JP6995730B2 - LED lighting device - Google Patents

Description

The present invention relates to an LED lighting device including a plurality of LED (Light Emitting Diode) elements as a light source.

Conventionally, as an LED lighting device using an LED as a light source, for example, a ceiling lighting fixture (ceiling light) disclosed in Patent Document 1 is known.

The LED lighting device (lighting device) disclosed in Patent Document 1 irradiates a first light source substrate provided as a main light source so as to irradiate light downward and an upward light provided as a secondary light source. A second light source substrate arranged in such a manner, and a heat radiating plate that dissipates heat generated by the first light source substrate and the second light source substrate are provided.

The first light source substrate, which is the main light source, has a large number of LED elements (hereinafter, appropriately referred to as "LEDs") that irradiate light downward. The LED cover is provided with an LED cover that guides the light emitted from the first light source substrate downward, and the LED cover has transparency and electrical insulation. Below the LED cover, a shade made of a translucent material that diffuses the light emitted from the LED is provided, and is engaged and held by a receiver provided on the heat sink. A ring member is provided on the outside of the shade, and the ring member is made of a light-transmitting material.

The second light source substrate, which is an auxiliary light source, has a substrate on which an LED is mounted and a mounting portion for mounting the substrate on the upper surface of the heat sink. A translucent cover is provided on the second light source substrate.

Ceiling luminaires are equipped with such a main light source and a sub-light source that illuminates the ceiling surface, so that the entire room can be illuminated regardless of the orientation of the luminaire, giving a feeling of brightness to the room. It is improving.

In Patent Document 1, the main light source that irradiates light downward is controlled by the two optical members of the LED cover and the shade, whereas the sub light source controls the light that irradiates downward. Since it is controlled by one, a method of attaching a reflective member to the cover to control the light emitted from the sub-light source is described.

Japanese Unexamined Patent Publication No. 2016-219119

Another object of the present invention is to provide an LED lighting device capable of reducing the cost, reducing the glare of the light emitted from the secondary light source, and making the brightness of the space uniform.

The present invention comprises a first light source substrate having a plurality of LED elements as a main light source and irradiating light, a second light source substrate having a plurality of LED elements as sub-light sources and irradiating light, and the first. An LED lighting device having a light source substrate and a heat radiating plate that dissipates heat from the second light source substrate, and the lower surface side of the heat radiating plate is the first light source substrate so as to irradiate light downward. Is arranged, and the second light source substrate is arranged so as to irradiate light upward on the upper surface side of the heat radiating plate, and an LED cover that diffuses and controls the light emitted from the first light source substrate side. A cover provided with a shade to diffuse and control the light emitted from the second light source substrate side, and light emitted from the second light source substrate side provided as a separate member from the cover and from the ceiling. It is characterized by having a transmitting portion that diffuses and controls the reflected light of.

According to the present invention, it is possible to provide an LED lighting device capable of reducing the cost, reducing the glare of the light emitted from the secondary light source, and making the brightness of the space uniform.

It is a figure which shows the LED lighting apparatus which concerns on embodiment of this invention, and is the external perspective view which shows when it is seen from diagonally downward. It is an external perspective view which shows the state when the LED lighting apparatus is seen from diagonally above. It is an exploded perspective view which shows the state when the LED lighting apparatus is seen from diagonally downward. It is an exploded perspective view which shows the state when the LED lighting apparatus is seen from diagonally above. It is a central vertical sectional view of the LED lighting apparatus. It is a perspective view which shows the LED lighting apparatus which removed the shade and cross-sectioned a part of the LED cover. It is a perspective view which shows the state when the LED lighting apparatus which cross-sectioned a part of the indirect light cover is seen from diagonally above. It is a bottom view which shows an example of the LED light source substrate. It is a perspective view which shows the state when the LED lighting apparatus which removed the indirect light cover and the sensor unit is seen from diagonally above. It is a figure which shows the wiring state of the electric wire, and is the enlarged schematic sectional view of the main part of the LED lighting apparatus which removed the indirect light cover. It is a central vertical sectional view when the LED lighting device is installed on the ceiling. .. FIG. 11 is an enlarged view of part A in FIG. It is an enlarged view of the main part which shows the 1st modification which integrated the shade and the transmission part. It is a figure which shows the modification of the indirect light light source substrate, and is the perspective view which shows the LED lighting apparatus which removed the indirect light cover. It is a figure which showed an example of the calculation result of the relationship between the fine particle diameter of a diffuser and a scattering coefficient at a wavelength of light of 600 nm. It is a figure which showed an example of the calculation result of the relationship between the fine particle diameter of a diffusing agent and the forward scattering coefficient at a wavelength of light of 600 nm.

