JP7002230B2 - Manufacturing method of electronic device - Google Patents

Description

The present invention relates to a method for manufacturing an electronic device in which an electronic component is mounted on a light transmissive substrate.

Conventionally, as a method of mounting an electronic component on a substrate, a bump ball is formed on a substrate on which a circuit pattern is formed in advance with an Au wire or the like, the electronic component is mounted on the bump ball, and the electronic component is electrically irradiated by heat and ultrasonic waves. There is known a method of fixing an electronic component to a circuit pattern while connecting to the circuit board. There is also a method of applying solder paste or the like to the circuit pattern on the board, mounting the electronic components on it, and heating to melt the solder to electrically connect and fix the electronic components to the circuit pattern. Are known.

As a method for forming a circuit pattern, a method of masking and etching a copper foil is widely used. Further, in Patent Document 1, a coating film of a wiring pattern is formed on a substrate by printing or the like with a conductive ink in which metal nanoparticles and a dispersant such as a polymer are dispersed in a liquid medium, and then the coating film of the wiring pattern is formed. A technique is disclosed in which an electronic component is mounted on the surface so that its external terminal is immersed therein, and metal nanoparticles of a coating film of a wiring pattern are photo-fired by irradiating light from the back surface side of the substrate. At this time, in the technique of Patent Document 1, after printing the wiring pattern, the liquid medium is removed so that the content of the liquid medium is in the range of 0.01 to 3% by mass, and then the electronic component is mounted. There is. This prevents the wiring pattern from collapsing when the electronic component is mounted on the wiring pattern, and also prevents the formation of holes inside the wiring pattern during light firing.

Japanese Unexamined Patent Publication No. 2014-17364

In the technique of Patent Document 1, after mounting the external terminal of the electronic component so as to be immersed in the wiring pattern printed with the conductive ink, the liquid medium of the conductive ink is removed to a predetermined amount, and then light firing is performed. Therefore, since the liquid medium is removed before the light firing with the electronic component mounted, the volume of the wiring pattern coating film formed of the conductive ink shrinks, causing the electronic component to be misaligned. When the joint area between the terminal of the electronic component and the wiring pattern is large, stress may be applied to the substrate due to the shrinkage of the coating film. In addition, a gap may be formed between the terminal of the electronic component and the shrunk coating film, resulting in poor bonding.

An object of the present invention is to reduce stress applied to an electronic component or a substrate when an electronic component is bonded to a wiring pattern by light firing the conductive particles.

In order to achieve the above object, the method for manufacturing an electronic device of the present invention is a method in which conductive particles are dispersed in a solution at a portion of a wiring pattern on a light transmissive substrate to which an electrode of an electronic component should be bonded. A coating process of applying ink to form a coating film for bonding, a mounting process of mounting electronic components on a light-transmitting substrate so that electrodes are mounted on the coating film for bonding, and bonding of one electrode. Includes a sintering step of forming two or more electrode connection regions for joining an electrode and a wiring pattern by sintering conductive particles in the bonding coating film with respect to the coating film. ..

According to the manufacturing method of the present invention, by light firing the conductive particles, it is possible to reduce the stress applied to the substrate when the electronic component is bonded to the wiring pattern.

(A)-(f) Explanatory drawing which shows the manufacturing method of the electronic device of 1st Embodiment. An explanatory diagram of an electrode connection region formed in the step of FIG. 1 (f). (A-1) and (a-2) are explanatory views showing an explanatory diagram showing a manufacturing process of the electronic device of the second embodiment and an explanatory diagram of an electrode connection region, and (b) is an explanatory diagram of the electronic device of the second embodiment. Explanatory drawing which shows still another manufacturing process. Explanatory drawing which shows the structure of the manufacturing apparatus of the electronic device of 3rd Embodiment. Explanatory drawing which shows the structure of the manufacturing apparatus of the electronic device of 3rd Embodiment. The flowchart which shows the control operation of the system control part of the manufacturing apparatus of the electronic device of 3rd Embodiment. The process diagram which shows the process of manufacturing an electronic device using the manufacturing apparatus of the electronic device of 3rd Embodiment. (A)-(c) Explanatory drawing which shows an example of the light flux dividing part of the manufacturing apparatus of the electronic device of 3rd Embodiment. (A)-(h) Explanatory drawing which shows an example of the shape of the irradiation spot of the luminous flux of the manufacturing apparatus of the electronic device of 3rd Embodiment. Explanatory drawing which shows the device manufacturing method of this embodiment. The explanatory view which shows the configuration example which arranges the mirror 105d in the manufacturing apparatus of 3rd Embodiment, and irradiates a light transmissive substrate 10 with light.

