JP7253905B2 - Mounting device and mounting method - Google Patents

Description

The present disclosure relates to a mounting device and a mounting method.

Japanese Patent Application Laid-Open No. 2002-200002 discloses a technique for correcting a shift in the mounting position of an electronic component as a shift caused by a movement operation during mounting.

Japanese Patent Application Laid-Open No. 2007-019201

The mounting position of the electronic component may shift in a direction different from the direction of movement during mounting. As a result, mounting defects may occur.

An object of the present invention is to suppress deviation in a direction different from the direction of movement operation during mounting.

According to an aspect of the present invention, a mounting head having a nozzle for releasably holding an electronic component and mounting the electronic component held by the nozzle onto a board; and a board camera supported by the mounting head. a moving mechanism for moving the mounting head; and a control device, wherein the control device moves the mounting head to a position based on the position of the substrate camera defined on a predetermined plane parallel to the surface of the substrate. a mounting processing unit for mounting the electronic component on the detection substrate; a detection processing unit for detecting the electronic component mounted on the position detection substrate by the substrate camera; a difference calculation processing unit that calculates a difference between the mounting set position and the detected position of the electronic component in each of the second axial directions of the predetermined plane perpendicular to the axial direction; and coordinates of the mounting set positions in the first axial direction. of the electronic component in a direction that cancels out the component of the coordinate in the second axis direction of the difference with respect to and a correction processing unit that corrects a mounting position.

According to the aspect of the present invention, deviation in a direction different from the direction of movement operation during mounting can be suppressed.

FIG. 1 is a diagram schematically showing an example of a mounting apparatus according to the first embodiment. FIG. 2 is a diagram schematically showing an example of the mounting apparatus according to the first embodiment; FIG. 3 is a functional block diagram showing the control device of the mounting device according to the first embodiment. FIG. 4 is a flow chart showing the mounting method according to the first embodiment. FIG. 5 is a diagram schematically showing an example of the mounting method according to the first embodiment. FIG. 6 is a diagram schematically showing an example of the mounting method according to the first embodiment. FIG. 7 is a diagram schematically showing an example of the mounting method according to the first embodiment. FIG. 8 is a diagram schematically showing an example of the mounting method according to the first embodiment. FIG. 9 is a diagram schematically showing an example of a mounting method according to the second embodiment.

Embodiments of the present invention will be described below with reference to the drawings, but the present invention is not limited thereto. The constituent elements of the embodiments described below can be combined as appropriate. Also, some components may not be used.

In the following description, an XYZ orthogonal coordinate system is set, and the positional relationship of each part will be described with reference to this XYZ orthogonal coordinate system. The direction parallel to the X-axis of a predetermined surface is the X-axis direction, the direction parallel to the Y-axis perpendicular to the X-axis on the predetermined surface is the Y-axis direction, and the direction parallel to the Z-axis perpendicular to the predetermined surface is the Z-axis direction. and

[First embodiment]
<Mounting equipment>
A first embodiment will be described. 1 and 2 are diagrams schematically showing an example of a mounting apparatus 1 according to this embodiment. FIG. 1 is a side view showing the mounting apparatus 1. FIG. FIG. 2 is a top view showing the mounting apparatus 1. FIG.

The mounting apparatus 1 mounts the electronic component C supplied by the feeder 20 on the substrate P. As shown in FIG. As shown in FIGS. 1 and 2, the mounting apparatus 1 includes a mounting head 2 that mounts an electronic component C on a board P, a board camera 3 supported by the mounting head 2, and a board camera 3 that moves the mounting head 2 together with the board camera 3. A moving mechanism 4 and a control device 5 are provided.

As shown in FIG. 2, near the center of the base 10 of the mounting apparatus 1, a board transfer section 11 for transferring the board P in the X-axis direction is arranged. The substrate transfer unit 11 carries the substrate P before mounting the electronic components C from one side in the X-axis direction below the mounting head 2 and positions it, and transfers the substrate P after mounting the electronic components C to the other side in the X-axis direction. Carry out to the side.