Next, the LED lighting device (LED ceiling light) according to the embodiment of the present invention will be described in detail with reference to the drawings as appropriate. In the present embodiment, an example of the LED lighting device 1 will be described by taking a circular shape in a plan view as an example, but the shape is not limited to this, and for example, a quadrangle, a hexagon, or an octagon. It can also be applied to polygonal objects such as. Further, in the present embodiment, the LED lighting device 1 using a light emitting diode (LED) as the main lighting light source will be described below, but the main lighting light source is not limited to the LED.

The LED lighting device 1 shown in FIGS. 1 and 2 is a mounting adapter 90 (not shown) that engages with an indoor wiring fixture (not shown) such as a hook rosette 80 (FIG. 11) or a hook ceiling provided on the ceiling surface of a house. Through 11), it is connected to an external power source and fixed at a predetermined position on the ceiling surface for use. The LED lighting device 1 is made of, for example, a round shape, a square shape, or the like (in the present embodiment, it is a round shape). In the following description, the upper side of the paper surface is the ceiling side (upper surface side) and the lower side of the paper surface is the floor side (lower surface side) based on the state in which the LED lighting device 1 is attached to the ceiling surface.

As shown in FIGS. 3 and 4, the LED lighting device 1 includes a backbone 11, an adapter receiving portion 12 (insulating plate), a power supply board 13, a heat radiating plate 14, an LED light source board 15 (first light source board), and an LED cover. It is configured to include 16, a center cover 17, a substantially annular transmission portion 18, a shade 19, an indirect light source substrate 20 (second light source substrate), an indirect light cover 21 (upper cover), a sensor unit 22, and the like.

The backbone 11 is a base member obtained by processing and molding a steel plate (for example, SECC (electrozinc plated steel plate)) into a substantially circular shape, and is formed in a substantially concave shape (dish shape) so that the concave surface faces the floor side. An adapter mounting hole 11a to which the mounting adapter 90 (FIG. 11) is locked is formed in the center of the backbone 11.

The mounting adapter receiving portion 12 is formed of a synthetic resin having flame-retardant and electrically insulating properties (for example, PP: polypropylene resin or the like), and is screw-fixed to the lower surface of the backbone 11 with a ring-shaped fixing portion 12a and the fixing thereof. It has a cylindrical portion 12b extending from the inner peripheral edge portion of the portion 12a to the floor side (downward).

As shown in FIG. 3, the power supply board 13 has a lighting circuit board and the like including a control unit, and is screwed to the backbone 11 via a mounting adapter receiving unit 12 (insulating plate). As a result, the power supply board 13 is arranged in a heat radiating space surrounded by the backbone 11 and the heat radiating plate 14 described later in a state of maintaining electrical insulation.

Further, the power supply board 13 is electrically connected to the mounting adapter 90 (FIG. 11) via an electric wire 23 connected to the power connector 13a fixed to the lower surface of the power supply board 13. As a result, the LED lighting device 1 is configured to be supplied with power via the indoor wiring fixture (not shown), the mounting adapter 90 (FIG. 11), the electric wire 23, and the power supply board 13, respectively.

The heat radiating plate 14 is a metal member that plays a role of radiating and cooling the heat of the power supply board 13 that generates heat during operation, the LED light source board 15 on which a plurality of LEDs are mounted, and the indirect light light source board 20. .. The LED of the LED element group 15b described later has a property of being vulnerable to heat. In addition, when an LED is used, it emits high-intensity light by passing a large current with a low voltage, and the heat generated by this light emission deteriorates the LED itself and surrounding members. Appropriate heat dissipation is required to achieve high reliability.

