JP7160244B2 - coil electronic components - Google Patents

Description

The present invention relates to a coil electronic component, and more particularly to a thin-film power inductor with increased capacity and reduced size.

As electronic products such as smartphones become smaller and have higher performance, there is a demand for electronic components mounted in the products to be smaller and have higher performance at the same time. Therefore, there is a demand for the development of power inductors, especially thin-film power inductors that are advantageous for miniaturization.

JP-A-11-204337

One of the various problems to be solved by the present invention is to provide a coil electronic component that eliminates non-uniform plating of a plurality of coil patterns.

A coil electronic component according to an example of the present invention includes a body and external electrodes disposed on an outer surface of the body. The body includes a support member having a through hole, and an upper coil and a lower coil supported by the support member. The upper coil and the lower coil are connected by a via, and the via is formed in at least part of the end of the through hole of the support member.

One of the various effects of the present invention is to provide a coil electronic component that reduces the non-uniformity of the coil pattern, improves the deterioration of the electrical characteristics, and maximizes the core area to increase the magnetic permeability. is.

1 is a perspective view of a coil electronic component according to a first embodiment of the present invention; FIG. FIG. 2 is a plan view of the internal coil of FIG. 1 viewed from above; FIG. 2 is a sectional view taken along line II' of FIG. 1; FIG. 2 is a process chart showing an example of a manufacturing process of the coil electronic component of FIG. 1; FIG. 2 is a process chart showing an example of a manufacturing process of the coil electronic component of FIG. 1; FIG. 2 is a process chart showing an example of a manufacturing process of the coil electronic component of FIG. 1; FIG. 2 is a process chart showing an example of a manufacturing process of the coil electronic component of FIG. 1; FIG. 2 is a process chart showing an example of a manufacturing process of the coil electronic component of FIG. 1; FIG. 2 is a process chart showing an example of a manufacturing process of the coil electronic component of FIG. 1; FIG. 2 is a process chart showing an example of a manufacturing process of the coil electronic component of FIG. 1; FIG. 2 is a process chart showing an example of a manufacturing process of the coil electronic component of FIG. 1; 1 is a perspective view of a conventional coil electronic component; FIG. FIG. 5b is a sectional view taken along line II-II' of FIG. 5a; FIG. 5 is a cross-sectional view of a coil electronic component according to a second embodiment of the present invention; FIG. 7 is a process chart showing an example of a manufacturing process of the coil electronic component of FIG. 6; FIG. 7 is a process chart showing an example of a manufacturing process of the coil electronic component of FIG. 6; FIG. 7 is a process chart showing an example of a manufacturing process of the coil electronic component of FIG. 6; FIG. 7 is a process chart showing an example of a manufacturing process of the coil electronic component of FIG. 6; FIG. 7 is a process chart showing an example of a manufacturing process of the coil electronic component of FIG. 6; FIG. 7 is a process chart showing an example of a manufacturing process of the coil electronic component of FIG. 6; FIG. 7 is a process chart showing an example of a manufacturing process of the coil electronic component of FIG. 6;

Embodiments of the present invention will now be described with reference to the accompanying drawings. However, embodiments of the invention may be embodied in various other forms, and the scope of the invention is not limited to the embodiments set forth below. Moreover, embodiments of the present invention are provided so that the present invention may be more fully understood by those of average skill in the art. Therefore, the shapes and sizes of elements in the drawings may be enlarged or reduced (or emphasized or simplified) for clearer explanation, and elements indicated by the same reference numerals in the drawings are the same. is an element.

In order to clearly explain the present invention, parts not related to the explanation are omitted in the drawings, and the thickness is enlarged to clearly express various layers and regions. The same reference numerals are used to describe the same components.

As used throughout the specification, the use of "comprising" an element means that other elements may be included, rather than excluding other elements, unless specifically stated to the contrary. do.

A coil electronic component according to an example of the present invention will be described below, but the present invention is not necessarily limited to this.

1 is a perspective view of the coil electronic component 100 according to the first embodiment of the present invention, FIG. 2 is a plan view of the internal coil of FIG. 1 as seen from above, and FIG. It is a sectional view.

