JP7108013B2 - LED lighting device - Google Patents

Description

TECHNICAL FIELD The present invention relates to an LED lighting device including a plurality of LED (Light Emitting Diode) elements as light sources.

2. Description of the Related Art Conventionally, as an LED lighting device using an LED as a light source, for example, a ceiling lighting fixture (ceiling light) disclosed in Patent Document 1 is known.
The LED lighting device (lighting device) disclosed in Patent Document 1 includes a main light source (lower unit) provided in the central part of the fixture body, an auxiliary light source provided in the frame part of the outer peripheral part of the fixture body, and a ceiling and an indirect light source (upper unit) provided on the upper part of the instrument body facing the surface.

The main light source is mounted on an arc-shaped board so as to divide the circular fixture body into a plurality of pieces, and includes a large number of LED elements (hereinafter referred to as "LEDs" as appropriate) that emit light downward. have.
The indirect light source has a board on which LEDs are mounted, and a mounting portion for mounting the board on the upper surface of the fixture body. The mounting portion is formed in an L shape as a whole, and a board having LEDs arranged sideways is mounted vertically so as to be perpendicular to the horizontal upper surface of the fixture body. The indirect light source is arranged so that the light from the LED is emitted outward in parallel with the upper surface of the fixture body.
A ceiling lighting fixture is equipped with such a main light source, an auxiliary light source, and an indirect light source that illuminates the ceiling surface. Improves brightness.

However, in a ceiling lighting device equipped with a large number of LEDs, the temperature of the LED substrate on which the LEDs are mounted becomes high, so a radiator plate is provided for cooling the LED substrate. The heat dissipation plate is formed with a truncated cone-shaped projection, and the LED substrate is placed on the mounting surface of the projection. It is fixed to the part (mounting surface).

JP 2013-145685 A

In the LED lighting device disclosed in Patent Document 1, the LED of the indirect light source is mounted on the back surface of the substrate (substrate 34) installed in the vertical direction, and arranged so as to irradiate the light in the horizontal direction. It is That is, the board of the indirect light source is placed vertically. For this reason, there is a problem that the fixture body and the heat sink become taller (increased in thickness), and the entire LED lighting device becomes taller and larger.

An object of the present invention is to provide an LED lighting device capable of reducing the overall height.

The present invention comprises a first light source board that includes a plurality of LED elements as a main light source and emits light, a light source board that includes a plurality of LED elements as a secondary light source and emits light, the first light source board, and the An LED lighting device comprising: a radiator plate that dissipates heat from a second light source substrate; The first light source substrate is arranged on the lower surface side of the plate so as to irradiate light downward, and the second light source substrate is arranged horizontally on the upper surface side of the heat sink so as to irradiate light upward. A translucent upper cover that covers the second light source substrate from above and transmits light is arranged on the upper surface side of the second light source substrate. A triangular ring-shaped projection protruding upward is formed at a position near the outer periphery of the region formed in the It is characterized by being reflected toward the outer circumference .

ADVANTAGE OF THE INVENTION According to this invention, the LED lighting apparatus which can make whole height low can be provided.

It is a figure which shows the LED lighting apparatus which concerns on embodiment of this invention, and is an external appearance perspective view shown when it sees from diagonally downward. It is an external appearance perspective view which shows the state when an LED lighting apparatus is seen from diagonally upward direction. It is an exploded perspective view which shows the state when an LED lighting apparatus is seen from diagonally downward direction. It is an exploded perspective view which shows the state when an LED lighting apparatus is seen from diagonally upward direction. It is a center longitudinal cross-sectional view of an LED lighting apparatus. It is a perspective view which shows the LED lighting apparatus which removed a shade and cut a part of LED cover. It is a perspective view which shows the state when the LED lighting apparatus which cut away a part of indirect light cover is seen from the diagonally upward direction. It is a bottom view which shows an example of an LED light source board. It is a perspective view which shows the state when the LED lighting apparatus which removed the indirect light cover and the sensor unit was seen from the diagonally upward direction. It is a figure which shows the wiring state of an electric wire, and is a principal part enlarged schematic sectional drawing of the LED lighting apparatus which removed the indirect light cover. 6 is an enlarged view of part A in FIG. 5; FIG. FIG. 6 is an enlarged view of a B portion in FIG. 5; It is a principal part expanded sectional view which shows the 1st modification of an indirect light cover. It is a principal part expanded sectional view which shows the 2nd modification of an indirect light cover. It is a figure which shows the modification of an indirect light source board|substrate, and is a perspective view which shows the LED lighting apparatus which removed the indirect light cover.