The heat radiating plate 14 is formed by processing and molding a steel plate into a substantially circular shape, and has a truncated cone-shaped substrate support portion 14a protruding toward the floor. Further, the heat radiating plate 14 is made of, for example, a metal having good thermal conductivity such as a galvanized steel plate, and is integrally formed seamlessly by squeezing to increase the strength. Further, the heat radiating plate 14 is formed to have a diameter larger than that of the backbone 11, and is attached to the backbone 11 so as to project radially outward from the backbone 11. The heat radiating plate 14 has an LED light source substrate 15 (first light source substrate) arranged on the lower surface side of the radiating plate 14 so that a plurality of LED elements 15b of the main light source irradiate light downward, and the upper surface of the radiating plate 14 is arranged. The indirect light source substrate 20 (second light source substrate) is arranged so that the plurality of LED elements 20a of the sub-light source described later irradiate the light upward. Supplementally, the LED light source substrate 15 is arranged on the lower surface side of the heat radiating plate 14 so as to be along the lower surface. Further, the indirect light source substrate 20 is arranged on the upper surface side of the heat radiating plate 15 (the upper surface of the annular portion 14c described later) so as to be along the upper surface so as to suppress the height (thickness).

A circular through hole 14b is formed at the radial center of the heat radiating plate 14 at a position corresponding to the cylindrical portion 12b of the adapter receiving portion 12. Further, the outer peripheral portion of the heat radiating plate 14 has a horizontally formed circular annular portion 14c and a cover mounting portion 14e formed on the outer peripheral portion of the annular portion 14c. On the lower surface of the annular portion 14c, receivers 14d (see FIG. 3) for hooking the shade 19 described later are attached to three places at 120 ° intervals.

As shown in FIG. 4, on the upper surface side of the annular portion 14c, an indirect light source substrate 20 screwed to the upper surface of the annular portion 14c and an indirect light cover 21 covering the indirect light source substrate 20 are arranged. ing.

As shown in FIGS. 5 and 10, the cover mounting portion 14e is a portion to which the indirect light cover 21 is mounted, and is formed so as to expand substantially in a tapered shape on the outer peripheral portion of the heat radiating plate 14. An indirect light source substrate 20 is mounted in a ring shape on the annular portion 14c (outer peripheral portion of the heat sink 14) above the cover mounting portion 14e, and a large number of LED elements 20a as sub-light sources are arranged.

As shown in FIGS. 6 and 10, the electric wire insertion hole 14f is composed of a through hole formed in the outer peripheral wall of the storage recess 14 formed in the shape of a recess inclined so as to expand upward. A plurality of electric wires 23 are wired in the electric wire insertion hole 14f.

The electric wire insertion hole 14g is composed of a through hole formed in the annular portion 14c, and the electric wire 23 drawn out from the electric wire insertion hole 14f is wired.

The storage recess 14 is a storage space in which the power supply board 13 to which the electric wire 23 is connected is installed.

The LED light source substrate 15 (first light source substrate) is a ring-shaped wiring board 15a arranged on the lower surface side of the backbone 11 with a heat radiation plate 14 interposed therebetween, and one surface side (floor surface side) of the wiring board 15a. It is configured to include a main light source LED element group 15b in which a plurality of LEDs arranged concentrically are mounted by soldering or the like. The details of the LED element group 15b will be described later.

The wiring substrate 15a is formed by, for example, forming an insulating layer, a copper foil pattern, or the like on a substantially annular metal plate made of an aluminum alloy, or a flat plate of a resin having good thermal conductivity (for example, a polyimide resin or the like). It is configured by forming a copper foil pattern, solder resist, etc. on the top. Further, the wiring board 15a is screwed to the heat radiating plate 14.

In the present embodiment, by providing the backbone 11 having the above-mentioned configuration and the heat sink 14, the volume of the heat dissipation space is increased (the amount of air in the heat dissipation space is increased), and the power supply board 13 and the LED light source board are provided. The heat dissipation efficiency of 15 is improved. As a result, the luminous efficiency of the LED element group 15b can be increased.

The LED light source substrate 15 shown in FIG. 3 shows an example of an LED arrangement pattern for 18 tatami mats. As shown in FIG. 8, the LED element group 15b includes a plurality of daylight color LEDs (Light Emitting Diodes) 15b1 that emit light of daylight color (D color) and a plurality of light bulb colors that emit light of light bulb color (L color). An LED 15b2, a plurality of blue LEDs 15b3 that emit blue light, and an LED 15b4 for a security light are provided to form a light source for main lighting. Further, at the outer peripheral end of the LED light source substrate 15, a substantially arc-shaped projecting piece 15c formed so as to project outward and an electric wire insertion hole 15d (see FIG. 4) formed at the base end of the projecting piece 15c. It has three connector portions 15e (see FIG. 6) mounted on the projecting piece 15c and connected to the electric wire 23.

