JP7340732B2 - Component supply device, component mounting device, component supply method, and component mounting method - Google Patents

Description

The present invention involves pitch-feeding a base tape having an element row in which a plurality of elements are arranged at regular intervals, and punching out a certain area of the base tape at a punching position set on the conveyance path of the base tape. The present invention relates to a component supply device, a component mounting device, a component supply method, and a component mounting method for taking out components in which elements are mounted on a base material.

2. Description of the Related Art Conventionally, components such as TCP (Tape Carrier Package), for example, have been known as components mounted on terminal portions formed on the edges of substrates such as liquid crystal panel substrates and organic EL display panel substrates. Such components are supplied with elements such as semiconductor elements arranged at regular intervals on a film-like base tape, and set in a component supply device. The component feeding device in which the base tape is set uses a sprocket to feed the base tape in pitches, and at a punching position set on the conveyance path of the base tape, the base tape is stopped at a constant rate. By punching out a region, a component in which an element is mounted on a base material is taken out (for example, Patent Document 1 below).

In the component feeding device with the above configuration, when a new base tape is set, the base tape is fed in pitch feed, and the first element located at the head of a plurality of element rows (element row) on the base tape is fed. Detect the position of the element. Once the position of the leading element is detected, the timing at which the element is positioned at the punching position can be determined simply by counting the number of subsequent pitch feed operations. It is possible to supply normal parts with elements mounted in the correct positions on the material. For this reason, conventionally, a reference position is set at a position upstream in the transport direction of the base tape from the punching position, and an element detection unit is installed to detect the element located at the reference position. The position of the leading element is detected by using an element detection section to detect the element that is positioned at the reference position for the first time in the state of the tape.

JP2008-251636A

However, in recent years, the miniaturization of elements has become remarkable, and depending on the tension applied to the base tape, the element may stop at a position slightly deviated from the reference position (a position beyond the reference position or a position before the reference position). A situation may occur. Therefore, when the leading element is detected when the base tape is stopped after the pitch feed operation as described above, the leading element has substantially reached the reference position (the leading element is located near the reference position). However, the leading element cannot be detected, and it becomes difficult to determine the timing at which the element is positioned at the punching position by counting the number of pitch feed operations, which may lead to component feeding errors. There was a problem.

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a component supply device, a component mounting device, a component supply method, and a component mounting method that can accurately determine the timing at which an element is positioned at a punching position and reduce the occurrence of component supply errors. With the goal.

The component supply device of the present invention includes a conveyance section that intermittently conveys a base tape having an element row in which a plurality of elements are arranged at regular intervals, and a conveyance path of the base tape conveyed by the conveyance section. A punching portion punches out a certain area of the base tape at a punching position set to , and a state in which the element is located at a reference position set upstream of the punching position in the conveying direction of the base tape is detected. an element detection unit that detects the element; a reference pitch feed operation specifying unit that specifies, when the element detection unit first detects the element, a conveyance operation that includes the detected timing as a reference pitch feed operation; and the reference pitch feed operation. At the end of the reference pitch feeding operation specified by the specifying unit, the element detecting unit detects the element or not, and determines whether the leading element located at the head of the element array is located at the reference position or the element detecting unit detects the element. and a cueing position detection section that detects a stop position of the base tape when located near the reference position as a cueing position of the element array.

The component mounting device of the present invention mounts the components supplied by the component supply device of the present invention on a board.

The component supply method of the present invention includes a transport unit that intermittently transports a base tape having an element row in which a plurality of elements are arranged at regular intervals, and a transport path of the base tape transported by the transport unit. A punching portion punches out a certain area of the base tape at a punching position set to , and a state in which the element is located at a reference position set upstream of the punching position in the conveying direction of the base tape is detected. A component supplying method using a component supplying device comprising an element detection unit that detects the element, wherein when the element detection unit first detects the element, a transport operation including the detected timing is specified as a reference pitch feeding operation. step of specifying a reference pitch feed operation, and observing whether or not the element detection section detects the element at the end of the reference pitch feed operation specified in the step of specifying the reference pitch feed operation, and determining whether or not the element is detected by the element detection section, and positioning the element at the head of the element row. and detecting a stop position of the base tape when the leading element is located at or near the reference position as a cue position of the element array.

The component mounting method of the present invention mounts the components supplied by the component supply method of the present invention on a board.

According to the present invention, the timing at which the element is positioned at the punching position can be accurately grasped, and the occurrence of component feeding errors can be reduced.