As shown in FIGS. 1 and 2 , a plurality of feeders 20 are arranged in the X-axis direction on both sides of the substrate transfer section 11 . In this embodiment, the feeder 20 is exemplified by a tape feeder that supplies the electronic component C to the mounting head 2 by means of a detachably attached tape reel, but the present invention is not limited to this, and feeders of other forms may be used. may be

As shown in FIG. 1, the mounting head 2 includes a plurality of nozzles 21 that releasably hold the electronic component C, a head base 23 that holds the plurality of nozzles 21 so as to be rotatable around a rotation axis 22, and a head and a head housing 24 that rotatably supports the base 23 . In this embodiment, the mounting head 2 is exemplified by a rotary type mounting head 2 in which the nozzles 21 mount the electronic components C one by one. Other forms of mounting heads, such as mountable in-line mounting heads, may also be used.

The board camera 3 is supported by the head housing 24 . An imaging position 3P on the board P of the board camera 3 is at a predetermined relative position indicated by a relative position vector R with the mounting position 2P of the nozzle 21 of the mounting head 2 on the board P as a reference. When the mounting head 2 mounts the electronic component C on the board P, the board camera 3 captures an image of the board P from above and acquires image data of the board P, thereby detecting the image pickup position 3P. 2P is detected. Further, the board camera 3 can detect the electronic component C by capturing an image of the electronic component C mounted on the board P from above and acquiring image data of the electronic component C. FIG.

The moving mechanism 4 is provided above the base 10 . The moving mechanism 4 includes a Z-axis guide 43 extending in the Z-axis direction that supports the mounting head 2 and the board camera 3 so that they can move up and down in the Z-axis direction, and a Z-axis guide 43 that moves the mounting head 2 and the board camera 3 along the Z-axis guide 43 . A Z-axis drive unit (not shown) that generates power for moving in the vertical direction, an X-axis guide 41 that supports a Z-axis guide 43 so as to be movable in the X-axis direction, and a Z-axis guide 41 along the X-axis guide 41. An X-axis drive unit (not shown) that generates power for moving the guide 43 in the X-axis direction, a pair of Y-axis guides 42 that support the X-axis guide 41 so as to be movable in the Y-axis direction, and a Y-axis guide. and a Y-axis drive unit (not shown) that generates power for moving the X-axis guide 41 in the Y-axis direction along 42 . The pair of Y-axis guides 42 are supported by supporting portions 17 erected at the four corners of the base 10 .

<Control device>
FIG. 3 is a functional block diagram showing the control device 5 of the mounting device 1 according to the first embodiment. The control device 5 includes a computer system that controls the mounting device 1 . As shown in FIG. 3, the control device 5 includes a processing device 5A including a microprocessor such as a CPU (Central Processing Unit), a non-volatile memory such as ROM (Read Only Memory) or storage, and a RAM (Random Access Memory). ), and an input/output interface 5C including an input/output circuit capable of inputting/outputting signals and data.

The processing device 5A has a mounting processing unit 51, a detection processing unit 52, a difference calculation processing unit 53, and a correction processing unit . The input/output interface 5C of the control device 5 is connected with the mounting head 2, the substrate camera 3, and the moving mechanism 4. FIG.

The mounting processing unit 51 uses the mounting head 2 to mount the electronic component C on the position detection board 6 (see FIG. 5) described later, using the position of the board camera 3 defined on a predetermined plane parallel to the surface of the board P as a reference. Outputs control commands to be implemented. In addition, before mounting the electronic component C on the position detection substrate 6 (see FIG. 5), the processing device 5A preliminarily mounts the predetermined surface of the mounting device 1 in the X-axis direction and the first-axis direction. Based on the Y-axis direction, which is the second axis direction of a predetermined plane orthogonal to set each.

The detection processing unit 52 outputs a control command for detecting a plurality of electronic components C mounted on the position detection board 6 (see FIG. 5) by the board camera 3 .

The difference calculation processing unit 53 calculates the difference D (see FIG. 6) between the mounting setting position CP (see FIG. 6) and the detection position RP (see FIG. 6) of the electronic component C in each of the X-axis direction and the Y-axis direction. calculate.

