JP7113218B2 - COMPONENT MOUNTING APPARATUS AND COMPONENT MOUNTING BOARD MANUFACTURING METHOD - Google Patents

Description

TECHNICAL FIELD The present invention relates to a component mounting apparatus for manufacturing a component-mounted board by mounting components including tall components on the board, and a component-mounted board manufacturing method.

A component mounting apparatus for manufacturing a component-mounted board by mounting components on a board includes a board transport section that transports the board in the horizontal direction as seen from the operator and positions the board at a work position, and a board transport section that positions the board at the work position. A front side component supply section provided adjacent to the front side (front side) seen from the operator, and a rear side component supply section provided adjacent to the rear side (rear side) seen from the operator. , and two mounting heads arranged in front and behind corresponding to these front and rear component supply units, respectively (see, for example, Patent Document 1 below). Each mounting head is equipped with a nozzle for sucking and picking up a component, as well as optical devices such as a camera and a sensor. Each mounting head normally receives components supplied from a component supply section located on the side of that mounting head (a front component supply section for a front mounting head, and a rear component supply section for a rear mounting head). After being picked up, it enters the upper area of the board as it is, and mounts the component on the board.

In such a component mounting apparatus, in addition to components (standard components) that are low in height when mounted on a substrate, such as chip components, and do not interfere with optical equipment even when the mounting head moves above them, A component (tall component), such as a connector, which is relatively high when mounted on the board and interferes with the optical device when the mounting head moves above the connector, may be mounted on the board. A tall component is normally supplied from a rear component supply unit, and is picked up by a mounting head on the rear side and mounted on a substrate. Since the optical device of the rear mounting head is arranged behind the nozzle, the rear head moves the components picked up from the rear component supply section into the upper area of the board from the rear side of the board. Then, even if the components to be mounted on the board include tall components, the optical equipment will not interfere with the already mounted components, and the components will It can be attached to the board.

By the way, among the component mounting apparatuses, from the viewpoint of manufacturing cost and downsizing of the entire apparatus, there is also known a component mounting apparatus having a configuration in which the mounting head on the rear side is removed from the component mounting apparatus having the above configuration. In this embodiment of the component mounting apparatus, one mounting head picks up components supplied from both the front and rear component supply units and mounts them on the board.

JP 2015-162480 A

However, in the mounting head provided in the component mounting apparatus of the above embodiment, since the optical device is arranged in front of the nozzle, the mounting head picks up the tall component supplied from the rear component supply section and moves forward as it is. The optics then follows the component through the upper region of the substrate. For this reason, when mounting components, there is a risk that an optical device may interfere with a tall component that has already been mounted on the board.

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a component mounting apparatus and a component mounting board manufacturing method that can mount components including tall components with one mounting head to manufacture a component mounting board.

A component mounting apparatus according to the present invention comprises a board transport section that transports a board in a horizontal first direction and positions it at a working position; A first component supply section provided adjacent to a first side, which is one of two sides facing in a second direction, and the other one of the two sides of the substrate positioned at the working position. a second component supply unit provided adjacent to the second side; one mounting head for picking up a component supplied from a second component supply unit by suction and then entering an area above the board positioned at the working position to mount the component on the board; an optical device provided on the head and positioned on the side facing the first side from the second side with respect to the nozzle, wherein the component supplied by the second component supply unit is mounted on the substrate a tall component whose height exceeds the height of the lower end of the optical device in a folded state, and the mounting head picks up the component supplied from the second component supply unit and then moves to the working position. and the first side of the substrate positioned at the position of the substrate and the first component supply section, and moves upward from the first side from within the first side region to the first side. The mounting head moves across the two sides to enter the upper area of the substrate, and the mounting head picks up the component from the second component supply unit and places the component on the substrate at the second target mounting position. They are attached to the board in order from the one closest to the side .