The daylight color LED 15b1 has a peak wavelength of 430 nm to 460 nm, and is formed in a plurality of rows (for example, 9 rows) concentrically from the outer peripheral side to the inner peripheral side.

The light bulb color LED 15b2 has a peak wavelength of 550 nm to 650 nm, and is arranged so as to sandwich the daylight color LED 15b1 in each row arranged in a plurality of concentric rows. That is, the light bulb color LEDs 15b2 are arranged in each concentric row with two daylight color LEDs 15b1 sandwiched in the circumferential direction. The light bulb color LEDs 15b2 in the second row from the inner peripheral side are arranged with one or two daylight color LEDs 15b1 sandwiched between them. Further, the daylight color LED 15b1 and the light bulb color LED 15b2 are arranged at equal intervals or substantially equal intervals in the circumferential direction in each concentric row.

The blue LED 15b3 has a peak wavelength of 470 nm to 480 nm, and is circularly spaced in the circumferential direction between the daylight color LEDs 15b1 arranged in a plurality of concentric rows and the outermost circumference and the innermost circumference of the light bulb color LED 15b2. They are arranged in a ring. In the embodiment of FIG. 8, the rows in which the daylight color LEDs 15b1 and the light bulb color LEDs 15b2 are arranged are arranged in 5 rows concentrically on the inner peripheral side of the blue LEDs 15b3 arranged in an annular shape, and 4 concentrically on the outer peripheral side. It is arranged in columns.

The LED element group 15b shown in FIG. 8 is composed of, for example, 275 daylight color LEDs 15b1, 142 light bulb color LEDs 15b2, and 41 blue LEDs 15b3. The number of blue LEDs 15b3 is preferably about 10% of the total number of daylight color LEDs 15b1 and light bulb color LEDs 15b2.

The heat sink 14 and the LED light source substrate 15 are reflectively coated with a white paint that reflects light from the LED element group 15b toward the floor.

The LED cover 16 has a function of guiding the luminous flux emitted from the plurality of LED element groups 15b to the surface side (floor side), a function of pressing the LED light source substrate 15 so as to be in close contact with the heat radiation plate 14, and a main illumination. It has a function of covering the entire lower surface side of the LED element group 15b which is a light source.

The LED cover 16 is integrally molded by injection molding or the like using, for example, a resin having translucency and electrical insulation such as polystyrene (PS), polycarbonate (PC), and acrylic (PMMA). In particular, it is preferable to use polystyrene in terms of transparency, cost and moldability. Further, the material used for the LED cover 16 is not limited to resin as long as it has translucency and electrical insulation, and may be glass or the like.

As shown in FIG. 6, the LED cover 16 has a substantially circular LED cover portion 16a that covers the entire light emitting surface (the surface on which the LED element group 15b is mounted) of the LED light source substrate 15, and the outside of the LED cover portion 16a. Containing a cylindrical wall portion 16b extending from the peripheral edge portion toward the back surface side (ceiling side), a brim portion 16c protruding radially outward from the upper end (rear surface side) of the wall portion 16b, and an LED light source substrate 15. It has a substrate storage portion 16d and a light source.

Further, in the LED cover 16, the LED cover portion 16a is screw-fixed to the substrate support portion 14a of the heat-dissipating plate 14, and the brim portion 16c is screw-fixed to the annular portion 14c of the heat-dissipating plate 14.

The wall portion 16b is formed so as to extend in a direction substantially orthogonal to the LED cover portion 16a. Further, a notch (not shown) is formed in the wall portion 16b so that the heat in the LED cover 16 can be released to the outside. The opening area of the notch is set to a size that the user's finger cannot insert. This makes it possible to prevent the user from directly touching the LED light source substrate 15 with his / her hand (finger).

The brim portion 16c is a fixing portion for fixing the LED cover 16 to the heat radiating plate 14 on the outer peripheral side of the LED light source substrate 15. The brim portion 16c extends along the circumferential direction and is formed by being divided into three parts.

The substrate accommodating portion 16d is formed in a state of being inclined and recessed from the brim portion 16c, and the LED light source substrate 15 is horizontally arranged on the inner bottom portion thereof to accommodate the LED element group 15a.