The correction processing unit 54 calculates the component of the Y coordinate of the difference D (see FIG. 6) with respect to the X coordinate of the mounting setting position CP (see FIG. 6) and the difference D (see FIG. 6) with respect to the Y coordinate of the mounting setting position CP (see FIG. 6). 6), the mounting position 2P of the electronic component C is corrected in the direction of canceling out the component of the X coordinate. Specifically, the correction processing unit 54 corrects the X coordinate of the difference D with respect to Y1 of the mounting setting position CP with respect to the coordinates (X1, Y1) of the mounting setting position CP where the electronic component C is mounted by the mounting processing unit 51. By subtracting the component ΔX1 from X1 and subtracting the Y coordinate component ΔY1 of the difference D of the mounting setting position CP from X1 from Y1, the coordinates are corrected to (X1−ΔX1, Y1−ΔY1).

The mounting processing unit 51, the detection processing unit 52, the difference calculation processing unit 53, and the correction processing unit 54 all perform the mounting method according to the first embodiment. It is a functional part realized by executing an implementation program for Detailed functions of the processing device 5A, that is, the detailed functions of the mounting processing unit 51, the detection processing unit 52, the difference calculation processing unit 53, and the correction processing unit 54 will be described later in detail in the mounting method according to the first embodiment. will be explained in the section below.

<Mounting method>
The operation of the mounting apparatus 1 according to the first embodiment will be described below. FIG. 4 is a flow chart showing the mounting method according to the first embodiment. 5, 6, 7 and 8 are diagrams schematically showing an example of the mounting method according to the first embodiment.

FIG. 5 shows a mounting example of the position detection substrate 6 used in the mounting step S10 and the electronic component C in the mounting step S10. FIG. 6 shows the relationship between the mounting setting position CP of the electronic component C set in the mounting step S10, the detection position RP of the electronic component C detected in the detecting step S20, and the difference D calculated in the difference calculating step S30. It shows about FIG. 7 shows the data of the X component of the vector of the difference D with respect to the Y coordinate of the mounting setting position CP compiled in the correction step S40. FIG. 7 shows the data of the Y component of the vector of the difference D with respect to the X coordinate of the mounting setting position CP collected in the correction step S40.

Regarding the mounting method according to the first embodiment executed by the mounting apparatus 1, the detailed functions and In addition, description will be made with reference to FIGS. 4 to 8. FIG.

As shown in FIG. 4, the mounting method according to the first embodiment includes mounting step S10, detection step S20, difference calculation step S30, and correction step S40.

As shown in FIG. 5, the position detection board 6 used in the mounting method according to the first embodiment is provided with reference marks 61 at the four corners. Like the substrate P, the position detection substrate 6 is loaded under the mounting head 2 and positioned. It should be noted that the position detection substrate 6 is preferably made of a glass plate with high positioning accuracy.

Before executing the mounting step S10, the processing device 5A calculates the X coordinate and the Y coordinate of the position detection board 6 with reference to the reference mark 61 based on the X axis and the Y axis of the mounting device 1, respectively. is set, and calibration processing of the mounting head 2 and alignment processing (position correction processing) between the mounting head 2 and the position detection board 6 are executed.

The mounting processing unit 51 outputs a control command to mount the electronic component C on the position detecting board 6 with the mounting head 2 on the basis of the position of the board camera 3 (mounting step S10).

In the mounting step S10, first, the mounting processing unit 51 sets the mounting setting position CP on the position detecting board 6 for each electronic component C, as shown in FIG. In this embodiment, the mounting setting position CP is set with reference to the corners of the -X direction and the -Y direction of the electronic component C, but the present invention is not limited to this. , or the center of the electronic component C may be used as a reference.

In the mounting step S10, the mounting processing unit 51 next uses the imaging function of the board camera 3 and the moving function of the moving mechanism 4 to move the imaging position 3P of the board camera 3 to the mounting setting position CP of the electronic component C. On the other hand, it is moved toward a position moved by the relative position vector R between the mounting position 2P and the imaging position 3P. Accordingly, the mounting processing section 51 moves the mounting position 2P of the nozzle 21 of the mounting head 2 toward the mounting setting position CP.

