JP7169366B2 - Component mounter - Google Patents

Description

This specification discloses a component mounting apparatus.

Conventionally, in this type of component mounting apparatus, a mounting head (suction nozzle) is moved to the pick-up position of an electronic component (component) of a component supply device, and the component is picked up by the mounting head and picked up. A method has been proposed in which a component is mounted on a board by moving a mounting head to a mounting position (see, for example, Patent Document 1). When a component is picked up by the mounting head, the component mounting apparatus moves the mounting head to an imaging position, picks up an image of the component picked up by the mounting head with a component recognition camera, and detects positional deviation of the component based on the captured image. to recognize Then, the component mounting apparatus corrects the mounting position based on the recognized positional deviation and mounts the component, and calculates the picking position to be used for the next component picking operation based on the recognized positional deviation. In addition, the component mounting apparatus determines whether or not the calculated picking position exceeds the limit position (permissible movement range). Try to do it at the limit position.

Japanese Patent Application Laid-Open No. 2000-106500

As described above, the displacement of the component is recognized based on the captured image by moving the suction nozzle to the imaging position and capturing an image of the component sucked by the suction nozzle with the imaging device. At this time, depending on the suction position of the component with respect to the suction nozzle, the position of the component may be displaced due to the acceleration and vibration acting on the component when moving the component sucked by the suction nozzle to the imaging position. In this case, based on the captured image, a positional deviation of the component different from that at the time of picking up is recognized, and as a result of calculating the pickup position of the next component based on the positional deviation, picking accuracy of the component deteriorates. Therefore, as in the component mounting apparatus described in Patent Document 1, when the picking position calculated based on the positional deviation exceeds the limit position, the picking position of subsequent component picking operations is fixed at the limit position. As a result, there is a risk that the component will continue to be picked up while the picking accuracy is degraded.

A main object of the present disclosure is to suppress deterioration of component pickup accuracy.

The present disclosure has taken the following means to achieve the above-mentioned main objectives.

The component mounting apparatus of the present disclosure is
A component mounting device that picks up a component supplied by a component supply device and mounts it on an object,
a suction nozzle for sucking the component;
a moving device that relatively moves the suction nozzle with respect to the component supply device;
an imaging device that captures an image of the component sucked by the suction nozzle;
suction control for controlling the moving device so that the component supplied by the component supply device is picked up by the suction nozzle at a target suction position; When the amount of correction corresponding to the amount of positional deviation of the component recognized based on the imaged image of the component by controlling the moving device and the imaging device does not reach the limit, the target pickup position is determined by the amount of correction. and updating the target suction position with a correction amount smaller than the limit when the correction amount corresponding to the positional deviation amount reaches the limit. When,
The gist is to provide

A control device for a component mounting apparatus of the present disclosure includes suction control for controlling a component supplied by a component supply device to be picked up by a suction nozzle at a target suction position, and target suction position update processing for updating the target suction position. and In the target pickup position update process, the component picked up by the suction nozzle is imaged at a predetermined imaging position, and the correction amount corresponding to the positional deviation amount of the component recognized based on the imaged image of the component does not reach the limit. In this case, the target suction position is updated by the correction amount. On the other hand, when the correction amount according to the positional deviation amount reaches the limit, the target suction position is updated with a correction amount smaller than the limit. In the component mounting apparatus of the present disclosure, if the position of the component is shifted for some reason while moving the component sucked by the suction nozzle to the imaging position, the position of the component differs from that at the time of pickup based on the captured image captured in that state. A deviation amount may be recognized. Therefore, in the component mounting apparatus of the present disclosure, when the amount of correction of the target pickup position derived according to the amount of positional deviation of the component reaches the limit, the target pickup position is updated with a correction amount smaller than the limit, and the next target pickup position is updated. By executing the adsorption control of (1), it is possible to reduce the influence on the target adsorption position due to the positional deviation amount of the component recognized in a posture different from that at the time of adsorption. As a result, even if the positional deviation amount of the component is recognized in a position different from that at the time of picking up, it is possible to suppress deterioration of the picking accuracy.