A method for manufacturing an electronic device according to an embodiment of the present invention will be described.

The method of manufacturing the electronic device of the first embodiment will be described with reference to FIGS. 1 (a) to 1 (f).

First, the light transmissive substrate 10 on which the wiring pattern 11 is formed is prepared.

Here, the wiring pattern 11 on the light transmissive substrate 10 is formed by the steps of FIGS. 1A to 1C. Specifically, a light-transmitting substrate 10 is prepared (FIG. 1A), and a solution (conductive ink) in which conductive particles and an insulating material are dispersed is desired on the surface of the light-transmitting substrate 10. It is applied to the shape of the wiring pattern by a method such as printing (FIG. 1 (b)). As a result, the coating film 11a of the conductive ink is formed on the surface of the light transmissive substrate 10. If necessary, the coating film 11a is heated to evaporate the solvent and dry it.

Next, as shown in FIG. 1 (c), the coating film 11a is made to transmit the light transmissive substrate 10 from the back surface side of the light transmissive substrate 10 and is irradiated with the electromagnetic wave (here, the luminous flux) 12. The luminous flux 12 has a wavelength that allows the light to pass through the light-transmitting substrate 10 and is absorbed by the conductive particles of the conductive ink. At this time, the light transmissive substrate 10 may be mounted on the light transmissive support material 9 with respect to the luminous flux 12. As a result, the luminous flux 12 can be stably irradiated even when the thin light transmissive substrate 10 is used. The luminous flux 12 may be focused to a predetermined spot diameter, or may be formed into a desired wiring pattern 11 shape by a mask or the like. Further, the entire light transmissive substrate 10 may be irradiated. In the region of the coating film 11a irradiated with the luminous flux 12, the conductive particles absorb the energy of light and the temperature rises, and the conductive particles melt at a temperature lower than the melting point of the bulk of the material constituting the particles. do. As the temperature of the conductive particles rises, the molten conductive nanoparticles directly fuse with the adjacent particles. As a result, the conductive particles are sintered together, and the conductive wiring pattern 11 is formed. At this time, since the melted conductive particles are fixed to the surface of the light-transmitting substrate 10, the wiring pattern 11 directly fixed to the light-transmitting substrate 10 can be formed. Further, if necessary, the coating film 11a that has not been irradiated with light may be removed.

Next, as shown in FIG. 1D, the conductive ink is applied to the portion of the wiring pattern 11 to which the electrode 31 of the electronic component 30 is to be bonded to form the coating film 40a.

Then, as shown in FIG. 1 (e), the electronic component 30 is mounted so that the electrode 31 is in contact with the coating film 40a. Then, as shown in FIG. 1 (f), the light transmissive substrate 10 is transmitted from the back surface side of the light transmissive substrate 10 directly under the electrode 31 to generate a luminous flux 12 having an irradiation diameter smaller than the size of the electrode 31. Simultaneously irradiate more than one spot, and at each spot, the conductive particles are sintered in the same manner as in the step of FIG. 1 (c). As a result, the electrode 31 and the wiring pattern 11 are joined by forming two or more electrode connection regions 40 for one electrode 31. In the steps of FIGS. 1 (e) and 1 (f), even if a load is applied to the electronic component 30, the electrode 31 is pressed against the coating film 40a of the conductive ink, and the electronic component 30 is sintered under the load. good.

It is also possible to join a plurality of joint points at the same time by irradiating a plurality of joint points with an irradiation size so that the irradiation can be performed collectively.

Since the volume shrinks when the coating film 40a is sintered and changes to the electrode connection region 40, stress is applied to the light transmissive substrate 10 and the electronic components due to the sintering of the coating film 40a. The stress can be relieved by simultaneously irradiating the light beam of the above two or more places at the same time to form two or more electrode connection regions 40 for one electrode 31. That is, since the region of the non-sintered coating film 40a between the plurality of electrode connection regions 40 is arranged between the plurality of sintered regions (electrode connection regions 40), the volume shrinkage of the entire coating film 40a It becomes a relaxation region and relaxes the stress applied to the light-transmitting substrate 10 and electronic components when the electrode connection region 40 is formed when the electrode 31 as a whole is viewed. Further, by simultaneously sintering two or more places of the coating film 40a, the electrode 31 and the wiring pattern 11 can be bonded by one sintering. Therefore, it is possible to prevent the electronic component 30 from being displaced due to the shrinkage of the coating film 40a.
Further, the volume shrinkage when the coating film 40a is sintered and changes to the electrode connection region 40 may cause a gap between the electrode connection region 40 and the electrode 31, but an electronic component 30 is subjected to a load. By pressing the coating film 40a against the coating film 40a, the two can be joined with high reliability without creating a gap or the like between the electrode 31 and the electrode connecting region 40.