In the mounting step S10, the mounting processing unit 51 moves the mounting position 2P toward the mounting setting position CP, and uses the mounting function of the mounting head 2 to position the electronic component C for position detection. It is mounted on the substrate 6.

In the mounting step S10, as shown in FIG. 5, the mounting processing unit 51 causes the mounting operation of one electronic component C described above to be repeatedly performed for all the electronic components C for which the mounting setting positions CP are set. As a result, all electronic components C to be mounted are mounted toward all mounting setting positions CP on the position detection substrate 6 .

In this embodiment, the mounting processing unit 51 sets a total of 84 mounting setting positions CP, which are regularly arranged in 12 columns at equal intervals in the X-axis direction and 7 rows at equal intervals in the Y-axis direction. However, the present invention is not limited to this, and the mounting setting positions CP may be arranged in other regular or irregular arrangements. It is preferable that the mounting processing unit 51 sets the mounting setting positions CP arranged regularly. The mounting position 2P can be corrected.

Moreover, in the mounting step S10, the mounting processing section 51 preferably mounts the electronic component C over a wide area of the position detecting board 6. FIG. That is, in the mounting step S<b>10 , it is preferable that the mounting setting positions CP where the electronic components C are mounted by the mounting processing section 51 are widely distributed on the position detecting board 6 . In this case, the difference calculation processing unit 53 can calculate the difference D in a wider range in the difference calculation step S30 described later, so that the correction processing unit 54 can mount the electronic component C in a wider range in the correction step S40 described later. Position 2P can be corrected.

The detection processing unit 52 outputs a control command to detect the plurality of electronic components C mounted on the position detection board 6 by the board camera 3 (detection step S20).

In the detection step S20, first, the detection processing unit 52 uses the imaging function of the board camera 3 and the moving function of the moving mechanism 4 to set the imaging position 3P of the board camera 3 on each mounting position detection board 6. Move it toward the setting position CP.

In the detection step S20, next, the detection processing unit 52 causes the board camera 3 that has moved to pick up images of the respective mounting setting positions CP and the respective electronic components C mounted in the vicinity thereof, thereby obtaining image data of the electronic components C. get Thereby, the detection processing unit 52 detects each electronic component C and detects the position where each electronic component C is mounted as the detection position RP.

The difference calculation processing unit 53 calculates the difference D between the mounting setting position CP and the detection position RP of the electronic component C (difference calculation step S30).

In the difference calculation step S30, as shown in FIG. 6, the difference calculation processing unit 53 calculates the XY coordinates of the vector of the difference D by subtracting the XY coordinates of the mounting setting position CP from the XY coordinates of the detection position RP. In the difference calculation step S30, the difference calculation processing unit 53 calculates the XY coordinates of the vector of the difference D for all the electronic components C mounted in the mounting step S10 and detected in the detection step S20.

The correction processing unit 54 adjusts the mounting position of the electronic component C in a direction that cancels out the Y-coordinate component of the difference D with respect to the X-coordinate of the mounting setting position CP and the X-coordinate component of the difference D with respect to the Y-coordinate of the mounting setting position CP. 2P is corrected (correction step S40). Specifically, the correction processing unit 54 corrects the X coordinate of the difference D with respect to Y1 of the mounting setting position CP with respect to the coordinates (X1, Y1) of the mounting setting position CP where the electronic component C is mounted by the mounting processing unit 51. By subtracting the component ΔX1 from X1 and subtracting the Y coordinate component ΔY1 of the difference D of the mounting setting position CP from X1 from Y1, the coordinates are corrected to (X1−ΔX1, Y1−ΔY1).

In the correction step S40, first, as shown in FIG. 7, the correction processing unit 54 collects the X-coordinate data of the vector of the difference D with respect to the Y-coordinate of the mounting setting position CP for each of the mounted electronic components C. . In the correction step S40, for example, the correction processing unit 54 collectively handles the mounting setting positions CP having the same Y coordinate, and performs statistical processing such as arithmetic averaging on the X coordinate data of the vectors of the plurality of differences D. to calculate data points DP _XY and error bars EB _XY .