A perspective view of a main part of a component mounting device equipped with a component supply device according to an embodiment of the present invention A side view of a main part of a component mounting device equipped with a component supply device according to an embodiment of the present invention A perspective view showing a board on which components are mounted by a component mounting apparatus according to an embodiment of the present invention, together with the components. A perspective view of a base tape that is pitch-fed by a component supply device included in a component mounting device according to an embodiment of the present invention. A block diagram showing a control system of a component mounting apparatus according to an embodiment of the present invention A configuration diagram of a parts supply device according to an embodiment of the present invention A diagram showing a change in the position of the leading element with respect to the reference position at the start and end of the reference pitch feeding operation performed by the component supply device according to an embodiment of the present invention (first case) A diagram showing a change in the position of the leading element with respect to the reference position at the start and end of the reference pitch feeding operation performed by the component supply device in an embodiment of the present invention (in the case of the second case) A diagram showing the leading element and the change in position (in the third case) with respect to the reference position at the start and end of the reference pitch feeding operation performed by the component supply device in an embodiment of the present invention. A diagram showing a change in the position of the leading element with respect to the reference position at the start and end of the reference pitch feeding operation performed by the component supply device in an embodiment of the present invention (in the case of the fourth case) Flowchart showing the flow of detecting the cue position of an element array by the component supply device in an embodiment of the present invention (a) (b) (c) Diagrams illustrating an example (second case) of the flow of detecting the cue position of an element array by the component supply device according to an embodiment of the present invention (a) (b) (c) (d) Diagrams illustrating an example (third case) of the flow of detecting the cue position of an element array by the component supply device according to an embodiment of the present invention (a) (b) (c) (d) Diagrams illustrating an example (fourth case) of the flow of cueing positions of element arrays by the component supply device according to an embodiment of the present invention

Embodiments of the present invention will be described below with reference to the drawings. 1 and 2 show a component mounting apparatus 1 in an embodiment of the present invention. The component mounting apparatus 1 is an apparatus that mounts a component 3 such as a TCP onto a terminal portion 2a (see also FIG. 3) formed at the edge of a substrate 2 such as a liquid crystal panel substrate or an organic EL display panel substrate. In the present embodiment, for convenience of explanation, the left-right direction as seen from the worker OP will be referred to as the X-axis direction, and the front-back direction as seen from the worker OP will be referred to as the Y-axis direction. Further, the vertical direction is referred to as the Z-axis direction.

As shown in FIG. 3, the component 3 has a configuration in which an element 4 such as a semiconductor element is arranged on a film-like base material 5. As shown in FIG. 4, the component 3 is supplied with a plurality of elements 4 arranged at regular intervals on a tape-shaped base material 5 (hereinafter referred to as base material tape 5T). That is, the component 3 is supplied as a base material tape 5T having an element row 4L in which a plurality of elements 4 are lined up, and a fixed area 5R of the base material tape 5T is sequentially punched out by a component supply device 16, which will be described later, to form the base material 5. A component 3 having an element 4 mounted thereon is taken out.

As shown in FIG. 3, the board 2 has terminal portions 2a on each of two orthogonal sides (long side and short side), with the terminal portion 2a provided on the long side and the terminal provided on the short side. Components 3 are mounted on each portion 2a. An adhesive tape such as ACF (Anisotropic Conductive Film) is pasted in advance to each terminal portion 2a provided on the substrate 2, and the component 3 is mounted on the terminal portion 2a via the pasted adhesive tape.

1 and 2, the component mounting apparatus 1 includes a board loading section 11, a board unloading section 12, a board holding stage 13, a stage moving mechanism 14, a backup section 15, a component supply device 16, a mounting head 17, and a head moving mechanism 18. It is equipped with The component mounting apparatus 1 further includes a control device 19 that controls the operation of each part of the component mounting apparatus 1 (see also FIG. 5).

In FIG. 1, a substrate carry-in section 11 and a substrate carry-out section 12 are located opposite to each other in the X-axis direction. The board loading section 11 loads the board 2 supplied from the upstream side of the component mounting apparatus 1 in the X-axis direction. The substrate holding stage 13 is equipped with a suction mechanism (not shown) that suctions the substrate 2 on its upper surface. The stage moving mechanism 14 is constituted by an orthogonal coordinate moving mechanism, and moves the substrate holding stage 13 in the X-axis direction, the Y-axis direction, the Z-axis direction, and the θ direction (rotation direction around the Z-axis direction). The substrate holding stage 13 is moved in the Y-axis direction by the stage moving mechanism 14, and is positioned on the side of the substrate carrying-in section 11, thereby receiving the substrate 2 carried in by the substrate carrying-in section 11, and attracts and holds the substrate 2.

