JP7377631B2 - career - Google Patents

Description

This specification discloses a carrier, a test board, and a component mounting system.

Conventionally, in component mounting machines that take out component parts and mount them on boards, there are known machines that mount test parts on test boards (testing equipment) and check the accuracy of the mounting prior to production. (For example, see Patent Document 1). The test board is provided with a plurality of pockets around the outer periphery of the mounting surface, in which test components are placed. The mounting test is performed by taking out the test component stored in the pocket of the test board, mounting it on the test board, inspecting and confirming the accuracy of the mounting, and then removing the test component from the test board.

Special table 2017-517898 publication

However, when attempting to test the mounting accuracy of each test component by mounting a large number of test components on a test board, a problem arises in that there is not enough space to accommodate the test components.

The main objective of the present disclosure is to provide a carrier and a test board that can accommodate more test components in a small space.

The present disclosure has taken the following measures to achieve the above-mentioned main objective.

The carrier of this disclosure is
A carrier that is used in a component mounting machine for mounting test components and inspecting the mounting accuracy of the mounted test components, and holding a test board on which the test components are mounted,
comprising a component storage pocket capable of accommodating a plurality of the inspection components in a stacked manner;
The gist is that.

The carrier of the present disclosure includes a component storage pocket that can accommodate a plurality of inspection components in a stacked manner. Therefore, compared to a case where only one inspection component is accommodated in one component storage pocket, it is possible to accommodate more inspection components in a smaller space.

The carrier of the present disclosure includes a carrier body that holds the inspection board on the upper surface, and a tray that is detachably attached to the upper surface of the outer periphery of the carrier body, and the component storage pocket is formed in the tray. It can also be used as a In this case, the tray may be attached to the carrier body so as to partially overlap the outer peripheral edge of the test substrate. The outer periphery of the test board is an area where no test components are placed, and by attaching the tray to the carrier body so that it partially overlaps the outer periphery of the test board, the test board is relatively large and the carrier Even if there is not enough space around the outer periphery, it is possible to accommodate a sufficient number of inspection parts.

The inspection substrate of the present disclosure includes:
An inspection board used in a component mounting machine for mounting inspection components and measuring the mounting accuracy of the mounted inspection components, and on which the inspection components are mounted,
comprising a component storage pocket capable of accommodating a plurality of the inspection components in a stacked manner;
The gist is that.

The inspection board of the present disclosure includes a component storage pocket that can accommodate a plurality of inspection components in a stacked manner. Therefore, compared to a case where only one inspection component is accommodated in one component storage pocket, it is possible to accommodate more inspection components in a smaller space.

The component mounting system of the present disclosure includes:
A component mounting system comprising a plurality of component mounting machines lined up in a board transport direction,
Each component mounting machine is
head and
an imaging device provided on the head;
a transport device that transports a test board having a component storage pocket for storing test components or a carrier having the component storage pocket and holding the test board in the board transport direction;
Controlling the transport device so as to carry in the test board or the carrier from the upstream side in the board transport direction, collecting the test component from the component storage pocket, and mounting the collected test component on the test board. The imaging device is controlled to take an image of the inspection board on which the inspection component is mounted, and the mounting accuracy of the inspection component is determined based on the obtained captured image. A control device that controls the head so as to return the test component mounted on the test board to the component storage pocket, and controls the transport device to carry out the test board or the carrier downstream in the board transport direction. and,
The main point is to have the following.

In the component mounting system of the present disclosure, the control device of each component mounting machine controls the test board having a component storage pocket for accommodating the test component or the carrier having the component storage pocket and holding the test board in the board transport direction. Carry in from the upstream side. Subsequently, the control device collects the test component from the component storage pocket and mounts the test component on the test board. Next, the control device images the test board on which the test component is mounted, determines the mounting accuracy of the test component based on the obtained image, and stores the test component mounted on the test board. Return it to your pocket. Then, the control device carries out the test substrate or carrier to the downstream side in the substrate transport direction. This allows efficient inspection of all the component mounting machines that make up the component mounting line.