In the correction step S40, as shown in FIG. 7, the correction processing unit 54 performs fitting processing on the data points DP _XY and the error bars EB _XY using a polynomial function to obtain the data points DP _XY and the error bars EB XY. A first approximation function F _ΔX (Y) based on EB _XY is obtained. This first approximation function F _ΔX (Y) is indicated by a first approximation function curve FC _XY in FIG.

In the correction step S40, the correction processing unit 54 then adjusts the mounting position 2P of the electronic component C in the direction of canceling out the X-coordinate component of the vector of the difference D based on the obtained first approximation function F _ΔX (Y). correct. Specifically, in the correction step S40, the correction processing unit 54 applies a first approximation function F _ΔX (Y _{) at Y=Y1 is subtracted from X1 to correct the coordinates (X1−F ΔX (} Y1), Y1).

In the correction step S40, in parallel with the processing of the X-coordinate data of the vector of the difference D with respect to the Y-coordinate of the mounting setting position CP, the Y-coordinate data of the vector of the difference D with respect to the X-coordinate of the mounting setting position CP is processed. Also run That is, in the correction step S40, first, as shown in FIG. gather up. In the correction step S40, for example, the correction processing unit 54 collectively handles the mounting setting positions CP having the same X coordinate, and performs statistical processing such as arithmetic averaging on the Y coordinate data of the vectors of the plurality of differences D. to calculate data points DP _YX and error bars EB _YX .

In the correction step S40, as shown in FIG. 8, the correction processing unit 54 performs fitting processing on the data point DP _YX and the error bar EB _YX using a polynomial function to obtain the data point DP _YX and the error bar EB YX. A second approximation function F _ΔY (X) based on EB _YX is obtained. This second approximation function F _ΔY (X) is indicated by a second approximation function curve FC _YX in FIG.

In the correction step S40, the correction processing unit 54 then adjusts the mounting position 2P of the electronic component C in the direction of canceling out the Y-coordinate component of the vector of the difference D based on the obtained second approximation function F _ΔY (X). correct. Specifically, in the correction step S40, the correction processing unit 54 applies a second approximation function F _ΔY (X ) at X=X1 is subtracted from Y1 to correct the coordinate (X1, Y1-F _ΔY (X1)) _.

Combining the processing in the above correction step S40, in the correction step S40, the correction processing unit 54 performs the coordinate (X1, Y1) of the mounting setting position CP at which the mounting processing unit 51 mounts the electronic component C as the first By subtracting the value F _ΔX (Y1) of the first approximation function F _ΔX (Y) at Y=Y1 from X1 and subtracting the value F _ΔY (X1) of the second approximation function F _ΔY (X) at X=X1 from Y1, , coordinates (X1-F _ΔX (Y1), Y1-F _ΔY (X1)).

<effect>
As described above, according to the present embodiment, the correction processing unit 54 calculates the component of the Y coordinate of the difference D with respect to the X coordinate of the mounting setting position CP and the X coordinate of the difference D with respect to the Y coordinate of the mounting setting position CP. Since the mounting position 2P of the electronic component C is corrected in the direction of canceling out the components , and , it is possible to suppress deviation in a direction different from the direction of the movement operation during mounting.

As a result of diligent studies, the inventor performed a calibration process of the mounting head 2 and an alignment process between the mounting head 2 and the position detection board 6 to set the mounting position CP of the mounting position 2P of the electronic component C. Even if the deviation from the nozzle 21 is suppressed to the order of several μm, when a plurality of electronic components C are mounted over 250 mm, only the tip of the nozzle 21 is bent due to mechanical distortion depending on the coordinates in the Y-axis direction. It has been found that there is a tendency for the mounting position 2P to deviate from the mounting set position CP by about 20 μm in the X-axis direction as the relative position vector R changes due to factors such as shifting. The mounting apparatus 1 according to the present embodiment makes it possible to suppress this type of deviation based on the tendency of this type of deviation.

