JP7403875B1 - Method for repairing printed wiring boards and method for manufacturing recycled printed wiring boards - Google Patents

Abstract

The present invention provides a printed wiring board repair method for repairing a damaged or peeled printed wiring board, and a method for manufacturing a recycled printed wiring board. A method for repairing a printed wiring board 100 in which a pad 110 or a pattern is damaged or peeled off includes a plating step of plating a predetermined area of the printed wiring board with a conductive metal, and a plating step in which a predetermined area of the printed wiring board is plated with a conductive metal; A shaving process of shaving off a range until a predetermined range becomes flat; a coating process of applying photoresist 410 to the area cut by the shaving process; and after the coating process, a photomask 500 with the same layout data as the circuit pattern of the repaired area is applied. an exposure process in which the circuit pattern is printed using a photoresist, a development process in which unnecessary portions of the photoresist 410 are removed using a developer after the exposure process, and an etching process in which unnecessary portions of the photoresist 410 are removed along the circuit pattern. It includes an etching process to remove conductive metal and reproduce the circuit pattern at the repaired location. [Selection diagram] Figure 7

Description

The present invention relates to a method for repairing a printed wiring board and a method for manufacturing a recycled printed wiring board.

In the manufacturing process of semiconductors such as ICs (Integrated Circuits), a circuit/pattern is first designed, and a mask manufacturing process is performed to draw the designed circuit pattern on the surface of a glass plate.

This glass plate becomes the original plate (master) for transferring the circuit onto the wafer.

Next, a wafer manufacturing process is performed to manufacture a silicon wafer, and a preprocess is performed to print a circuit pattern on the manufactured wafer.

In the wafer manufacturing process, the silicon ingot is cut and the created wafer is polished.

In the pre-process, a circuit pattern is formed by forming an oxide film on the wafer surface and forming thin films of various materials on top of the oxide film.

Additionally, in the pre-process, a wafer test is performed by touching each of the hundreds of chips formed on the wafer with a probe (needle) to check for electrical problems.

Next, the wafer is cut into chips (dicing), the chips are fixed to a lead frame, the chips and lead frames are connected with gold wire (wire bonding), and the chips are packaged with resin to protect them from scratches and impact. Perform post-processing to perform molding.

In the post-process, electrical property tests (final tests) and appearance inspections are performed after package assembly.

Japanese Patent Application Publication No. 2005-166750

In the final test, the IC is attached to an IC socket attached to a performance board (test board for the tester) and tested in order to connect the IC and the tester.

The pads of the performance board and the IC socket are connected by spring probes (pogo pins).

However, in the final test, when pressing the IC into the IC socket, the spring probe hits the pad of the performance board, which may damage or peel off the pad or pattern.

If even one pad is damaged or peeled off, contact resistance may increase or contact may become impossible, which poses a problem in that the performance board may become unusable.

Patent Document 1 describes a wiring repair method and a wiring repair apparatus for repairing disconnection of wiring formed on an electric circuit board such as a liquid crystal panel, a semiconductor substrate, or a printed wiring board.

This wiring repair method involves applying a masking agent over an area wider than the disconnection in a plan view to a disconnected part of the wiring formed on an electronic circuit board, and irradiating the laser beam with laser light to repair the wiring area including the disconnection. After removing the masking agent, a solution containing a conductive substance is applied to the wiring area from which the masking agent has been removed, and the solution containing the conductive substance is heated by irradiating it with laser light. In this way, a thin film of conductive material is deposited to connect the disconnected parts.

Thereby, the shape of the disconnected connection portion is matched to the shape of the wiring on the electronic circuit board, and the wiring can be repaired accurately in accordance with the shape.

However, the invention according to Patent Document 1 has a problem in that it is difficult to use when the pads of a printed wiring board such as a performance board are damaged or peeled off.

Further, a similar problem occurs in a wafer test in a wafer inspection process.

Specifically, spring probes push the performance board every time a wafer test is performed, but if the positions of the pads on the performance board and the spring probes do not match accurately, the pads may be damaged or peeled off.

The purpose of the invention is to repair damaged or delaminated printed wiring boards.

Another object of the present invention is to provide a method for repairing a damaged or peeled printed wiring board.

Another object of the present invention is to provide a method for manufacturing recycled printed wiring boards.

