cushioning material, the above-mentioned winding core, the above-mentioned resin film, the above-mentioned packaging film, and the above-mentioned cushioning material may be held in a suspended state, and the above-mentioned winding excluding the above-mentioned cushioning material may be held in a suspended state. The core, the resin film, and the packaging film may be held in a suspended state.

For example, when a roll package with a holding member is packed into a packaging material such as a cardboard box, the winding core, resin film, and packaging film do not come into contact with the packaging material, so it is not susceptible to shock during transportation. The occurrence of cracks or cracks in the resin film can be further prevented.

It is preferable that the holding members are attached to both sides of the winding core in the axial direction.

When the winding core has openings on both sides in the axial direction, the holding member has a holding member main body and an insertion part, and the insertion part of the holding member is inserted into the opening of the winding core. Preferably, it is inserted.

From the viewpoint of increasing the stability of the attached holding member and from the viewpoint of preventing damage to the winding core (particularly the ends of the winding core), it is necessary to It is preferable that the tip of the insertion portion of the holding member inserted into the holding member be located inside the end of the resin film.

From the viewpoint of holding the winding core, the resin film, and the packaging film in a suspended manner, it is preferable that the holding member has a certain degree of strength. Examples of the material for the holding member include polypropylene (PP) resin, acrylonitrile butadiene styrene (ABS) resin, and polyethylene (PE) resin.

Although the shape of the holding member is not particularly limited, it is preferably rectangular parallelepiped from the viewpoint of holding the winding core, resin film, and packaging film in a suspended state.

The shape of the insertion portion can be changed depending on the shape of the opening at the end of the winding core. The outer shape of the holding member is preferably a polygon such as a quadrangle.

(buffer film)
In the roll packaging body according to the present invention, it is preferable that a buffer film is disposed between the roll body of the resin film and the packaging film.

By providing a buffer film, it is possible to further prevent the occurrence of cracks or cracks in the resin film due to external impacts. Further, when the roll package is stored at a low temperature (for example, 5° C. or lower), it is possible to prevent dew condensation from forming on the resin film during use.

The material for the buffer film is preferably, for example, polyethylene foam.

Hereinafter, the present invention will be specifically explained by giving Examples and Comparative Examples. The invention is not limited to the following examples.

The following winding core, packaging film, cushioning material, holding member, buffering film, base material, and protective film were prepared.

(rolling core)
A winding core A and a winding core B having the shapes shown in FIG. 1 were prepared. The details of the winding core A and the winding core B are as follows.

Winding core A:
Material: Acrylonitrile butadiene styrene (ABS) resin Axial dimension of winding core: 56cm
Thickness of core: 0.4cm
Inner diameter of core: 7.6cm

Winding core B:
Material: Acrylonitrile butadiene styrene (ABS) resin Axial dimension of winding core: 51cm
Thickness of core: 0.4cm
Inner diameter of core: 7.6cm

(packaging film)
Packaging film A (“Stretch film” manufactured by Sanyo Chemical Co., Ltd., thickness 15 μm)
Packaging film B (“Saran Wrap (registered trademark)” manufactured by Asahi Kasei, thickness 11 μm)

(buffer material)
Polyethylene foam with the shape shown in Figure 1

(Holding member)
Plastic holding member having the shape shown in Figure 1

(buffer film)
Buffer film (“Lightron S” manufactured by Sekisui Plastics Co., Ltd.)

(Base material)
Polyethylene terephthalate (PET) film (“AL5” manufactured by Lintec, thickness 38 μm)

(Protective film)
Protective film (Oji F-Tex Co., Ltd. "Alphan MA-411", thickness 15 μm)