Further, in the method of the present embodiment, since the size of the coating film 40a can be made smaller than the size of the electrode 31, it is difficult to reach with the conventional bump, and the adjacent electrodes 31 are close to each other. However, since each electrode can be connected to the wiring pattern 11 without causing a short circuit, the density of the electrodes 31 can be improved.

As an example, the magnitude of the load is 1 g / mm ² or more and 10000 g / mm ² or less per unit area of the electrode 31, preferably 1 g / mm ² or more and 5000 g / mm ² or less, and 5 g / mm ² or more. More preferably 1000 g / mm ² or less.

As described above, according to the method of manufacturing the electronic device of the present embodiment, it is possible to improve the position accuracy and the joining quality of the electronic component with respect to the wiring pattern 11.

Further, by supporting the light transmissive substrate 10 by the light transmissive support material 9 as shown in FIGS. 1 (c) to 1 (f), when the light transmissive substrate 10 is thin and has low rigidity, a load is applied to the electrons. The component 30 can be pressed against the coating film 40a.

As the light transmissive support material 9, a material that transmits the light flux 12 and has rigidity that can withstand a load is used.

The size of one electrode connection region 40 can be formed to be, for example, 1 mm or less in diameter and 1 nm to 50 μm in thickness. The distance between the two or more electrode connection regions 40 can be about 5 to 200 μm. Further, the electric resistance value of the electrode connection region 40 is preferably 10 ^-4 Ω · cm or less, and particularly preferably a low resistance on the order of 10 ^-6 Ω · cm.

The magnitude of the load can be set to, for example, about 1 g / mm ² or more and 10000 g / mm ² or less.

Further, as the method for forming the coating film 11a or the coating film 40a in the step of FIG. 1B or FIG. 1D, any method can be used as long as a film having a desired film thickness can be formed. You may. When the coating films 11a and 40a are formed by printing, gravure printing, flexographic printing, screen printing and the like can be used. In addition, an inkjet method, a transfer method, or the like can be used.

In the above description, the wiring pattern 11 on the light transmissive substrate 10 is formed by using the conductive ink by the steps of FIGS. 1A to 1C, but it may be formed by another method. good. For example, the wiring pattern 11 may be formed by attaching a metal substance such as a copper foil to the surface of the light transmissive substrate 10 and then forming a desired wiring shape by an etching method or the like and plating as necessary.

Further, in the above description, after forming the coating film 11a on the light transmissive substrate 10 using the conductive ink by the steps of FIGS. 1A to 1D, the conductive particles are baked by irradiating the light beam 12. After connecting and forming the wiring pattern 11, the coating film 40a serving as the electrode connecting region 40 is applied, but the present embodiment is not limited to this method. After forming the coating film 11a according to FIGS. 1 (a) and 1 (b), a drying step is performed as necessary, and FIGS. 1 (d) to 1 (f) are performed without irradiating the light flux 12 of FIG. 1 (c). ), And in the step of FIG. 1F, the coating film 11a and the coating film 40a are irradiated with light simultaneously or continuously to obtain the wiring pattern 11 and the electrode connection region 40. It may be formed in the same process.

As the wavelength of the luminous flux 12 to be irradiated, the wavelength absorbed by the conductive particles contained in the coating films 11a and 40a is used. The light to be irradiated may be ultraviolet, visible, or infrared light, or may be microwave. For example, when Ag, Cu, Au, Pd or the like is used as the conductive particles, visible light having a diameter of 400 to 600 nm can be used.

The conductive ink will be further described. This ink is a solution in which conductive particles are dispersed. As the conductive particles, one or more of conductive metals such as Au, Ag, Cu, Pd, ITO, Ni, Pt, and Fe and conductive metal oxides can be used. In order to efficiently perform sintering by electromagnetic waves, it is desirable to enhance the electromagnetic wave absorption characteristics of ink containing conductive particles, and it is desirable that some or all of the conductive particles have a nano-sized shape. The particle size contained is, for example, 10 to 150 nm. Further, the particle size of the conductive particles may be only nanoparticles of less than 1 μm, or may be a mixture of nanoparticles of less than 1 μm and nanoparticles of 1 μm or more.

As the solution for dispersing the conductive particles of the conductive ink, it is preferable to use an organic solvent or water, but it may be contained in epoxy, silicone, or urethane resin. An additive (polymer component, etc.) for improving dispersibility may be added to the solvent, and a resin component (epoxy, silicone, urethane, etc.) may be added for improving the fixing force.