Next, an LED lighting device (LED ceiling light) according to an embodiment of the present invention will be described in detail with appropriate reference to the drawings. In this embodiment, an example of the LED lighting device 1 is described as being circular in plan view. However, the shape is not limited to this. It can also be applied to polygonal shapes such as Further, in this embodiment, the LED lighting device 1 using a light-emitting diode (LED) as a main illumination light source will be described below, but the main illumination light source is not limited to an LED.

The LED lighting device 1 shown in FIGS. 1 and 2 can be mounted, for example, through a mounting adapter (not shown) that engages with an indoor wiring fixture (not shown) such as a hanging rosette or hanging ceiling provided on the ceiling surface of a house. , is used by being connected to an external power source and fixed at a predetermined position on the ceiling surface. The LED illumination device 1 is, for example, round or square (round in this embodiment). In the following description, the upper side of the paper surface is the ceiling side (upper surface side), and the lower side of the paper surface is the floor side (lower surface side), based on the state in which the LED lighting device 1 is attached to the ceiling surface.

As shown in FIGS. 3 and 4, the LED lighting device 1 includes a backbone 11, an adapter receiving portion 12 (insulating plate), a power supply board 13, a radiator plate 14, an LED light source board 15 (first light source board), and an LED cover. 16, a center cover 17, a ring member 18, a shade 19, an indirect light source board 20 (second light source board), an indirect light cover 21 (upper cover), a sensor unit 22 and the like.

The backbone 11 is a base member formed by processing a steel plate (for example, SECC (electrogalvanized steel plate)) into a substantially circular shape, and is formed in a substantially concave shape (dish shape) so that the concave surface faces the floor. At the center of the backbone 11, an adapter mounting hole 11a is formed in which a mounting adapter (not shown) is locked.

The adapter receiving portion 12 is made of a flame-retardant and electrically insulating synthetic resin (for example, PP: polypropylene resin, etc.). and a cylindrical portion 12b extending from the inner peripheral edge portion of 12a to the floor side (downward).

As shown in FIG. 3, the power board 13 has a lighting circuit board and the like including a control section, and is screwed to the backbone 11 via an adapter receiving section 12 (insulating plate). As a result, the power supply substrate 13 is arranged in a heat dissipation space surrounded by the backbone 11 and a heat dissipation plate 14, which will be described later, while maintaining electrical insulation.

The power supply board 13 is also electrically connected to a mounting adapter (not shown) via a wire 23 connected to a power connector 13a fixed to the lower surface of the power supply board 13. As shown in FIG. Thereby, the LED lighting device 1 is configured to be supplied with power via the indoor wiring fixture (not shown), the mounting adapter (not shown), the electric wire 23, and the power supply board 13, respectively.

The radiator plate 14 is made of a metal that serves to dissipate and cool the heat of the power supply board 13, the control board, the LED light source board 15 on which a plurality of LEDs are mounted, and the indirect light source board 20, which generate heat during operation. It is a member. The LEDs of the LED element group 15b, which will be described later, are vulnerable to heat. In addition, when LEDs are used, a large current of low voltage is passed through them to emit high-brightness light, and the heat generated by this light emission causes deterioration of the LED itself and surrounding materials. Appropriate heat dissipation is required to achieve high reliability.