1 to 3, the coil electronic component 100 includes a body 1 and external electrodes 21, 22 arranged on the outer surface of the body.

The main body 1 constitutes the appearance of the coil electronic component, and includes an upper surface and a lower surface facing each other in the thickness (T) direction, a first end face and a second end face facing each other in the longitudinal (L) direction, and a width (W) direction. may have a substantially hexahedral shape, including first and second sides facing each other at, but not limited to.

The main body 1 includes a magnetic material 11, but the magnetic material may include any magnetic material without limitation, such as being filled with ferrite or a metallic soft magnetic material. good too. The ferrite may include known ferrites such as Mn--Zn ferrite, Ni--Zn ferrite, Ni--Zn--Cu ferrite, Mn--Mg ferrite, Ba ferrite and Li ferrite. The metal-based soft magnetic material may be an alloy containing one or more selected from the group consisting of Fe, Si, Cr, Al and Ni, for example, Fe-Si-B-Cr amorphous may include, but are not limited to, fine metal particles. The metallic soft magnetic material may have a particle size of 0.1 μm or more and 20 μm or less, and may be contained in a dispersed form in a polymer phase such as epoxy resin or polyimide.

An internal coil 12 is sealed in the main body 1 with a magnetic material 11 . The internal coils include an upper coil 121 and a lower coil 122 , the upper coil supported on the upper surface of the support member 13 and the lower coil supported on the lower surface of the support member 13 .

First, the support member 13 will be described. Any material that can insulate the upper coil and the lower coil can be used for the support member 13 without limitation. As the insulating material, thermosetting resin such as epoxy resin, thermoplastic resin such as polyimide, or resin impregnated with reinforcing material such as glass fiber or inorganic filler, such as prepreg, can be used. It is not limited to these.

The support member 13 includes a through hole H penetrating from the upper surface to the lower surface. The through hole is filled with a magnetic material to smooth the flow of magnetic flux and improve magnetic permeability. At least part of the boundary surface HS of the through-hole is in contact with the via 1212 .

5a and 5b, FIG. 5a is a perspective view of a conventional coil electronic component 500, and FIG. 5b is a cross-sectional view taken along line II-II' of FIG. 5a. As shown in FIGS. 5a and 5b, in the conventional coil electronic component 500, the vias 51 connecting the upper coil and the lower coil fill the via holes V provided separately from the through holes of the supporting member. configured to As a result, there is no room for vias to be formed at the boundary surfaces of the through-holes in the support member. In this way, when a via hole is formed separately from the through hole and then the via is configured to fill the via hole, the via pad for forming the via is designed to have a predetermined size or larger to prevent the via from opening. However, this is designed regardless of the line width of the coil pattern connected to the via. When the via pad is formed over a predetermined size, it is difficult to prevent the line width of the via from overgrowing compared to the line width of other coil patterns. In this case, variations in plating occur between the via and non-via coil patterns, resulting in non-uniform growth in the coil pattern. In addition, since via holes are formed in addition to the through holes in the support member having a limited size, the space for forming the through holes is relatively reduced. If the through-hole is formed large, there is an advantage in electrical characteristics such as magnetic permeability, but there is a limit to improving the electrical characteristics of the coil electronic component due to insufficient marginal space.

Unlike the conventional coil electronic component 500, the coil electronic component 100 according to the first embodiment does not have a separate via hole, so that the area of the through hole H of the support member can be maximized. As a result, the magnetic permeability can be improved and the magnetic flux generated from the internal coil can flow smoothly.

The maximum line width W1 occupied by the via 1212 on the boundary surface HS of the through hole is not particularly limited, but is preferably formed substantially at the same level as the average line width of the coil pattern other than the via. This means that overplating of vias does not occur, and when the line width of the coil pattern is made finer, the line width of the vias can also be finely controlled to a similar level. The maximum line width W1 of the via is preferably 0.8 times or more and 1.2 times or less of the line width W2 of the coil pattern directly connected to the via. If maintained, the line width W2 of the coil pattern directly connected to the via is substantially the same as the average line width of the coil pattern. In this way, when the maximum line width W1 of the via exhibits a 20% level variation in the coil pattern other than the via, it is possible to prevent deterioration in characteristics due to non-uniform growth of the coil pattern.