A method for repairing a printed wiring board according to a first aspect of the present invention is a method for repairing a printed wiring board whose pads or patterns are damaged or peeled off, comprising:
a plating step of plating a predetermined area of the printed wiring board with a conductive metal;
After the plating step, a shaving step of shaving off the predetermined range until the predetermined range becomes flat;
a coating step of applying photoresist to the portion scraped by the scraping step;
After the coating step, an exposure step of exposing the circuit pattern using layout data of the circuit pattern of the repaired area and printing the circuit pattern;
After the exposure step, a developing step of removing unnecessary photoresist portions with a developer;
The method for repairing a printed wiring board includes, after the development step, performing etching to remove the unnecessary conductive metal along the circuit pattern and regenerating the circuit pattern at the repaired location.

The shaving step may be a step of shaving until conductive metal in a pattern provided on the printed wiring board is exposed.

With this method, circuit patterns can be easily reproduced and discarded printed wiring boards can be used again.

A method for repairing a printed wiring board according to a second aspect of the present invention is a method for repairing a printed wiring board whose pads or patterns are damaged or peeled off, comprising:
a coating step of applying photoresist to a predetermined area of the printed wiring board;
After the coating step, an exposure step of exposing the circuit pattern using layout data of the circuit pattern of the repaired area and printing the circuit pattern;
After the exposure step, a developing step of removing unnecessary photoresist portions with a developer;
After the development step, a plating step of plating a predetermined area of the printed wiring board with a conductive metal;
The method for repairing a printed wiring board includes, after the plating step, a step of removing the predetermined range until the predetermined range becomes flat.

Even with this method of repairing a printed wiring board, the same effects as in the first aspect can be achieved.

A method for repairing a printed wiring board according to a third aspect of the present invention is a method for repairing a printed wiring board whose pads or patterns are damaged or peeled off, comprising:
a shaving step of shaving a predetermined area of the printed wiring board until it reaches the resin;
a plating step of plating the portion scraped off in the scraping step with a conductive metal;
After the plating step, a coating step of applying a photoresist to the portion plated by the plating step;
After the coating step, an exposure step of exposing the circuit pattern using layout data of the circuit pattern of the repaired area and printing the circuit pattern;
After the exposure step, a developing step of removing unnecessary photoresist portions with a developer;
The method for repairing a printed wiring board includes, after the development step, performing etching to remove the unnecessary conductive metal along the circuit pattern and regenerating the circuit pattern at the repaired location.

Even with such a printed wiring board repair method, the same effects as in the first and second aspects can be achieved.

A method for repairing a printed wiring board according to a fourth aspect of the present invention is a method for repairing a printed wiring board whose pads or patterns are damaged or peeled off, comprising:
a shaving step of shaving a predetermined range of the printed wiring board until the predetermined range becomes flat;
The method for repairing a printed wiring board includes, after the scraping process, a circuit printing process of printing a circuit pattern on a predetermined area of the printed wiring board using a conductive metal.

This method of repairing printed wiring boards does not require plating, masking, or etching processes, and the circuit pattern can be easily regenerated, allowing discarded printed wiring boards to be used again. be able to.

A method for repairing a printed wiring board according to a fifth aspect of the present invention is a method for repairing a printed wiring board whose pads or patterns are damaged or peeled off, comprising:
an ink application step of applying conductive ink to a predetermined area of the printed wiring board;
After the coating step, a laser step is performed in which a circuit pattern is drawn using a laser beam in a predetermined area of the printed wiring board, and a layout of the circuit pattern at the repair location is drawn on the conductive ink coated area, and after the laser step , a cleaning step of removing unnecessary conductive ink portions with a cleaning solution.

This method of repairing printed wiring boards does not require plating, masking, or etching processes, and the circuit pattern can be easily regenerated, allowing discarded printed wiring boards to be used again. be able to.

A method for repairing a printed wiring board according to a sixth aspect of the present invention is a method for repairing a printed wiring board whose pads or patterns are damaged or peeled off, comprising:
A pre-processing step of scraping the pads in areas that have collapsed and protruded from the predetermined range;
After the pretreatment step, an ink application step of applying conductive ink to a predetermined area of the printed wiring board;
After the ink application step, a firing step of firing the applied conductive ink;
After the baking step, a coating step of applying a photoresist to a predetermined area of the printed wiring board;
After the coating step, an exposure step of exposing the circuit pattern using layout data of the circuit pattern of the repaired area and printing the circuit pattern;
After the exposure step, a developing step of removing unnecessary photoresist portions with a developer;
The method for repairing a printed wiring board includes, after the development step, performing etching to remove the unnecessary conductive metal along the circuit pattern and regenerating the circuit pattern at the repaired location.