(Example 1)
Preparation of resin film material: 107 parts by weight of cyclohexanone slurry (solid content 70% by weight) of aminophenylsilane-treated silica ("SOC2" manufactured by Admatex) was prepared. To this slurry, 11 parts by weight of biphenyl epoxy resin ("NC3000H" manufactured by Nippon Kayaku Co., Ltd.), 5 parts by weight of bisphenol A epoxy resin ("850S" manufactured by DIC Corporation), 7.9 parts by weight of cyclohexanone, and methyl ethyl ketone were added. 7.7 parts by weight were added. Using a stirrer, the mixture was stirred at 1200 rpm for 60 minutes, and it was confirmed that there was no undissolved material. Thereafter, 11 parts by weight of a mixed solution of aminotriazine-modified phenol novolac curing agent ("LA-1356" manufactured by DIC Corporation) in methyl ethyl ketone (solid content 50% by weight) and 3 parts by weight of phenol novolac curing agent ("H4" manufactured by Meiwa Kasei Co., Ltd.) were added. Added a section. The mixture was stirred at 1200 rpm for 60 minutes, and it was confirmed that there was no undissolved material. Thereafter, a mixed solution of bisphenolacetophenone skeleton phenoxy resin (YX6954, manufactured by Mitsubishi Chemical Corporation) in methyl ethyl ketone and cyclohexanone (solid content 30% by weight) was prepared. 2.5 parts by weight of the mixed solution (solid content 30% by weight), 0.1 part by weight of 2-ethyl-4-methylimidazole ("2E4MZ" manufactured by Shikoku Kasei Co., Ltd.), and a leveling agent ("2E4MZ" manufactured by Kusumoto Kasei Co., Ltd.). LS-480'') was further added. The mixture was stirred at 1200 rpm for 30 minutes to obtain a resin film material (varnish).

Preparation of laminated film of base material, resin film, and protective film:
The obtained resin film material was applied onto the base material using a die coater, and then dried at an average temperature of 100° C. for 3 minutes to volatilize the solvent. In this way, a resin film (B-stage film) having a thickness of 40 μm and a residual amount of solvent of 1.0% by weight or more and 3.0% by weight or less was formed on the base material.

Thereafter, a protective film was thermally laminated on the surface of the resin film opposite to the base material side at a temperature of 50° C. to obtain a laminated film in which the resin film was a B-stage film.

Preparation of roll packaging:
The obtained laminated film was slit to have a widthwise dimension of 51 cm. This laminated film was wound in a roll shape for 100 m on the outer circumferential surface of the winding core A in a region excluding the outer circumferential surface of the end portion of the winding core A to create a roll body of a resin film (laminated film). Wrap a buffer film once on the outer peripheral surface of the roll of the obtained resin film (laminated film), wrap packaging film A twice around the outside, and fold packaging film A into the opening of core A. is. Next, a cushioning material was placed on the outer peripheral surface of the end of the winding core A with the packaging film A in between so that the outer peripheral surface of the end of the winding core A was completely covered. Next, in the axial direction of the winding core A, the insertion part of the holding member is inserted into the opening of the winding core A so that the tip of the insertion part of the holding member is located inside the end of the resin film. , holding members were attached to both sides of the winding core A in the axial direction to obtain a roll package. When the roll package was placed on the mounting surface inside the cardboard box, the winding core A, the resin film, and the packaging film A were held in a suspended state.

(Example 2)
A roll package was obtained in the same manner as in Example 1, except that no cushioning material was placed during the production of the roll package.

(Example 3)
At the time of manufacturing the roll package, the buffer film was not placed, and the holding member was placed so that the tip of the insertion part of the holding member was located outside the end of the resin film in the axial direction of the winding core A. A roll package was obtained in the same manner as in Example 1, except that the insertion portion was inserted into the opening of the core.

(Comparative example 1)
A laminated film was obtained in the same manner as in Example 1.

Preparation of roll packaging:
The obtained laminated film was slit to have a widthwise dimension of 51 cm. This laminated film was wound in a roll shape for 100 m on the outer circumferential surface of the winding core A in a region excluding the outer circumferential surface of the end portion of the winding core A to create a roll body of a resin film (laminated film). The packaging film B was wound around the outside of the roll of the obtained resin film (laminated film) twice so that the packaging film B did not reach the side surface of the roll. Next, in the axial direction of the winding core A, the insertion part of the holding member is inserted into the opening of the winding core A so that the tip of the insertion part of the holding member is located outside the end of the resin film. , holding members were attached to both sides of the winding core A in the axial direction to obtain a roll package. When the roll package was placed on the mounting surface inside the cardboard box, the core A, the resin film, and the packaging film B were held in a suspended state.