A method of manufacturing a component-mounted board according to the present invention comprises: a board transporting section that transports a board in a horizontal first direction and positions the board at a working position; a first component supply section provided adjacent to a first side which is one of two sides facing each other in a horizontal second direction; A second component supply unit provided adjacent to one of the second sides, and one mounting head having a downwardly extending nozzle, which is movable with respect to the substrate positioned at the working position. and an optical device provided on the mounting head and positioned on the side facing the first side from the second side with respect to the nozzle, wherein the component supplied by the second component supply unit includes the substrate A method for manufacturing a component-mounted board by a component mounting apparatus including a tall component whose height exceeds the height of the lower end of the optical device when mounted on the optical device, wherein the board is transported by the board transport section. a substrate positioning step of positioning the substrate at the working position; a component mounting step of entering an upper region of the substrate positioned at the working position by the positioning step and mounting a component on the substrate, wherein the component mounting head moves the second component supply part to the component mounting step; After picking up the components supplied from the part supplying part, it moves into the first side area between the first side of the board positioned at the working position and the first part supplying part, The mounting head moves from within the side area so as to traverse above the first side in a direction toward the second side to enter the upper area of the substrate, and the mounting head picks up from the second component supply unit. The components are mounted on the substrate in order from those whose target mounting positions on the substrate are closer to the second side .

According to the present invention, a component mounting board can be manufactured by mounting components including tall components with one mounting head.

1 is a plan view of a component mounting apparatus according to an embodiment of the present invention; FIG. 1 is a side view of a component mounting apparatus according to one embodiment of the present invention; FIG. 1 is a plan view of part of a component mounting apparatus according to an embodiment of the present invention; FIG. 1 is a block diagram showing a control system of a component mounting apparatus according to one embodiment of the present invention; FIG. FIG. 1 is a side view showing a component mounted on a board together with the board by the component mounting apparatus according to the embodiment of the present invention; FIG. 2 is a diagram showing an example of a moving path of a mounting head included in a component mounting apparatus according to an embodiment of the present invention when a component picked up from a front component supply unit is mounted on a board; FIG. 2 is a diagram showing an example of a movement path of a mounting head provided in a component mounting apparatus according to an embodiment of the present invention when a component picked up from a rear component supply section is mounted on a board; (a), (b), and (c) are diagrams for explaining a procedure for mounting, on a board, a component picked up from a rear component supply unit by the mounting head provided in the component mounting apparatus according to the embodiment of the present invention;

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described with reference to the drawings. A component mounting apparatus 1 shown in FIGS. 1 and 2 is an apparatus for manufacturing a component-mounted board by mounting a component 3 on a board 2 . The component mounting apparatus 1 includes a base 11, a substrate transfer section 12, a front component supply section 13A (first component supply section), a rear component supply section 13B (second component supply section), a head moving mechanism 14, a mounting A head 15 , a substrate camera 16 and a component camera 17 are provided. Here, for convenience of explanation, the horizontal direction seen from the operator OP is the X-axis direction (first direction), and the front-rear direction seen from the operator OP, that is, the horizontal direction perpendicular to the first direction is the Y-axis direction. (second direction). Also, the vertical direction is defined as the Z-axis direction.

In FIGS. 1 and 2, the substrate transfer section 12 is provided on the base 11. As shown in FIG. The substrate conveying unit 12 conveys the substrate 2 in the X-axis direction by means of two belt conveyors 12a arranged in parallel, and positions the substrate 2 at a predetermined work position SP.

1 and 3, the front component supply section 13A is provided adjacent to the front side of the board 2 (front side 2A) in the front area of the board 2 positioned at the work position SP. The rear component supply section 13B is provided adjacent to the rear side of the board 2 (rear side 2B) in the rear region of the board 2 positioned at the work position SP. In the present embodiment, the front side 2A of the substrate 2 is one side (first side) of the two sides facing the second horizontal direction (Y-axis direction) orthogonal to the first direction (X-axis direction) ), and the rear side 2B of the substrate 2 corresponds to the other side (second side) of the above two sides of the substrate 2 .

In FIGS. 1 and 2, the front component supply section 13A and the rear component supply section 13B are respectively a carriage 13D connected to the base 11 and a plurality of parts feeders 13P (for example, tape feeders) detachably attached to the carriage 13D. feeder). Each parts feeder 13P supplies the parts 3 to the parts supply port 13K.

1, 2 and 3, the head moving mechanism 14 includes a fixed beam 14a extending in the Y-axis direction, a moving beam 14b extending in the X-axis direction, and a moving plate 14c. The moving beam 14b moves in the Y-axis direction along the fixed beam 14a. The moving plate 14c moves in the X-axis direction along the moving beam 14b.

1, 2 and 3, the mounting head 15 is attached to the moving plate 14c. The head moving mechanism 14 can independently move the mounting head 15 in the X-axis direction (first direction) and the Y-axis direction (second direction). is moved in the Y-axis direction, and the moving plate 14c is moved in the X-axis direction with respect to the moving beam 14b, thereby moving the mounting head 15 in the horizontal plane.