1 is a configuration diagram showing an outline of the configuration of a component mounting apparatus 10 of this embodiment; FIG. FIG. 3 is an explanatory diagram showing an electrical connection relationship of the control device 30; 6 is a flowchart showing an example of component mounting processing; FIG. 4 is an explanatory diagram showing how a component P is picked up and then transported onto a substrate S; 9 is a flowchart showing an example of target pickup position update processing; FIG. 10 is an explanatory diagram showing how adsorption displacement occurs; FIG. 11 is an explanatory diagram showing changes in an adsorption deviation amount and a correction amount of a target adsorption position in a comparative example; FIG. 10 is an explanatory diagram showing how the adsorption deviation amount and the correction amount of the target adsorption position change in the present embodiment; FIG. 10 is an explanatory diagram showing how the adsorption deviation amount and the correction amount of the target adsorption position change in the present embodiment; It is a flow chart which shows target adsorption position update processing of a modification.

Next, embodiments for implementing the present disclosure will be described with reference to the drawings.

FIG. 1 is a configuration diagram showing an outline of the configuration of a component mounting apparatus 10 of this embodiment. FIG. 2 is an explanatory diagram showing the electrical connection relationship of the control device 30. As shown in FIG. Note that the horizontal direction in FIG. 1 is the X-axis direction, the front (front) and rear (back) directions are the Y-axis direction, and the vertical direction is the Z-axis direction.

As shown in FIG. 1, the component mounting apparatus 10 includes a component supply device 21, a board transfer device 22, a moving mechanism 23, a head 24, a suction nozzle 25, a parts camera 26, a mark camera 27, a nozzle A stocker 28 and a control device 30 (see FIG. 2) are provided.

The component supply device 21 supplies the component P to a component supply position. The component supply device 21 is configured as a tape feeder that supplies the components P to a component supply position by pulling out from a reel a tape containing the components P in storage units formed at predetermined intervals and feeding the tape by pitch. The tape feeders are detachably attached to a plurality of feeder stands arranged in the left-right direction (X-axis direction) provided on the front portion of the base 11 that supports the housing 12 .

The substrate transfer device 22 is provided from the central portion to the rear portion of the base 11, and carries in, fixes, and carries out the substrate S along the horizontal direction (X-axis direction) in the figure. The substrate transfer device 22 has a pair of conveyor belts that are spaced in the front-rear direction and spanned in the left-right direction. The substrate S is transported by a conveyor belt.

The head 24 picks up the component P supplied to the component supply position and mounts it on the substrate S. As shown in FIG. The head 24 includes a nozzle holder to which the suction nozzle 25 is attachable and detachable, and an elevating device that moves the nozzle holder up and down (moves in the Z-axis direction) together with the suction nozzle 25 . The suction nozzle 25 sucks the component P by negative pressure supplied to and discharged from the suction port.

The moving mechanism 23 moves the head 24 in the XY directions. The moving mechanism 23 can be configured by, for example, a ball screw mechanism.

The parts camera 26 is provided between the parts supply device 21 of the base 11 and the substrate transfer device 22, and images the parts P sucked by the suction nozzle 25 from below. The mark camera 27 is provided on the head 24 and captures an image of the positioning reference mark provided on the substrate S from above. The nozzle stocker 28 is provided adjacent to the parts camera 26 and stocks a plurality of suction nozzles 25 for replacement.

The control device 30 includes a CPU 31, a ROM 32, an HDD 33, a RAM 34, and an input/output interface 35, as shown in FIG. These are electrically connected via bus 36 . Image signals from the parts camera 26 and the mark camera 27 and detection signals from position sensors that detect the respective positions of the suction nozzle 25 in the X, Y and Z directions are sent to the control device 30 via an input/output interface 35 . is entered. On the other hand, from the control device 30, control signals to the component supply device 21, the substrate transfer device 22, the moving mechanism 23, the head 24, etc. are output via the input/output interface 35. FIG. Also, the control device 30 is connected to the management device 40 so as to be capable of two-way communication, and exchanges data and control signals with each other.

The management device 40 is, for example, a general-purpose computer, and as shown in FIG. These are electrically connected via a bus 46 . An input signal is input to the management device 40 from an input device 47 such as a mouse or a keyboard via an input/output interface 45 . An image signal to the display 48 is output from the management device 40 via the input/output interface 45 . The HDD 43 stores the board S production program. Here, the production program for the boards S means which parts P are to be mounted on the boards S in what order in each component mounting apparatus 10, and how many boards S on which the parts P are mounted in such a manner are to be produced. The process that defines the is described.