Even with such a printed wiring board repair method, the circuit pattern can be easily reproduced, and a discarded printed wiring board can be used again.

A method for repairing a printed wiring board according to a seventh aspect of the present invention is a method for repairing a printed wiring board according to any of the first to third aspects, wherein after the etching step, nickel plating and gold plating are performed to regenerate the circuit pattern. This is a printed wiring board repair method including a circuit patterning process.

A method for manufacturing a recycled printed wiring board according to an eighth aspect of the present invention is a method for manufacturing a printed wiring board in which a pad or pattern is damaged or peeled off, comprising:
a plating step of plating a predetermined area of the printed wiring board with a conductive metal;
After the plating step, a shaving step of shaving off the predetermined range until the predetermined range becomes flat;
a coating step of applying photoresist to the portion scraped by the scraping step;
After the coating step, an exposure step of exposing the circuit pattern using layout data of the circuit pattern of the repaired area and printing the circuit pattern;
After the exposure step, a developing step of removing unnecessary photoresist portions with a developer;
The method for manufacturing a printed wiring board includes, after the development step, etching to remove the unnecessary conductive metal along the circuit pattern and regenerate the circuit pattern at the repaired location.

With such a method, recycled printed wiring boards can be manufactured.

A method for manufacturing a recycled printed wiring board according to a ninth aspect of the present invention is a method for manufacturing a printed wiring board in which pads or patterns are damaged or peeled off, comprising:
a coating step of applying photoresist to a predetermined area of the printed wiring board;
After the coating step, an exposure step of exposing the circuit pattern using layout data of the circuit pattern of the repaired area and printing the circuit pattern;
After the exposure step, a developing step of removing unnecessary photoresist portions with a developer;
After the development step, a plating step of plating a predetermined area of the printed wiring board with a conductive metal;
The method for manufacturing a printed wiring board includes, after the plating step, a shaving step of shaving the predetermined range until the predetermined range becomes flat.

Even with such a method, the same effects as the manufacturing method according to the eighth aspect can be achieved.

A method for manufacturing a recycled printed wiring board according to a tenth aspect of the present invention is a method for manufacturing a printed wiring board in which pads or patterns are damaged or peeled off, comprising:
a shaving step of shaving a predetermined area of the printed wiring board until it reaches the resin;
a plating step of plating the portion scraped off in the scraping step with a conductive metal;
After the plating step, a coating step of applying photoresist to the portion scraped by the scraping step;
After the coating step, an exposure step of exposing the circuit pattern using layout data of the circuit pattern of the repaired area and printing the circuit pattern;
After the exposure step, a developing step of removing unnecessary photoresist portions with a developer;
The method for manufacturing a printed wiring board includes, after the development step, etching is performed to remove the unnecessary conductive metal along the circuit pattern and reproduce the circuit pattern at the repaired location.

Such a manufacturing method provides the same effects as the manufacturing methods according to the eighth and ninth aspects.

A method for manufacturing a recycled printed wiring board according to an eleventh aspect of the present invention is a method for manufacturing a printed wiring board for recycling a printed wiring board whose pads have been damaged or peeled off, comprising:
a shaving step of shaving a predetermined range of the printed wiring board until the predetermined range becomes flat;
The method for manufacturing a printed wiring board includes, after the scraping step, a circuit printing step of printing a circuit pattern on a predetermined area of the printed wiring board using a conductive metal.

With such a manufacturing method, a plating process, a mask process, and an etching process are not necessary, and a recycled printed wiring board can be manufactured.

A method for manufacturing a recycled printed wiring board according to a twelfth aspect of the present invention is a method for manufacturing a printed wiring board in which pads or patterns are damaged or peeled off, comprising:
an ink application step of applying conductive ink to a predetermined area of the printed wiring board;
After the coating step, a laser step is performed in which a circuit pattern is drawn using a laser beam in a predetermined area of the printed wiring board, and a layout of the circuit pattern at the repair location is drawn on the conductive ink coated area, and after the laser step , a cleaning step of removing unnecessary conductive ink portions with a cleaning liquid.