FIG. 6 is a perspective view showing an example of a state in which the LED cover 16 having a partial cross section is attached to the lower side of the LED light source substrate 15. The LED of the LED element group shown in FIG. 8 is configured to emit light to the floor side through the corresponding plurality of dome-shaped portions 16a2 in the LED cover 16 shown in FIG. In the present embodiment, a set of two LEDs is housed in one dome-shaped portion 162a, but the number of LEDs housed in the dome-shaped portion 16a2 is not limited to this. For example, for example, of the set of two LEDs arranged in one dome-shaped portion 16a2, one is a daylight color LED15b1 and the other is a light bulb color LED15b2.

The center cover 17 is a member that covers the mounting adapter 90 (FIG. 11) exposed in the center of the main body of the apparatus, and is formed of, for example, a flame-retardant synthetic resin (for example, PP: polypropylene resin). Further, the center cover 17 is formed in a disk shape and is detachably attached to the LED cover 16.

The transmissive portion 18 has a substantially annular shape, and the inner peripheral side is held on the outer peripheral side of the shade 19 made of a translucent material, and the outer peripheral side is configured to project outward from the outer periphery of the shade 19 and the indirect light source substrate 20. There is. In order to receive the light emitted from the indirect light source substrate 20 and the light reflected by the ceiling 100, the length of the transmitting portion 18 protruding from the outer periphery of the indirect light source substrate 20 is better as it is longer in the outer peripheral direction. However, since the installability of the LED lighting device 1 is deteriorated, it is preferable that the transmission portion 18 has an outer diameter of about 1000 mm or less so that the transmission portion 18 protrudes from the outer periphery of the indirect light source substrate 20. Further, if the length of the indirect light source substrate 20 protruding from the outer periphery of the transmission portion 18 is short, the light receiving property of the light emitted from the indirect light source substrate 20 and the light reflected by the ceiling 100 deteriorates, so that the length is longer than a certain level. It is preferable that the outer diameter is as high as possible. For example, as shown in FIG. 12, a point SP that passes through the center of the LED element 20a and intersects the line SL that is perpendicular to the light emitting surface of the LED element 20a and the surface of the ceiling 100 that faces the light emitting surface of the LED element 20a. When the outer diameter and position of the transmissive portion 18 are configured so that the line QL intersects the transmissive portion 18 when the angle X formed by the line QL extending diagonally downward from the floor toward the floor is 45 degrees. Of the light reflected by the ceiling 100, about half of the high-intensity light components directly above the LED element 20a can be received by the transmission unit 18 , which is preferable. In order to distribute the light emitted from the LED light source substrate 15 and the indirect light source substrate 20 (second light source substrate) into the space where the LED lighting device 1 is installed, the transmission unit 18 has light transmission. It is made of material. For example, it is integrally molded by injection molding or the like using a translucent resin such as polystyrene (PS), polycarbonate (PC), and acrylic (PMMA). In particular, it is preferable to use polystyrene in terms of transparency, cost and moldability. A diffusing agent for scattering light may be added to the material, and by adding the diffusing agent, glare is prevented or reduced, and the brightness in the space where the LED lighting device 1 is installed is made uniform. It has the effect of becoming.

Further, since the indirect light source substrate 20 (second light source substrate) is installed so as to oppose the ceiling 100, most of the light emitted from the LED element 20a is the ceiling 100 as shown in FIG. It is reflected by and returned to the lighting device 1 side. Therefore, the floor side is uncontrolledly irradiated with light under the influence of the ceiling 100, causing uneven brightness in the space where the LED lighting device 1 is installed, but the transmitting portion 18 diffuses the light. By containing the agent, light can be scattered, remarkable glare can be prevented, and the brightness of the space in which the LED lighting device 1 is installed can be made uniform.

Further, as shown in FIG. 13, the transmissive portion 18 may be formed integrally with, for example, the shade 19, the number of parts can be reduced, the assembly is good, and the cost can be suppressed. Play.

Further, the transmission unit 18 includes the transmission unit 1 (182a) and the transmission unit 2 (182b) shown in FIG.
It may be composed of a plurality of transmissive portions such as the transmissive portion 3 (182c), and the plurality of transmissive portions prevent or significantly reduce glare and the brightness in the space where the LED lighting device 1 is installed. It has the effect of equalizing the brightness.