(Comparative example 2)
A laminated film was obtained in the same manner as in Example 1.

Preparation of roll packaging:
The obtained laminated film was slit to have a widthwise dimension of 51 cm. The obtained laminated film was wound in a roll shape for 100 m on the outer peripheral surface of a winding core B to create a roll body of a resin film (laminated film). Since the width direction dimension of the resin film (laminated film) and the axial direction dimension of the winding core B are the same length, in Comparative Example 2, the resin film (laminated film) is wrapped. The packaging film B was wound around the outside of the roll of the obtained resin film (laminated film) twice so that the packaging film B did not reach the side surface of the roll. Next, in the axial direction of the winding core B, by inserting the insertion part of the holding member into the opening of the winding core B so that the tip of the insertion part of the holding member is located inside the end of the resin film. , holding members were attached to both sides of the winding core B in the axial direction to obtain a roll package. When the roll package was placed on the mounting surface inside the cardboard box, the core B, the resin film, and the packaging film B were held in a suspended state.

(Comparative example 3)
A laminated film was obtained in the same manner as in Example 1. The obtained laminated film was slit to have a widthwise dimension of 51 cm. The obtained laminated film was wound in a roll shape for 100 m on the outer peripheral surface of a winding core B to create a roll body of a resin film (laminated film). Since the width direction dimension of the resin film (laminated film) and the axial direction dimension of the winding core B are the same length, in Comparative Example 3, the resin film (laminated film) is wrapped. The packaging film A was wound twice on the outer peripheral surface of the roll of the obtained resin film (laminated film), and the packaging film A was folded into the opening of the winding core B. Next, in the axial direction of the winding core B, by inserting the insertion part of the holding member into the opening of the winding core so that the tip of the insertion part of the holding member is located inside the end of the resin film, Holding members were attached to both sides of the core in the axial direction to obtain a roll package. When the roll package was placed on the placement surface inside the cardboard box, the core B, the resin film, and the packaging film A were held in a suspended state.

(evaluation)
(1) Cracks or cracks in resin film The roll packages obtained in Examples 1 to 3 and Comparative Example 1 were packed in a cardboard box with inner dimensions of 59 cm x 17 cm x 17 cm. The roll packages obtained in Comparative Examples 2 and 3 were packed in a cardboard box with inner dimensions of 54.5 cm x 17 cm x 17 cm. The roll package packed in a cardboard box was transported for 2 days while keeping the temperature below 5°C. After transportation, the roll package was allowed to stand at room temperature for 2 hours or more, and then the resin film was visually observed to evaluate cracks or breaks in the resin film.

[Criteria for determining cracks or cracks in resin film]
○: There are no cracks or breaks in the resin film ×: There are cracks or breaks in the resin film

(2) Preparation of void evaluation board:
A laminate plate measuring 100 mm in length and 100 mm in width was prepared, in which copper foil with a thickness of 25 μm was laminated on a glass epoxy substrate with a thickness of 400 μm. The copper foil was etched to form a total of 900 circular recesses each having a diameter of 100 μm and a depth of 25 μm, 30 in the vertical direction and 30 in the horizontal direction, in an area of 30 mm in length and 30 mm in width on the laminate. Note that the distance between the centers of adjacent circles is 900 μm. In this way, an evaluation board was obtained.