In FIGS. 1 and 2, the backup section 15 is located in front of the substrate holding stage 13 (on the side of the operator OP). The backup part 15 has a suction port on its upper surface. The backup portion 15 suctions and supports the lower surface of the edge portion (the portion where the terminal portion 2a is provided) of the substrate 2 held by the substrate holding stage 13 from below.

In FIGS. 1 and 2, the component supply device 16 supplies the component 3 to the component supply port 16K. The components 3 mounted on the long side terminal section 2a of the board 2 and the components 3 mounted on the short side terminal section 2a are of different types, and so that these two types of components 3 can be supplied, the components 3 are The mounting apparatus 1 includes two component supply devices 16. The configuration of the component supply device 16 and the operation of supplying the components 3 will be described later. Note that the number of component supply devices 16 provided in the component mounting apparatus 1 does not necessarily have to be two, and may be one, or three or more.

In FIG. 2, the mounting head 17 includes a suction nozzle 17a extending downward so as to be movable in the Z-axis direction and rotatable around the Z-axis. The head moving mechanism 18 moves the mounting head 17 in the X-axis direction and the Y-axis direction. The mounting head 17 is moved by the head moving mechanism 18 to pick up the component 3 supplied by the component supply device 16, and mounts the picked up component 3 onto the terminal portion 2a of the board 2 supported by the backup portion 15.

In mounting the component 3, first, the long side of the board 2 is supported by the backup part 15, and the mounting head 17 mounts the component 3 on the terminal part 2a on the long side. After the components 3 are mounted on all terminal portions 2a on the long side, the stage moving mechanism 14 rotates the substrate holding stage 13 by 90 degrees around the Z axis. When the short side of the board 2 is thereby supported by the backup part 15, the mounting head 17 mounts the component 3 on the terminal part 2a on the short side. Once the components 3 are mounted on all the terminal portions 2a on the short side, the work of mounting the components 3 on the board 2 is completed.

When the mounting work of the component 3 on the board 2 is completed, the stage moving mechanism 14 moves the board holding stage 13 backward and positions it on the side of the board carrying out part 12. The board unloading unit 12 receives the board 2 on which the component 3 has been mounted from the board holding stage 13, and transports the board 2 to the downstream side of the component mounting apparatus 1 in the X-axis direction.

Next, the configuration of the component supply device 16 and the operation of supplying the components 3 will be explained. In FIG. 6, the component supply device 16 includes a supply reel 21, a transport section 22, a punching section 23, an element detection section 24, and a base tape collection section 25. A base tape 5T is wound around the supply reel 21, and the transport unit 22 intermittently moves the base tape 5T sent out from the supply reel 21 along a predetermined transport path 5L.

In FIG. 6, the punching unit 23 punches out a certain region 5R (FIG. 4) of the base tape 5T at a punching position P1 set on the conveyance path 5L of the base tape 5T conveyed by the conveyance unit 22, and Parts 3 including 4 are taken out individually. When taking out the component 3 including the elements 4, the conveyance section 22 conveys the base tape 5T by pitch-feeding the elements 4 at intervals (multiple pitches). The element detection unit 24 detects a state in which the element 4 is located at a reference position P2 set upstream of the punching position P1 in the conveying direction of the base tape 5T. The base tape collection unit 25 collects the used base tape 5T that has been punched out by the punching unit 23 at the punching position P1. In addition, pitch feeding here represents conveying with the space|interval of the hole formed in the base tape 5T being one pitch.

The punching position P1 and the reference position P2 are separated by a distance that is an integral multiple of the distance between the pitches of the base tape 5T, and are both set at positions where the element 4 stops due to the pitch feed operation of the base tape 5T. ing. Therefore, the element 4 located at the reference position P2 at a certain point of time reaches the punching position P1 when the base tape 5T is pitch-fed a plurality of times thereafter.

In FIG. 6, the element detection section 24 includes a light projector 24a that projects detection light onto the reference position P2, and a light receiver 24b that receives the detection light projected by the light projector 24a. The light emitter 24a and the light receiver 24b are provided at positions vertically sandwiching the base tape 5T traveling on the transport path 5L, and detect the state in which the element 4 is located at the reference position P2. The element detection unit 24 constantly detects the element 4, and when it detects the element 4 located at the reference position P2, it outputs an element detection signal to the control device 19 while detecting the element 4 (Fig. 5 ).