Referring to FIG. 2, the vias are formed to form a predetermined angle θ with respect to the winding direction of the coil pattern, and it is appropriate that the predetermined angle is less than 180°. This means that the via has a structure configured to extend along the boundary surface of the through-hole of the support member, so that an angle is necessarily formed in order to connect the upper coil to the lower coil. do. More preferably, the vias are drawn out perpendicular to the winding direction of the coil pattern. In this case, the size of the via can be minimized and the filling rate of the magnetic material in the center of the coil core can be maximized, which is advantageous for electrical characteristics.

On the other hand, the conventional coil electronic component 500 is designed such that the vias 51 are filled in the via holes rather than formed on the ends of the through holes. It is distinguished from the coil electronic component 100 of the present invention in that it is formed along the via hole of the supporting member as it is without changing the direction from the coil electronic component 100 of the present invention.

Also, referring to FIG. 2, both ends of the support member that supports the lead-out portion of the internal coil connected to the external electrode include a slit portion S. The slit portion is formed to prevent overplating of the lead-out portion. is selectively formed at The cross-sectional shape of the slit portion can be appropriately set by those skilled in the art. For example, a plurality of slit portions can be formed in a polygonal, elliptical, or circular shape, or a combination thereof. The slit portion S may be formed before plating the internal coil, or may be formed after the internal coil is plated, and the forming method may be appropriately selected by laser, drilling, or the like. When forming the slit portion after plating the internal coil, the upper and lower surfaces of the support member where the slit portion is formed are preferably shielded with an insulating material to prevent plating. The slit portion S may be filled with a magnetic material that fills the through hole of the support member.

Next, the via 1212 has a laminated structure in which a plurality of conductive pattern layers are laminated. For a detailed description of this structure, refer to an enlarged view of area A of FIG.

Referring to the enlarged view of area A in FIG. 3, the vias 1212 may be composed of at least the first to fifth conductive pattern layers. Here, the via does not have to include all of the first to fifth conductive pattern layers, and may include additional conductive pattern layers in addition to the conductive pattern layers. Additional conductive pattern layers are added to increase the aspect ratio of the coil and can be combined as appropriate in view of the anisotropic and/or isotropic plating process requirements.

The via 1212 includes a first patterned conductive layer 1212a contacting the top or bottom surface of the support member and disposed at the bottom of the plurality of patterned conductive layers. The first conductive pattern layer may be a copper (Cu) foil layer previously prepared when forming the support member. Although the thickness of the first conductive pattern layer is not particularly limited, it is preferably about 20 μm considering the thickness of a normal copper foil layer of CCL (Copper Clad Laminate). In addition, the first conductive pattern layer may be a thin film layer formed using a separate sputtering process other than the copper foil layer. In this case, molybdenum (Mo), nickel (Ni), etc. Various metals can be selected in addition to the metals that can be used in the plating process, increasing the degree of freedom in material selection.

The first conductive pattern layer 1212a has a structure that does not contact the interface of the through hole. This is because the first conductive pattern layer was prepared at the same time as the support member was prepared, and then the through holes were formed. This is because there is no room for

A second conductive pattern layer 1212b is disposed on the first conductive pattern layer 1212a. The method of forming the second conductive pattern layer 1212b is not particularly limited, but it may be formed by chemical copper plating, for example. The second conductive pattern layer 1212b covers the entire top surface of the first conductive pattern layer of the upper coil, and continuously covers the interface of the through hole and the top surface of the first conductive pattern layer of the lower coil. It is formed. In effect, the second conductive pattern layer acts as a base pattern layer through which vias are formed through the interior of the through-holes. Although the thickness of the second conductive pattern layer is not critically limited, the second conductive pattern layer functions as a base pattern layer and is a pattern layer for substantially increasing the aspect ratio of the coil. Therefore, there is little need to form a thick film. For example, the thickness of the second conductive pattern layer is preferably 1 μm to 10 μm, but is not limited to this.