As the electromagnetic wave used for sintering the conductive particles, those including those in the wavelength range of ultraviolet light, visible light, infrared light, and microwave can be used. By focusing the electromagnetic waves and irradiating the coating film 40a on the wiring pattern 11, the heating region becomes extremely local to the spot diameter of the focused electromagnetic waves, and the local heat is applied to the surrounding light-transmitting substrate. It is possible to conduct heat to 10 and dissipate heat in the air. By implementing this method, it is possible to suppress the temperature rise of the light-transmitting substrate 10, and it is possible to form the wiring pattern 11 without damaging the light-transmitting substrate 10. Therefore, a resin or the like can also be used as the light transmissive substrate 10.

In the present embodiment, as the light-transmitting substrate 10, for example, a thin light-transmitting substrate or film having a thickness of 10 to 1000 μm can be used. Even with such a thin light-transmitting substrate 10, the electronic component 30 can be mounted by electromagnetic wave sintering as in the present embodiment. Examples of the material of the light transmissive substrate 10 include glass, PS (polystyrene), PP (polypropylene), PC (polycarbonate), PET (polyethylene terephthalate), PEN (polyethylene naphthalate), polyimide, acrylic, epoxy, silicone and the like. It is possible to use a product mainly composed of the organic components of the above. In order to improve the adhesion between the light-transmitting substrate 10 and the wiring pattern 11, the light-transmitting substrate 10 may be surface-treated. For example, a plasma treatment, a UV (ultraviolet) treatment, a treatment of applying a coupling agent, or the like is performed.

Further, it is desirable that the wiring pattern 11 formed in the steps of FIGS. 1A to 1C is relatively thick. In particular, the ratio of the thickness to the width of the wiring pattern 11 is preferably thickness / width = 1/100 or more, more preferably thickness / width = 5/100 or more, and thickness / width = 10/100 or more. Especially desirable in some cases. Further, when a large current is supplied to the wiring pattern 11, it is desirable that the thickness / width = 20/100 or more. As an example, the wiring pattern 11 is formed to have a width of 1 μm or more and a thickness of about 1 nm to 50 μm. Further, the electrical resistivity of the wiring pattern 3 is preferably 10 ^-4 Ω · cm or less, and particularly preferably a low resistance on the order of 10 ^-6 Ω · cm.

In the steps of FIGS. 1 (a) to 1 (c), it is desirable that the wiring pattern 11 to be formed is formed so as to be porous. That is, the adjacent conductive particles are not completely melted and mixed with each other, but are sintered at the interface where they come into contact with each other to form pores at least a part between the sintered conductive particles. It is desirable to sinter electromagnetic waves at a high temperature. For example, by using a laser beam as the light flux 12 and irradiating the coating film 11a with an irradiation intensity that does not melt the transmitted light transmissive substrate 10, the region of the coating film 11a irradiated with the light flux 12 can be irradiated in a short time. A relatively large amount of energy can be input, the conductive particles can be heated to melt and sintered, and by stopping the irradiation of the luminous flux 12 of the laser light, heat conduction to the surrounding coating film 11a and the light transmissive substrate 10 can be achieved. Since it can be cooled more quickly, a porous wiring pattern can be formed. In other words, when the coating film 11a is sintered with the luminous flux 12 of the laser beam, the irradiation intensity of the coating film 12 is adjusted so that the coating film 11a has an appropriate temperature to form the porous wiring pattern 11. can. As a specific example, a stretched polyethylene terephthalate (PET) film (melting point of about 250 ° C., heat resistant temperature of about 150 ° C.) is used as the light transmissive substrate 10, and a laser is used so that the shape of the light transmissive substrate 10 is maintained. When the coating film 11a is irradiated from the back surface of the light transmissive substrate 10 by adjusting the intensity of the light light flux 12 and the conductive particles of the coating film 11a are sintered, a porous wiring pattern 11 can be formed. ..

When the wiring pattern 11 is porous, as described above, the wiring pattern 11 itself has followability (flexibility), so that even when the flexible light transmissive substrate 10 is deformed, it accompanies it. Since the wiring pattern 11 follows, the wiring pattern 11 is less likely to come off from the light transmissive substrate 10, and cracks and the like are less likely to occur. Therefore, it is possible to provide a flexible light transmissive substrate 10 in which disconnection is unlikely to occur.

In the step of FIG. 1 (c), it is of course possible to irradiate the light flux 12 from the surface of the light transmissive substrate 10 on the side where the coating film 11a is provided.

Any electronic component 30 may be used, but as an example, a light emitting element (LED, LD), a light receiving element, an integrated circuit, and a display element (liquid crystal display, plasma display, EL display, etc.) are used. be able to. Further, in FIG. 1, only one electronic component 30 is mounted on the light transmissive substrate 10, but it is of course possible to mount two or more electronic components 30.