The spacing between the elements 4 on the base tape 5T is set to such an interval that the sprocket 31 passes a fixed point on the conveyance path 5L every time the sprocket 31 performs a pitch feeding operation a predetermined number of times (for example, three times). Therefore, when the sprocket 31 performs the pitch feeding operation a predetermined number of times, new elements 4 successively reach the reference position P2 and the punching position P1.

In FIG. 6 , the conveying section 22 includes a sprocket 31 , a plurality of drive rollers 32 , a plurality of guide rollers 33 , a tension roller 34 , and a press roller 35 . The sprocket 31 and the plurality of drive rollers 32 are driven in synchronization and convey the base tape 5T. The transport unit 22 transports the base tape 5T with different pitch feeding operations depending on the transport status of the base tape 5T. The plurality of guide rollers 33 guide the base tape 5T so that the base tape 5T, which is conveyed by the sprocket 31 and the plurality of drive rollers 32, advances along a predetermined conveyance path 5L. The tension roller 34 is allowed to move within a certain range, and applies appropriate tension to the base tape 5T traveling along the conveyance path 5L. The pressing roller 35 holds the base tape 5T between it and the drive roller 32 located at the most downstream side in the traveling direction of the base tape 5T, and sends the used base tape 5T to the base tape collecting section 25. invite.

In FIG. 6, the punching unit 23 moves the base material at the punching position P1 set on the conveyance path 5L in the Y-axis direction (direction from the front side to the back side as seen from the operator OP). A push-up die 41 that pushes up the tape 5T from below, and a receiving die that is placed opposite the push-up die 41 and above the base tape 5T, and against which the push-up die 41 is pressed. 42.

The push-up die 41 pushes up a certain region 5R of the base tape 5T and presses it against the receiving die 42 with the element 4 located at the punching position P1. As a result, the component 3 with the element 4 mounted on the base material 5 is punched out from the base tape 5T and taken out from the base tape 5T. The component 3 taken out from the base tape 5T is sucked by the suction nozzle 17a of the mounting head 17 through an opening (not shown) provided in the receiving mold 42 and a component supply port 16K of the component supply device 16. and will be picked up.

As described above, the element 4 located at the reference position P2 at a certain point in time reaches the punching position P1 when the base tape 5T is pitch fed a plurality of times. Therefore, among the plurality of elements 4 arranged on the base tape 5T, the element 4 located at the head of the element row 4L of the base tape 5T (hereinafter referred to as "head element 4S") is detected and placed at the reference position P2. Once the position of the element 4 is determined, the timing at which the element 4 is positioned at the punching position P1 can be determined simply by counting the number of pitch feed operations. Therefore, when a new base tape 5T is set in the component supply device 16, the component supply device 16 detects the position of the leading element 4S while feeding the base tape 5T in a pitched manner.

Detection of the position of the leading element 4S will be explained. In FIG. 5, the control device 19 includes a signal monitoring section 19a, a reference pitch feed operation specifying section 19b, and a cueing position detecting section 19c. When the element detection unit 24 detects the element 4, the signal monitoring unit 19a continuously maintains the signal presence/absence flag from the time when the element detection signal outputted by the element detection unit 24 is detected. Specifically, when the element detection unit 24 outputs the element detection signal for the first time, the signal presence/absence flag is switched from "absent" to "present" and maintained.

The reference pitch feed operation specifying unit 19b detects that the element detecting unit 24 first detects the element 4 when the signal presence/absence flag of the signal monitoring unit 19a switches from “absent” to “present” (that is, the element detecting unit 24 When it is detected that the leading element 4S has been detected, the conveying operation including that timing is specified as the reference pitch feeding operation. When the reference pitch feed operation is specified by the reference pitch feed operation specifying section 19b, the cue position detection section 19c determines whether or not the element detection section 24 detects the element 4 at the end of the specified reference pitch feed operation. The stop position of the base tape 5T when the leading element 4S is located at or near the reference position P2 is detected as the cueing position of the element row 4L.

7, FIG. 8, FIG. 9, and FIG. 10 show four cases (first case, second case, third case, and fourth case) in which the leading element 4S is detected by the element detection unit 24. , shows changes in the position of the leading element with respect to the reference position at the start and end of the reference pitch feed operation. 7 corresponds to the first case, FIG. 8 corresponds to the second case, FIG. 9 corresponds to the third case, and FIG. 10 corresponds to the fourth case.