Next, a third conductive pattern layer 1212c is further formed to cover the second conductive pattern layer using the second conductive pattern layer 1212b as a base pattern layer. The third conductive pattern layer 1212c may be formed by patterning a dry film and then filling it. The third conductive pattern layer 1212c may be made of any material having excellent electrical conductivity, such as copper (Cu) and nickel (Ni). The third conductive pattern layer is formed so as to penetrate through the through holes, like the second conductive pattern layer.

On the other hand, when forming the via 1212, as described above, since the dry film is patterned and then filled, at least part of the end of the via can be formed in a straight line. The dry film acts as a guide for the formation of vias, and the shape can be controlled so that the vias have straight edges. This means that overplating of vias can be effectively prevented.

Next, on the third conductive pattern layer 1212c, a fourth conductive pattern layer 1212d, which is relatively thinner than the third conductive pattern layer, may be formed, which is a kind of overplating. It can be said. An anisotropically plated layer that substantially increases the aspect ratio of the coil pattern may be formed as a fifth conductive pattern layer 1212e on the fourth conductive pattern layer 1212d.

In the case of the via 1212, since it is not necessary to form a via pad larger than a predetermined size, the line width of the via can be controlled to the same or similar level as the line width of the coil pattern other than the via. As a result, variations in line width and thickness of the coil pattern can be greatly reduced.

On the other hand, the coil pattern 123 forming the upper coil and the lower coil other than the via also has a laminated structure like the via. Referring to the enlarged view of area B of FIG. 3, each of the coil patterns includes a plurality of conductive layers. In the coil pattern, the first conductive layer 123a, which is in direct contact with the top or bottom surface of the support member, is disposed coplanar with the first conductive pattern layer of the via and comprises the same material, but this is the same as the first conductive layer. This is because the conductive layer and the first conductive pattern layer are formed in the same process. A second conductive layer 123b is formed on the first conductive layer, and the second conductive layer may be a thin chemical copper plating layer. Substantially, the first conductive layer and the second plated layer are formed by etching the side surfaces by etching or the like, and therefore preferably have the same line width. Next, a third plating layer 123c having the same line width as that of the second plating layer is formed on the second plating layer, and the third plating layer is filled with a plating solution after patterning a dry film. Since it is formed by , it is a layer whose shape is relatively easy to control. Next, on the third plating layer, a fourth plating layer 123d that is a multi-layer plating layer and a fifth plating layer 123e that is an anisotropic plating layer may be formed.

The method of manufacturing the coil electronic component according to the first embodiment described with reference to FIGS. 1 to 3 can be appropriately designed by those skilled in the art, and one possible manufacturing process will be briefly described.

4a to 4h are process diagrams showing an example of the manufacturing process of the coil electronic component 100 according to the first embodiment, and FIG. 4a shows the process of preparing the support member 41. FIG. In this case, a copper foil layer 42 may be coated on the support member, but for convenience, a known CCL (Copper Clad Laminate) containing copper foil layers on both sides of the insulating sheet may be used. The use of a known CCL has the advantage that a thin-film coil can be formed without changing facilities and equipment for the process. Here, the copper foil layer 42 may substantially constitute the bottom layer of the via or coil pattern.

FIG. 4b is a cavity process for forming a through-hole penetrating from the upper surface to the lower surface of the support member. Normally, the cavity process is generally performed in a post-process after the internal coil is completed. It is necessary to form a through hole. At this time, it is preferable to apply a post-treatment to the boundary surface of the through-hole, but it is also possible to form an uneven structure on the surface of the boundary surface in addition to applying a post-treatment for adjusting the surface of the boundary surface. The concave-convex structure formed on the surface of the boundary surface is applicable without limitation as long as it has a shape that can improve the adhesive strength between the via and the support member when forming the plating layer for the via on the boundary surface of the through hole. be able to.

