JP7197176B2 - 透明材料加工方法 - Google Patents
透明材料加工方法 Download PDFInfo
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- JP7197176B2 JP7197176B2 JP2019563963A JP2019563963A JP7197176B2 JP 7197176 B2 JP7197176 B2 JP 7197176B2 JP 2019563963 A JP2019563963 A JP 2019563963A JP 2019563963 A JP2019563963 A JP 2019563963A JP 7197176 B2 JP7197176 B2 JP 7197176B2
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- laser beam
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- 239000012780 transparent material Substances 0.000 title claims description 163
- 238000003672 processing method Methods 0.000 title claims description 29
- 239000006096 absorbing agent Substances 0.000 claims description 50
- 238000000034 method Methods 0.000 claims description 32
- 239000002184 metal Substances 0.000 claims description 23
- 229910052751 metal Inorganic materials 0.000 claims description 23
- 238000007747 plating Methods 0.000 claims description 12
- 230000001678 irradiating effect Effects 0.000 claims description 9
- 239000000126 substance Substances 0.000 claims description 8
- 239000007788 liquid Substances 0.000 claims description 7
- 239000007787 solid Substances 0.000 claims description 5
- 230000031070 response to heat Effects 0.000 claims description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 105
- 238000001723 curing Methods 0.000 description 17
- 239000000463 material Substances 0.000 description 14
- 239000004205 dimethyl polysiloxane Substances 0.000 description 9
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 9
- 239000011521 glass Substances 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- 230000003287 optical effect Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 238000000206 photolithography Methods 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- 239000010408 film Substances 0.000 description 3
- 238000001000 micrograph Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000010419 fine particle Substances 0.000 description 2
- 238000001459 lithography Methods 0.000 description 2
- 238000004506 ultrasonic cleaning Methods 0.000 description 2
- 238000000018 DNA microarray Methods 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- JEGUKCSWCFPDGT-UHFFFAOYSA-N h2o hydrate Chemical compound O.O JEGUKCSWCFPDGT-UHFFFAOYSA-N 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 239000011859 microparticle Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- -1 polydimethylsiloxane Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229920006305 unsaturated polyester Polymers 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/57—Working by transmitting the laser beam through or within the workpiece the laser beam entering a face of the workpiece from which it is transmitted through the workpiece material to work on a different workpiece face, e.g. for effecting removal, fusion splicing, modifying or reforming
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/55—Working by transmitting the laser beam through or within the workpiece for creating voids inside the workpiece, e.g. for forming flow passages or flow patterns
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
- B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00023—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems without movable or flexible elements
- B81C1/00055—Grooves
- B81C1/00071—Channels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C99/00—Subject matter not provided for in other groups of this subclass
- B81C99/0005—Apparatus specially adapted for the manufacture or treatment of microstructural devices or systems, or methods for manufacturing the same
- B81C99/0025—Apparatus specially adapted for the manufacture or treatment of microstructural devices or systems not provided for in B81C99/001 - B81C99/002
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/30—Organic material
- B23K2103/42—Plastics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
- B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
- B29C2035/0838—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using laser
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2101/00—Use of unspecified macromolecular compounds as moulding material
- B29K2101/10—Thermosetting resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y10/00—Processes of additive manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2201/00—Manufacture or treatment of microstructural devices or systems
- B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
- B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
- B81C2201/0128—Processes for removing material
- B81C2201/0143—Focussed beam, i.e. laser, ion or e-beam