Next, the operation of the component mounting apparatus 10 of this embodiment configured in this way will be described. FIG. 3 is a flowchart showing an example of component mounting processing executed by the control device 30. As shown in FIG. This process is performed for each feeder. That is, the same component mounting process is performed for components supplied from the same feeder, and a different component mounting process is performed for components supplied from different feeders.

When the component mounting process is executed, the CPU 31 of the control device 30 first moves the suction nozzle 25 above the target suction position (Xp, Yp) and lowers it so that the suction nozzle 25 picks up the component P. The moving mechanism 23 and the head 24 are controlled (step S100). Here, the target suction position (Xp, Yp) is determined for each feeder. Next, the CPU 31 controls the moving mechanism 23 so that the part P sucked by the suction nozzle 25 moves above the parts camera 26, and also controls the parts camera 26 so that the part P is imaged (step S110). . Subsequently, the CPU 31 processes the obtained captured image to recognize the actual suction position, and the positional deviation amount ΔXc(i ), ΔYc(i) is obtained (step S120). It should be noted that i indicates the number of pickup times of parts P picked up from the same feeder. Therefore, .DELTA.Xc(i) and .DELTA.Yc(i) mean the amount of positional deviation of the component P picked up from the same feeder for the i-th time. Next, the CPU 31 offsets the target mounting position (X*, Y*) of the component P sucked by the suction nozzle 25 in the same direction by the amount of positional deviation ΔXc(i), ΔYc(i). The mounting position (X*, Y*) is corrected (step S130). Then, the CPU 31 moves the component P sucked by the suction nozzle 25 above the corrected target mounting position (X*, Y*) and lowers it so that the component P is mounted on the board S. 23 and the head 24 (step S140). As shown in FIG. 4, the component P supplied by the component supply device 21 is picked up at the component supply position (Xp, Yp), imaged above the parts camera 26, and then picked up at the target mounting position on the board S. It is transported to (X*, Y*) and mounted.

Next, the CPU 31 executes target suction position update processing for updating the target suction position (Xp, Yp) used in step S100 (step S150). Details of the target suction position update process will be described below. FIG. 5 is a flow chart showing an example of target pickup position update processing. In this target suction position update process, the CPU 31 first multiplies the X-axis direction positional deviation amount ΔXc(i) acquired in step S120 by a coefficient k and assigns a minus sign to the target suction position in the X-axis direction. A correction amount ΔXp(i) of Xp is set (step S200). Here, the coefficient k may be set to a value of 1, or may be set to a value greater than 0 and less than 1. Subsequently, the CPU 31 determines whether the correction amount Xp in the X-axis direction is equal to or greater than a predetermined limit (-ΔXlim) (step S210), and determines whether the correction amount ΔXp(i) in the X-axis direction is equal to or less than the limit ΔXlim. It is determined whether or not (step S220). Here, the limits ΔXlim and -ΔXlim are allowable limit values of the correction amount in the X-axis direction (rightward and leftward directions). When the CPU 31 determines that the correction amount ΔXp(i) is equal to or greater than the limit Δ(−Xlim) and equal to or less than the limit ΔXlim, the CPU 31 sets the target pickup position Xp in the X-axis direction of the component P to be picked up next from the same feeder to It is updated to a value offset by a correction amount ΔXp corresponding to the positional deviation amount ΔXc(i) of the component P picked up this time (step S230). As a result, the component mounting apparatus 10 can bring the pickup position of the next component P to be picked up in the X-axis direction closer to the ideal position.

When the CPU 31 determines in step S220 that the correction amount ΔXp(i) in the X-axis direction is greater than the limit ΔXlim, the CPU 31 increments the limit reaching count Nx by 1 (step S240), and picks up the component P from the same feeder. It is determined whether or not i is more than m times (step S250). Here, m times is the number of times required for the suction of the component P by the suction nozzle 25 to be stabilized, and is set to a number larger than n times (for example, three times) described later. When the CPU 31 determines that the number of times of pickup i is greater than m times, the CPU 31 changes the target pickup position Xp in the X-axis direction of the component P to be picked up next from the same feeder to the position of the part P picked up n (<m) times before. The value is updated to a value offset by the correction amount ΔXp(in) corresponding to the positional deviation amount ΔXc(in) (step S260). On the other hand, when the CPU 31 determines that the number i of suctions is not more than m, that is, is m times or less, the CPU 31 updates the target suction position Xp to a value offset by the correction amount corresponding to the limit ΔXlim (step S270). ).