In the first case in FIG. 7, the leading element 4S (shaded element 4 in the figure) is located exactly at the reference position P2 at the stop position of the base tape 5T at the end of the reference pitch feeding operation. It is a case. Therefore, in the first case, the stop position of the base tape 5T at the end of the reference pitch feeding operation becomes the cue position of the element row 4L.

In the second case in FIG. 8, after the leading element 4S is located at the reference position P2 immediately before the end of the reference pitch feeding operation, the base tape 5T is pitch-adjusted depending on the tension applied to the base tape 5T. This is a case in which the leading element 4S is not located at the reference position P2 at the stop position of the base tape 5T at the end of the reference pitch feeding operation because it has been pulled back in the opposite direction. In the second case, the leading element 4S is not detected by the element detection unit 24 at the end of the reference pitch feeding operation, but is located near the reference position P2, so that the base tape 5T at the end of the reference pitch feeding operation The stop position becomes the cue position of the element row 4L.

In the third case in FIG. 9, since the leading element 4S passes the reference position P2 in the pitch feeding direction immediately before the end of the reference pitch feeding operation, at the stop position of the base tape 5T at the end of the reference pitch feeding operation, This is a case where the leading element 4S is not located at the reference position P2. In the third case, the leading element 4S is not detected by the element detection unit 24 at the end of the reference pitch feeding operation, but is located near the reference position P2, so that the base tape 5T at the end of the reference pitch feeding operation The stop position becomes the cue position of the element row 4L.

In the fourth case in FIG. 10, since the leading element 4S passes the reference position P2 in the pitch feeding direction immediately after the start of the reference pitch feeding operation, at the stop position of the base tape 5T at the end of the reference pitch feeding operation, This is a case where the leading element 4S is not located at the reference position P2. In the fourth case, the leading element 4S is located at a position approximately one pitch away from the reference position P2 in the pitch feeding direction at the end of the reference pitch feeding operation. Therefore, in the fourth case, the time when the leading element 4S is located near the reference position P2 is the end of the pitch feeding operation immediately before the reference pitch feeding operation. Therefore, in the fourth case, the stop position of the base tape 5T at the end of the pitch feed operation immediately before the reference pitch feed operation becomes the cue position of the element array 4L.

Next, a procedure in which the control device 19 identifies the above four cases and detects the cue position of the element array 4L will be described using the flowchart of FIG. 11. When a new base tape 5T is set in the component supply device 16 by the operator OP, the control device 19 first specifies a reference pitch feed operation while feeding the base tape 5T by pitch feed ( (Step ST1 to Step ST3, reference pitch feed operation identification step).

In specifying the reference pitch feeding operation, the sprocket 31 is pitch-driven to feed the base tape 5T one pitch at a time (step ST1), and when one pitch feeding is completed, the signal presence/absence flag of the signal monitoring unit 19a is set. It is determined whether or not it has been switched from "absent" to "present" (step ST2). If the signal presence/absence flag of the signal monitoring section 19a remains "absent", the process returns to step ST1 and the next pitch feed is performed, and the signal presence/absence flag of the signal monitoring section 19a changes from "absent" to "present". If so, the next pitch feed is not performed, and the pitch feed operation in which the signal presence/absence flag of the signal monitoring unit 19a is switched to "present" is specified as the reference pitch feed operation (step ST3).

After specifying the reference pitch feed operation, the control device 19 detects the cue position of the element array 4L (cue position detection step of steps ST4 to ST12). The cue position detection step is performed by the cue position detection unit 19c observing whether the element detection unit 24 detects the element 4 at the end of the reference pitch feed operation specified in the reference pitch feed operation identification step. . Specifically, it is observed whether the element detection section 24 detects the element 4 at the end of the reference pitch feeding operation (step ST4), and if the element detection section 24 detects the element 4, the reference pitch feeding operation is performed. It is determined that the leading element 4S was located at the reference position P2 at the end of the operation (that is, it is determined that the first case in FIG. 7 applies). Then, the stop position of the base tape 5T at the end of the reference pitch feeding operation is set as the cue position of the element row 4L (step ST5). On the other hand, in step ST4, if the element detection section 24 does not detect the element 4 at the end of the reference pitch feeding operation, one of the second case, the third case, and the fourth case is determined. So, let's identify this next.