Even with such a manufacturing method, a plating process, a mask process, and an etching process are not necessary, and a recycled printed wiring board can be manufactured.

A method for manufacturing a recycled printed wiring board according to a thirteenth aspect of the present invention is a method for manufacturing a printed wiring board in which a pad or pattern is damaged or peeled off, comprising:
A pre-processing step of scraping the pads in areas that have collapsed and protruded from the predetermined range;
After the pretreatment step, an ink application step of applying conductive ink to a predetermined area of the printed wiring board;
After the ink application step, a firing step of firing the applied conductive ink;
After the baking step, a coating step of applying a photoresist to a predetermined area of the printed wiring board;
After the coating step, an exposure step of exposing the circuit pattern using layout data of the circuit pattern of the repaired area and printing the circuit pattern;
After the exposure step, a developing step of removing unnecessary photoresist portions with a developer;
The method for manufacturing a printed wiring board includes, after the development step, etching is performed to remove the unnecessary conductive metal along the circuit pattern and reproduce the circuit pattern at the repaired location.

Even with such a manufacturing method, a recycled printed wiring board can be manufactured.

A method for manufacturing a recycled printed wiring board according to a fourteenth aspect of the present invention is a method for manufacturing a recycled printed wiring board according to the eighth to tenth aspects, wherein after the etching step, nickel plating and gold plating are performed. This is a method for manufacturing a recycled printed wiring board, including a circuit pattern step of regenerating a circuit pattern.

FIG. 1 is a plan view of a printed wiring board according to an embodiment of the present invention. FIG. 3 is a plan view of the printed wiring board of the same embodiment. . FIG. 3 is a plan view of a printed wiring board plated with copper according to the same embodiment. . FIG. 2 is a conceptual diagram of a side cross section of a printed wiring board plated with copper according to the same embodiment. FIG. 3 is a partially cut plan view of the printed wiring board of the same embodiment. FIG. 3 is a conceptual diagram of a partially cut side cross section of the printed wiring board of the same embodiment. FIG. 3 is a conceptual diagram of a partially cut side cross section of the printed wiring board of the same embodiment. FIG. 3 is a conceptual diagram of a partially cut side cross section of the printed wiring board of the same embodiment. 1 is a flowchart of a printed wiring board repair method according to an embodiment of the present invention. FIG. 1 is a conceptual diagram of a side cross section of a printed wiring board according to an embodiment of the present invention. FIG. 3 is a conceptual diagram of a side cross section of the printed wiring board of the same embodiment. FIG. 3 is a conceptual diagram of a side cross section of the printed wiring board of the same embodiment. FIG. 3 is a conceptual diagram of a side cross section of the printed wiring board of the same embodiment. 1 is a flowchart of a printed wiring board repair method according to an embodiment of the present invention. 1 is a flowchart of a printed wiring board repair method according to an embodiment of the present invention. FIG. 1 is a conceptual diagram of a side cross section of a printed wiring board according to an embodiment of the present invention. FIG. 3 is a conceptual diagram of a side cross section of the printed wiring board of the same embodiment. FIG. 3 is a conceptual diagram of a side cross section of the printed wiring board of the same embodiment. 1 is a flowchart of a printed wiring board repair method according to an embodiment of the present invention.

Embodiments of the present invention will be described below with reference to the drawings.
<First embodiment>
FIG. 1 is an example of a performance board 100 in which pads 110 on resin 200 are damaged and peeled off. Moreover, FIG. 9 is a flowchart of the repair method or the manufacturing method of a recycled printed wiring board according to the first embodiment.

The surface of a printed wiring board is not coated with solder resist, and there are parts where metal foil such as copper or gold is exposed, and these parts are called pads or lands.

Pads are used for soldering surface-mounted components and for inputting and outputting signals from the middle of a circuit, and are square or circular in shape.

The land is located around the through hole and is used to pass the lead component through the through hole and solder it.

A pattern is a wiring made on a printed wiring board using copper foil that conducts electricity. On a performance board, wiring is drawn out from multiple pads in a pattern around the board.

As shown in FIGS. 3 and 4, first, a predetermined area including the pads 110 or patterns of the performance board 100 is entirely plated with copper 310 (step S11, plating process). Specifically, a predetermined area of the frame A shown in FIG. 2 is plated with copper.