In FIG. 2, the mounting head 15 has a nozzle 15a. The mounting head 15 raises and lowers the nozzle 15a and rotates it around the vertical axis (Z-axis). The mounting head 15 introduces a vacuum pressure from the outside to the nozzle 15a to generate a suction force at its lower end. The nozzle 15a sucks the component 3 supplied from the parts feeder 13P to the component supply port 13K by the suction force generated at the lower end.

1, 2 and 3, the substrate camera 16 is attached to the moving plate 14c of the head moving mechanism 14. As shown in FIG. Therefore, the substrate camera 16 moves in the horizontal plane together with the mounting head 15 . The substrate camera 16 is located on the side facing from the second side to the first side (the side facing from the rear side to the front side) with respect to the nozzle 15a, and is provided in front of the nozzle 15a in the present embodiment. The substrate camera 16 has its imaging optical axis directed downward, and images the substrate mark 2M provided on the substrate 2 from above the substrate 2 positioned at the work position SP by the substrate transfer unit 12 .

1, 2 and 3, the component camera 17 is provided in a front region SJ1 (first side region) between the front side 2A of the board 2 positioned at the working position and the front side component supply section 13A. It is Each component camera 17 has an imaging field of view directed upward. The component camera 17 captures an image of the component 3 sucked by the nozzle 15a by the mounting head 15 from below.

In FIG. 4, the operation of conveying and positioning the substrate 2 by the substrate conveying unit 12, the operation of supplying the components 3 by the front component supply unit 13A, and the operation of supplying the components 3 by the rear component supply unit 13B are controlled by the component mounting apparatus 1. controlled by device 20; The control device 20 also controls the movement of the mounting head 15 by the head moving mechanism 14, the movement of the nozzles 15a by the mounting head 15, and the pickup of the component 3 by the nozzles 15a. The image data captured by the board camera 16 and the image data captured by the component camera 17 are sent to the control device 20 .

In FIG. 5, the front side component supply section 13A has a height higher than a predetermined reference height HH (here, the height of the lower end 16a of the board camera 16) when mounted on the board 2 like a chip component. A component (referred to as a standard component 3A, FIG. 5) is provided that is low and does not interfere with the optical device (here, substrate camera 16) provided on the mounting head 15 even when the mounting head 15 moves in the upper region. On the other hand, the rear component supply section 13B, like the standard component 3A and the connector, has a height exceeding the reference height HH when mounted on the substrate 2, and the mounting head 15 is positioned above it. A component (referred to as a tall component 3B, FIG. 5) that may interfere with an optical device (substrate camera 16) provided on the mounting head 15 when moved is supplied.

Next, a procedure for manufacturing a component-mounted board by mounting the component 3 on the board 2 using the component-mounting apparatus 1 (method for manufacturing a component-mounted board) will be described. For this purpose, first, the board transfer unit 12 receives the board 2 sent from the upstream process side, transfers it, and positions it at the working position SP (substrate positioning process). When the board 2 is positioned at the work position SP, the mounting head 15 moves above the board 2 and causes the board camera 16 to image the board mark 2M. The board camera 16 sends image data of the board mark 2M obtained by imaging to the control device 20, and the control device 20 recognizes the board 2 by performing image recognition based on the image data.

After causing the board camera 16 to image the board mark 2M, the mounting head 15 moves above the parts feeder 13P of the front component supply section 13A or the rear component supply section 13B. After the mounting head 15 moves above the parts feeder 13P, the nozzle 15a is lowered to suck the component 3 supplied by the parts feeder 13P onto the nozzle 15a. Although the parts feeder 13P includes a tape feeder and a tray feeder, a tray feeder is often used as the parts feeder 13P for supplying tall parts 3B.

After the component 3 is picked up by the nozzle 15a, the mounting head 15 moves so as to pass over the component camera 17 in the X-axis direction, and causes the component camera 17 to image the component 3. FIG. The component camera 17 sends image data of the component 3 obtained by imaging to the control device 20, and the control device 20 recognizes the component 3 by performing image recognition based on the image data.

After causing the component camera 17 to image the component 3, the mounting head 15 moves above the substrate 2 positioned at the work position SP. After moving above the substrate 2, the mounting head 15 lowers the nozzle 15a above the target mounting position MS (FIG. 3) on the substrate 2 to mount the component 3 on the substrate 2 (component mounting step).