The diffusing agent added to the material is formed of fine particles having a size of about 1 to 100 μm, such as calcium carbonate, silica, and silicone, which have high light diffusivity and can maintain high transmittance when added to the material. .. In particular, calcium carbonate is superior in terms of cost. Further, when it is added to polystyrene or polycarbonate having a refractive index of about 1.6, it is preferable to use calcium carbonate or silica having a refractive index of about 1.5 to 1.6 without any significant difference. When the refractive index is significantly different, the reflection inside the transmitting portion 18 increases, the transmittance is remarkably lowered, and the brightness is reduced. Further, the shape of the fine particles of the diffusing agent added to the material is preferably spherical from the viewpoint of the uniformity of light scattering, and is preferably the same shape and size in the diffusing agent to be added.

Further, when the size of the fine particles of the diffuser is sufficiently smaller than the wavelength of the transmitted light, the scattering characteristic becomes Rayleigh scattering, the wavelength dependence of the light becomes remarkable, and the LED light source substrate composed of a plurality of wavelengths. The light emitted from the 15 and the indirect light light source substrate 20 is dispersed to generate light color unevenness. Therefore, it is preferably about 1 μm or more, which is about the wavelength of light, and if it is larger than about the light wavelength, the scattering characteristics depend on Mie scattering and geometrical optics, and the wavelength dependence disappears, so that light color unevenness is suppressed. It works.
FIG. 15 is an example of the calculation result of the scattering coefficient by the Mie scattering theory when the particle shape is spherical and the wavelength of light is 600 nm. FIG. 16 is an example of the calculation result of the forward scattering coefficient by the Mie scattering theory when the particle shape is spherical and the wavelength of light is 600 nm. It is shown that the larger the scattering coefficient, the larger the scattering, which contributes to the prevention of glare and the equalization of the brightness of the space in which the LED lighting device 1 is installed. Further, the larger the forward scattering coefficient, the more the light is scattered in the traveling direction of the scattered light, and it is possible to realize the transmitting portion 18 having a high transmittance.
In the calculation results shown in FIGS. 15 and 16, the scattering coefficient became maximum when the particle diameter was about 2 μm, and the forward scattering coefficient showed good results when the particle diameter was about 3 μm. Therefore, the particle diameter is preferably about 3 μm from both the viewpoints of scattering and transmission, but when there is a variation in the particle diameter, the scattering coefficient changes greatly with respect to the particle diameter in order to obtain more stability of light scattering. Except for particle diameters of 3 μm or less, it is preferable to use fine particles having a particle diameter of 4 μm or more.

By configuring the transmissive portion 18 in this way, the space where the LED lighting device 1 is installed, such as the ceiling and the floor to be installed, is illuminated in a wide range, and the effect of equalizing the brightness is obtained.

As shown in FIG. 5 (also as shown in FIGS. 3 and 4), the LED cover portion 16a has a circular through hole 16a1 formed in the central portion in the radial direction. In the LED cover portion 16a, a dome-shaped portion 16a2 is formed at a position corresponding to each of the LED element group 15b (daylight color LED15b1, light bulb color LED15b2, blue LED15b3) of the LED light source substrate 15. The dome-shaped portion 16a2 has a lens function, and is a member that polarizes the light from the daylight color LED15b1, the light bulb color LED15b2, and the blue LED15b3.

The shade 19 is a translucent cover made of a resin (for example, acrylic, polystyrene, etc.) having translucency (including transparent, translucent, or milky white), and is configured in a dome shape. The shade 19 diffuses the luminous flux emitted from the light source (LED element group 15b) to reduce the glare when the user directly looks at the LED lighting device 1, or in the space where the LED lighting device 1A is installed. It plays a role in making the brightness uniform. The shade 19 is detachably engaged and held by the receiver 14d of the heat sink 14.

As shown in FIG. 9, the indirect light source substrate 20 (second light source substrate) is arranged on the outer peripheral portion on the upper surface side of the heat radiating plate so as to irradiate light from the entire position of the outer peripheral portion. The indirect light source substrate 20 is configured by arranging and connecting four substantially fan-shaped substrates in a C shape, and mounting LED elements 20a as a plurality of sub-light sources. The indirect light source board 20 includes a board connection connector 20b provided at the end in the circumferential direction, a board connection wire 20c wired between the connectors 20b, a power supply connection wire 23, and this wire. It is provided with a wiring notch 20e for inserting the 23 and a connector 20d for power supply connection attached in the vicinity of the notch 20e. The indirect light source substrate 20 is screwed and arranged on the annular portion 14c of the peripheral portion on the upper surface side of the heat radiating plate 14.