<Second embodiment>
The second embodiment will be described with reference to FIGS. 2 and 3.

In the first embodiment, a plurality of electrode connection regions 40 are provided for one electrode 31, but one or more electrode connection regions 40 are provided for each of the plurality of electrodes 31 by simultaneous irradiation of the luminous flux 12. It may be formed and a plurality of electrodes 31 may be joined to the wiring pattern 11 at the same time.

For example, as shown in FIGS. 3 (a-1) and 3 (a-2), a coating film 40a is formed so as to correspond to a pair of electrodes 31 provided in one electronic component 30, and a light flux 12 is formed. Can be simultaneously irradiated to join the pair of electrodes 31 to the wiring pattern 11.

As a result, the accuracy of the distance between the pair of electrode connection regions 40 is improved as compared with the case where the coating film 40a under the pair of electrodes 31 is sequentially irradiated with the light flux 12 to form the electrode connection regions 40 in order. And the joining accuracy can be improved.

Further, in the joining method of FIGS. 3 (a-1) and 3 (a-2), the electrode connection region 40 for each electrode 31 may be divided into a plurality of electrode connection regions 40 as shown in FIG.

Further, as shown in FIG. 3B, the coating film 40a is arranged so as to correspond to the electrodes 31 of the plurality of electronic components 30, and each coating film 40a is simultaneously irradiated with the light flux 12 to simultaneously irradiate each electronic component. 30 can be joined to the wiring pattern 11 at the same time.

In this case, when applying a load to the electronic component 30, it is desirable to apply a load to each electronic component 30 at the same time.

Since the configurations and steps other than these are the same as those of the first embodiment, the description thereof will be omitted.

<Third embodiment>
The third embodiment will be described with reference to FIGS. 4 to 7.

The apparatus shown in FIGS. 4 and 5 is a manufacturing apparatus that realizes the manufacturing method of the first embodiment.

This manufacturing apparatus includes a light transmissive substrate support portion (stage) 101 that supports the light transmissive substrate 10 on which the wiring pattern 11 is formed, a dispenser 102, an electronic component moving portion 103, a load portion 104, and an electromagnetic wave ( A light beam) irradiation unit 105 is provided. The dispenser 102 forms a coating film 40a by applying a conductive ink in which conductive particles are dispersed in a solution onto a light-transmitting substrate 10. The electronic component moving unit 103 lifts the electronic component 30 and moves it to the position of the coating film 40a of the light transmissive substrate 10 and mounts it on the coating film 40a. The electromagnetic wave (luminous flux) irradiation unit 105 simultaneously irradiates two or more places of the coating film 40a with electromagnetic waves from the back surface side of the light transmissive substrate 10 to sinter the conductive particles in the coating film 40a. The load unit 104 applies a load for pressing the electronic component 30 mounted on the coating film 40a against the coating film 40a, if necessary. An electronic device is manufactured by performing the steps of FIGS. 1 (c) to 1 (d) described in the first embodiment by this apparatus.

In the devices of FIGS. 4 and 5, a light transmissive substrate support drive mechanism 106 for moving the light transmissive substrate support 101 from the position of the dispenser 102 to the position of the electronic component moving unit 103 is further provided. The electronic component moving unit 103 is configured to apply a load as necessary by pressing the lifted electronic component 30 against the coating film 40a. As a result, the electronic component moving unit 103 also serves as the load unit 104.

This will be explained in more detail. The light-transmitting substrate support portion 101 is provided with a light-transmitting support material 9 for mounting the light-transmitting substrate 10. The dispenser 102 includes a tank 102a that stores conductive ink and sends out an instructed amount, a nozzle 102b that discharges the conductive ink sent out from the tank 102a, and a z-direction drive unit 102c that adjusts the height of the nozzle 102b. , A drive control unit 103f that controls these drive units, and a discharge control unit 102d that controls the tank 102a.

Further, the tank 102a may have a structure integrated with the nozzle 102b. Further, the dispenser 102 may further include a drive mechanism for moving the nozzle 102b with respect to the light transmissive substrate 10. The drive mechanism has a structure in which the nozzle 102b can move in the x and y directions with respect to the light transmissive substrate 10. As a result, the nozzle 102b can be precisely moved with respect to the light transmissive substrate 10, so that the coating film 40a and the coating film 11a can be formed more finely and accurately.