FIG. 4c is the step of forming a chemical copper plating layer 43 covering the upper surface of the copper foil layer 42 on the support member and the interface of the through holes. The chemical copper plating process is intended to substantially function as a seed pattern for pattern plating. Plating in the chemical copper plating step may be electroless plating or electroplating, but is not particularly limited.

FIG. 4d shows a step of patterning 44 into a desired pattern after laminating the dry film. In this case, the patterning is designed such that a part of the boundary surface of the through-hole is opened in order to form a via for electrically connecting the upper coil and the lower coil. At this time, since the line width of the via can be substantially controlled, it is preferable to pattern to substantially the same level as the line width of the coil pattern other than the via.

FIG. 4e is the step of pattern plating 45 the coil pattern in the openings of the patterned 44 dry film. The pattern plating 45 is formed by using the chemical copper plating layer 43 as a seed pattern and covering the surface of the chemical copper plating layer 43 . The thickness of the pattern plating varies depending on the thickness of the laminated dry film, and can be appropriately controlled by those skilled in the art.

FIG. 4f is the step of removing the dry film. The method of removing the dry film is not limited, and may be removed using chemical etching or mechanical peeling.

FIG. 4g shows the step of applying overlap plating 46 to cover the laminated structure of the remaining copper foil layer, chemical copper plating layer and pattern plating, and FIG. This is a process for realizing a high aspect ratio, and is a process for forming the anisotropically plated layer 47 .

Although not specifically shown, post-processes such as a blade process for filling with a magnetic material and exposing the lead-out portion of the coil, a plating process for forming external electrodes, and the like are different from the normal chip forming process. It is redundant.

FIG. 6 is a perspective view of a coil electronic component 200 according to a second embodiment of the invention. A coil electronic component 200 according to the second embodiment differs from the coil electronic component 100 according to the first embodiment described above only in the number of layers of the laminated structure of the vias and the laminated structure of the coil patterns other than the vias. contains essentially the same components. For convenience of explanation, overlapping explanations are omitted, and the same reference numerals are used for the same components. However, in the second embodiment, the first number of the code is changed from "1" to "2" to distinguish it from the first embodiment.

Referring to FIG. 6, the via 2212 of the coil electronic component 200 according to the second embodiment has a laminated structure. Here, the via 2212 differs from the via 1212 of the coil electronic component according to the first embodiment in that it does not include the first conductive pattern layer. A second conductive pattern layer 2212b, which does not include the first conductive pattern layer and continuously covers the upper and lower surfaces of the support member and the boundary surfaces of the through holes, constitutes the lowest layer of the plurality of conductive pattern layers of the via. This is advantageous if the coil electronics is implemented as a Low-Profile product, and if a thin film support member is used to replace the known CCL. In general, using a known CCL is simple because it does not require a separate process for forming the first conductive pattern layer, but the thickness is about 60 μm, which meets the low profile requirement. It may disappear. Therefore, by adopting a support member that is much thinner than the known CCL and directly forming the second conductive pattern layer 2212b on the support member, the size of the coil electronic component in the thickness direction can be reduced. , a relatively high aspect ratio of the coil pattern can be achieved. Also, as described above, the third to fifth conductive pattern layers 2212c, 2212d, and 2212e can be arranged on the second conductive pattern layer.

Similarly, the coil pattern 223 of the coil electronic component 200 according to the second embodiment, excluding the vias, has a laminated structure, but when compared with the coil pattern of the coil electronic component according to the first embodiment, the first conductive layer is omitted. is. The structure of the coil pattern 223 is also for conforming to the trend of low-magnification and high-aspect-ratio coil electronic components. The bottom layer of the coil pattern 223 is the second conductive layer 223b, and as described above, the third to fifth conductive layers 223c, 223d and 223e can be arranged on the second conductive layer.