FIG. 1 is a configuration diagram schematically showing the configuration of a component mounting system 1 according to the present embodiment. 1 is an external perspective view of a component mounting machine 10. FIG. FIG. 2 is a top view of the component mounting machine 10. FIG. FIG. 2 is an explanatory diagram showing an electrical connection relationship between a control device 60 and a management device 80 of the component mounting machine 10. FIG. FIG. 5 is a perspective view of the appearance of a carrier 50. FIG. FIG. 5 is an exploded perspective view of the carrier 50. 6 is a sectional view taken along line AA in FIG. 5. FIG. 3 is a flowchart illustrating an example of a mounting accuracy inspection process.

Next, embodiments for carrying out the invention of the present disclosure will be described with reference to the drawings.

FIG. 1 is a configuration diagram showing an outline of the configuration of a component mounting system 1 according to the present embodiment. FIG. 2 is an external perspective view of the component mounter 10. FIG. 3 is a top view of the component mounting machine 10. FIG. 4 is an explanatory diagram showing the electrical connection relationship between the control device 60 and the management device 80 of the component mounter 10. In FIGS. 1 and 2, the left-right direction is the X-axis direction, the front-rear direction is the Y-axis direction, and the up-down direction is the Z-axis direction.

As shown in FIG. 1, the component mounting system 1 includes a printing machine 2, a print inspection machine 3, a plurality of component mounting machines 10, a mounting inspection machine (not shown), and a management device 80 that manages the entire system. and. The printing machine 2 prints solder on the substrate S to form a circuit pattern. The print inspection machine 3 inspects the state of the solder printed by the printing machine 2. A plurality of component mounting machines 10 mount components on a board. The mounting inspection machine inspects the mounting state of the components mounted by the component mounting machine 10. The printing machine 2, the print inspection machine 3, the plurality of component mounting machines 10, and the mounting inspection machines are installed side by side in the conveyance direction of the board S to constitute a production line.

As shown in FIG. 2, the component mounting machine 10 includes a component supply device 21 that supplies components, a board transfer device 22 that transfers a board, a head 40 having a suction nozzle that picks up components, and a head 40 that is arranged along the X axis. It includes a head moving device 30 that moves the mounting machine in both the direction and the Y-axis direction, and a control device 60 (see FIG. 4) that controls the entire mounting machine. In addition to these, the component mounter 10 is equipped with a parts camera 23 for capturing an image of the suction posture of the component suctioned by the suction nozzle, a nozzle station 24 that accommodates a replacement suction nozzle, and a head 40. It also includes a mark camera 43 for capturing images of positioning reference marks attached to the board.

The component supply device 21 includes, for example, a tape reel around which a carrier tape containing components at predetermined intervals is wound, and a tape feeding mechanism that draws out the carrier tape from the tape reel and sends it out to a component supply position by driving a drive motor. It is configured as a tape feeder. This component supply device 21 (tape feeder) is detachably attached to a feeder table (not shown) provided in the component mounting machine 10.

The substrate transfer device 22 includes a pair of conveyor rails arranged at intervals in the Y-axis direction, and moves the substrate from left to right in FIG. 1 (substrate transfer direction) by driving the pair of conveyor rails. transport.

As shown in FIG. 1, the head moving device 30 includes a pair of X-axis guide rails 31, an X-axis slider 32, an X-axis actuator 33 (see FIG. 4), a pair of Y-axis guide rails 35, and a Y-axis It includes a slider 36 and a Y-axis actuator 37 (see FIG. 4). A pair of Y-axis guide rails 35 are installed at the upper stage of the housing 11 so as to extend parallel to each other in the Y-axis direction. The Y-axis slider 36 spans a pair of Y-axis guide rails 35 and moves in the Y-axis direction along the Y-axis guide rails 35 by driving of the Y-axis actuator 37. A pair of X-axis guide rails 31 are installed in front of the Y-axis slider 36 so as to extend parallel to each other in the X-axis direction. The X-axis slider 32 spans a pair of X-axis guide rails 31 and moves in the X-axis direction along the X-axis guide rails 31 by driving the X-axis actuator 33. A head 40 is attached to the X-axis slider 32, and the head moving device 30 moves the head 40 in the X-axis direction and the Y-axis direction by moving the X-axis slider 32 and the Y-axis slider 36. .