According to this embodiment, the first approximation function F _ΔX (Y) is obtained for the data of the X coordinate of the vector of the difference D with respect to the Y coordinate of the mounting setting position CP, and the difference D with respect to the X coordinate of the mounting setting position CP is obtained. A second approximation function F _ΔY (X) is _obtained for the Y-coordinate data of the vector, and the _XY The mounting position 2P of the electronic component C is corrected in the direction of canceling both components. Therefore, according to the present embodiment, even at each coordinate where the electronic component C is not mounted in the mounting step S10, the mounting position 2P of the electronic component C is appropriately corrected, and the direction of the movement operation during mounting is changed. Misalignment in different directions can be suppressed.

[Second embodiment]
A second embodiment will be described. In the following description, the same reference numerals are given to the same constituent elements as in the above-described embodiment, and the description thereof will be simplified or omitted.

In the present embodiment, the correction processing unit 54 uses the data acquired and calculated when the position detection substrate 6 is placed in the first area 6A (see FIG. 9) and the position detection substrate 6 in the first area 6A. An example will be described in which the data acquired and calculated when placed in a different second area 6B (see FIG. 9) are combined and processed as one piece of data.

<Mounting method>
FIG. 9 is a diagram schematically showing an example of a mounting method according to the second embodiment. FIG. 9 shows a first region 6A and a second region 6B, which are two regions where the position detection substrate 6 is placed, and an example of mounting the electronic component C when the position detection substrate 6 is placed in each region. It shows about

In the mounting method according to the second embodiment, when the position detection substrate 6 is placed in the first area 6A, the same mounting step S10, detection step S20, and difference calculation step S30 as in the mounting method according to the first embodiment are performed. to run.

In addition, in the mounting method according to the second embodiment, when the position detection substrate 6 is placed on the second region 6B, the same mounting method is used when the position detection substrate 6 is placed on the first region 6A. Using the XY coordinate system, the same mounting step S10, detection step S20, and difference calculation step S30 as in the mounting method according to the first embodiment are executed.

In the correction step S40 in the mounting method according to the second embodiment, first, the correction processing unit 54 determines the difference from the mounting set position CP of the electronic component C acquired when the position detection board 6 is placed in the first area 6A. D and the data of the difference D and the mounting set position CP of the electronic component C obtained when the position detection board 6 is placed in the second area 6B are combined into one piece of data.

In the correction step S40 in the mounting method according to the second embodiment, after that, the same data as in the correction step S40 in the mounting method according to the first embodiment is performed on the combined data, and the vector of the difference D is The mounting position 2P of the electronic component C is corrected in the direction of canceling each component of the XY coordinates of .

<effect>
As described above, according to the present embodiment, the correction processing unit 54 obtains and calculates the data obtained and calculated when the position detection substrate 6 is placed on the first area 6A, and the position detection substrate 6 as the first position detection substrate. Since the data obtained and calculated when placed in the second area 6B different from the area 6A is combined and processed as one piece of data, a wide area that cannot be covered by a single substrate 6 for position detection can also be processed. , the mounting position 2P of the electronic component C can be corrected based on one unified reference.

DESCRIPTION OF SYMBOLS 1... Mounting apparatus, 2... Mounting head, 2P... Mounting position, 3... Board camera, 3P... Imaging position, 4... Moving mechanism, 5... Control device, 5A... Processing device, 5B... Storage device, 5C... Input/output interface , 6... substrate for position detection, 6A... first area, 6B... second area, 10... base, 11... substrate conveying part, 17... support part, 20... feeder, 21... nozzle, 22... rotating shaft, 23 Head base 24 Head housing 41 X-axis guide 42 Y-axis guide 43 Z-axis guide 51 Mounting processing unit 52 Detection processing unit 53 Difference calculation processing unit 54 Correction processing unit 61: Reference mark C: Electronic component CP: Mounting setting position D: Difference P: Board R: Relative position vector RP: Detection position DP _XY : Data point DP _YX : Data point , EB _XY ... error bar, EB _YX ... error bar, FC _XY ... first approximate function curve, FC _YX ... second approximate function curve.