Next, FIGS. 7a to 7g are process diagrams showing an example of the manufacturing process of the coil electronic component 200 according to the second embodiment. The manufacturing process of the coil electronic component 200 according to the second embodiment shown in FIGS. 7a to 7g differs from the manufacturing process of the coil electronic component 100 according to the first embodiment described in FIGS. 4a to 4h. 7a to 7g will be omitted here because they are different only in that they further include a step of removing the foil layer, and since they contain substantially duplicate content. In the second embodiment shown in FIGS. 7a to 7g, the same reference numerals are used for the components overlapping the manufacturing process of the coil electronic component 100 according to the first embodiment shown in FIGS. Change the first digit of the code from "4" to "7" to distinguish from

The invention is not limited to the embodiments described above and the accompanying drawings, but rather to the scope of the claims. Therefore, a person having ordinary knowledge in the technical field can make various substitutions, modifications, and changes within the scope of the technical idea of the present invention described in the claims. These are also included in the scope of the present invention.

On the other hand, the expression "one example" used in the present invention does not mean the same embodiment as each other, but is provided to emphasize and explain unique features that are different from each other. However, one embodiment presented above does not exclude cases where it is implemented in combination with features of other embodiments. For example, even if an item described in one particular embodiment is not described in another embodiment, it is not described in other embodiments to the contrary or inconsistent with that item. As long as the description is related to other embodiments, it can also be interpreted.

Also, the terms used in the present invention are only used to describe one example and are not intended to limit the present invention. In this context, the singular includes the plural unless the context clearly dictates otherwise.
[Item 1]
a main body including a support member including a through hole, an upper coil and a lower coil supported by the support member, and vias connecting the upper coil and the lower coil;
an external electrode disposed on the outer surface of the body;
The coil electronic component, wherein the via is formed on at least part of a boundary surface of the through hole.
[Item 2]
The coil electronic component according to item 1, wherein the via has a laminated structure in which a plurality of conductive pattern layers are laminated.
[Item 3]
At least one conductive pattern layer of the plurality of conductive pattern layers is formed along a portion of the boundary surface of the through hole, and the at least one conductive layer formed along a portion of the boundary surface. 3. The coil electronic component according to item 2, wherein the patterned layer continuously extends to the top and bottom of the support member.
[Item 4]
A conductive pattern layer formed along upper and lower surfaces of the support member continuously connected to a portion of the boundary surface of the through hole and a portion of the boundary surface includes a plurality of conductive patterns of the via. 4. The coil electronic component according to item 3, which is a conductive pattern layer arranged in the lowest layer among the layers.
[Item 5]
5. The coil electronic component according to any one of items 2 to 4, wherein, among the plurality of conductive pattern layers, the conductive pattern layer that contacts the upper surface or the lower surface of the support member contains Mo or Cu. .
[Item 6]
6. The coil electronic component according to any one of items 2 to 5, wherein the outermost conductive pattern layer among the plurality of conductive pattern layers is arranged to penetrate through the through hole. .
[Item 7]
7. The coil electronic component according to any one of items 1 to 6, wherein the support member further includes a slit portion penetrating from the upper surface to the lower surface of the support member at a position spaced apart from the through hole.
[Item 8]
The coil electronic component according to Item 7, wherein the slit portions are arranged at both ends of the support member.
[Item 9]
9. The coil electronic component according to item 7 or 8, wherein the inside of the slit portion is filled with a magnetic substance.
[Item 10]
10. The coil electronic component according to any one of items 1 to 9, wherein the through-hole is filled with a magnetic substance.
[Item 11]
11. The coil electronic component according to any one of items 1 to 10, wherein a boundary surface of the through hole, excluding a boundary surface where the via is formed, is in contact with an insulating layer or a magnetic substance.
[Item 12]
12. The upper coil and the lower coil according to any one of items 1 to 11, wherein each of the plurality of coil patterns includes a plurality of coil patterns other than the vias, and each of the plurality of coil patterns is composed of a plurality of conductive layers. coil electronics.
[Item 13]
Item 12, wherein the line width of the first conductive layer in contact with the top surface or the bottom surface of the support member among the plurality of conductive layers is the same as the line width of the second conductive layer in contact with the top surface of the first conductive layer. Coil electronics as described.
[Item 14]
14. The maximum line width of the via according to any one of items 1 to 13, wherein the line width of the coil pattern physically connected to the via is 0.8 times or more and 1.2 times or less. coil electronic components.
[Item 15]
15. The coil electronic component according to any one of items 1 to 14, wherein at least part of an end portion of the cross section of the via when viewed from above the main body is straight.
[Item 16]
16. The coil electronics according to any one of items 1 to 15, wherein the via is formed in a direction forming an angle (θ) of less than 180° with a direction in which the coil pattern of the upper coil or the lower coil is wound. parts.