In step ST4, if the element detection section 24 does not detect the element 4 at the end of the reference pitch feeding operation, a return operation is performed to return the base tape 5T by one pitch from the position at the end of the reference pitch feeding operation. (Step ST6). Then, it is observed whether or not the element detection section 24 detects the element 4 until the base tape 5T returns by one pitch due to the return operation (step ST7). As a result, when the element detection unit 24 does not detect the element 4 (FIG. 12(a) → FIG. 12(b)), the leading element 4S is located near the reference position P2 at the end of the reference pitch feeding operation. (In other words, it is determined that the second case in FIG. 8 applies). Then, the stop position of the base tape 5T at the end of the reference pitch feeding operation is set as the cue position of the element row 4L (step ST5). On the other hand, if the element detecting section 24 detects the element 4 in step ST7, this means that it is either the third case or the fourth case, which is then identified.

When the element detection unit 24 detects the element 4 in step ST7, a continuous feeding operation is performed in which the base tape 5T, which has been returned by one pitch due to the return operation, is continuously fed by minute distances in the pitch feeding direction (step ST8). Then, by the continuous feeding operation, the timing at which the element 4 (in detail, the leading edge of the element 4 in the pitch feeding direction) is detected by the element detection unit 24 is captured after the base tape 5T starts to be continuously fed in the pitch feeding direction. (Step ST9). When the element 4 is detected by the element detection section 24, the element 4 is detected by the element detection section 24 from when the base tape 5T starts to be continuously fed in the pitch feeding direction by the continuous feeding operation until the element 4 is detected by the element detection section 24. The amount of movement is calculated (step ST10).

After calculating the movement amount, the calculated movement amount is compared with a predetermined reference amount, and it is determined whether the movement amount exceeds the reference amount (step ST11). The reference amount is, for example, a distance equivalent to a half pitch (half the amount of movement for one pitch). In this judgment, if the movement amount exceeds the reference amount (FIG. 13(a) → FIG. 13(b) → FIG. 13(c)), the leading element 4S is moved to the reference position P2 at the end of the reference pitch feeding operation. (that is, it is determined that the third case in FIG. 9 applies). Then, the stop position of the base tape 5T at the end of the reference pitch feeding operation is set as the cue position of the element row 4L (step ST5).

On the other hand, in step ST11, if the calculated movement amount does not exceed (below) the reference amount (FIG. 14(a) → FIG. 14(b) → FIG. 14(c)), the reference pitch feed operation is performed. It is determined that the leading element 4S was located near the reference position P2 at the end of the previous pitch feed (that is, it is determined that the fourth case in FIG. 10 applies). Then, the stop position of the base tape 5T at the end of the pitch feed operation immediately before the reference pitch feed operation is set as the cue position of the element array 4L (step ST12).

After the control device 19 detects the position of the leading element 4S in the cue position detection step according to the above procedure, it executes a position adjustment step (step ST13). The position adjustment process is a process of positioning the base tape 5T at the cue position of the element array 4L detected in the cue position detection process.

In the first case, the stop position of the base tape 5T at the end of the reference pitch feeding operation is taken as the cue position of the element row 4L, and when the cue position is detected, the base tape 5T is exactly at the cue position. It is located in Therefore, there is no need to move the base tape 5T in the position adjustment process.

In the second case, the stop position of the base tape 5T at the end of the reference pitch feeding operation is taken as the cue position of the element row 4L, and when the cue position is detected, the base tape 5T is moved from the cue position. It is located at a position moved back by one pitch (FIG. 12(b)). Therefore, in the position adjustment process, the base tape 5T can be positioned at the cue position by advancing the base tape 5T by one pitch (FIG. 12(b)→FIG. 12(c)).

In the third case, the stop position of the base tape 5T at the end of the reference pitch feeding operation is taken as the cue position of the element row 4L, and when the cue position is detected, the base tape 5T is moved to the cue position ( After being moved back by one pitch from FIG. 13(a) (FIG. 13(b)), it is located at a position further advanced in the pitch feeding direction by the amount of continuous feeding (FIG. 13(c)). Therefore, in the position adjustment process, the base tape 5T is positioned at the cue position by advancing the base tape 5T in the pitch feeding direction by (the amount of movement for one pitch) - (the amount of movement continuously fed). (Fig. 13(c) → Fig. 13(d)).