Therefore, as shown in FIGS. 11 and 12, the LED element 20a is arranged so as to irradiate light from the position of the entire peripheral portion on the upper surface side of the heat radiating plate 14. Further, the LED element 20a is arranged on the outer peripheral side of the outer peripheral portion of the LED light source substrate 15.

On the upper side of the indirect light source substrate 20 (second light source substrate), an indirect light cover 21 (upper cover) made of an annular translucent resin that covers the indirect light source substrate 20 from above is provided (upper cover). See Figure 3).

As shown in FIGS. 3 and 4, the sensor unit 22 changes the power supplied to the LED element group 15b according to the brightness of the environment (space) in which the LED lighting device 1 is installed, for example, to illuminate the LED. It provides a function to obtain a constant illuminance under the device 1. It also detects the illuminance under the LED lighting device 1. The sensor unit 22 is attached to the upper part of the portion of the indirect light source substrate 20 in which a C-shaped notch is formed.

Next, the operation of the LED lighting device 1 according to the embodiment of the present invention will be described with reference to FIGS. 5, 11 and 12, mainly with reference to each figure.

The LED lighting device 1 shown in FIGS. 1 and 2 operates by being supplied with electric power from a power supply and a power supply circuit (not shown). The power supply circuit has a function of adjusting the power of the power supply to a predetermined voltage or current. Further, the LED lighting device 1 has a function of receiving a signal (for example, infrared light) output from the remote controller by the light receiving unit (not shown) and transmitting the received signal to the control unit (not shown).

Further, the lighting circuit (not shown) has a function of driving the daylight color LED 15b1, the light bulb color LED 15b2, and the blue LED 15b3 based on the control signal received from the control unit. Further, the lighting circuits 102, 103, 104 have a function of individually changing the drive current for driving the daylight color LED15b1, the light bulb color LED15b2, and the blue LED15b3 based on the daylight color LED15b1 and the control signal received from the control unit.

The remote controller (not shown) has a function to output a set signal by operating a button. For example, all light mode, brightness up mode, blue LED addition mode, brightness up mode + blue LED addition. It can be set to the mode etc.

By the way, when you want to make the characters of books and newspapers easier to see, you can press the specified button on the remote control to increase the brightness of the daylight color LED15b1 and the light bulb color LED15b2, and the blue LED15b3 will light up to add blue-green light to make it even brighter. Achieve a natural light that is closer to sunlight. This makes it easier to see characters, photographs, and the like.

When the LED element group 15b of the main light source shown in FIG. 3 is turned on, the light emitted from the LED element group 15b illuminates the floor side through the LED cover 16 and the shade 19. When the LED element group 15b is irradiated with light, heat is also dissipated.

As shown in FIG. 5, an LED light source substrate 15 is interposed between the heat sink 14 and the LED cover 16, and the LED cover 16 is screwed to the heat sink 14. As a result, the adhesion of the LED light source substrate 15 to the heat radiating plate 14 becomes high, and the heat radiating property can be improved. Therefore, it is possible to realize the LED lighting device 1 in which the density of the light emitting surface of the main light source is uniform and the light emitting efficiency of the LED element group 15b is excellent. Further, the heat sink 14 has an effect of correcting the arrangement of the LEDs of the LED element group 15 at an appropriate position with respect to the LED cover 17 and reducing the warp and deformation of the LED light source substrate 15.

Further, as shown in FIG. 3, in the heat radiating plate 14, the LED light source substrate 15 (first light source substrate) is arranged on the lower surface side of the radiating plate 14 so as to irradiate light downward. An indirect light source substrate 20 (second light source substrate) is arranged on the upper surface side so as to irradiate light upward. That is, since the indirect light source substrate 20 is a flat plate-shaped substrate connected in a C shape and arranged horizontally, the height is lowered in the vertical direction to reduce the size and thickness of the entire LED lighting device 1. can do.

As shown in FIGS. 11 and 12, a large number of LED elements 20a of the indirect light source substrate 20 are arranged so as to irradiate the outer peripheral portion on the upper surface side of the heat radiating plate 14 with light from the entire position of the outer peripheral portion. ing.