The mounting head 15 sequentially mounts the components 3 at each target mounting position MS set on the substrate 2 by repeatedly executing the component mounting process. In this repetitively executed component mounting process, the mounting head 15 first mounts the component 3 (standard component 3A) supplied from the front component supply section 13A onto the substrate 2, and then the standard component 3A supplied from the rear component supply section 13B. The components 3 (the standard component 3A and the tall component 3B) are mounted on the board 2. As shown in FIG.

The mounting head 15 picks up the component 3 (standard component 3A) supplied from the front component supply section 13A and mounts it on the substrate 2, and the component 3 (standard component 3A and back panel) supplied from the rear component supply section 13B. Each operation, which is different from the operation of picking up the high component 3B) and mounting it on the substrate 2, will be described below.

In FIG. 6, when the mounting head 15 mounts the component 3 (standard component 3A) supplied from the front component supply section 13A on the substrate 2, the component is first supplied from the parts feeder 13P of the front component supply section 13A. The component 3 is sucked and picked up by the nozzle 15a. After picking up the component 3, the mounting head 15 moves to the starting point T1 of the movement path NL for component imaging set to extend in the X-axis direction above the component camera 17, and then moves in the X-axis direction from there to the end point T2. do. As a result, the component 3 picked up by the mounting head 15 passes above the component camera 17, and the component camera 17 takes an image of the component 3 during this time.

When the mounting head 15 reaches the end point T2 of the moving path NL during component imaging, it advances backward from the end point T2. Then, it traverses above the front side 2A (first side) in a direction (backward) toward the rear side 2B, enters the upper region of the substrate 2, and moves above the target mounting position MS. When the mounting head 15 reaches above the target mounting position MS, the nozzle 15 a is lowered to mount the component 3 on the board 2 . After mounting the component 3 on the board 2, the mounting head 15 advances forward over the front side edge 2A of the board 2 to pick up the next component 3, and moves above the front side component supply section 13A.

The mounting head 15 mounts the components 3 (standard components 3A) supplied from the front component supply section 13A at a plurality of target mounting positions MS on the substrate 2 by repeatedly executing such operations.

In FIG. 7, when the mounting head 15 mounts the component 3 supplied from the rear component supply section 13B onto the substrate 2, first, the component 3 supplied from the parts feeder 13P of the rear component supply section 13B is fed to the nozzle. 15a sucks and picks up. After picking up the component 3, the mounting head 15 moves into the rear region SJ2 (second side region) between the rear side 2B of the substrate 2 positioned at the working position SP and the rear component supply section 13B. . Then, it moves to the front area SJ1 through a preset head movement path HK.

In FIG. 7, the head movement path HK extends along the Y-axis direction in the upstream area (in FIG. 7, the area on the left side of the substrate 2 in FIG. 7) in the direction in which the substrate 2 is transported by the substrate transport unit 12 of the substrate 2 positioned at the working position SP. is set to extend to This is to allow the mounting head 15 to move into the front side area SJ1 avoiding the area above the substrate 2 positioned at the working position SP. As a result, the starting point W1 of the head movement path HK is set at a position in the rear region SJ2 and upstream in the transport direction of the substrate 2 positioned at the working position SP. The end point W2 of the head movement path HK is set at a position behind the start point W1 along the Y-axis direction and to the left of the component camera 17 (left of the start point T1 of the movement path NL for component imaging). ing.

When the mounting head 15 advances forward along the head movement path HK and moves into the front side area SJ1 (the path of W1→W2 shown in FIG. 7), the mounting head 15 moves from the end point W2 of the head movement path HK to the start point of the component imaging movement path NL. It passes through T1 and moves to the end point T2 of the moving path NL for component imaging (FIG. 7). As a result, the component 3 picked up by the mounting head 15 passes above the component camera 17, and the component camera 17 takes an image of the component 3 during this time.

When the mounting head 15 reaches the end point T2 of the moving path NL during component imaging, it advances from the end point T2 to the waypoint CC set in the front area SJ1. The waypoint CC is set at a position ahead along the Y-axis direction from each target mounting position MS, and the waypoint CC is also different for the target mounting positions MS having different coordinates in the X-axis direction. For example, as shown in FIG. 7, when there are three target mounting positions MS (MS1, MS2, MS3) having mutually different coordinates in the X-axis direction on the substrate 2, these three target mounting positions MS (MS1, MS2, MS3), three waypoints CC (CC1, CC2, CC3) with different coordinates in the X-axis direction are set.