As a result, the crushed or peeled pads 110 or patterns are plated with copper.

In this embodiment, copper 310 is plated, but before plating with copper 310, the pad 110 or pattern is crushed and the part of the pad 110 or pattern that protrudes from the original pad 110 or pattern is scraped off. It may also be possible to prevent short-circuiting between pads 110 or patterns.

The portion of the pad 110 or pattern that protrudes from the range of the original pad 110 or pattern may be dissolved by etching, burned with a laser, or blown away with a CO2 blaster or the like.

Furthermore, although a performance board is used in this embodiment, other printed wiring boards may be used.

Although copper is used in this embodiment, other conductive metals such as gold and silver may also be used.

Next, as shown in FIGS. 5 and 6, the copper-plated portion B is shaved from above (shaving state C), exposing the copper 320 (pad 110 or pattern) of the original circuit pattern as shown in C. (Step S12, scraping process).

Specifically, portion B plated with copper 310 is shaved down to the gold and nickel portions of the original circuit pattern, exposing the copper 320 of the original circuit pattern.

In other words, portion B plated with copper 310 is scraped away until the copper of the original circuit pattern is exposed (reached).

As a result, as shown in FIG. 6, the copper 320 of the original circuit pattern and the plated copper 310 become flat.

Note that the term "circuit pattern" refers to a pattern made using conductive metal foil such as copper foil.

Furthermore, in this embodiment, the copper 320 plated on the original circuit pattern is scraped until it is exposed in the scraping process, but it is sufficient that the copper 320 is not exposed as long as it becomes flat (plane, flat). good.

Next, as shown in FIG. 7, a photoresist 410 is applied to the shaved portion C (step S13, coating process).

Next, after applying the photoresist 410, the shaved portion C is exposed using a photomask 500 having the same layout (layout data) as the circuit pattern of the repaired portion (scraped portion C) (step S14, exposure process).

That is, light is irradiated through the photomask 500 to print a circuit pattern.

In this embodiment, the layout (layout data) of the circuit pattern of the repaired area is used, but it does not necessarily have to be the same layout (layout data) as before the repair, as long as it is a repairable layout (layout data). .

In this embodiment, the photomask 500 is irradiated with light while in contact with the photoresist 410.

The circuit pattern may be printed on the photomask by irradiating light from a remote location through a reduction lens without contacting the photoresist 410.

A "photomask" is a component used in the manufacturing process of integrated circuits such as LSI, and is a transparent glass plate with a very fine circuit pattern etched into the light-shielding film on the surface. This is the original version.

Next, unnecessary photoresist portions are removed using a developer (step S15, development process).

Next, etching is performed to remove unnecessary copper along the circuit pattern, as shown in FIG. 8, to reproduce the original circuit pattern (step S16, etching process).

Etching includes wet etching using an aqueous solution of acid or alkali, and dry etching using plasma generated from gas.

Next, nickel plating and gold plating are performed to reproduce the circuit pattern (step S17, second plating step).

<Second embodiment>
10 to 13 show a method for repairing a printed wiring board or a method for repairing a recycled printed wiring board according to the second embodiment.
FIG. 14 is a flowchart of a printed wiring board repair method or recycled printed wiring board according to the second embodiment. As shown in FIG. 10, the pad 110 or pattern is crushed and the portion of the pad 110 or pattern that protrudes from the original range of the pad 110 or pattern is scraped off to prevent short-circuiting between the pads 110 or patterns (step S21). , pre-treatment step).

The portion of the pad that protrudes from the original pad 110 or the pattern may be dissolved by etching, or may be blown away using a CO2 blaster or the like.

Next, as shown in FIG. 10, a photoresist 410 is applied to a predetermined area of the performance board 100 (step S22, coating process).

``Photoresist'' is a liquid chemical agent whose main components are a polymer, a photosensitizer, and a solvent that reacts to light and has the ability to withstand etching.

The photoresist 410 is formed by spin coating, for example, and has a thickness of several hundred nm to several μm.

"Spin coating" refers to coating using a device that uses high-speed rotation centrifugal force to form a coating film on a flat base material.

In the photoresist 410, the portions exposed to light undergo a chemical reaction to change the polarity and molecular weight of the polymer, thereby adding development selectivity.