The radiator plate 14 is formed by processing a steel plate into a substantially circular shape, and has a truncated cone-shaped substrate supporting portion 14a protruding toward the floor. The radiator plate 14 is made of metal with good thermal conductivity, such as a galvanized steel sheet, and is formed seamlessly and integrally by drawing to increase its strength. Moreover, the heat sink 14 is formed to have a larger diameter than the backbone 11 and is attached to the backbone 11 so as to protrude radially outward from the backbone 11 . The heat dissipation plate 14 has an LED light source board 15 (first light source board) arranged on the lower surface side of the heat dissipation plate 14 so that a plurality of LED elements 15b serving as the main light source emit light downward. The indirect light source board 20 (second light source board) is arranged so that a plurality of LED elements 20a of the secondary light source, which will be described later, emit light upward. Supplementally, the LED light source substrate 15 is arranged on the lower surface side of the radiator plate 14 so as to follow the lower surface. Further, the indirect light source substrate 20 is arranged on the upper surface side of the radiator plate 15 (the upper surface of the annular portion 14c described later) so as to follow the upper surface so as to reduce the height (thickness).

A circular through-hole 14b is formed in the radial center of the radiator plate 14 at a position corresponding to the cylindrical portion 12b of the adapter receiving portion 12 . Further, the outer peripheral portion of the radiator plate 14 has a horizontally formed circular annular portion 14c and a cover mounting portion 14e formed on the outer peripheral portion of the annular portion 14c. Three receivers 14d (see FIG. 3) for hooking a shade 19, which will be described later, are attached to the lower surface of the annular portion 14c at intervals of 120°.
As shown in FIG. 4, an indirect light source substrate 20 screwed to the upper surface of the annular portion 14c and an indirect light cover 21 covering the indirect light source substrate 20 are arranged on the upper surface side of the annular portion 14c. ing.

As shown in FIGS. 5, 11 and 12, the cover attachment portion 14e is a portion to which the indirect light cover 21 is attached, and is formed on the outer peripheral portion of the radiator plate 14 so as to expand in a substantially tapered shape. An indirect light source board 20 is mounted in a ring shape on the annular portion 14c (peripheral portion of the radiator plate 14) of the upper portion of the cover mounting portion 14e, and a large number of LED elements 20a as auxiliary light sources are arranged.

As shown in FIGS. 6 and 10, the wire insertion hole 14f is a through hole formed in the outer peripheral wall of the storage recess 14 formed in a recess shape that is inclined to expand upward. A plurality of electric wires 23 are wired in the electric wire insertion hole 14f.
The wire insertion hole 14g is a through hole formed in the annular portion 14c, and the wire 23 drawn out from the wire insertion hole 14f is wired.
The storage recess 14 is a storage space in which the power supply board 13 to which the electric wire 23 is connected is provided.

The LED light source substrate 15 (first light source substrate) includes a ring-shaped wiring substrate 15a disposed on the lower surface side of the backbone 11 with the heat sink 14 interposed therebetween, and one surface side (floor surface side) of the wiring substrate 15a. and an LED element group 15b as a main light source in which a plurality of concentrically arranged LEDs are mounted by soldering or the like. Details of the LED element group 15b will be described later.

The wiring board 15a is, for example, formed by forming an insulating layer and a copper foil pattern on a substantially annular metal plate made of an aluminum alloy, or a flat plate made of a resin having good thermal conductivity (for example, polyimide resin, etc.). It is configured by forming a copper foil pattern, a solder resist, etc. on it. Also, the wiring board 15a is screwed to the radiator plate 14 .

In this embodiment, by providing the backbone 11 and the heat dissipation plate 14 configured as described above, the volume of the heat dissipation space is increased (the amount of air in the heat dissipation space is increased), and the power supply board 13 and the LED light source board 15 is intended to improve the heat dissipation efficiency. As a result, the luminous efficiency of the LED element group 15b can be increased.