The electronic component moving unit 103 has a table 103h in which a plurality of electronic components 30 are arranged in advance, a suction head 103a, a pump 103b for depressurizing the inside of the suction head 103a, and a suction head 103a in the x, y, z directions. It has a drive unit 103c, 103d, 103e to be moved to, a drive control unit 103f for controlling these drive units, and a pump control unit 103g for controlling the pump 103b. The z-direction drive unit 103e also serves as the load unit 104.

The electromagnetic wave (luminous flux) irradiation unit 105 includes a laser light source 105a, a luminous flux dividing unit 105c that divides the light emitted from the laser light source 105a into two or more light beams, and a light source control unit 105b that controls the laser light source 105a. ..

The light-transmitting substrate support drive mechanism 106 includes light-transmitting substrate support drive portions 106a and 106b that move the support portion 101 in the x and y directions, respectively. The drive control unit 103f also controls the operation of the light transmissive substrate support unit drive units 106a and 106b.

The support unit drive unit 106 may be configured to drive the support unit 101 in the z direction as well. This makes it possible to control the position of the support portion 101 more precisely.

The dispense control unit 102d, the pump control unit 103g, the drive control unit 103f, and the light source control unit 105b are connected to the system control unit 107 that controls the overall operation.

When a transfer method is used as a method for forming the coating film 40a of the conductive ink, it can be realized by using the discharge mechanism portion as the transfer mechanism portion.

A method of manufacturing an electronic device using the manufacturing apparatus of this embodiment will be described. FIG. 6 is a flowchart showing a control operation by the system control 107, and FIG. 7 is a process chart showing a manufacturing process. The system control unit 107 is configured to include a CPU and a memory, and the CPU reads and executes a program stored in the memory in advance, and operates as shown in the flow of FIG. 6 to function as the system control unit 107. To realize.

First, according to the steps of FIGS. 1 (a) and 1 (b) of the first embodiment, the coating film 11a in the shape of the wiring pattern 11 is printed with the conductive ink on the light transmissive substrate 10 (step 701). If necessary, the coating film 11a is heated to evaporate the solvent and dry it. At this stage, the coating film 11a is not photosintered.

The operator sets the light-transmitting substrate 10 on which the coating film 11a is formed on the light-transmitting support material 9 of the light-transmitting substrate support portion 101 of the manufacturing apparatus of FIG. 4 (step 702). The support material 9 can be set from the time of step 701.

The following steps are performed using the manufacturing apparatus of FIGS. 4 and 5. The system control unit 107 instructs the drive control unit 103f to operate the light transmissive substrate support unit drive units 106a and 106b in the x and y directions, and moves the light transmissive substrate support unit 101 to move the dispenser 102. The light transmissive substrate 10 is moved to the dropping position of the nozzle 102b of Nozzle 102b (step 61). Subsequently, the system control unit 107 instructs the drive control unit 103 to operate the z-direction drive unit 102c of the dispenser 102 to bring the nozzle 102b closer to the light transmissive substrate 10 to a predetermined distance. Then, the system control unit 107 instructs the dispense control unit 102d to send out a predetermined amount of the conductive ink from the tank 102a. As a result, the conductive ink is ejected from the tip of the nozzle 102b and is dropped at a predetermined position on the coating film 11a of the light transmissive substrate 10 (step 62). By the above steps 61 and 62, the coating film 40a is formed at a predetermined position of the coating film 11a of the light transmissive substrate 10 (step 703).

The system control unit 107 instructs the drive control unit 103 to operate the light-transmitting substrate support units 106a and 106b in the x and y directions to move the light-transmitting substrate support unit 101. As in step 5, the light transmissive substrate 10 is moved to the position of the electronic component moving portion 103 (step 63). Next, the system control unit 107 instructs the drive control unit 103f to operate the drive units 103c, 103d, 103e and move the suction head 103a in the x, y, z directions to make the suction head 103a a table. It is moved to the coordinates of one electronic component 30 on 103h (step 64). Then, the system control unit 107 instructs the pump control unit 103g to reduce the pressure inside the suction head 103a by the pump 103b, and sucks the electronic component 30 to the tip of the suction head 103a (step 65). Further, the system control unit 107 instructs the drive control unit 103f to operate the drive units 103c, 103d, 103e, and makes the suction head 103a the coating film 40a of the light transmissive substrate 10 on the light transmissive substrate support unit 101. The electrode of the electronic component 30 and the coating film 40a are aligned with each other, and the electronic component 30 is placed on the coating film 40a (step 66). Subsequently, when the operator instructs the drive control unit 103f to apply a load, the drive control unit 103f operates the drive unit 103e in the z direction to lower the suction head 103a, and the suction head 103a causes the electronic component 30 to move. It is pressed to maintain a state in which a predetermined load is applied (step 67). In this state, the system control unit 107 instructs the light source control unit 105b to emit the laser light from the laser light source 105a (step 68). The emitted laser light is divided into a plurality of luminous fluxes 12 by the luminous flux dividing unit 105c. The plurality of light fluxes 12 pass through the light transmissive support material 9 and the light transmissive substrate 10 and are simultaneously irradiated to a plurality of places of the coating film 40a for a predetermined time, and the conductive particles in the plurality of places in the coating film 40a are photoburned. Together, a plurality of electrode connection regions 40 are formed. When the electrode connection region 40 is formed, the pump control unit 103g stops the depressurization of the pump 103b to turn off the adsorption of the electronic component 30, and the drive control unit 103f sets the drive unit 103e in the z direction. By operating and raising the suction head 103a, the application of the load to the electronic component 30 is stopped (step 69). By these steps 63 to 69, the electronic components are picked up, moved to the top of the light transmissive substrate 10 (step 704), mounted on the coating film 40a (step 705), and a plurality of electronic components are applied while applying a load as necessary. Each step of simultaneously irradiating the light beam 12 of No. 12 and sintering (step 706) to form an electrode connection region 40 and joining the electrode 31 and the wiring pattern 11 (step 707) can be executed (FIG. 1). (E), (f)).