In the fourth case, the stop position of the base tape 5T at the end of the pitch feed operation immediately before the reference pitch feed operation is taken as the cue position of the element array 4L, and the base tape The tape 5T was moved back by one pitch from a position one pitch ahead of the cue position (FIG. 14(a)) (FIG. 14(b)), and then advanced in the pitch feeding direction by the amount of continuous feeding. (FIG. 14(c)). Therefore, in the position adjustment process, the leading element 4S can be positioned at the reference position P2 by returning (retreating) the base tape 5T by the continuously fed movement amount (FIG. 14(c)→FIG. 14( d)).

Next, a procedure for supplying the component 3 by the component supply device 16 (component supply method) will be explained. In supplying the component 3 by the component supply device 16, first, the above-mentioned reference pitch feed operation specifying step (step ST1 to step ST3), cue position detection step (step ST4 to step ST12), and position adjustment step (step ST13) are carried out. Then, the base tape 5T is positioned at the cue position of the element row 4L. When the base tape 5T is located at the cue position of the element row 4L, the base tape 5T is pitch-fed, the punching section 23 punches out the base tape 5T at the punching position P1, and the component 3 is inserted into the component supply port. Supply to 16K. The timing of punching out the base tape 5T by the punching section 23 can be controlled by counting the number of pitch feed operations of the base tape 5T, and the base tape 5T is punched out with the element 4 accurately positioned at the punching position P1. be able to. Therefore, it is possible to always supply a normal component 3 in which the element 4 is mounted on the base material 5 at the correct position.

As explained above, the component supply device 16 in this embodiment (further, the component mounting device 1 that mounts the component 3 supplied by the component supply device 16 on the board 2, the component supply method by the component supply device 16, and this component supply In the component mounting method of mounting the component 3 supplied by the method on the board 2, when the element detection unit 24 first detects the element 4, the transport operation including the detected timing is specified as the reference pitch feeding operation. Then, it is observed whether the element detection section 24 detects the element 4 at the end of the specified reference pitch feeding operation, and whether the first element 4S located at the head of the element row 4L is located at the reference position P2 or not at the reference position The stop position of the base tape 5T when located near P2 is detected as the cue position of the element array 4L. Therefore, it is possible to detect not only when the leading element 4S stops at the reference position P2 but also when it stops near the reference position P2, and it is possible to reliably locate the beginning of the element array 4L. Therefore, according to the component supply device 1 (component supply method) in this embodiment, the timing at which the element 4 is positioned at the punching position P1 can be accurately grasped, and the occurrence of supply errors of the component 3 can be reduced.

Although the embodiments of the present invention have been described so far, the present invention is not limited to the above-described embodiments, and various modifications and the like are possible. For example, in the above-described embodiment, the timing at which the leading edge of the element 4 in the pitch feeding direction reaches the reference position P2 is captured in steps ST8 and ST9. It is also possible to capture the timing when the edge reaches the reference position P2, and then capture the timing when the middle part of the element 4 reaches the reference position P2. In this case, when the pitch feed dimension of the element 4 is relatively large, accurate identification (discrimination between the third case and the fourth case) can be performed. Further, the form (configuration of the transport section 22) in which the component supply device 16 transports the base tape 5T is arbitrary, and is not limited to that shown in the above embodiment.

Provided are a component supply device, a component mounting device, a component supply method, and a component mounting method that can accurately grasp the timing at which an element is positioned at a punching position and can reduce the occurrence of component supply errors.

1 Component mounting device 2 Board 3 Component 4 Element 4L Element row 5T Base tape 5R Fixed area 16 Component supply device 19b Reference pitch feed operation specifying section 19c Cue position detection section 22 Conveyance section 23 Punching section 24 Element detection section

Claims (8)