The LED light source board 15 shown in FIG. 3 shows an example of an arrangement pattern of LEDs for 18 tatami mats. As shown in FIG. 8, the LED element group 15b includes a plurality of daylight-colored LEDs (Light Emitting Diodes) 15b1 that emit daylight-colored (D color) light, and a plurality of light-emitting diodes (LEDs) that emit light bulb-colored (L-color) light. The LED 15b2, a plurality of blue LEDs 15b3 that emit blue light, and an LED 15b4 for security light constitute a light source for main illumination. Further, at the outer peripheral end of the LED light source board 15, a substantially arc-shaped projecting piece 15c projecting outward and a wire insertion hole 15d (see FIG. 4) formed at the base end of the projecting piece 15c are provided. , and three connector portions 15e (see FIG. 6) mounted on the projecting pieces 15c and connected to the electric wire 23. As shown in FIG.

The daylight LEDs 15b1 have a peak wavelength of 430 nm to 460 nm, and are arranged in a plurality of rows (for example, 9 rows) concentrically from the outer peripheral side to the inner peripheral side.

The light bulb-colored LEDs 15b2 have a peak wavelength of 550 nm to 650 nm, and are arranged with the daylight-colored LEDs 15b1 interposed in each row arranged concentrically. That is, the light bulb color LEDs 15b2 are arranged in each concentric row with two daylight color LEDs 15b1 sandwiched therebetween in the circumferential direction. The bulb-colored LEDs 15b2 in the second row from the inner peripheral side are arranged with one or two daylight-colored LEDs 15b1 sandwiched therebetween. In addition, the daylight color LEDs 15b1 and the light bulb color LEDs 15b2 are arranged in each concentric row at equal or substantially equal intervals in the circumferential direction.

The blue LEDs 15b3 have a peak wavelength of 470 nm to 480 nm, and are circularly spaced apart in the circumferential direction between the outermost and innermost circumferences of the daylight-colored LEDs 15b1 and the bulb-colored LEDs 15b2 arranged in a plurality of concentric rows. arranged in a circle. In the embodiment of FIG. 8, the rows in which the daylight color LEDs 15b1 and the light bulb color LEDs 15b2 are arranged are arranged concentrically in five rows on the inner peripheral side of the blue LEDs 15b3 arranged in an annular shape, and concentrically in four rows on the outer peripheral side. It is arranged in rows.

The LED element group 15b shown in FIG. 8 includes, for example, 275 daylight color LEDs 15b1, 142 light bulb color LEDs 15b2, and 41 blue LEDs 15b3. The number of blue LEDs 15b3 is preferably about 10% of the total number of daylight color LEDs 15b1 and light bulb color LEDs 15b2.

The radiator plate 14 and the LED light source substrate 15 are coated with white paint for reflecting light from the LED element groups 15b toward the floor.

The LED cover 16 has a function of guiding the luminous flux emitted from the plurality of LED element groups 15b to the surface side (floor side), a function of pressing the LED light source substrate 15 so as to be in close contact with the heat sink 14, and a main lighting function. It has a function of covering the entire lower surface side of the LED element group 15b, which is a light source for lighting.

The LED cover 16 is integrally formed by injection molding or the like using a translucent and electrically insulating resin such as polystyrene (PS), polycarbonate (PC), acrylic (PMMA), or the like. In particular, it is preferable to use polystyrene in terms of transparency, cost and moldability. Further, the material used for the LED cover 16 is not limited to resin as long as it has translucency and electrical insulation, and may be glass or the like.

As shown in FIG. 6, the cover 16 includes a substantially circular LED cover portion 16a that covers the entire light emitting surface (the surface on which the LED element group 15b is mounted) of the LED light source substrate 15, and an outer peripheral edge of the LED cover portion 16a. A cylindrical wall portion 16b extending toward the back side (ceiling side) from the wall portion 16b; and a substrate housing portion 16d.

In the LED cover 16, the LED cover portion 16a is screwed to the substrate support portion 14a of the heat sink 14, and the collar portion 16c is screwed to the annular portion 14c of the heat sink 14. As shown in FIG.

The wall portion 16b is formed extending in a direction substantially perpendicular to the LED cover portion 16a. A notch (not shown) is formed in the wall portion 16b so that the heat inside the LED cover 16 can escape to the outside. The opening area of the notch is set to a size that the user's finger cannot be inserted into. This prevents the user from directly touching the LED light source board 15 with his/her hand (finger).