REFERENCE SIGNS LIST 100 coil electronic component 1 body 11 magnetic substance 12 internal coil 121 upper coil 122 lower coil 1212 via 13 support member 21, 22 external electrode

Claims (16)

a main body including a support member including a through hole, an upper coil and a lower coil supported by the support member, and vias connecting the upper coil and the lower coil;
an external electrode disposed on the outer surface of the body;
the via is formed on at least part of the boundary surface of the through hole ,
The via has a laminated structure in which a plurality of conductive pattern layers are laminated,
The plurality of conductive pattern layers are
a first patterned conductive layer covering the upper and lower surfaces of the support member;
a second conductive pattern layer covering the first conductive pattern layer from the upper surface side and the lower surface side of the supporting member and covering the boundary surface of the through hole;
a third conductive pattern layer covering the second conductive pattern layer from the upper surface side and the lower surface side of the support member and the boundary surface side;
including coil electronics. 2. The coil according to claim 1, wherein the plurality of conductive pattern layers further includes a fourth conductive pattern layer covering the third conductive pattern layer from the upper surface side and the lower surface side of the support member and the boundary surface side. electronic components. 3. The coil according to claim 2, wherein the plurality of conductive pattern layers further includes a fifth conductive pattern layer covering the fourth conductive pattern layer from the upper surface side and the lower surface side of the support member and the boundary surface side. electronic components. The second patterned conductive layer is thinner than the first patterned conductive layer and the fourth patterned conductive layer is thinner than the third patterned conductive layer.
The coil electronic component according to claim 2 or 3. The coil electronic component according to claim 1 , wherein the first conductive pattern layer contains Mo or Cu. 6. The coil electron device according to claim 1 , wherein the outermost conductive pattern layer among the plurality of conductive pattern layers is arranged to pass through the through hole. parts. 7. The upper coil and the lower coil according to any one of claims 1 to 6, wherein the upper coil and the lower coil each include a slit portion penetrating from the upper surface to the lower surface of the upper coil and the lower coil at a position spaced apart from the through hole. coil electronic components. 8. The coil electronic component according to claim 7, wherein said slit portions are arranged at both ends of said support member. 9. The coil electronic component according to claim 7, wherein the interior of said slit portion is filled with a magnetic substance. 10. The coil electronic component according to claim 1, wherein said through-hole is filled with a magnetic substance. The coil electronic component according to any one of claims 1 to 10, wherein a boundary surface of said through-hole excluding a boundary surface where said via is formed contacts an insulating layer or a magnetic substance. 12. The upper coil and the lower coil according to any one of claims 1 to 11, wherein each of the plurality of coil patterns includes a plurality of coil patterns other than the vias, and each of the plurality of coil patterns is composed of a plurality of conductive layers. coil electronic components. 13. The coil electronic component according to claim 12, wherein the line width of said first conductive pattern layer is the same as the line width of said second conductive pattern layer in contact with the upper surface of said first conductive pattern layer. 14. The maximum line width of the via according to any one of claims 1 to 13, wherein the line width of the coil pattern physically connected to the via is 0.8 times or more and 1.2 times or less. Coil electronics as described. 15. The coil electronic component according to any one of claims 1 to 14, wherein at least part of an end of a cross section of said via when viewed from above said main body is straight. 16. The coil according to any one of claims 1 to 15, wherein the vias are formed in a direction forming an angle ([theta]) of less than 180[deg.] with a direction in which the coil pattern of the upper coil or the lower coil is wound. electronic components.

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