When the CPU 31 determines in step S210 that the correction amount ΔXp(i) in the X-axis direction is smaller than the limit (−ΔXlim), the CPU 31 increments the limit reaching count Nx by 1 (step S280), and the suction count i is m times. It is determined whether or not the number is greater than (step S290). When the CPU 31 determines that the number of times of pickup i is greater than m times, the CPU 31 changes the target pickup position Xp in the X-axis direction of the component P to be picked up next from the same feeder to the positional deviation amount ΔXc of the component P picked up n times before. It is updated to a value offset by the correction amount ΔXp(i−n) corresponding to (i−n) (step S300). On the other hand, when the CPU 31 determines that the number i of suctions is not more than m, that is, is m times or less, the CPU 31 updates the target suction position Xp to a value offset by the correction amount corresponding to the limit (-ΔXlim). (Step S310).

Next, the CPU 31 multiplies the positional deviation amount ΔYc(i) in the Y-axis direction obtained in step S120 by a coefficient k and assigns a minus sign to it as a correction amount ΔYp(i) for the target suction position Yp in the Y-axis direction. ) (step S320). Subsequently, the CPU 31 determines whether the correction amount ΔYp in the Y-axis direction is equal to or greater than a predetermined limit (−ΔYlim) (step S330), and determines whether the correction amount ΔYp(i) in the Y-axis direction is equal to or less than the limit ΔYlim. It is determined whether or not (step S340). Here, the limits .DELTA.Ylim and -.DELTA.Ylim are permissible limit values of the correction amount in the Y-axis direction (forward and backward directions). When the CPU 31 determines that the correction amount ΔYp(i) is equal to or greater than the limit (−ΔYlim) and equal to or less than the limit ΔYlim, the CPU 31 sets the target pickup position Yp in the Y-axis direction of the component P to be picked up next from the same feeder to the current target pickup position Yp. The value is updated to a value offset by the correction amount ΔYp(i) corresponding to the positional deviation amount ΔYc(i) of the picked up component P (step S350), and the target pickup position updating process ends. As a result, the component mounting apparatus 10 can bring the pickup position of the next component P to be picked up in the Y-axis direction closer to the ideal position.

When the CPU 31 determines in step S340 that the correction amount ΔYp(i) in the Y-axis direction is greater than the limit ΔYlim, the CPU 31 increments the limit reaching count Ny by 1 (step S360), and picks up the component P from the same feeder. It is determined whether i is more than m times (step S370). When the CPU 31 determines that the number of times of pickup i is greater than m times, the CPU 31 changes the target pickup position Yp in the Y-axis direction of the component P to be picked up next from the same feeder to the positional deviation amount ΔYc of the component P picked up n times before. The value is updated to a value offset by the correction amount ΔYp(i−n) corresponding to (i−n) (step S380), and the target suction position updating process ends. On the other hand, when the CPU 31 determines that the number of suction times i is not more than m, that is, is equal to or less than m times, the CPU 31 updates the target suction position Yp to a value offset by the correction amount corresponding to the limit ΔYlim (step S390), the target suction position update process is terminated.

When the CPU 31 determines in step S330 that the correction amount ΔYp(i) in the Y-axis direction is smaller than the limit (−ΔYlim), the CPU 31 increments the limit reaching count Ny by 1 (step S400), and the suction count i becomes m times. It is determined whether or not it is greater than (step S410). When the CPU 31 determines that the number of times of pickup i is greater than m times, the CPU 31 changes the target pickup position Yp in the Y-axis direction of the component P to be picked up next from the same feeder to the positional deviation amount ΔYc of the component P picked up n times before. The value is updated to a value offset by the correction amount ΔYp(i−n) corresponding to (i−n) (step S420), and the target suction position updating process ends. On the other hand, when the CPU 31 determines that the number of suction times i is not more than m, that is, is m times or less, the CPU 31 updates the target suction position Yp to a value offset by the correction amount corresponding to the limit (-ΔYlim). (step S430), the target suction position update process is terminated.