The flange portion 16 c is a fixing portion that fixes the LED cover 16 to the heat dissipation plate 14 on the outer peripheral side of the LED light source substrate 15 . The flange portion 16c extends along the circumferential direction and is divided into three portions.
The substrate housing portion 16d is formed in a recessed state with an inclination from the flange portion 16c, and the LED light source substrate 15 is horizontally arranged on the inner bottom portion thereof to house the LED element group 15a.

FIG. 6 is a perspective view showing an example of a state in which an LED cover 16 having a partial cross section is attached to the lower side of the LED light source board 15. As shown in FIG. The LEDs of the LED element group shown in FIG. 8 are configured in the LED cover 16 shown in FIG. 6 so as to emit light to the floor side via a plurality of corresponding dome-shaped portions 16a2. In this embodiment, a set of two LEDs is housed in one dome-shaped portion 162a, but the number of LEDs housed in the dome-shaped portion 16a2 is not limited to this. For example, in one set of two LEDs arranged in one dome-shaped portion 16a2, one is the daylight color LED 15b1 and the other is the light bulb color LED 15b2.

The center cover 17 is a member that covers a mounting adapter (not shown) exposed at the center of the apparatus main body, and is made of, for example, a flame-retardant synthetic resin (eg, PP: polypropylene resin). Also, the center cover 17 is formed in a disc shape and is detachably attached to the LED cover 16 .

The inner peripheral side of the ring member 18 is held on the outer peripheral side of a shade 19 made of a translucent material, and the outer peripheral side of the ring member 18 protrudes outside the outer periphery of the shade 19 . The ring member 18 is made of a material having optical transparency.

As shown in FIG. 5 (also shown in FIGS. 3 and 4), the LED cover portion 16a has a circular through hole 16a1 formed in the center portion in the radial direction. Dome-shaped portions 16a2 are formed in the LED cover portion 16a at positions corresponding to the LED element groups 15b (daylight color LED 15b1, light bulb color LED 15b2, blue LED 15b3) of the LED light source substrate 15, respectively. The dome-shaped portion 16a2 has a lens function, and is a member that diffuses the light beams from the daylight color LED 15b1, the light bulb color LED 15b2, and the blue LED 15b3.

The shade 19 is a translucent cover made of resin (for example, acrylic, polystyrene, etc.) having translucency (including transparent, translucent, or milky white) and is configured in a dome shape. The shade 19 diffuses the luminous flux emitted from the light source (the LED element group 15b) to reduce glare when the user looks directly at the LED lighting device 1, or to reduce the glare of the space in which the LED lighting device 1A is installed. It plays the role of equalizing the brightness. The shade 19 is detachably engaged and held by a receiving member 14d of the radiator plate 14. As shown in FIG.

As shown in FIG. 9, the indirect light source board 20 (second light source board) is arranged on the outer periphery on the upper surface side of the heat sink so that light is emitted from the entire outer periphery. The indirect light source substrate 20 is configured by connecting four substantially fan-shaped substrates arranged in a C shape, and is mounted with a plurality of LED elements 20a as auxiliary light sources. The indirect light source board 20 includes connectors 20b for board connection provided at the ends in the circumferential direction, electric wires 20c for board connection wired between the connectors 20b, electric wires 23 for power supply connection, and these electric wires. 23, and a power supply connector 20d attached near the cutout 20e. The indirect light source substrate 20 is arranged by screwing onto the annular portion 14c of the peripheral portion on the upper surface side of the radiator plate 14 .

For this reason, as shown in FIGS. 11 and 12, the LED elements 20a are arranged so as to irradiate light from the entire periphery of the upper surface side of the radiator plate . Also, the LED elements 20a are arranged on the outer peripheral side of the LED light source substrate 15 relative to the outer peripheral portion thereof.