The head 40 includes a Z-axis actuator 41 (see FIG. 4) that moves the suction nozzle in the Z-axis (up and down) direction, and a θ-axis actuator 42 (see FIG. 4) that rotates the suction nozzle around the Z-axis. The head 40 can suction components by applying negative pressure to the suction port by communicating a negative pressure source to the suction port of the suction nozzle. Further, the head 40 can release the suction of the component by communicating a positive pressure source to the suction port of the suction nozzle, thereby applying positive pressure to the suction port.

As shown in FIG. 4, the control device 60 is configured as a microprocessor centered around a CPU 61, and includes a ROM 62, an HDD 63, a RAM 64, and an input/output interface 65 in addition to the CPU 61. These are electrically connected via a bus 66. The control device 60 receives a position signal from the X-axis position sensor 34 that detects the position of the X-axis slider 32, a position signal from the Y-axis position sensor 38 that detects the position of the Y-axis slider 36, and a position signal from the mark camera 43. Image signals, image signals from the parts camera 23, and the like are input via an input/output interface 65. On the other hand, the control device 60 sends a control signal to the component supply device 21 , a control signal to the substrate transport device 22 , a drive signal to the X-axis actuator 33 , a drive signal to the Y-axis actuator 37 , and a drive signal to the Z-axis actuator 41 . A drive signal for the θ-axis actuator 42, a drive signal for the θ-axis actuator 42, etc. are outputted via the input/output interface 75. Further, the control device 60 is connected to the management device 80 so as to be able to communicate bidirectionally, and exchanges data and control signals with each other.

The management device 80 is, for example, a general-purpose computer, and includes a CPU 81, a ROM 82, an HDD 83, a RAM 84, an input/output interface 85, and the like, as shown in FIG. These are electrically connected via a bus 86. Input signals are input to this management device 80 via an input/output interface 85 from an input device 87 such as a mouse or a keyboard. Furthermore, an image signal is outputted from the management device 80 to a display 88 via an input/output interface 85. The HDD 83 stores the production job for the board S. Here, the production job for the board S includes production information such as which components are to be mounted on the board S in which order in each component mounting machine 10, and how many boards S to be manufactured with the components mounted in this way. Includes schedule. The management device 80 generates a production job based on the data input by the operator via the input device 87, and sends the generated production job to each component mounter 10, thereby controlling production for each component mounter 10. Instructs to start.

Next, the operation of the component mounting machine 10 in the component mounting system 1 of this embodiment configured in this manner will be explained. In particular, the mounting accuracy inspection performed in each component mounting machine 10 prior to the start of production will be described. Here, in the mounting accuracy test, the carrier 50 holding the test component P and the test board S is transported by the board transport device 22, and each component mounter 10 sucks the test component P to test the test board S. This is done by implementing the implementation and checking the implementation status. FIG. 5 is an external perspective view of the carrier 50. FIG. 6 is an exploded perspective view of the carrier 50. FIG. 7 is a sectional view taken along line AA in FIG.

The carrier 50 includes a carrier body 51 and a component storage tray 55, as shown in FIGS. 5 and 6.

The carrier main body 51 is a flat plate member formed in a rectangular shape. As shown in FIG. 6, a rectangular recess 51a is formed in the center of the surface of the carrier body 51. As shown in FIG. Furthermore, fasteners 52 are provided on the two short sides of the outer peripheral surface of the carrier body 51, respectively. The inspection substrate S is accommodated in the recess 51 a of the carrier body 51 and held by the carrier body 51 by the fasteners 52 . Furthermore, mounting pins 51b that protrude upward from the surface are provided at the four corners of the outer circumference of the surface of the carrier body 51, respectively. Further, permanent magnets 53 are attached to two long sides of the outer peripheral surface of the carrier body 51, respectively.

The component storage tray 55 is a long and rectangular flat plate member, and the bottom surface is formed of a metal material. The component storage tray 55 is attached to two long sides of the outer peripheral surface of the carrier body 51 so that the longitudinal direction thereof runs along the long sides. Attachment holes 55b are formed at both ends of the component storage tray 55 in the longitudinal direction, respectively. The component storage tray 55 is attached to the carrier body 51 by fitting the attachment holes 55b with attachment pins 51b provided at the four corners of the outer peripheral surface of the carrier body 51. The component storage tray 55 is fixed to the carrier body 51 by the magnetic attraction force of the permanent magnets 53 provided on the two long sides of the outer peripheral surface of the carrier body 51.