When the mounting head 15 is moved to the waypoint CC corresponding to the target mounting position MS of the picked-up component 3, the mounting head 15 moves the substrate 2 from the waypoint CC so as to traverse the upper side of the front side 2A in a direction (rearward) toward the rear side 2B. enter the upper region of the At this time, the mounting head 15 advances linearly in the Y-axis direction from the waypoint CC and enters the upper region of the substrate 2 (FIG. 7). After entering the area above the substrate 2 , the mounting head 15 moves above the target mounting position MS, lowers the nozzle 15 a from the target mounting position MS, and mounts the component 3 on the substrate 2 .

By repeating such operations, the mounting head 15 sequentially mounts the tall components 3B on the plurality of target mounting positions MS on the board 2. The components 3 whose mounting position MS is closer to the rear side 2B (second side) (farther from the front side 2A) are sequentially mounted. For example, as shown in FIG. 7, when the distances L1, L2, and L3 from the front side 2A of the three target mounting positions MS (MS1, MS2, and MS3) on the board 2 are L1>L2>L3, 8, the mounting head 15 mounts the components 3 in the order of MS1, MS2 and MS3 (FIG. 8(a)→FIG. 8(b)→FIG. 8(c)).

Here, when the mounting head 15 moves across the upper side of the front side 2A from within the front side area SJ1, the optical device (board camera 16) provided in the mounting head 15 follows the component 3 and moves over the area above the board 2. will proceed. For this reason, as long as the components 3 picked up by the mounting head 15 are mounted on the board 2 in order from the one closest to the rear side 2B, not only the standard component 3A already mounted on the board 2 but also the tall component 3B already mounted is mounted on the board 2. The substrate camera 16 does not reach upward, and interference between the component 3 already mounted on the substrate 2 and the substrate camera 16 can be avoided. Similarly, when mounting a plurality of components 3 having the same X-axis coordinate of the target mounting position MS on the board 2, the components 3 closer to the rear side 2B (components 3 farther from the front side 2A) are mounted on the board 2 in order. It goes without saying that it should be attached to the

Further, in the present embodiment, when the tall component 3B is mounted on the substrate 2, the mounting head 15 advances linearly in the Y-axis direction (second direction) from the waypoint CC to move the mounting head 15 upward from the target mounting position MS. , the interference between the component 3 already mounted on the board 2 and the board camera 16 is reliably prevented. Further, the mounting head 15 is set so as to avoid the upper area of the substrate 2 positioned at the working position SP when moving into the front area SJ1 after picking up the component 3 from the rear part supply section 13B. Since the movement path HK is followed, there is no danger of the substrate camera 16 interfering with the component 3 already mounted on the substrate 2 when carrying the picked up component 3 into the front area SJ1.

After mounting the component 3 at the target mounting position MS, the mounting head 15 moves from the area above the substrate 2 to above the rear component supply section 13B in order to pick up the next component 3 . At this time, the mounting head 15 advances in the opposite direction (i.e., crosses the upper side of the front side 2A in the direction opposite to the rear side 2B) in the same path as when it entered the upper region of the substrate 2, Return to CC. Thereby, it is possible to avoid interference between the component 3 already mounted on the board 2 and the board camera 16 .

After returning to the waypoint CC, the mounting head 15 proceeds in the opposite direction along the head movement path HK (W2→W1 route shown in FIG. 7) and moves into the rear area SJ2. After moving into the rear region SJ2, the mounting head 15 moves from the starting point W1 of the head movement path HK to the rear component supply section 13B, and picks up the component 3 to be mounted on the substrate 2 next.

After the mounting head 15 finishes mounting the component 3 supplied from the rear component supply section 13B on the board 2 in this way, the board conveying section 12 operates to carry out the board 2 to the downstream process side. As a result, the component mounting process for each board 2 is completed.