Returning to the component mounting process, the CPU 31 thus executes the target pick-up position update process in step S150. It is determined whether or not (step S160). If the CPU 31 determines that neither the limit reaching count Nx nor the limit reaching count Ny has reached the threshold value Nref, it increments i by 1 (step S170), returns to step S100, and repeats the suction process. On the other hand, when the CPU 31 determines that either the number of times Nx of reaching the limit or the number of times of reaching the limit Ny has reached the threshold value Nref, the CPU 31 stops the process of picking up the component from the target feeder (step S180), and ends the component mounting process. do.

As described above, the displacement of the part P is recognized based on the captured image by moving the part P sucked by the suction nozzle 25 above the part camera 26 and picking up an image of the part P. At this time, the part P sucked by the suction nozzle 25 may shift from the suction position due to acceleration and vibration when moving from the part supply position of the feeder to the imaging position above the parts camera 26 . In this case, based on the picked-up image, a positional deviation of the component P different from that at the time of pickup is recognized, and based on the positional deviation, the target pickup position (Xp, Yp) of the component P to be picked up next is calculated. The adsorption accuracy of P deteriorates. For example, as shown in FIG. 6, when the suction nozzle 25 is sucked at the right end of the upper surface for some reason, the part P moves around the axis of the suction nozzle 25 around the tip of the suction nozzle 25 due to acceleration and vibration during transportation. In some cases, it rotates and assumes a posture of being sucked on the left end of the upper surface (see FIGS. 6(a) to 6(c)). In this case, the misalignment is recognized by the attitude of the component P that is different from the attitude at the time of pickup. As a result of updating the target pickup position (Xp, Yp) of the next component P to be picked up based on the recognized positional deviation, the next component P is shifted to the left by a greater amount than the current component P. (See FIG. 6(d)). As a result, poor suction and poor mounting are caused. Here, in the component mounting apparatus of the comparative example, as shown in FIG. 7, an upper limit (limit) is set for the correction amount. The target pickup position of the part P is fixed at the position corrected by the correction amount corresponding to the limit. However, in the component mounter of the comparative example, as shown in FIG. 7, the pickup accuracy (positional deviation amount ΔXc) is only kept in an unstable state, and there is no chance to return the pickup accuracy to a good state. In contrast, in the component mounting apparatus 10 of the present embodiment, the correction amounts ΔXp(i) and ΔYp(i) corresponding to the positional deviations ΔXc(i) and ΔYc(i) of the component P picked up this time reach the limits. Then, the components to be picked up next are corrected by the correction amounts ΔXp(in) and ΔYp(in) corresponding to the positional deviations ΔXc(in) and ΔYc(in) of the component P picked up n times before. P's target pick-up position (Xp, Yp) is updated. As a result, in the component mounting apparatus 10 of the present embodiment, as shown in FIG. 8, the amount of positional deviation fluctuates greatly, and the correction amount may repeatedly reach the limit. Accuracy may return to good condition. As a result, the component mounting apparatus 10 of the present embodiment can suppress the deterioration of the pickup accuracy due to the amount of positional deviation recognized in a component posture different from that during pickup. Further, when the number of times the correction amounts ΔXp and ΔYp reach the limits (limit reaching times Nx and Ny) reaches the threshold value Nref, the component mounting apparatus 10 of the present embodiment stops subsequent suction processing. As a result, it is possible to prevent the adsorption process from being repeated in a state in which there is no prospect of improvement in the adsorption accuracy, and the frequent occurrence of poor adsorption and poor mounting.

Here, the correspondence between the main elements of the embodiment and the main elements of the present disclosure described in the claims will be described. That is, the component supply device 21 of this embodiment corresponds to the component supply device of the present disclosure, the suction nozzle 25 corresponds to the suction nozzle, the moving mechanism 23 and the lifting device correspond to the moving device, and the parts camera 26 corresponds to the imaging device. , and the control device 30 corresponds to the control device.

It goes without saying that the present disclosure is not limited to the above-described embodiments, and can be implemented in various forms as long as they fall within the technical scope of the present disclosure.