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0037—Production of three-dimensional images
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
- G03F7/2053—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a laser
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Thermal Sciences (AREA)
- Oral & Maxillofacial Surgery (AREA)
- Toxicology (AREA)
- Electromagnetism (AREA)
- Analytical Chemistry (AREA)
- Laser Beam Processing (AREA)
Description
Claims (6)
- 熱に応じて硬化する透明材料を加工する透明材料加工方法であって、
硬化前の透明材料を配置する配置工程と、
前記配置工程において配置された前記硬化前の透明材料にレーザー光を照射して、当該硬化前の透明材料にキャビテーションバブルを発生させるレーザー光照射工程と、
前記レーザー光照射工程においてキャビテーションバブルが発生した硬化前の透明材料に対して硬化処理を行う硬化処理工程と、
を含む透明材料加工方法。 - 前記配置工程において、前記硬化前の透明材料をレーザー光吸収体に接触させて配置し、
前記レーザー光照射工程において、前記配置工程において配置されたレーザー光吸収体に対して、前記硬化前の透明材料を介してレーザー光を照射して、当該硬化前の透明材料にキャビテーションバブルを発生させる、請求項1に記載の透明材料加工方法。 - 前記レーザー光吸収体は、金属であり、
前記硬化処理工程において硬化処理が行われた透明材料の、前記キャビテーションバブルの発生の際に削り取られたレーザー光吸収体が付着した部分に対してメッキ処理を行うメッキ処理工程を更に含む請求項2に記載の透明材料加工方法。 - 前記レーザー光照射工程において、前記レーザー光吸収体に対して、レーザー光を集光して照射する請求項2又は3に記載の透明材料加工方法。
- 前記配置工程において、前記レーザー光照射工程において前記硬化前の透明材料に照射されるレーザー光の出射位置から当該硬化前の透明材料にかけて、固体及び液体の少なくとも何れかから構成される透明な物質を配置する請求項1~4の何れか一項に記載の透明材料加工方法。
- 前記レーザー光照射工程において、前記配置工程において配置された前記硬化前の透明材料にレーザー光を照射して、当該硬化前の透明材料に、線状に連続したキャビテーションバブルを発生させる請求項1~5の何れか一項に記載の透明材料加工方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018000508 | 2018-01-05 | ||
JP2018000508 | 2018-01-05 | ||
PCT/JP2018/047072 WO2019135362A1 (ja) | 2018-01-05 | 2018-12-20 | 透明材料加工方法、透明材料加工装置及び透明材料 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2019135362A1 JPWO2019135362A1 (ja) | 2020-12-24 |
JP7197176B2 true JP7197176B2 (ja) | 2022-12-27 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019563963A Active JP7197176B2 (ja) | 2018-01-05 | 2018-12-20 | 透明材料加工方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US11471981B2 (ja) |
JP (1) | JP7197176B2 (ja) |
CN (1) | CN111542411B (ja) |
WO (1) | WO2019135362A1 (ja) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6672552B1 (en) | 2003-05-02 | 2004-01-06 | Chzh-Lin Jao | Supporting rod assembly providing luminous decorating effect |
JP2007245460A (ja) | 2006-03-15 | 2007-09-27 | Alps Electric Co Ltd | 積層成形品及びその製造方法 |
JP2010515233A (ja) | 2007-01-05 | 2010-05-06 | ビーエーエスエフ ソシエタス・ヨーロピア | 導電性表面の形成方法 |
WO2013132819A1 (ja) | 2012-03-06 | 2013-09-12 | 富士フイルム株式会社 | ハニカム構造フィルムの製造方法 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
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US3909582A (en) * | 1971-07-19 | 1975-09-30 | American Can Co | Method of forming a line of weakness in a multilayer laminate |
JPH0897513A (ja) * | 1994-09-27 | 1996-04-12 | Kubota Corp | 微小光学部品の作製方法 |
JP2838663B2 (ja) * | 1994-11-29 | 1998-12-16 | デンケンエンジニアリング株式会社 | 光造形法 |
JP3803735B2 (ja) * | 1996-02-14 | 2006-08-02 | 独立行政法人理化学研究所 | リコートと同時に光走査する光固化造形装置 |
DE10053078A1 (de) * | 1999-12-15 | 2001-06-28 | Werner Hermann Wera Werke | Handwerkzeug, insbesondere Schraubwerkzeug |
US7304005B2 (en) * | 2003-03-17 | 2007-12-04 | Semiconductor Energy Laboratory Co., Ltd. | Laser irradiation apparatus, laser irradiation method, and method for manufacturing a semiconductor device |
JP4231924B2 (ja) * | 2003-03-27 | 2009-03-04 | 独立行政法人産業技術総合研究所 | 透明材料の微細加工装置 |
JP4235945B2 (ja) | 2003-08-29 | 2009-03-11 | 独立行政法人理化学研究所 | 金属配線形成方法および金属配線形成装置 |
JP2009136912A (ja) | 2007-12-10 | 2009-06-25 | Konica Minolta Holdings Inc | 透明材料加工法及び透明材料加工装置 |
CN101508056B (zh) * | 2008-12-15 | 2012-07-04 | 吴敏锋 | 在透明材料内实现内雕的方法及装置 |
CN108136811B (zh) * | 2015-10-02 | 2019-11-22 | 凸版印刷株式会社 | 防伪结构体 |
CN107068291B (zh) | 2017-04-10 | 2019-04-30 | 武汉理工大学 | 一种转移银纳米线透明导电薄膜到柔性衬底的方法 |
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2018
- 2018-12-20 JP JP2019563963A patent/JP7197176B2/ja active Active
- 2018-12-20 US US16/958,099 patent/US11471981B2/en active Active
- 2018-12-20 WO PCT/JP2018/047072 patent/WO2019135362A1/ja active Application Filing
- 2018-12-20 CN CN201880085209.9A patent/CN111542411B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6672552B1 (en) | 2003-05-02 | 2004-01-06 | Chzh-Lin Jao | Supporting rod assembly providing luminous decorating effect |
JP2007245460A (ja) | 2006-03-15 | 2007-09-27 | Alps Electric Co Ltd | 積層成形品及びその製造方法 |
JP2010515233A (ja) | 2007-01-05 | 2010-05-06 | ビーエーエスエフ ソシエタス・ヨーロピア | 導電性表面の形成方法 |
WO2013132819A1 (ja) | 2012-03-06 | 2013-09-12 | 富士フイルム株式会社 | ハニカム構造フィルムの製造方法 |
Also Published As
Publication number | Publication date |
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JPWO2019135362A1 (ja) | 2020-12-24 |
CN111542411A (zh) | 2020-08-14 |
WO2019135362A1 (ja) | 2019-07-11 |
CN111542411B (zh) | 2021-12-28 |
US20210061650A1 (en) | 2021-03-04 |
US11471981B2 (en) | 2022-10-18 |
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