On the upper side of the indirect light source board 20 (second light source board), an indirect light cover 21 (upper cover) made of an annular translucent resin is provided to cover the indirect light source board 20 from above ( See Figure 3). The indirect light cover 21 includes reflecting portions 21a and 21b that reflect light emitted from the LED elements 20a of the secondary light source, a substrate accommodating portion 21c that covers the upper surface of the indirect light source substrate 20, and a substrate accommodating portion 21c that is provided on the upper surface side. The formed mountain-shaped portion 21d, the inner edge portion 21e formed on the inner edge of the indirect light cover 21 (see FIGS. 3, 4 and 7), and the outer edge portion 21f formed on the outer peripheral portion of the mountain-shaped portion 21d. ,have.

As shown in FIG. 11, the reflecting portion 21a is composed of a substantially annular protruding piece that protrudes downward from the inner surface (ceiling surface) of the peak portion 21d, and the light emitted from the LED element 20a on the outer surface are formed so as to reflect toward the outer circumference.
The reflecting portion 21b is composed of a substantially annular thick portion formed downward from the inner surface (ceiling surface) of the peak portion 21d, and the outer wall surface reflects the light emitted from the LED element 20a in the outer peripheral direction. is formed to
The reflecting portions 21a and 21b, which are formed in a substantially annular shape when viewed from the bottom, are formed in a recessed shape (substantially C-shaped) in order to avoid this at the location where the sensor unit 22 is arranged. ing.

The substrate accommodating portion 21c is formed of a mountain-shaped portion 21d and a flat annular portion formed on the inner peripheral side of the mountain-shaped portion 21d.
The mountain-like portion 21 d is a portion that forms a space for forming the reflecting portions 21 a and 21 b between the upper surface of the indirect light source board 20 and the lower surface of the indirect light cover 21 . The mountain-like portion 21d has a mountain-like (triangular) top surface in a longitudinal view, and is formed in a bulging state upward.

As shown in FIG. 7 , the inner edge portion 21 e is formed so as to have a shape on the inner peripheral portion of the inner edge portion of the indirect light source substrate 20 .
As shown in FIGS. 11 and 12, the outer peripheral portion 21f is formed downward from the outer peripheral portion of the mountain-shaped portion 21d and arranged to cover the outer peripheral surface of the cover attachment portion 14e of the heat sink 14. ing.

As shown in FIGS. 3 and 4, the sensor unit 22 changes the power supplied to the LED element group 15b according to the brightness of the environment (space) in which the LED lighting device 1 is installed, for example, so that the LED lighting It provides a function for obtaining a constant illuminance under the device 1 . Also, the illuminance under the LED lighting device 1 is detected. The sensor unit 22 is attached to the upper portion of the indirect light source substrate 20 where the C-shaped notch is formed.

[Action]
Next, the operation of the LED lighting device 1 according to the embodiment of the present invention will be described mainly with reference to FIGS. 5, 11 and 12. FIG.

The LED lighting device 1 shown in FIGS. 1 and 2 operates by being supplied with power from a power supply and a power supply circuit (not shown). The power supply circuit has the function of adjusting the power of the power supply to a predetermined voltage or current. The LED lighting device 1 also has a function of receiving a signal (for example, infrared light) output from a remote control at a light receiving section (not shown) and transmitting the received signal to a control section (not shown).

A lighting circuit (not shown) has a function of driving the daylight color LED 15b1, the light bulb color LED 15b2, and the blue LED 15b3 based on the control signal received from the control unit. Further, the lighting circuits 102, 103, and 104 have a function of individually changing the drive currents for driving the daylight LED 15b1, the light bulb LED 15b2, and the blue LED 15b3 based on the control signals received from the daylight LED 15b1 and the control unit.

A remote controller (not shown) has a function of outputting a set signal by operating a button. For example, all lighting mode, brightness up mode, blue LED addition mode, brightness up mode + blue LED addition mode can be set.
By the way, in order to make the characters in books and newspapers easier to see, when a predetermined button on the remote controller is pressed, the brightness of the daylight color LED 15b1 and the light bulb color LED 15b2 increases, and the blue LED 15b3 lights up to add bluish green light, making it even brighter. Realize natural lighting closer to sunlight. This makes it easier to see characters, pictures, and the like.

When the LED element group 15b of the main light source shown in FIG. The LED element group 15b also emits heat when irradiated with light.