For example, in the above-described embodiment, the controller 30 of the component mounting apparatus 10 determines the correction amounts ΔXp(i) and ΔYp(i) corresponding to the positional deviations ΔXc(i) and ΔYc(i) of the component P picked up this time. When the limit is reached, based on the correction amounts ΔXp(in) and ΔYp(in) corresponding to the positional deviations ΔXc(in) and ΔYc(in) of the component P picked up n times before, The target pickup position (Xp, Yp) of the component P to be picked up next is updated. However, the control device 30 may update the target suction position (Xp, Yp) by the following processing. FIG. 10 is a flow chart showing the target pickup position update process of the modification. Among the processes of the target suction position update process of the modified example, the same processes as those of the target suction position update process of the embodiment shown in FIG.

In the target pickup position update process of the modified example, the CPU 31 determines in step S220 that the positional deviation amount ΔXc(i) of the component P picked up this time is greater than the limit ΔXlim, and increments the limit reaching count Nx in step S240. A correction amount ΔXp(i-1) corresponding to the positional deviation amount ΔXc(i-1) of the component P picked up last time is calculated from the correction amount ΔXp(i) corresponding to the positional deviation amount ΔXc(i) of the part P picked up this time. It is determined whether or not the reduced amount of change is greater than threshold A (step S250B). The process of step S250B is a process of determining whether the correction amount ΔXp has rapidly increased and reached the limit ΔXlim. When the CPU 31 determines that the amount of change is greater than the threshold value A, the CPU 31 shifts the target pickup position Xp by a correction amount ΔXp(i−1) corresponding to the positional deviation amount ΔXc(i−1) of the previously picked component P. It is updated to the offset value (step S260B). On the other hand, when the CPU 31 determines that the amount of change is equal to or less than the threshold value A, the CPU 31 updates the target suction position Xp to a value offset by the correction amount corresponding to the limit ΔXlim (step S270).

The CPU 31 determines in step S210 that the correction amount ΔXp(i) corresponding to the positional deviation amount ΔXc(i) of the component P picked up this time is smaller than the limit (-ΔXlim), and in step S280 increments the limit reaching count Nx. Then, the correction amount ΔXp(i−1) corresponding to the positional deviation amount ΔXc(i−1) of the component P picked up last time is changed to the correction amount ΔXp(i−1) corresponding to the positional deviation amount ΔXc(i) of the component P picked up this time. ) is greater than the threshold value A (step S290B). The process of step S290B is a process of determining whether or not the correction amount ΔXp has suddenly decreased and reached the limit (−ΔXlim). When the CPU 31 determines that the amount of change is greater than the threshold value A, the CPU 31 shifts the target pickup position Xp by a correction amount ΔXp(i−1) corresponding to the positional deviation amount ΔXc(i−1) of the previously picked component P. It is updated to the offset value (step S300B). On the other hand, when the CPU 31 determines that the amount of change is equal to or less than the threshold value A, the CPU 31 updates the target suction position Xp to a value offset by the correction amount corresponding to the limit (-ΔXlim) (step S310).

The CPU 31 determines in step S340 that the positional deviation amount ΔYc(i) of the component P picked up this time is greater than the limit ΔYlim, and increments the limit reaching count Ny in step S360. The amount of change obtained by subtracting the correction amount ΔYp(i−1) according to the misalignment amount ΔYc(i−1) of the component P picked up last time from the correction amount ΔYp(i) according to (i) is larger than the threshold value B. It is determined whether or not (step S370B). The process of step S370B is a process of determining whether the correction amount ΔYp has rapidly increased and reached the limit ΔYlim. When the CPU 31 determines that the amount of change is larger than the threshold value B, the CPU 31 shifts the target pickup position Yp by a correction amount ΔYp(i−1) corresponding to the positional deviation amount ΔYp(i−1) of the component P that was picked up last time. It is updated to the offset value (step S380B). On the other hand, when the CPU 31 determines that the amount of change is equal to or less than the threshold value B, the CPU 31 updates the target suction position Yp to a value offset by the correction amount corresponding to the limit ΔYlim (step S390).