Further, since the translucent indirect light cover 21 that covers the indirect light source substrate 20 from above is provided on the upper surface side of the heat radiation plate 14, the ceiling direction (upward direction) and the outer peripheral direction (lateral direction) are irradiated. The entire room can be illuminated brightly.

The LED element 20a of the indirect light source substrate 20 is arranged on the outer peripheral side of the outer peripheral portion of the LED light source substrate 15 (first light source substrate). Therefore, the LED element 20a that generates heat on the indirect light light source substrate 20 and the LED element group 15a that is arranged on the LED light source substrate 15 and generates heat can be arranged so as to be offset from the heat sink 14. , It is possible to efficiently dissipate heat and cool it. Further, since the LED element 20a can be arranged at a position from the outer peripheral end in the LED lighting device 1, it is possible to brightly illuminate the outer peripheral direction of the LED lighting device 1.

As shown in FIGS. 5, 11 and 12, an indirect light cover 21 (upper cover) is attached to the cover mounting portion 14e on the outer peripheral portion of the heat radiating plate 14. Further, the LED element 20a of the indirect light source substrate 20 (second light source substrate) is arranged above the cover mounting portion 14e.

Therefore, the LED element 20a can illuminate the light emitted from the LED element 20a in the outer peripheral direction and the upward direction without being blocked by other members, so that the outer peripheral direction and the ceiling direction of the LED lighting device 1 can be illuminated. In addition, the amount of light can be increased compared to conventional devices to illuminate brightly.

As described above, in the LED lighting device 1 according to the embodiment of the present invention, the height (thickness) of the lighting device can be reduced, and the light of the indirect light source substrate 20 can be directed to the outside. Because it can be used, it is possible to illuminate the ceiling surface and the upper surface of the wall in the room, so that the brightness of the room can be increased. Further, the LED lighting device 1 can be made thinner and smaller as a whole by lowering the height of the whole LED lighting device 1.

Further, in the present embodiment, the translucent portion 18 can scatter the light emitted from the LED of the indirect light source substrate 20 and returned from the ceiling to the floor surface, so that glare can be compared with the example of Patent Document 1. Can be prevented or significantly reduced, and the brightness of the space can be made uniform.

<Modification example of indirect light source board>
FIG. 15 is a diagram showing a modified example of the indirect light source substrate 20A, and is a perspective view showing an LED lighting device with the indirect light cover removed.

In the above embodiment, as an example of the indirect light light source substrate 20 (see FIG. 9), a case where a circuit substrate divided into three is connected in a C shape in a plan view has been described, but the present invention is not limited thereto. ..

As shown in FIG. 15, the indirect light source substrate 20A may be a circuit board formed in one C shape.

Further, the indirect light source substrate 20A may be a circuit board formed in one annular shape.

1 LED lighting device 11 Bagbone 14 Heat sink 14e Cover mounting part 15 LED light source board (first light source board)
15b LED element group (LED element)
16 LED cover 18 Transmissive part 182 Transmissive part (Modification 1)
20 Indirect light source board (second light source board)
20a LED element 21 Indirect light cover (upper cover)

Claims (4)

Mounted on the ceiling,
A first light source substrate that has a plurality of LED elements as a main light source and irradiates light,
A second light source substrate that has a plurality of LED elements as secondary light sources and irradiates light,
It has a first light source substrate and a heat sink that dissipates heat from the second light source substrate.
The first light source substrate is arranged on the lower surface side of the heat sink so as to irradiate light downward.
The second light source substrate is arranged on the upper surface side of the heat sink so as to irradiate light upward.
A transmissive portion projecting outward from the second light source substrate is arranged so that a part or all of the light emitted from the second light source substrate is indirectly incident and diffused at least once .
The transmitting portion is configured to receive light radiated from the second light source substrate and reflected by the ceiling, and to scatter the light reflected by the ceiling at a plurality of portions. Lighting device. The LED lighting device according to claim 1, further comprising a cover that covers the second light source substrate, and the transmissive portion is arranged separately from the cover. The LED lighting device according to claim 1 or 2, wherein the transmitting portion contains a light diffusing agent composed of fine particles. The LED lighting device according to claim 1 or 2, wherein the transmitting portion contains a light diffusing agent composed of fine particles having a length of 4 μm or more.

Images