Furthermore, a plurality of component storage pockets 55a are formed on the surface of the component storage tray 55 so as to be lined up in the longitudinal direction. As shown in FIGS. 6 and 7, each of the plurality of component storage pockets 55a accommodates a plurality of (in the illustrated example, three) inspection components P in a stacked state. This makes it possible to accommodate a larger number of inspection components P in a smaller space than in the case where only one inspection component P is accommodated in each component storage pocket 55a.

Furthermore, as shown in FIG. 7, the component storage tray 55 is attached to the outer circumference of the surface of the carrier body 51 so as to partially overlap the outer circumference of the inspection board S. The outer periphery of the test board S is an area where no test component P is placed, and by attaching the component storage tray 55 to the carrier body 51 so as to partially overlap the outer periphery of the test board S, the test board Even if S is relatively large and there is not enough space on the outer periphery of the surface of the carrier 50, a sufficient number of inspection parts P can be accommodated.

Next, details of the mounting accuracy inspection performed in each component mounter 10 using the carrier 50 will be described. FIG. 8 is a flowchart showing an example of a mounting accuracy inspection process executed by the control device 60 of each component mounter 10.

When the mounting accuracy inspection process is executed, the CPU 61 of the control device 60 first controls the substrate transport device 22 so that the carrier 50 containing the inspection substrate S and the inspection component P is carried in (S100). Subsequently, the CPU 61 controls the head moving device 30 so that the suction nozzle comes above the component storage pocket 55a (S110), and the inspection component P stored in the component storage pocket 55a is sucked by the suction nozzle. The head 40 is then controlled (S120). When the inspection component P is sucked into the suction nozzle, the CPU 61 controls the head moving device 30 so that the sucked inspection component P comes above the target mounting position of the inspection substrate S (S130), and The head 40 is controlled so that P is mounted at the target mounting position (S140).

Then, the CPU 61 determines whether or not there is an unmounted inspection component P (S150). If it is determined that there is an unmounted inspection component P, the CPU 61 returns to S110 and places the inspection component P into the component storage pocket. The process of S110 to S140 in which the test board S is taken out from the test board S and mounted on the next target mounting position is repeated.

On the other hand, if the CPU 61 determines that there is no unmounted inspection component P, the CPU 61 controls the head moving device 30 so that the mark camera 43 comes above the inspection substrate S, and images the inspection substrate S with the mark camera 43. (S160). Subsequently, the CPU 61 performs image processing on the obtained captured image (S170), and inspects the mounting accuracy by measuring the amount of positional deviation of the inspection component P with respect to the target mounting position of the inspection board S (S180). .

When the inspection of mounting accuracy is completed, the CPU 61 controls the head moving device 30 so that the suction nozzle is located above the inspection component P mounted on the inspection substrate S (S190), and the inspection component P is moved to the suction nozzle. The head 40 is controlled so that it is attracted (S200). When the inspection component P is sucked into the suction nozzle, the CPU 61 controls the head moving device 30 so that the sucked inspection component P is placed above an empty pocket among the plurality of component storage pockets 55a (S210); The head 40 is controlled so that the inspection component P is returned/collected to the component storage pocket 55a (S220).

Then, the CPU 61 determines whether or not there is an unrecovered inspection component P on the inspection board S (S230), and if it is determined that there is an unrecovered inspection component P, the CPU 61 returns to S190 and returns to S190. The processes of S190 to S220 in which the component P is taken out from the inspection board S and returned to/recovered in the component storage pocket 55a are repeated.

On the other hand, if the CPU 61 determines that there is no unrecovered inspection component P on the inspection substrate S, the CPU 61 controls the substrate transport device 22 so that the carrier 50 is carried out (S240), and ends this process. By sequentially executing the above-described mounting accuracy inspection process from the upstream side to the downstream side by each component mounter 10 included in the production line, it is possible to efficiently inspect the mounting accuracy of each component mounter 10.