a conveyance unit that conveys a base tape having an element row in which a plurality of elements are arranged at regular intervals;
a punching unit that punches out a certain area of the base tape at a punching position set on a conveyance path of the base tape conveyed by the conveyance unit;
an element detection unit that detects a state in which the element is located at a reference position set upstream of the punching position in the conveyance direction of the base tape;
a reference pitch feed operation specifying unit that, when the element detection unit first detects the element, specifies a conveyance operation that includes the detected timing as a reference pitch feed operation;
Observe whether or not the element detection unit detects the element at the end of the reference pitch feed operation specified by the reference pitch feed operation identification unit, and determine whether the first element located at the head of the element row is at the reference position. a cueing position detection unit that detects a stop position of the base tape when located at or near the reference position as a cueing position of the element array ,
The cue position detection unit detects that the leading element is located at the reference position when the reference pitch feed operation ends, when the element detection unit detects the element at the end of the reference pitch feed operation. determining and setting the stop position of the base tape at the end of the reference pitch feeding operation as the cue position of the element array;
If the element detecting section does not detect the element at the end of the reference pitch feeding operation, a return operation is performed to return the base tape by one pitch from the position at the end of the reference pitch feeding operation, and the element is detected. If the detection unit does not detect the element, it is determined that the leading element was located near the reference position at the end of the reference pitch feeding operation, and the starting element is determined to be in the vicinity of the reference position at the end of the reference pitch feeding operation. A component supply device in which a stop position of a material tape is a cue position of the element array . If the element detection unit detects the element before the base tape returns by one pitch due to the return operation, the cue position detection unit detects the element after the base tape returns by one pitch due to the return operation. A continuous feeding operation is performed to continuously feed the material tape in the pitch feeding direction, and from the time when the base material tape starts to be continuously fed in the pitch feeding direction due to the continuous feeding operation until the element is detected by the element detection section. If the amount of movement of the element exceeds a predetermined reference amount, it is determined that the leading element was located near the reference position at the end of the reference pitch feeding operation, and the reference pitch feeding is performed. The component supply device according to claim 1 , wherein the stop position of the base tape at the end of the operation is the cue position of the element array. The cueing position detection unit is configured to detect, when the moving amount is less than the reference amount, that the leading element is located near the reference position at the end of the pitch feeding operation immediately before the reference pitch feeding operation. 3. The component supply device according to claim 2, wherein the part supplying device determines that the base tape has stopped at the end of the pitch feeding operation immediately before the reference pitch feeding operation and sets the stop position of the base tape at the end of the pitch feeding operation immediately before the reference pitch feeding operation as the cueing position of the element array. A component mounting device for mounting components supplied by the component supply device according to any one of claims 1 to 3 on a board. a conveyance unit that conveys a base tape having an element row in which a plurality of elements are arranged at regular intervals; and a conveyance unit that conveys a base tape having an element row in which a plurality of elements are arranged at regular intervals; A component supply device comprising: a punching unit for punching out a certain area of the base tape; and an element detection unit for detecting a state in which the element is located at a reference position set upstream of the punching position in the conveyance direction of the base tape. A parts supply method according to
a reference pitch feeding operation specifying step of specifying, when the element detection unit first detects the element, a conveying operation including the detected timing as a reference pitch feeding operation;
Observe whether or not the element detection section detects the element at the end of the reference pitch feed operation specified in the reference pitch feed operation specifying step, and determine whether the first element located at the head of the element row is at the reference position. a cue position detection step of detecting a stop position of the base tape when the base tape is located at or near the reference position as a cue position of the element array ;
In the cue position detection step, if the element detection unit detects the element at the end of the reference pitch feed operation, it is determined that the leading element was located at the reference position at the end of the reference pitch feed operation. determining and setting the stop position of the base tape at the end of the reference pitch feeding operation as the cue position of the element array;
If the element detecting section does not detect the element at the end of the reference pitch feeding operation, a return operation is performed to return the base tape by one pitch from the position at the end of the reference pitch feeding operation, and the element is detected. If the detection unit does not detect the element, it is determined that the leading element was located near the reference position at the end of the reference pitch feeding operation, and the starting element is determined to be in the vicinity of the reference position at the end of the reference pitch feeding operation. A component supply method in which a stop position of a material tape is a cue position of the element array . In the cueing position detection step, if the element detection unit detects the element before the base tape returns by one pitch due to the return operation, the base tape returns by one pitch due to the return operation. A continuous feeding operation is performed to continuously feed the material tape in the pitch feeding direction, and from the time when the base material tape starts to be continuously fed in the pitch feeding direction due to the continuous feeding operation until the element is detected by the element detection section. If the amount of movement of the element exceeds a predetermined reference amount, it is determined that the leading element was located near the reference position at the end of the reference pitch feeding operation, and the reference pitch feeding is performed. 6. The component supply method according to claim 5 , wherein the stop position of the base tape at the end of the operation is the cue position of the element array. In the cueing position detection step, if the movement amount is less than the reference amount, the leading element is located near the reference position at the end of the pitch feeding operation immediately before the reference pitch feeding operation. 7. The component supply method according to claim 6 , wherein the stop position of the base tape at the end of the pitch feed operation immediately before the reference pitch feed operation is determined as the cue position of the element array. A component mounting method for mounting components supplied by the component supply method according to any one of claims 5 to 7 on a board.

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