Solder resist 400 is a resist placed on the printed wiring board before repair.

Specifically, the solder resist 400 is an ink that covers the surface of a printed wiring board (PWB) and becomes an insulating film that protects a circuit pattern.

Next, as shown in FIG. 11, the solder resist 400 and the photoresist 410 are masked with a photomask 500 and exposed to light (step S23, exposure process).

As a result, the circuit pattern of the repaired area is printed.

Next, the masked pad 110 or the photoresist 410 in the pattern portion is removed using a developer (step S24, development process).

Note that in the positive method, the photoresist 410 is removed in the exposed areas, and in the negative method, the photoresist 410 is removed in the unexposed areas, but either the positive type or the negative type may be used.

In this embodiment, a positive type is used, and the photoresist 410 at exposed locations is removed.

Next, as shown in FIG. 12, a predetermined area is plated with copper 310 (step S25, plating process). Specifically, it is similar to FIG. 3 of the first embodiment.

Next, as shown in FIG. 13, in order to remove the copper 310 between the pads 110, the top is cut down to the original height of the pads 110, exposing the copper 320 of the pads 110 (step S26). Specifically, it is similar to FIG. 5 of the first embodiment.

Note that the height of the circuit pattern needs to be flattened, and as long as the copper 310 between the pads 110 is removed, it is not necessary to cut the circuit pattern to the height of the original circuit pattern.

Next, nickel plating and gold plating are performed to reproduce the circuit pattern (step S27, second plating step).

As shown in FIG. 13, by leaving the photoresist 410 around the copper 310 (by covering the periphery of the pad 110 with the photoresist 410), deformation of the pad 110 by the spring probe can be prevented. .

In other words, even if the spring probe contacts the pad 110 at a position shifted from the center, the spring probe is supported by the photoresist 410 due to the presence of the photoresist 410 around the pad 110, and the pad 110 is pressed by the spring probe. Partial damage can be prevented.

<Third embodiment>
As shown in FIG. 15, in the third embodiment, first, a predetermined range of the frame A is shaved until the resin 200 is reached (step S31, scraping process).

In other words, not only the damaged pads 110 within the predetermined range of frame A but also the undamaged pads 110 (copper 320) and the like are shaved until the resin 200 is reached.

Note that, similarly to the first embodiment and the second embodiment, it is sufficient to cut it so that it becomes flat, and it is not necessary to cut it until it reaches the resin 200. Alternatively, the resin 200 may be shaved.

Next, the scraped portion is plated with copper 310 (step S32, plating process).

Next, a photoresist 410 is applied to the plated portion (step S33, coating process).

Next, exposure is performed using a photomask 500 of the layout (layout data) of the circuit pattern of the repaired area (step S34, masking process).

Next, etching is performed to remove unnecessary copper 310 along the circuit pattern and reproduce the original circuit pattern (step S35, etching process).

Next, nickel plating and gold plating are performed to reproduce the circuit pattern (step S36, second plating step).

<Fourth embodiment>
Further, in the first to third embodiments, plating was performed with copper 310, but instead of plating, a conductive ink such as conductive Cu nano ink may be applied and baked to deposit copper.

Specifically, as shown in FIGS. 16 to 19, first, the pad 110 is crushed and the portion of the pad protruding from the original pad 110 is scraped off to prevent short-circuiting between the pads 110 (step S41). , pre-treatment step).

The portion of the pad protruding from the original range of the pad 110 may be dissolved by etching, or may be blown away using a CO2 blaster or the like.

Next, as shown in FIG. 16, conductive Cu nano-ink 600 is applied to a predetermined area (step S42, ink application step).

Next, the applied conductive Cu nano ink 600 is irradiated with a xenon lamp, the conductive Cu nano ink 600 is fired, and copper 610 is deposited (step S43, firing process).

In this embodiment, the conductive Cu nano ink 600 is fired by irradiation with a xenon lamp, but it may also be fired by irradiation with LED light or laser light.

Next, as shown in FIG. 17, a photoresist 410 is applied on the deposited copper 610 (step S44, coating process).

In this embodiment, the photoresist 410 is applied after firing the conductive Cu nano ink 600, but before applying the photoresist 410, a scraping process may be performed to flatten the surface.

Next, after applying a photoresist 410, exposure is performed using a photomask 500 having the same layout as the circuit pattern of the repaired area (step S45, masking process).