Here, the correspondence between the main elements of the embodiment and the main elements of the invention described in the section of the disclosure of the invention will be explained. That is, the carrier 50 corresponds to a carrier, and the component storage pocket 55a corresponds to a component storage pocket. Further, the carrier body 51 corresponds to a carrier body, and the component storage tray 55 corresponds to a tray. Further, the component mounting machine 10 corresponds to a component mounting machine, the head 40 corresponds to a head, the board transfer device 22 corresponds to a transfer device, and the control device 60 corresponds to a control device.

The carrier 50 of this embodiment described above includes a component storage tray 55 fixed to the carrier body 51, which includes a component storage pocket 55a that can accommodate a plurality of inspection components P in a stacked manner. Therefore, compared to a case where only one inspection component P is accommodated in each component storage pocket 55a, more inspection components P can be accommodated in a smaller space.

Further, the component storage tray 55 is attached to the carrier body 51 so as to partially overlap the outer peripheral edge of the inspection board S. The outer periphery of the test board S is an area where no test component P is placed, and by attaching the component storage tray 55 to the carrier body 51 so as to partially overlap the outer periphery of the test board S, the test board Even if S is relatively large and there is not enough space on the outer periphery of the surface of the carrier 50, a sufficient number of inspection parts P can be accommodated.

Further, each component mounting machine 10 constituting the component mounting line of the component mounting system 1 of this embodiment carries in the carrier 50 from the upstream side in the board conveyance direction, takes out the inspection component P from the component storage pocket 55a, and inspects it. The test board S on which the test component P is mounted is imaged to test the mounting accuracy. When each component mounter 10 finishes testing the mounting accuracy, it takes out the component P for inspection from the substrate S for inspection, collects it in the component storage pocket 55a, and carries out the carrier 50 downstream in the board transport direction. Thereby, it is possible to efficiently inspect the mounting accuracy of all the component mounting machines constituting the component mounting line.

It goes without saying that the present invention is not limited to the embodiments described above, and can be implemented in various forms as long as they fall within the technical scope of the invention of the present disclosure.

For example, in the embodiment described above, the carrier 50 is constructed by attaching the component storage tray 55 in which the component storage pocket 55a is formed to the carrier body 51. However, the carrier 50 may be configured such that component storage pockets are formed directly on the outer circumference of the surface of the carrier body 51.

Further, in the embodiment described above, the test substrate S is held by the carrier 50. However, the test substrate S may be integrated with the carrier. That is, the inspection board S may include a component storage pocket that accommodates a plurality of inspection components P in an overlapping manner.

The present disclosure can be used in the manufacturing industry of component mounting machines and component mounting systems.

1 Component mounting system, 2 Printing machine, 3 Print inspection machine, 10 Component mounting machine, 11 Housing, 21 Component supply device, 22 Board transfer device, 23 Parts camera, 24 Nozzle station, 30 Head moving device, 31 X-axis guide Rail, 32 X-axis slider, 33 X-axis actuator, 34 X-axis position sensor, 35 Y-axis guide rail, 36 Y-axis slider, 37 Y-axis actuator, 38 Y-axis position sensor, 40 Head, 41 Z-axis actuator, 42 θ Axis actuator, 43 mark camera, 50 carrier, 51 carrier body, 51a recess, 51b mounting pin, 52 fastener, 53 permanent magnet, 55 parts storage tray, 55a parts storage pocket, 55b mounting hole, 60 control device, 61 CPU, 62 ROM, 63 HDD, 64 RAM, 65 input/output interface, 66 bus, 80 management device, 81 CPU, 82 ROM, 83 HDD, 84 RAM, 85 input/output interface, 86 bus, S inspection board, P inspection parts .

Claims (2)

A carrier that is used in a component mounting machine for mounting test components and inspecting the mounting accuracy of the mounted test components, and holding a test board on which the test components are mounted,
a carrier body that holds the inspection substrate on its upper surface;
a tray that is removably attached to the upper surface of the outer periphery of the carrier main body, and a component storage pocket that can accommodate a plurality of the inspection components in a stacked manner;
Equipped with
career. The carrier according to claim 1,
The tray is attached to the carrier body so as to partially overlap the outer peripheral edge of the test substrate.
career.

Images