As shown in FIG. 5, the LED cover 16 is screwed to the heat sink 14 with the LED light source board 15 interposed between the heat sink 14 and the LED cover 16 . As a result, the adhesion of the LED light source substrate 15 to the heat sink 14 is increased, and the heat dissipation can be improved. Therefore, it is possible to realize the LED lighting device 1 in which the density of the light emitting surface of the main light source is uniform and the light emitting efficiency of the LED element group 15b is excellent. Furthermore, the heat sink 14 corrects the arrangement of the LEDs of the LED element group 15 to a proper position with respect to the LED cover 17, and also has the effect of reducing warpage and deformation of the LED light source substrate 15. FIG.

As shown in FIG. 3, the LED light source substrate 15 (first light source substrate) is arranged on the lower surface side of the heat sink 14 so as to emit light downward. An indirect light source substrate 20 (second light source substrate) is arranged on the upper surface side so as to emit light upward. That is, since the indirect light source substrate 20 is composed of a flat substrate that is horizontally arranged and connected in a C-shape, the height is lowered in the vertical direction, and the overall size and thickness of the LED lighting device 1 are reduced. can do.

As shown in FIGS. 11 and 12, a large number of LED elements 20a of the indirect light source board 20 are arranged on the outer peripheral portion of the upper surface side of the heat sink 14 so that light is emitted from the entire outer peripheral portion. ing.

A translucent indirect light cover 21 covering the indirect light source board 20 from above is provided on the upper surface side of the heat sink 14 , and the indirect light cover 21 covers the plurality of LED elements on the indirect light source board 20 . It has reflecting portions 21a and 21b that reflect the light emitted from 20a in the outer peripheral direction.
Therefore, the light emitted from the LED element 20a is reflected in the outer peripheral direction by the reflecting portions 21a and 21b of the indirect light cover 21, so that the light is emitted in the outer peripheral direction (horizontal direction) to brightly illuminate the entire room. can be done.

The LED elements 20a of the indirect light source board 20 are arranged closer to the outer periphery than the outer periphery of the LED light source board 15 (first light source board). Therefore, the heat-generating LED elements 20a on the indirect light source substrate 20 and the heat-generating LED element groups 15a arranged on the LED light source substrate 15 can be arranged with being shifted from each other on the radiator plate 14. , can be efficiently dissipated and cooled. In addition, since the LED element 20a can be arranged at a position closer to the outer peripheral edge of the LED lighting device 1, the outer peripheral direction of the LED lighting device 1 can be brightly illuminated.

As shown in FIGS. 5, 11, and 12, an indirect light cover 21 (upper cover) is attached to the cover attachment portion 14e on the outer periphery of the radiator plate 14. As shown in FIGS. Further, the LED elements 20a of the indirect light source board 20 (second light source board) are arranged above the cover mounting portion 14e.
Therefore, the LED element 20a can illuminate the light emitted from the LED element 20a in the outer peripheral direction and the upward direction without being blocked by other members. In addition, the amount of light can be increased compared to conventional devices, and bright illumination can be achieved.

As described above, the LED lighting device 1 according to the embodiment of the present invention can reduce the height (thickness) of the lighting device and direct the light of the indirect light source substrate 20 outward. Since it is possible to illuminate the ceiling surface and the upper surface of the wall in the room, the brightness of the room can be increased. In addition, the LED lighting device 1 can be made thinner and smaller by reducing the height of the entire LED lighting device 1 .

Further, in the present embodiment, the LEDs of the indirect light source board 20 face the upper surface (ceiling surface), but in Patent Document 1, the LEDs of the board 34 corresponding to the indirect light source board 20 of the present embodiment face sideways. is facing Therefore, in Patent Document 1, glare is likely to occur due to direct visibility of the high-intensity light source. On the other hand, in the present embodiment, the LEDs of the indirect light source substrate 20 face the upper surface (ceiling surface), so glare is prevented or significantly reduced as compared with the example of Patent Document 1.