As described above, in the component mounting apparatus 1 according to the present embodiment, the mounting head 15 picks up the component 3 supplied from the rear-side component supply section 13B, and then picks up the front side of the substrate 2 positioned at the work position SP. It moves to the front side area SJ1 between the side 2A and the front side component supply section 13A, moves from the front side area SJ1 so as to cross the upper side of the front side side 2A in a direction (rearward) toward the rear side side 2B, and moves above the substrate 2. A part 3 is mounted on the substrate 2 by entering the area. For this reason, the mounting head 15 mounts the components 3 picked up from the rear side component supply section 13B onto the board 2 in order from those whose target mounting position MS on the board 2 is closer to the rear side 2B. In the process of mounting the component 3 on the board 2 , it is possible to prevent the optical device (board camera 16 ) provided in the mounting head 15 from interfering with the component 3 already mounted on the board 2 . Therefore, according to the component mounting apparatus 1 of the present embodiment, a single mounting head 15 can be used to mount the component 3 including the tall component 3B to manufacture a component mounting board.

Although the embodiments of the present invention have been described so far, the present invention is not limited to the above, and various modifications are possible. For example, unlike the above-described embodiment, the head movement path HK may be set to pass through a region on the downstream side (right side in FIG. 1) in the transport direction of the substrate 2 by the substrate transport section 12 . However, when the component-mounted board, which has been carried out after the mounting of the component 3 to the board 2 is completed, is kept waiting on the board transport section 12 in the area downstream of the transport direction of the board 2, the head movement Since the mounting head 15 moving on the path HK may interfere with the tall component 3B on the board 2, the head movement path HK is designed to move the board 2 by the board transfer section 12 as in the above-described embodiment. is preferably set so as to pass through an area on the upstream side in the conveying direction.

In the above-described embodiment, the substrate camera 16 was mentioned as an optical device that may interfere with the tall component 3B already mounted on the substrate 2. If the mounting head 15 is provided with a sensor for detecting the lower end of the component 3, the sensor can be an optical device that interferes with the tall component 3B. Further, in the above-described embodiment, the component camera 17 is provided only in the front area SJ1, but may be provided also in the rear area SJ2. When the component camera 17 is also provided in the rear region SJ2, the mounting head 15 causes the rear component camera 17 to recognize the component 3 picked up from the rear component supply unit 13B, and then moves the head moving path. It can be made to move forward through the HK.

In the above-described embodiment, the mounting head 15 first mounts the standard component 3A supplied from the front component supply section 13A on the substrate 2, and then the standard component 3A supplied from the rear component supply section 13B and the height of the standard component 3A supplied from the rear component supply section 13B. An example is shown in which the components 3B are mounted in order from the one closest to the rear side 2B of the substrate 2. First, the standard component 3A supplied from the front side component supply section 13A and the standard component 3A supplied from the rear side component supply section 13B. are mounted on the substrate 2, the tall components 3B supplied from the rear component supply section 13B may be mounted in order from the one closest to the rear side 2B of the substrate 2. FIG.

Further, unlike the above-described embodiment, the rear side 2B of the board 2 corresponds to the first side, the front side 2A corresponds to the second side, the rear side component supply section 13B corresponds to the first side component supply section, and the front side component supply section 13B corresponds to the first side. The supply section 13A may be considered to correspond to the second component supply section. In this case, the mounting head 15 has an optical device on the front side of the nozzle 15a, crosses the upper side of the rear side 2B in the direction toward the front side 2A, enters the upper region of the substrate 2, and places the component 3 on the substrate. 2 will be installed.

To provide a component mounting apparatus and a component mounting board manufacturing method capable of mounting components including tall components with one mounting head to manufacture a component mounting board.

1 component mounting device 2 board 2A front side (first side)
2B rear side (second side)
3 parts 3B tall parts 12 board transfer part 13A front side parts supply part (first parts supply part)
13B rear component supply unit (second component supply unit)
14 head movement mechanism 15 mounting head 15a nozzle 16 substrate camera (optical device)
SP working position SJ1 front area (first side area)
CC Waypoint HK Head movement path MS Target mounting position

Claims (14)