Next, the masked pad 110 or the photoresist 410 in the pattern portion is removed using a developer (step S46, development process).

Next, as shown in FIG. 18, etching is performed to remove unnecessary copper 610 along the circuit pattern and reproduce the original circuit pattern (step S47, etching process).

Next, nickel plating and gold plating are performed to reproduce the circuit pattern (step S48, second plating step).

<Other embodiments>
In the first to third embodiments, plating was performed with copper 310, but instead of plating, a 3D printer is used to directly print a circuit pattern with conductive metals such as copper, silver, and gold. It may also be printed (circuit printing process).

In this case, since the circuit pattern is printed, a plating process, a mask process, and an etching process are unnecessary.

Furthermore, in the first to fourth embodiments, the photomask 500 was used to reproduce the original circuit pattern, but ultraviolet laser light may also be used (laser process).

That is, without using the photomask 500, the original circuit pattern may be reproduced by directly drawing the circuit pattern on the photoresist 410 using ultraviolet laser light (laser process).

Note that after the laser process, the masked pad 110 or the photoresist 410 in the pattern portion is removed using a developer (developing process).

After the circuit pattern is reproduced, an etching process is performed to remove unnecessary copper along the circuit pattern.

In addition, in the first to fourth embodiments, unnecessary copper was removed along the circuit pattern by etching to reproduce the original circuit pattern, but a conductive ink such as conductive Cu nano ink was used. Then, the original circuit pattern may be reproduced by printing a circuit pattern by inkjet or gravure printing (circuit printing process), firing the conductive ink (baking process), and depositing a metal such as copper.

In this case, since the circuit pattern is directly drawn, plating, masking, and etching processes are not necessary.

The present invention can be implemented in various forms with various improvements, modifications, and variations without departing from the spirit thereof.

100 Performance board (printed wiring board)
110 Pad 200 Resin (prepreg resin)
310 Copper 320 Copper 400 Solder resist 410 Photoresist 500 Photomask 600 Conductive Cu nano ink

Claims (3)

A method for repairing a printed wiring board whose pads or patterns are damaged or peeled off, the method comprising:
a plating step of plating a predetermined area of the printed wiring board with a conductive metal;
After the plating step, a shaving step of shaving off the predetermined range until the predetermined range becomes flat;
a coating step of applying photoresist to the portion scraped by the scraping step;
After the coating step, an exposure step of exposing the circuit pattern using layout data of the circuit pattern of the repaired area and printing the circuit pattern;
After the exposure step, a developing step of removing unnecessary photoresist portions with a developer;
A method for repairing a printed wiring board, comprising: after the development step, etching is performed to remove the unnecessary conductive metal along the circuit pattern and reproduce the circuit pattern at the repaired location. A method for repairing a printed wiring board whose pads or patterns are damaged or peeled off, the method comprising:
a shaving step of shaving a predetermined area of the printed wiring board until it reaches the resin;
a plating step of plating the portion scraped off in the scraping step with a conductive metal;
After the plating step, a coating step of applying a photoresist to the portion plated by the plating step;
After the coating step, an exposure step of exposing the circuit pattern using layout data of the circuit pattern of the repaired area and printing the circuit pattern;
After the exposure step, a developing step of removing unnecessary photoresist portions with a developer;
A method for repairing a printed wiring board, comprising: after the development step, etching is performed to remove the unnecessary conductive metal along the circuit pattern and reproduce the circuit pattern at the repaired location. A method for repairing a printed wiring board whose pads or patterns are damaged or peeled off, the method comprising:
A pre-processing step of scraping the pads in areas that have collapsed and protruded from the predetermined range;
After the pretreatment step, an ink application step of applying conductive ink to a predetermined area of the printed wiring board;
After the ink application step, a firing step of firing the applied conductive ink;
After the baking step, a coating step of applying a photoresist to a predetermined area of the printed wiring board;
After the coating step, an exposure step of exposing the circuit pattern using layout data of the circuit pattern of the repaired area and printing the circuit pattern;
After the exposure step, a developing step of removing unnecessary photoresist portions with a developer;
After the development process, etching is carried out along the circuit pattern.Beforeelectrical conductivityUnwanted substances deposited from inkA method for repairing a printed wiring board, including an etching process for removing metal and regenerating a circuit pattern at a repaired location.

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