It is also possible to form a plurality of electrode bonding regions 40 by irradiating a plurality of coating films 40a together with light instead of irradiating a plurality of locations of one coating film 40a.

After that, the coating film 11a is continuously irradiated with laser light from the light source 105a, and the conductive particles in the coating film 11a are photosintered to form the wiring pattern 11. At this time, the drive control unit 103f operates the light transmissive substrate support unit drive units 106a and 106b to move the light transmissive substrate 10 so that the entire wiring pattern 11 is sintered. The entire region of the coating film 11a to be sintered is irradiated with the laser beam.

As described above, by using the manufacturing apparatus of the third embodiment, the electronic device can be manufactured by the manufacturing method of the first embodiment.

The luminous flux dividing portion 105c may have any configuration as long as the laser light from the laser light source 105a can be divided into a plurality of luminous flux 12. For example, as shown in FIG. 8A, a combination of the half mirror 81a and the mirror 81b can be used as the light flux splitting unit 105c. Further, FIG. 8B shows an example in which the prism is used as the luminous flux dividing portion 105c. FIG. 8C shows a configuration in which a mask having a plurality of openings is used as the light flux dividing portion 105c, and only the plurality of light fluxes 12 transmitted through the openings of the mask are applied to the coating film 40a.

Further, as shown in FIGS. 9A to 9G, the shape of the luminous flux 12 includes a circular shape, a ring shape, an elliptical shape, an elliptical ring shape, a square shape, a square frame shape, a rectangular shape, a rectangular frame shape, and the like. A desired shape can be used. The ring, the elliptical ring, the square frame shape, and the rectangular frame shape can be formed by using the mask as shown in FIG. 8C as the light flux dividing portion 105c.

The load unit 104 may have any structure as long as it can apply a downward load to the suction head 103a, and a weight or a spring may be used.

The timing for irradiating the coating film 11a with light to form the wiring pattern 11 may be after the electrode connection region 40 is formed as in the third embodiment, but may be between steps 702 and 703 in FIG. 7.

It is also possible to adopt a method in which the substrate support portion 101 does not move. In this case, by providing the dispenser 102 with a mechanism for driving the nozzle 102a in the x, y, and z directions, the electronic component 30 can be mounted on the light transmissive substrate 10 with high accuracy.

In the first to third embodiments described above, a method of joining a wiring pattern on a light transmissive substrate and an electrode of an electronic component by photosintering to manufacture an electronic device has been described. The object to be joined by the method of the form is not limited to the electrodes of electronic components. For example, as shown in FIG. 10, it is also possible to bond an optical component 81 such as a lens on the light transmissive substrate 10. The manufacturing method in this case is as follows. First, a conductive ink in which conductive particles are dispersed in a solution is applied to a portion of the light transmissive substrate 10 to which the optical component 81 is to be bonded to form a bonding coating film 40a. Next, the portion to be bonded (edge in FIG. 10) of the optical component 81 is mounted on the bonding coating film 40a. At this time, the light transmissive substrate 10 is mounted on the light transmissive support material 9 as needed. Further, if necessary, a load is applied to the optical component 81, and while the portion (edge) to be bonded is pressed against the bonding coating film 40a, the bonding coating film 40a is irradiated with a plurality of light fluxes 12 for bonding. By sintering the conductive particles in the coating film 40a, a bonding region (40) for joining the portion (edge) of the optical component 81 and the light transmissive substrate 10 is formed. For example, as shown in FIG. 10, the light flux 12 may be transmitted from the back surface side of the light transmissive support material 9 and the light transmissive substrate 10 and irradiated, or may be irradiated from above the light transmissive substrate 10. good.