a substrate transport unit that transports the substrate in a horizontal first direction and positions it at the working position;
a first component supply section provided adjacent to a first side which is one of two sides facing in a horizontal second direction orthogonal to the first direction of the substrate positioned at the working position; ,
a second component supply section provided adjacent to a second side that is the other one of the two sides of the substrate positioned at the working position;
After sucking and picking up the components supplied from the first component supply unit and the second component supply unit, which are movable with respect to the substrate positioned at the working position and which are extended downward by the nozzles. , a mounting head for entering an area above the substrate positioned at the working position to mount a component on the substrate;
an optical device provided on the mounting head and positioned on a side of the nozzle facing from the second side to the first side;
The components supplied by the second component supply unit include tall components whose height exceeds the height of the lower end of the optical device when mounted on the board,
After picking up the component supplied from the second component supply unit, the mounting head moves a first part between the first side of the substrate positioned at the working position and the first component supply unit. moving into a side region, moving from within the first side region above the first side in a direction toward the second side, and entering an upper region of the substrate ;
A component mounting apparatus in which the mounting head mounts components picked up from the second component supply section onto the board in order from those whose target mounting positions on the board are closer to the second side . In a second side area between the second side of the substrate positioned at the working position and the second component supply section, the mounting head picking up a component from the second component supply section is provided. 2. The component mounting apparatus according to claim 1 , wherein a starting point of a head moving path through which said mounting head passes when moving into said first side area is set . After moving into the first side area, the mounting head moves to a waypoint set in the first side area, advances linearly in the second direction from the waypoint, and 3. A component mounting apparatus according to claim 1 or 2, which enters an upper region of the board. The head movement path along which the mounting head moves into the first side area after picking up the component from the second component supply section is such that the mounting head is positioned at the working position. 4. The component mounting apparatus according to claim 3, which is set so as to be able to move into said first side area while avoiding an upper area of said substrate. 5. The component mounting apparatus according to claim 4, wherein the head movement path passes through an area on the upstream side in the direction in which the board is conveyed by the board conveying section of the board positioned at the working position. 6. The component mounting apparatus according to claim 1, wherein the head moving mechanism for moving the mounting head independently moves the mounting head in the first direction and the second direction. The optical device is a substrate camera that directs the optical axis downward to take an image of the substrate positioned at the working position, or a sensor that directs the optical axis in the horizontal direction and detects the lower end of the component picked up by the mounting head. A component mounting apparatus according to any one of claims 1 to 6. A substrate transport unit that transports a substrate in a horizontal first direction and positions the substrate in a working position, and 2 that faces the substrate positioned in the working position in a horizontal second direction perpendicular to the first direction. A first component supply section provided adjacent to a first side, which is one of the sides, and a second side, which is the other one of the two sides of the substrate positioned at the working position. one mounting head having a downwardly extending nozzle which is movable with respect to the substrate positioned at the working position; and an optical device located on the side facing the first side from the second side. A method for manufacturing a component-mounted board using a component-mounting apparatus including tall components exceeding the height of the lower end of the device,
a substrate positioning step of transporting the substrate by the substrate transport unit and positioning the substrate at the working position;
After the components supplied from the first component supply unit and the second component supply unit are picked up by the mounting head by means of the nozzle, the substrate positioned at the working position by the substrate positioning step is removed. a component mounting step of entering an upper region and mounting a component on the board;
In the component mounting step, the mounting head picks up the component supplied from the second component supply unit, and then attaches the first side of the substrate positioned at the working position to the first component supply unit. and moves into the upper region of the substrate from within the first side region so as to traverse the upper side of the first side in a direction toward the second side. death,
The method of manufacturing a component-mounted board , wherein the mounting head mounts the components picked up from the second component supply section onto the board in order from those whose target mounting positions on the board are closer to the second side . In a second side area between the second side of the substrate positioned at the working position and the second component supply section, the mounting head picking up a component from the second component supply section is provided. 9. The method of manufacturing a component mounting board according to claim 8, wherein a starting point of a head moving path through which said mounting head passes when moving into said first side region is set . After moving into the first side area, the mounting head moves to a waypoint set in the first side area, advances linearly in the second direction from the waypoint, and 10. The method of manufacturing a component-mounted board according to claim 8, wherein the component-mounted board enters an upper region of the board. The head movement path along which the mounting head moves into the first side area after picking up the component from the second component supply section is such that the mounting head is positioned at the working position. 11. The method of manufacturing a component-mounted board according to claim 10, wherein the board is set so as to avoid the upper area of the board and move into the first side area. 12. The method of manufacturing a component-mounted board according to claim 11, wherein the head movement path passes through an area on the upstream side in the direction in which the board is conveyed by the board conveying section of the board positioned at the working position. 13. The manufacturing of a component mounting board according to claim 8, wherein the head moving mechanism for moving the mounting head independently moves the mounting head in the first direction and the second direction. Method. The optical device is a substrate camera that directs the optical axis downward to take an image of the substrate positioned at the working position, or a sensor that directs the optical axis in the horizontal direction and detects the lower end of the component picked up by the mounting head. A method for manufacturing a component mounting board according to any one of claims 8 to 13.

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