Claims (4)

a mounting head having a nozzle for releasably holding an electronic component, and for mounting the electronic component held by the nozzle onto a substrate;
a substrate camera supported by the mounting head;
a moving mechanism for moving the mounting head;
a controller;
The control device is
a mounting processing unit that mounts the electronic component on the position detection board by the mounting head with reference to the position of the board camera defined on a predetermined plane parallel to the surface of the board;
a detection processing unit that detects the electronic component mounted on the position detection board by the board camera;
a difference calculation processing unit that calculates a difference between a mounting set position and a detection position of the electronic component in each of a first axial direction of the predetermined surface and a second axial direction of the predetermined surface orthogonal to the first axial direction;
a component of the second axis direction coordinate of the difference with respect to the first axis direction coordinate of the mounting setting position; and a first axis direction coordinate of the difference with respect to the second axis direction coordinate of the mounting setting position. and a correction processing unit that corrects the mounting position of the electronic component in a direction to cancel the component of
The correction processing unit is configured to calculate the component of the second axis direction coordinate of the difference with respect to the first axis direction coordinate of the mounting setting position and the component of the difference with respect to the second axis direction coordinate of the mounting setting position. obtaining an approximation function for each of the coordinate component in the first axis direction and correcting the mounting position based on the approximation function;
mounting equipment. a mounting head having a nozzle for releasably holding an electronic component, and for mounting the electronic component held by the nozzle onto a substrate;
a substrate camera supported by the mounting head;
a moving mechanism for moving the mounting head;
a controller;
The control device is
a mounting processing unit that mounts the electronic component on the position detection board by the mounting head with reference to the position of the board camera defined on a predetermined plane parallel to the surface of the board;
a detection processing unit that detects the electronic component mounted on the position detection board by the board camera;
a difference calculation processing unit that calculates a difference between a mounting set position and a detection position of the electronic component in each of a first axial direction of the predetermined surface and a second axial direction of the predetermined surface orthogonal to the first axial direction;
a component of the second axis direction coordinate of the difference with respect to the first axis direction coordinate of the mounting setting position; and a first axis direction coordinate of the difference with respect to the second axis direction coordinate of the mounting setting position. and a correction processing unit that corrects the mounting position of the electronic component in a direction to cancel the component of
The correction processing unit obtains and calculates data obtained when the position detection substrate is placed on the first region and data obtained when the position detection substrate is placed on the second region different from the first region. Process the obtained and calculated data together as one data,
mounting equipment. a mounting step of mounting an electronic component on a position detection board by means of a mounting head with reference to the position of the board camera defined on a predetermined plane parallel to the surface of the board;
a detection step of detecting the electronic component mounted on the position detection board by the board camera;
a difference calculating step of calculating a difference between a mounting set position and a detected position of the electronic component in each of a first axial direction of the predetermined surface and a second axial direction of the predetermined surface orthogonal to the first axial direction;
a component of the second axis direction coordinate of the difference with respect to the first axis direction coordinate of the mounting setting position; and a first axis direction coordinate of the difference with respect to the second axis direction coordinate of the mounting setting position. and a correction step of correcting the mounting position of the electronic component in a direction to cancel the component of
In the correcting step, the components of the second axis direction coordinates of the difference with respect to the first axis direction coordinates of the mounting setting position and the second component of the difference with respect to the second axis direction coordinates of the mounting setting position Obtaining an approximation function for each of a coordinate component in one axis direction and correcting the mounting position based on the approximation function;
How to implement. a mounting step of mounting an electronic component on a position detection board by means of a mounting head with reference to the position of the board camera defined on a predetermined plane parallel to the surface of the board;
a detection step of detecting the electronic component mounted on the position detection board by the board camera;
a difference calculating step of calculating a difference between a mounting set position and a detected position of the electronic component in each of a first axial direction of the predetermined surface and a second axial direction of the predetermined surface orthogonal to the first axial direction;
a component of the second axis direction coordinate of the difference with respect to the first axis direction coordinate of the mounting setting position; and a first axis direction coordinate of the difference with respect to the second axis direction coordinate of the mounting setting position. and a correction step of correcting the mounting position of the electronic component in a direction to cancel the component of
In the correcting step, data acquired and calculated when the position detection substrate is placed on the first region and data acquired when the position detection substrate is placed on the second region different from the first region and the calculated data are combined and processed as one data,
How to implement.

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