In the manufacturing apparatus of the third embodiment, as shown in FIG. 11, a movable mirror 105d that reflects the laser light emitted by the laser light source 105a in a desired direction may be arranged. As a result, the plurality of coating films 40a can be sequentially irradiated with light without changing the position of the light transmissive substrate 10. As a result, a plurality of electronic components 30 can be bonded onto the light transmissive substrate 10. In particular, in the configuration using the movable mirror 105d of FIG. 11, when the light transmissive substrate 10 has a concave curved shape with respect to the light source 105a, the conditions (irradiation angles) equivalent to those of the coating films 40a at a plurality of locations are the same. , Irradiation intensity), there is a merit that the light beam 12 can be irradiated.

The electronic device of this embodiment can be applied to any device as long as the electronic component is mounted on a light transmissive substrate. For example, it can be applied to an instrument panel (instrument display panel) of an automobile, a display unit of a game machine, or the like. Further, since the substrate can be curved, it can be applied to wearable (wearable to the body) electronic devices (glasses, watches, displays, medical devices, etc.) and curved displays.

In addition to these, lighting equipment (point emission / surface emission lighting, flexible lighting, automobile lighting (interior, exterior), etc.), display equipment (see-through display, wearable display, head-up display, etc.), production equipment (game) It can be suitably used for directing lighting, display, etc. for equipment (pachinko).

9 ... Light-transmitting support material, 10 ... Light-transmitting substrate, 11a ... Coating, 11 ... Wiring pattern, 40a ... Coating, 40 ... Electromagnetic connection region, 101 ... Light-transmitting substrate support (stage), 102 ... Dispenser, 103 ... Electronic component moving part, 104 ... Load part, 105 ... Electromagnetic wave (luminous flux) irradiation part, 106 ... Light transmitting substrate support part Drive mechanism, 107 ... System control part

Claims (7)

A wiring pattern forming step of forming a wiring pattern or a coating film for wiring having the shape of the wiring pattern on a light transmissive substrate.
After the wiring pattern forming step, the conductive ink in which the conductive particles are dispersed in the solution is applied to the portion of the wiring pattern or the coating film for wiring to which the electrodes of the electronic components should be bonded to form the coating film for bonding. And the coating process
The mounting process of mounting the electronic component on the light transmissive substrate so that the electrode is mounted on the bonding coating film, and
After the mounting step, the electrode and the wiring pattern are bonded by irradiating the bonding coating film of one electrode with an electromagnetic wave to sintered the conductive particles in the bonding coating film. A method for manufacturing an electronic device, which comprises a sintering step of forming two or more electrode connection regions for one of the electrodes. The method for manufacturing an electronic device according to claim 1, wherein in the sintering step, the bonding coating film of one electrode is simultaneously irradiated with electromagnetic waves at two or more locations. A method for manufacturing an electronic device, which comprises a sintering step of forming two or more electrode connection regions with respect to the one electrode by sintering the conductive particles inside. The method for manufacturing an electronic device according to claim 2, wherein in the sintering step, a load is applied to the electronic component, and the electromagnetic wave is applied to two or more places while pressing the electrode against the bonding coating film. A method for manufacturing an electronic device, which comprises simultaneous irradiation. The method for manufacturing an electronic device according to claim 1 or 2, wherein the wiring pattern forming step is a wiring coating film having the shape of the wiring pattern by applying the conductive ink on the light transmissive substrate. A method for manufacturing an electronic device, which comprises a wiring pattern coating process for forming a wiring pattern. The method for manufacturing an electronic device according to claim 4, wherein in the sintering step, both the wiring coating film and the bonding coating film are irradiated with electromagnetic waves to be sintered. Manufacturing method. The method for manufacturing an electronic device according to claim 3 , wherein in the sintering step, the light-transmitting substrate is supported by a support mechanism against the load. A coating process in which conductive ink in which conductive particles are dispersed in a solution is applied to a portion of a light-transmitting substrate to be bonded to form a coating film for bonding.
The mounting process of mounting the component on the light transmissive substrate so that the portion to be bonded of the component is mounted on the coating film for bonding.
After the mounting step, the conductive particles in the bonding coating film are sintered by simultaneously irradiating two or more locations with electromagnetic waves to the bonding coating film at the site to be bonded. A method for manufacturing an electronic device, which comprises a sintering step of forming two or more bonding regions for joining the portions and the light transmissive substrate for one portion to be joined.

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