In step S330, the CPU 31 determines that the correction amount ΔYp(i) corresponding to the positional deviation amount ΔYc(i) of the component P picked up this time is smaller than the limit (−ΔYlim), and increments the limit reaching count Ny in step S400. Then, the correction amount ΔYp(i−1) corresponding to the positional deviation amount ΔYc(i−1) of the component P picked up last time is changed to the correction amount ΔXp(i) corresponding to the positional deviation amount ΔYc(i) of the component P picked up this time. ) is greater than the threshold value B (step S410B). The process of step S410B is a process of determining whether the correction amount ΔYp has suddenly decreased and reached the limit (−ΔYlim). When the CPU 31 determines that the amount of change is larger than the threshold value B, the CPU 31 shifts the target pickup position Yp by a correction amount ΔYp(i−1) corresponding to the positional deviation amount ΔYc(i−1) of the component P that was picked up last time. It is updated to the offset value (step S420B). On the other hand, when the CPU 31 determines that the amount of change is equal to or less than the threshold value B, the CPU 31 updates the target suction position Yp to a value offset by the correction amount corresponding to the limit (-ΔYlim) (step S430).

In the target pickup position update processing of such a modified example, when the correction amount suddenly changes and reaches the limit, the CPU 31 offsets the target pickup position by the correction amount corresponding to the positional deviation amount of the component P which was picked up last time. value. As a result, as shown in FIG. 6, the component mounting apparatus of the modified example is capable of It is possible to eliminate the influence on the target suction position and suppress the deterioration of the suction accuracy.

In the above-described embodiment, when the correction amount according to the positional deviation amount of the component P picked up this time reaches the limit, the CPU 31 corrects the target suction position according to the positional deviation amount of the component P picked up a predetermined time ago. Updated to the value offset by the amount. However, when the correction amount reaches the limit, the CPU 31 may update the target suction position with a correction amount smaller than the limit.

In the embodiment described above, the moving mechanism 23 moves the head 24 in the XY directions. However, the moving mechanism may be any mechanism that can move relative to the component supply device 21, and may move the component supply device 21 in the XY directions.

As described above, the component mounting apparatus of the present disclosure is a component mounting apparatus (10) that sucks a component (P) supplied by a component supply device (12) and mounts it on an object (S), a suction nozzle (25) for sucking the component (P); a moving device (23) for relatively moving the suction nozzle (25) with respect to the component supply device (12); an image pick-up device (26) for picking up an image of the component (P) received; and the moving device (26) so that the component (P) supplied by the component supply device (12) is sucked by the suction nozzle (25) at a target suction position. (23), and controlling the moving device (23) and the imaging device (26) so that the component sucked by the suction nozzle (25) is imaged at a predetermined imaging position. If the amount of correction according to the amount of positional deviation of the part (P) recognized based on the captured image of (P) does not reach the limit, the target suction position is updated by the amount of correction, and the positional deviation a control device (30) for executing a target suction position update process for updating the target suction position with a correction amount smaller than the limit when the correction amount according to the amount reaches the limit. This is the gist of it.

A control device for a component mounting apparatus of the present disclosure includes suction control for controlling a component supplied by a component supply device to be picked up by a suction nozzle at a target suction position, and target suction position update processing for updating the target suction position. and In the target pickup position update process, the component picked up by the suction nozzle is imaged at a predetermined imaging position, and the correction amount corresponding to the positional deviation amount of the component recognized based on the imaged image of the component does not reach the limit. In this case, the target suction position is updated by the correction amount. On the other hand, when the correction amount according to the positional deviation amount reaches the limit, the target suction position is updated with a correction amount smaller than the limit. In the component mounting apparatus of the present disclosure, if the position of the component is shifted for some reason while moving the component sucked by the suction nozzle to the imaging position, the position of the component differs from that at the time of pickup based on the captured image captured in that state. A deviation amount may be recognized. Therefore, in the component mounting apparatus of the present disclosure, when the amount of correction of the target pickup position derived according to the amount of positional deviation of the component reaches the limit, the target pickup position is updated with a correction amount smaller than the limit, and the next target pickup position is updated. By executing the adsorption control of (1), it is possible to reduce the influence on the target adsorption position due to the positional deviation amount of the component recognized in a posture different from that at the time of adsorption. As a result, even if the positional deviation amount of the component is recognized in a position different from that at the time of picking up, it is possible to suppress deterioration of the picking accuracy.