Preparation of laminate of evaluation board and resin film:
The roll packages obtained in Examples 1 to 3 and Comparative Example 1 were packed in a cardboard box with inner dimensions of 59 cm x 17 cm x 17 cm. The roll packages obtained in Comparative Examples 2 and 3 were packed in a cardboard box with inner dimensions of 54.5 cm x 17 cm x 17 cm. The roll package packed in a cardboard box was transported for 2 days while keeping the temperature below 5°C. After transportation, the laminated film was cut out from the roll package after being allowed to stand at room temperature for 2 hours or more. Peel off the protective film of the laminated film, and heat and pressurize the exposed surface of the resin film for 20 seconds at a lamination pressure of 0.4 MP and a lamination temperature of 90°C using a batch vacuum laminator MVLP-500IIA (manufactured by Meiki Seisakusho Co., Ltd.). After that, heating and pressing was carried out for 20 seconds at a press pressure of 0.8 MPa and a press temperature of 90°C. Next, the base material of the laminated film was peeled off to obtain a laminate of the evaluation board and the resin film.

Void observations:
All the recesses of the evaluation board of the obtained laminate were observed using an optical microscope, and voids were evaluated.

[Void judgment criteria]
○○: No voids are observed in the recesses (ratio of recesses with voids is 0%)
○: The percentage of recesses with voids is less than 5% ×: The percentage of recesses with voids is 5% or more

(3) Misalignment The roll packages obtained in Examples 1 to 3 and Comparative Example 1 were packed in a cardboard box with inner dimensions of 59 cm x 17 cm x 17 cm. The roll packages obtained in Comparative Examples 2 and 3 were packed in a cardboard box with inner dimensions of 54.5 cm x 17 cm x 17 cm. The roll package packed in a cardboard box was stored in a refrigerator at a temperature of 5° C. or lower for one week. After storage, the cardboard box containing the roll package was dropped from a height of 1 m from the ground. After dropping, the roll package was visually observed and the winding deviation of the resin film was evaluated.

[Criteria for determining winding misalignment]
○: No winding misalignment △: Winding misalignment that is not a practical problem ×: There is a winding misalignment that is a practical problem

The configuration of the roll package and the results are shown in Table 1 below.

1, 11A, 11B...Roll packaging body 2...Resin film (roll body of resin film)
3... Winding core 3a... Opening 4... Packaging film 5, 5A... Cushioning material 5a... First buffer member 5b... Second buffer member 6... Holding member 6a... Holding member main body 6b... Insertion part 7... Buffer film

Claims (11)

Comprising a winding core, a resin film (excluding photosensitive resin film) , and a packaging film,
The axial dimension of the winding core is larger than the width direction dimension of the resin film,
The resin film is wound in a roll shape on the outer peripheral surface of the winding core in a region excluding the outer peripheral surface of the end of the winding core,
The packaging film is wound on the outer peripheral surface of the roll body of the resin film,
The packaging film extends onto the side surface of the roll body of the resin film,
A cushioning material is disposed on the outer peripheral surface of the end of the winding core, and the cushioning material is arranged so as to cover the entire outer peripheral surface of the end of the winding core,
A roll package, wherein the resin film contains 30% by weight or more of an inorganic filler. The winding core has openings on both sides in the axial direction,
The roll package according to claim 1, wherein the packaging film is folded into the opening of the core. The roll package according to claim 2, wherein the cushioning material is disposed on the outer peripheral surface of the end of the core with the packaging film interposed therebetween. comprising a holding member for holding the winding core, the resin film, and the packaging film in a suspended manner;
The roll package according to any one of claims 1 to 3, wherein the holding members are attached to both sides of the core in the axial direction. The winding core has openings on both sides in the axial direction,
The holding member has a holding member main body and an insertion portion,
The roll package according to claim 4, wherein the insertion portion of the holding member is inserted into the opening of the winding core. 6. The distal end of the insertion portion of the holding member inserted into the opening of the winding core is located inside the end of the resin film in the axial direction of the winding core. Roll packaging. The roll packaging body according to any one of claims 1 to 6, wherein a buffer film is disposed between the roll body of the resin film and the packaging film. The roll package according to any one of claims 1 to 7, wherein the resin film contains the inorganic filler in an amount of 60% by weight or more. The roll package according to any one of claims 1 to 8, wherein the resin film contains a thermosetting compound and a curing agent. The roll package according to claim 9, wherein the thermosetting compound is an epoxy resin. The roll package according to any one of claims 1 to 10, wherein the resin film is a B-stage film.

Images