[Modification]
It should be noted that the present invention is not limited to the above-described embodiments, and various modifications and changes are possible within the scope of its technical ideas, and the present invention does not extend to these modified and changed inventions. Of course. The same reference numerals are given to the same parts as those described in the above embodiment, and the description thereof will be omitted.

<First Modification of Indirect Light Cover>
FIG. 13 is an enlarged cross-sectional view of a main part showing a first modified example of the indirect light cover 21A (upper cover).
As shown in FIG. 13, the indirect light cover 21A includes a light guide portion 21Aa ( prism).

In this case, the light guide portion 21Aa forms a triangular ring-shaped protrusion 21Ab that protrudes upward from the outer inclined surface of the mountain-shaped portion 21d. By forming the light guide portion 21Aa in this manner, the light emitted from the LED element 20a is reflected in the outer peripheral direction by the inclined surface of the projection 21Ab.

<Second Modification of Indirect Light Cover>
FIG. 14 is an enlarged cross-sectional view of a main part showing a second modification of the indirect light cover 21B (upper cover).
As shown in FIG. 14, the indirect light cover 21B forms a light guide portion 21Ba functioning as a prism at a position closer to the outer periphery of the upper surface of the substrate housing portion 21Bc above the LED element 20a for the secondary light source. You may

In this case, the light guide portion 21Ba has a triangular ring-shaped protrusion 21Bb that protrudes upward at a position near the outer periphery of the flat substrate accommodation portion 21Bc . If the light guide portion 21Ba is formed in this manner, the light emitted from the LED element 20a is reflected toward the outer peripheral direction by the inclined surface (light guide portion 21Ba) of the projection 21Bb. When the indirect light cover 21B is formed in this way, the height in the upward direction can be reduced, so that the height of the entire LED lighting device can be reduced and the thickness thereof can be reduced.

<Modified Example of Indirect Light Source Board>
FIG. 15 is a diagram showing a modification of the indirect light source board 20A, and is a perspective view showing the LED lighting device with the indirect light cover removed.
In the above-described embodiment, as an example of the indirect light source board 20 (see FIG. 9), the case where three divided circuit boards are connected in a C shape when viewed from the top has been described, but the present invention is not limited to this. .
As shown in FIG. 15, the indirect light source board 20A may be a single C-shaped circuit board.
Also, the indirect light source board 20A may be a circuit board formed in a single annular shape.

Reference Signs List 1 LED lighting device 11 backbone 14 heat sink 14e cover mounting portion 15 LED light source board (first light source board)
15b LED element group (LED element)
16 LED cover 20 indirect light source board (second light source board)
20a LED element 21 indirect light cover (upper cover)
21Ba light guide part (reflection part)
21Bc substrate housing (area)
21Bb protrusion

Claims (3)

a first light source substrate that includes a plurality of LED elements as a main light source and emits light;
a second light source substrate that includes a plurality of LED elements as secondary light sources and emits light;
a radiator plate for radiating heat from the first light source substrate and the second light source substrate;
and a reflecting portion that reflects the light emitted from the plurality of LED elements of the second light source substrate in an outer peripheral direction,
The first light source substrate is arranged on the lower surface side of the heat dissipation plate so as to emit light downward, and the second light source substrate is arranged on the upper surface side of the heat dissipation plate so as to emit light upward. arranged horizontally,
A translucent upper cover that covers the second light source substrate from above and transmits light is arranged on the upper surface side of the second light source substrate,
The reflecting portion has a prism function, and is formed with a triangular ring-shaped projection protruding upward at a position near the outer periphery of the flatly formed area of the upper cover,
The LED lighting device, wherein the light emitted from the second light source substrate is reflected in the outer peripheral direction by the inclined surface of the projection. 2. The LED lighting device according to claim 1, wherein the plurality of LED elements of the second light source board are arranged closer to the outer periphery than the outer periphery of the first light source board. a cover mounting portion in contact with the upper cover is provided on an outer peripheral portion of the heat sink,
3. The LED lighting device according to claim 1, wherein the plurality of LED elements of the second light source board are arranged above the cover mounting portion.

Images