In the component mounting apparatus of the present disclosure, the control device (30) executes the target pickup position update process for a second predetermined number of times or more, which is larger than the first predetermined number of times, and also performs the target pickup position update process recognized in the current target pickup position update process. When the correction amount according to the positional deviation amount has reached the limit, the correction amount according to the positional deviation amount recognized in the target adsorption position update process executed the first predetermined number of times before the target The suction position may be updated. In this way, even if the posture of the component is different between when it is picked up and when it is picked up, and a positional deviation different from that when picked up is recognized, the effect on the target picking position can be reduced, and the deterioration of the picking accuracy can be suppressed. be able to. Here, the "second predetermined number of times" may be the number of times required for the suction nozzle to stably pick up the component.

Further, in the component mounting apparatus of the present disclosure, the control device (30) determines whether the correction amount according to the positional deviation amount recognized in the current target pickup position update process reaches the limit and the current target pickup position If the correction amount corresponding to the positional deviation amount recognized in the update process has changed by a predetermined amount or more from the correction amount corresponding to the positional deviation amount recognized in the previous target suction position updating process, The target suction position may be updated by a correction amount corresponding to the positional deviation amount recognized in the target suction position updating process of 1. In this way, even if the positional deviation amount greatly changes due to the difference in the posture of the component between when it is picked up and when it is picked up, the effect on the target picking position can be reduced, and the picking accuracy can be reduced. aggravation can be suppressed.

Further, in the component mounting apparatus of the present disclosure, the control device (30) determines that the correction amount corresponding to the positional deviation amount has reached the limit, and the execution count of the target pickup position update process reaches a predetermined number of times. Then, the subsequent execution of the adsorption control may be stopped. By doing so, it is possible to prevent the adsorption process from being repeated in a state in which there is no prospect of improvement in the adsorption accuracy, and the frequent occurrence of poor adsorption and poor mounting.

INDUSTRIAL APPLICABILITY The present disclosure is applicable to the manufacturing industry of component mounting apparatuses and the like.

10 component mounting device, 11 base, 12 housing, 21 component supply device, 22 board transfer device, 23 moving mechanism, 24 head, 25 suction nozzle, 26 parts camera, 27 mark camera, 28 nozzle stocker, 30 control device, 31 CPU, 32 ROM, 33 HDD, 34 RAM, 35 input/output interface, 36 bus, 40 management device, 41 CPU, 42 ROM, 43 HDD, 44 RAM, 45 input/output interface, 46 bus, 47 input device, 48 display , P component, S substrate.

Claims (3)

A component mounting device that picks up a component supplied by a component supply device and mounts it on an object,
a suction nozzle for sucking the component;
a moving device that relatively moves the suction nozzle with respect to the component supply device;
an imaging device that captures an image of the component sucked by the suction nozzle;
suction control for controlling the moving device so that the component supplied by the component supply device is picked up by the suction nozzle at a target suction position; When the amount of correction corresponding to the amount of positional deviation of the component recognized based on the imaged image of the component by controlling the moving device and the imaging device does not reach the limit, the target pickup position is determined by the amount of correction. and updating the target suction position with a correction amount smaller than the limit when the correction amount corresponding to the positional deviation amount reaches the limit. When,
with
The control device performs correction according to the positional deviation amount recognized in the current target adsorption position updating process when the correction amount corresponding to the positional deviation amount recognized in the current target adsorption position updating process reaches the limit and the positional deviation amount recognized in the current target adsorption position updating process. If the amount has changed by a predetermined amount or more with respect to the correction amount corresponding to the positional deviation amount recognized in the previous target adsorption position update process, the positional deviation recognized in the previous target adsorption position update process is corrected. updating the target suction position by a correction amount according to the amount;
Component mounting equipment. The component mounting apparatus according to claim 1 ,
When the number of executions of the target suction position update processing determined that the correction amount corresponding to the positional deviation amount has reached the limit reaches a predetermined number of times, the control device stops execution of the subsequent suction control.
Component mounting equipment. The component mounting apparatus according to claim 1 or 2 ,
The control device repeatedly executes the suction control and the target suction position update process.
Component mounting equipment.

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